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Product Bulletin
Document # : PB21308Z
Issue Date: 26 April 2016
Title of Change:
NCV7707 Datasheet Update – Revision 3
Effective date:
26 April 2016
Contact information:
Contact your local ON Semiconductor Sales Office or Roman Buzas <[email protected]>
Type of notification:
ON Semiconductor will consider this change accepted.
Wafer Fab Change
Change category:
Assembly Change
Change Sub-Category(s):
Manufacturing Site Change/Addition
Manufacturing Process Change
Test Change
Other _______________
Material Change
Product specific change
Datasheet/Product Doc change
Shipping/Packaging/Marking
Other: _______________________
ON Semiconductor site(s) :
External Foundry/Subcon site(s)
Sites Affected:
All site(s)
not applicable
Description and Purpose:
Features list updated

AEC-Q100 Qualified and PPAP Capable” statement added (page 1)
New OPN added

NCV7707B added to the Marking Diagram (page 1)

NCV7707DQBR2G added to the Ordering information table (page 1)
Thermal resistance Junction-to-Case added

RθJC parameter added to Thermal Characteristics table (page 5)
Electrical Characteristics - Current Sense parameters updated

Current Sense settling time (tis) values updated (page 14)

Current Sense blanking time parameter added (tis_blank) (page 14)
Package drawing updated to the latest revision

Modified dimension A2 min value

Modified dimension b max value
Minor text corrections

Current Sensing paragraph (page 20)
Electrical Characteristics Summary:
Current Sense settling time (tis) values updated (page 7)
Current Sense blanking time parameter added (tis_blank) (page 7)
Original Datasheet
Updated Datasheet
List of affected Standard Parts:
NCV7707DQR2G
TEM001094 Rev. E
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