PLX TECHNOLOGY QUARTERLY MONITOR REPORT RELIABILITY TEST Q4, 2009: Rev. 1 PROCESS TECHNOLOGY MATRIX FOUNDRY FAB TSMC, Taiwan Seiko Epson, Japan NEC, Japan PROCESS TECHNOLOGIES 0.09, 0.13, 0.18, 0.25, 0.35, 0.50 μm CMOS 0.35 and 0.6 μm, CMOS 0.15, 0.25, 0.35 μm CMOS DIE RELIABILITY DATA OUTLINE HTOL (IFR/EFR) ASSEMBLY SUBCON ASE, Kaohsiung ASE, Malaysia NEC, Japan Seiko-Epson, Japan STATS ChiPAC, Korea STATS ChiPAC, Singapore UTAC, Singapore PACKAGE TECHNOLOGIES EPQFP, PBGA, HSBGA, HFCBGA PQFP, PBGA, HSBGA PQFP, PBGA, FBGA PQFP, PBGA PBGA, HSBGA PQFP PQFP, EPQFP PACKAGE RELIABILITY DATA OUTLINE TCT THBT/HAST PCT RELIABILITY HTOL DATA @125 °C FOUNDRY: TSMC Taiwan, Process: 0.09 µm Low-K CMOS EFR (Early Fail Rate,=< 168 Hours) YEAR Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 FITs @ 60% CL, 55C, Ea = 0.7eV Sample # Failure PPM Sample Cum Dev # Failure FITs 120 120 120 120 120 240 120 120 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 120 120 120 120 120 240 120 120 60,000 210,000 330,000 450,000 570,000 810,000 930,000 1,050,000 0 0 1* 0 0 0 0 0 196 56 79 58 46 32 28 25 Note: *=1 unit damaged during failure analysis, root cause could not be determined, random failure. IFR(Intrinsic Fail Rate,>168 Hours) Cumulative 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 FIT PPM EFR(Early Fail Rate, =<168 Hours) 250 200 150 100 50 0 Q1,08Q2,08Q3,08Q4,08Q1,09Q2,09Q3,09Q4,09 Year Year RELIABILITY HTOL DATA @125 °C FOUNDRY: TSMC Taiwan, Process: 0.13 µm LVCMOS EFR (Early Fail Rate,=< 168 Hours) YEAR 2005 2006 Q1,07 Q2,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 FITs @ 60% CL, 55C, Ea = 0.7eV Sample # Failure PPM Sample Cum Dev # Failure FITs 499 1200 360 240 120 120 120 120 120 120 120 239 240 1* 0 0 0 0 0 0 0 0 0 0 1**** 0 0 0 0 0 0 0 0 0 0 0 0 0 0 499 1199 360 240 120 120 120 119 120 120 120 239 240 359,500 1,107,800 1,467,800 1,607,960 1,727,960 1,787,960 1,847,960 1,966,960 2,086,960 2,206,960 2,326,960 2,565,960 2,805,960 0 1** 0 0 0 0 0 1*** 0 0 0 0 0 25 11 8 7 7 7 6 13 12 12 11 10 9 Note: * = invalid reject at 168 hrs due to EOS ** = invalid reject due to mechanical damage after 1000 hrs ***=1 unit functional failure, root cause could not be determined, random failure. **** = invalid reject at 168 hrs due to Assy related stitch bond issue. IFR(Intrinsic Fail Rate,>168 Hours) Cumulative 1 0.9 09 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 FIT PPM EFR(Early Fail Rate, =<168 Hours) 14 12 10 8 6 4 2 0 Q1,08Q2,08Q3,08Q4,08Q1,09Q2,09Q3,09Q4,09 Year Year RELIABILITY HTOL DATA @125 °C FOUNDRY: NEC Japan, Process: 0.15 µm CMOS EFR (Early Fail Rate,=< 168 Hours) YEAR 2000-2007 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q3,09 FITs @ 60% CL, 55C, Ea = 0.7eV Sample # Failure PPM Sample Cum Dev # Failure FITs 1366 120 120 96 96 72 72 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1366 120 120 96 96 72 72 1366000 1486000 1606000 1654000 1702000 1774000 1846000 0 0 0 0 0 0 0 9 8 7 7 7 7 6 Note: IFR(Intrinsic Fail Rate,>168 Hours) Cumulative 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 FIT PPM EFR(Early Fail Rate, =<168 Hours) 9 8 7 6 5 4 3 2 1 0 