PCA9554/PCA9554A 8-bit I2C-bus and SMBus I/O port with interrupt Rev. 07 — 13 November 2006 Product data sheet 1. General description The PCA9554 and PCA9554A are 16-pin CMOS devices that provide 8 bits of General Purpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and were developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements include higher drive capability, 5 V I/O tolerance, lower supply current, individual I/O configuration, 400 kHz clock frequency, and smaller packaging. I/O expanders provide a simple solution when additional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc. The PCA9554/PCA9554A consist of an 8-bit Configuration register (Input or Output selection); 8-bit Input Port register, 8-bit Output Port register and an 8-bit Polarity Inversion register (active HIGH or active LOW operation). The system master can enable the I/Os as either inputs or outputs by writing to the I/O configuration bits. The data for each input or output is kept in the corresponding Input Port or Output Port register. The polarity of the read register can be inverted with the Polarity Inversion register. All registers can be read by the system master. Although pin-to-pin and I2C-bus address compatible with the PCF8574 series, software changes are required due to the enhancements and are discussed in Application Note AN469. The PCA9554/PCA9554A open-drain interrupt output is activated when any input state differs from its corresponding Input Port register state and is used to indicate to the system master that an input state has changed. The power-on reset sets the registers to their default values and initializes the device state machine. Three hardware pins (A0, A1, A2) vary the fixed I2C-bus address and allow up to eight devices to share the same I2C-bus/SMBus. The PCA9554A is identical to the PCA9554 except that the fixed I2C-bus address is different allowing up to sixteen of these devices (eight of each) on the same I2C-bus/SMBus. 2. Features n n n n n n n n n n Operating power supply voltage range of 2.3 V to 5.5 V 5 V tolerant I/Os Polarity Inversion register Active LOW interrupt output Low standby current Noise filter on SCL/SDA inputs No glitch on power-up Internal power-on reset 8 I/O pins which default to 8 inputs 0 Hz to 400 kHz clock frequency PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt n ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101 n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA n Packages offered: DIP16, SO16, SSOP16, SSOP20, TSSOP16, HVQFN16 (2 versions: 4 × 4 × 0.85 mm and 3 × 3 × 0.85 mm), and bare die 3. Ordering information Table 1. Ordering information Tamb = −40 °C to +85 °C. Type number Topside mark PCA9554N PCA9554N PCA9554AN PCA9554AN PCA9554D PCA9554D PCA9554AD PCA9554AD PCA9554DB 9554DB PCA9554ADB 9554A PCA9554TS PCA9554 PCA9554ATS PA9554A PCA9554PW 9554DH PCA9554APW 9554ADH PCA9554BS 9554 PCA9554ABS 554A PCA9554BS3 P54 PCA9554ABS3 54A PCA9554U - Package Name Description Version DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 × 4 × 0.85 mm SOT629-1 HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 × 3 × 0.85 mm SOT758-1 bare die - - PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 2 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 4. Block diagram PCA9554/PCA9554A A0 A1 A2 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 8-bit SCL SDA INPUT FILTER I2C-BUS/SMBus CONTROL write pulse VDD POWER-ON RESET INPUT/ OUTPUT PORTS read pulse VDD VSS LP FILTER INT 002aac492 All I/Os are set to inputs at reset. Fig 1. Block diagram of PCA9554/PCA9554A PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 3 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 5. Pinning information 5.1 Pinning PCA9554N PCA9554AN A0 1 16 VDD A1 2 15 SDA A2 3 14 SCL A0 1 16 VDD IO0 4 13 INT A1 2 15 SDA IO1 5 12 IO7 A2 3 IO0 4 IO1 5 IO2 6 11 IO6 IO3 7 10 IO5 VSS 8 IO2 6 11 IO6 IO3 7 10 IO5 VSS 9 8 IO4 002aac485 12 IO7 9 IO4 Fig 3. Pin configuration for SO16 A0 1 A1 2 16 VDD 15 SDA A2 3 14 SCL IO0 4 13 INT IO1 5 12 IO7 IO2 6 11 IO6 IO3 7 10 IO5 VSS 8 9 IO4 002aac487 Fig 4. Pin configuration for SSOP16 PCA9554_9554A_7 Product data sheet 13 INT 002aac486 Fig 2. Pin configuration for DIP16 PCA9554DB PCA9554ADB 14 SCL PCA9554D PCA9554AD A0 1 16 VDD A1 2 15 SDA A2 3 IO0 4 IO1 5 IO2 6 11 IO6 IO3 7 10 IO5 VSS 8 14 SCL PCA9554PW PCA9554APW 