Philips Semiconductors Product specification Rectifier diodes Schottky barrier FEATURES PBYL3025CT, PBYL3025CTB series SYMBOL • Low forward volt drop • Fast switching • Reverse surge capability • High thermal cycling performance • Low thermal resistance QUICK REFERENCE DATA VR = 20 V/ 25 V a2 3 a1 1 IO(AV) = 30 A VF ≤ 0.43 V k 2 GENERAL DESCRIPTION Dual schottky rectifier diodes intended for use as output rectifiers in low voltage, high frequency switched mode power supplies. The PBYL3025CT series is supplied in the SOT78 (TO220AB) conventional leaded package. The PBYL3025CTB series is supplied in the SOT404 surface mounting package. PINNING SOT78 (TO220AB) PIN DESCRIPTION 1 gate 2 drain 1 3 source SOT404 tab tab 2 tab drain 1 23 1 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. PBYL30 PBYL30 VRRM VRWM VR IO(AV) IFRM IFSM IRRM Tj Tstg Peak repetitive reverse voltage Working peak reverse voltage Continuous reverse voltage Average rectified output current (both diodes conducting) Repetitive peak forward current per diode Non-repetitive peak forward current per diode Peak repetitive reverse surge current per diode Operating junction temperature Storage temperature MAX. UNIT - 20CT 20CTB 20 25CT 25CTB 25 V - 20 25 V Tmb ≤ 120 ˚C - 20 25 V square wave; δ = 0.5; Tmb ≤ 123 ˚C - 30 A square wave; δ = 0.5; Tmb ≤ 123 ˚C - 30 A t = 10 ms t = 8.3 ms sinusoidal; Tj = 125 ˚C prior to surge; with reapplied VRRM(max) pulse width and repetition rate limited by Tj max - 135 150 A A - 1 A - 150 ˚C - 65 175 ˚C 1. It is not possible to make connection to pin 2 of the SOT404 package. March 1998 1 Rev 1.000 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYL3025CT, PBYL3025CTB series THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-mb per diode both diodes SOT78 package, in free air SOT404 package, pcb mounted, minimum footprint, FR4 board Rth j-a Thermal resistance junction to mounting base Thermal resistance junction to ambient MIN. - TYP. MAX. UNIT 60 50 2 1.5 - K/W K/W K/W K/W ELECTRICAL CHARACTERISTICS All characteristics are per diode at Tj = 25 ˚C unless otherwise specified SYMBOL PARAMETER VF Forward voltage IR Reverse current Cd Junction capacitance March 1998 CONDITIONS MIN. IF = 15 A; Tj = 150˚C IF = 15 A; Tj = 125˚C IF = 30 A; Tj = 125˚C IF = 30 A VR = VRWM VR = VRWM; Tj = 100˚C VR = 5 V; f = 1 MHz, Tj = 25˚C to 125˚C 2 - TYP. MAX. UNIT 0.35 0.38 0.52 0.6 1 22 700 0.43 0.46 0.6 0.67 5 40 - V V V V mA mA pF Rev 1.000 Philips Semiconductors Product specification Rectifier diodes Schottky barrier 12 PBYL3025CT, PBYL3025CTB series Forward dissipation, PF (W) Tmb(max) / C PBYL3025CT D = 1.0 Vo = 0.32 V Rs = 0.009 Ohms 10 PBYR2025CT Tj = 150 C 130 0.5 IR / A 1A 126 100mA 125 8 134 0.2 100 10mA 0.1 138 6 75 1mA 4 tp I D= tp 142 T 146 150 25 10uA 2 0 5 10 15 20 Average forward current, IF(AV) (A) Forward dissipation, PF (W) PBYL3025CT Tmb(max) / C Vo = 0.32 V Rs = 0.009 Ohms 0 5 10 15 20 25 VR / V Fig.1. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x √D. 10 25 t T 0 50 100uA Fig.4. Typical reverse leakage current per diode; IR = f(VR); parameter Tj 10000 130 PBYR2025CT Cd / pF a = 1.57 8 2.2 1.9 134 2.8 4 6 138 1000 4 142 2 146 0 0 5 10 Average forward current, IF(AV) (A) 150 15 100 Fig.2. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). 30 typ 25 100 10 Transient thermal impedance, Zth j-mb (K/W) max Tj = 25 C Tj = 125 C 20 10 VR / V Fig.5. Typical junction capacitance per diode; Cd = f(VR); f = 1 MHz; Tj = 25˚C to 125 ˚C. PBYR2025CT IF / A 1 1 0.1 15 10 PD 0.01 tp D= tp T 5 0 0 0.2 0.4 0.6 0.8 0.001 1us 1 VF / V Fig.3. Typical and maximum forward characteristic IF = f(VF); parameter Tj March 1998 T 10us t 100us 1ms 10ms 100ms 1s 10s pulse width, tp (s) PBYL3025CT Fig.6. Transient thermal impedance per diode; Zth j-mb = f(tp). 3 Rev 1.000 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYL3025CT, PBYL3025CTB series MECHANICAL DATA Dimensions in mm 4,5 max Net Mass: 2 g 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 0,9 max (3x) 2,54 2,54 0,6 2,4 Fig.7. SOT78 (TO220AB); pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for SOT78 (TO220) envelopes. 2. Epoxy meets UL94 V0 at 1/8". March 1998 4 Rev 1.000 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYL3025CT, PBYL3025CTB series MECHANICAL DATA Dimensions in mm 4.5 max 1.4 max 10.3 max Net Mass: 1.4 g 11 max 15.4 2.5 0.85 max (x2) 0.5 2.54 (x2) Fig.8. SOT404 : centre pin connected to mounting base. MOUNTING INSTRUCTIONS Dimensions in mm 11.5 9.0 17.5 2.0 3.8 5.08 Fig.9. SOT404 : soldering pattern for surface mounting. Notes 1. Epoxy meets UL94 V0 at 1/8". March 1998 5 Rev 1.000 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYL3025CT, PBYL3025CTB series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. March 1998 6 Rev 1.000