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q3,09 Q1 08 Q2 08 Q3 08 Q4 08 Q1 09 Q3 09 Year Year RELIABILITY HTOL DATA @125 °C FOUNDRY: TSMC Taiwan, Process: 0.18 µm CMOS EFR (Early Fail Rate,=< 168 Hours) YEAR 2005 2006 Q1,07 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 FITs @ 60% CL, 55C, Ea = 0.7eV Sample # Failure PPM Sample Cum Dev # Failure FITs 480 480 120 120 119 120 120 120 120 120 120 120 120 120 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 480 479 120 120 119 120 120 120 120 120 120 120 119 120 838,168 1,314,668 1,434,668 1,554,668 1,653,676 1,773,676 1,833,676 2,013,676 2,133,676 2,253,676 2,373,676 2,493,676 2,612,676 2,732,676 0 1* 0 0 0 0 0 0 0 0 0 0 1** 0 14 20 18 17 16 15 14 13 12 12 11 10 10 10 Note: * = 1 unit functional failure, root cause could not be determined, random failure. ** = invalid reject at 500 hrs due to missing solder balls IFR(Intrinsic Fail Rate,>168 Hours) Cumulative 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 16 14 12 10 8 6 4 2 0 FIT PPM EFR(Early Fail Rate, =<168 Hours) Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 Year Year RELIABILITY HTOL DATA @125 °C FOUNDRY: TSMC Taiwan, Process: 0.25 µm CMOS YEAR 2005 2006 Q1,07 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q1,09 Q2,09 Q3,09 Q4,09 EFR (Early Fail Rate,=< 168 Hours) FITs @ 60% CL, 55C, Ea = 0.7eV Sample # Failure PPM Sample Cum Dev # Failure FITs 480 480 120 119 120 120 120 120 100 100 100 100 100 0 0 0 0 0 0 0 0 0**** 0**** 0**** 0**** 0**** 0 0 0 0 0 0 0 0 0 0 0 0 0 477 480 120 119 111 120 120 120 100 100 100 100 100 1,138,096 1,528,096 1,587,764 1,675,264 1,786,246 1,906,264 1,966,264 2,026,264 2,126,264 2,226,264 2,326,264 2,426,264 2,526,264 3* 0 0 1* 9** 0 0 1*** 0**** 0**** 0**** 0**** 0**** 10 7 7 7 7 6 6 13 12 12 11 11 10 Note: * = mechanical damage after 500 hrs ** = 9 mechanical damage after 1KH ***= 1 unit functional failure after 1000 hrs, root cause could not be determined, random failure. ****= TSMC Process HTOL Reliability Data. IFR(Intrinsic Fail Rate,>168 Hours) Cumulative 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 14 12 10 8 6 4 2 0 FIT PPM EFR(Early Fail Rate, =<168 Hours) Q1,08 Q2,08 Q3,08 Q1,09 Q2,09 Q3,09 Q4,09 Year Year RELIABILITY HTOL DATA @125 °C FOUNDRY: Seiko-Epson Japan, Process: 0.35 µm CMOS EFR (Early Fail Rate,=< 168 Hours) YEAR 2003 2004 2005 2006 Q1,07 Q2,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3/Q4,09 FITs @ 60% CL, 55C, Ea = 0.7eV Sample # Failure PPM Sample Cum Dev # Failure FITs 315 450 225 225 45 66 44 132 22 44 135 135 135 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 315 450 225 225 45 66 44 132 22 44 135 135 135 240,120 734,230 914,240 1,071,240 1,093,740 1,104,740 1,126,740 1,214,740 1,225,740 1,269,740 1,337,240 1,404,740 1,539,740 0 0 0 0 0 0 0 0 0 0 0 0 0 24 16 13 11 11 11 10 10 10 9 9 8 8 Note: IFR(Intrinsic Fail Rate,>168 Hours) Cumulative 1 0.9 0.8 0.7 0 7 0.6 0.5 0.4 0.3 0.2 0.1 0 FIT PPM EFR(Early Fail Rate, =<168 Hours) 12 10 8 6 4 2 0 Q1,08 Year Q2,08 Q3,08 Q4,08 Year Q1,09 Q2,09 Q3/Q4,09 RELIABILITY STRESS DATA Temperature Cycle Test >=500 Cycles, -65/+150 ˚C YEAR Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 2004 2005 2006 Q1,07 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q Q1,09 Q2,09 Q3,09 Q4,09 2004 2005 2006 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 PKG SAMPLE TYPE SIZE H/FCBGA H/FCBGA H/FCBGA H/FCBGA H/FCBGA H/FCBGA H/FCBGA H/FCBGA HSBGA HSBGA HSBGA HSBGA HSBGA HSBGA HSBGA HSBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA G PBGA PBGA PBGA QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP 45 45 90 90 180 135 180 149 135 120 120 90 270 270 255 114 993 1158 1347 390 270 270 405 480 525 480 300 270 210 210 242 318 428 375 180 132 150 252 140 184 75 120 120 215 174 500 cycles 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 FAILURE RATE FINAL RESULT (%) (PASS/FAIL) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS SS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS Note: ASSEMBLY SUBCON ASE, Kaohsiung ASE, Malaysia NEC, Japan Seiko-Epson, Japan STATS ChiPAC, Korea STATS ChiPAC, Singapore UTAC, Singapore PACKAGE TECHNOLOGIES EPQFP, PBGA, HSBGA, HFCBGA PQFP, PBGA, HSBGA PQFP, PBGA, FBGA PQFP, PBGA PBGA, HSBGA PQFP PQFP, EPQFP RELIABILITY STRESS DATA Temperature Humidity Test 85/85 or HAST YEAR Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 2004 2005 2006 Q1,07 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1 09 Q1,09 Q2,09 Q3,09 Q4,09 2004 2005 2006 Q2,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 PKG SAMPLE FAILURE RATE FINAL RESULT TYPE SIZE (%) (PASS/FAIL) H/FCBGA H/FCBGA H/FCBGA H/FCBGA H/FCBGA H/FCBGA H/FCBGA H/FCBGA HSBGA HSBGA HSBGA HSBGA HSBGA HSBGA HSBGA HSBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP 45 45 90 90 180 135 180 90 135 120 120 90 270 270 255 114 983 1114 1870 90 270 360 360 480 525 480 300 270 210 210 242 245 1324 706 30 186 96 118 75 75 75 125 52 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS Note: Conditions for 85/85 are 1000 Hours, 85C, 85%RH. HAST is an alternative stress with conditions of 96 Hours, 130C, 85%RH. ASSEMBLY SUBCON ASE, Kaohsiung ASE, Malaysia NEC, Japan Seiko-Epson, Japan STATS ChiPAC, Korea STATS ChiPAC, Singapore UTAC, Singapore PACKAGE TECHNOLOGIES EPQFP, PBGA, HSBGA, HFCBGA PQFP, PBGA, HSBGA PQFP, PBGA, FBGA PQFP, PBGA PBGA, HSBGA PQFP PQFP, EPQFP RELIABILITY STRESS DATA Pressure Cooker Test: 168 Hours, 121 ˚C/ 100% RH YEAR Q1,08 Q2,08 Q3,08 Q3,09 Q4,09 2004 2005 2006 Q2,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q4,09 2004 2005 2006 Q1,07 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q2,09 Q3,09 Q3,09 PKG SAMPLE 96 Hours 168 Hours FAILURE RATE FINAL RESULT TYPE SIZE ( Ref ) ( Accep ) (%) (PASS/FAIL) HSBGA HSBGA HSBGA HSBGA HSBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP 90 30 30 30 30 128 830 142 30 30 30 30 30 30 30 30 30 623 980 3794 150 360 390 495 120 140 184 30 30 30 125 152 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS Note: ASSEMBLY SUBCON ASE, Kaohsiung ASE, Malaysia NEC, Japan Seiko-Epson, Japan STATS ChiPAC, Korea STATS ChiPAC, Singapore UTAC, Singapore PACKAGE TECHNOLOGIES EPQFP, PBGA, HSBGA, HFCBGA PQFP, PBGA, HSBGA PQFP, PBGA, FBGA PQFP, PBGA PBGA, HSBGA PQFP PQFP, EPQFP