13 INT 12 IO7 9 IO4 002aac488 Fig 5. Pin configuration for TSSOP16 © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 4 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt INT 1 20 IO7 SCL 2 19 IO6 n.c. 3 18 n.c. SDA 4 VDD 5 A0 6 A1 7 14 IO3 n.c. 8 13 n.c. A2 9 12 IO2 IO0 10 11 IO1 17 IO5 16 IO4 PCA9554TS PCA9554ATS 15 VSS 002aac489 Fig 6. Pin configuration for SSOP20 13 SDA 14 VDD 3 10 IO7 IO2 4 9 IO2 4 9 IO6 002aac490 Fig 7. Pin configuration for HVQFN16 (SOT629-1) PCA9554_9554A_7 8 IO1 IO5 10 IO7 7 3 IO4 IO1 6 11 INT VSS 2 5 IO0 IO3 11 INT 8 2 IO5 IO0 7 12 SCL 6 1 IO4 A2 VSS 12 SCL 5 1 IO3 A2 Transparent top view Product data sheet 16 A1 terminal 1 index area 15 A0 PCA9554BS3 PCA9554ABS3 13 SDA 14 VDD 16 A1 terminal 1 index area 15 A0 PCA9554BS PCA9554ABS IO6 002aac491 Transparent top view Fig 8. Pin configuration for HVQFN16 (SOT758-1) © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 5 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 5.2 Pin description Table 2. Pin description Symbol Pin Description DIP16, SO16, SSOP16, TSSOP16 HVQFN16 SSOP20 A0 1 15 6 address input 0 A1 2 16 7 address input 1 A2 3 1 9 address input 2 IO0 4 2 10 input/output 0 IO1 5 3 11 input/output 1 IO2 6 4 12 input/output 2 IO3 7 5 14 input/output 3 VSS 8 6[1] 15 supply ground IO4 9 7 16 input/output 4 IO5 10 8 17 input/output 5 IO6 11 9 19 input/output 6 IO7 12 10 20 input/output 7 INT 13 11 1 interrupt output (open-drain) SCL 14 12 2 serial clock line SDA 15 13 4 serial data line VDD 16 14 5 supply voltage n.c. - - 3, 8, 13, 18 not connected [1] HVQFN package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the thermal pad region. 6. Functional description Refer to Figure 1 “Block diagram of PCA9554/PCA9554A”. 6.1 Registers 6.1.1 Command byte Table 3. Command byte Command Protocol Function 0 read byte Input Port register 1 read/write byte Output Port register 2 read/write byte Polarity Inversion register 3 read/write byte Configuration register The command byte is the first byte to follow the address byte during a write transmission. It is used as a pointer to determine which of the following registers will be written or read. PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 6 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 6.1.2 Register 0 - Input Port register This register is a read-only port. It reflects the incoming logic levels of the pins, regardless of whether the pin is defined as an input or an output by Register 3. Writes to this register have no effect. The default ‘X’ is determined by the externally applied logic level, normally ‘1’ when no external signal externally applied because of the internal pull-up resistors. Table 4. Register 0 - Input Port register bit description Bit Symbol Access Value Description 7 I7 read only X determined by externally applied logic level 6 I6 read only X 5 I5 read only X 4 I4 read only X 3 I3 read only X 2 I2 read only X 1 I1 read only X 0 I0 read only X 6.1.3 Register 1 - Output Port register This register reflects the outgoing logic levels of the pins defined as outputs by Register 3. Bit values in this register have no effect on pins defined as inputs. Reads from this register return the value that is in the flip-flop controlling the output selection, not the actual pin value. Table 5. Register 1 - Output Port register bit description Legend: * default value. Bit Symbol Access Value Description 7 O7 R 1* 6 O6 R 1* reflects outgoing logic levels of pins defined as outputs by Register 3 5 O5 R 1* 4 O4 R 1* 3 O3 R 1* 2 O2 R 1* 1 O1 R 1* 0 O0 R 1* PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 7 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 6.1.4 Register 2 - Polarity Inversion register This register allows the user to invert the polarity of the Input Port register data. If a bit in this register is set (written with ‘1’), the corresponding Input Port data is inverted. If a bit in this register is cleared (written with a ‘0’), the Input Port data polarity is retained. Table 6. Register 2 - Polarity Inversion register bit description Legend: * default value. Bit Symbol Access Value Description 7 N7 R/W 0* inverts polarity of Input Port register data 6 N6 R/W 0* 0 = Input Port register data retained (default value) 5 N5 R/W 0* 1 = Input Port register data inverted 4 N4 R/W 0* 3 N3 R/W 0* 2 N2 R/W 0* 1 N1 R/W 0* 0 N0 R/W 0* 6.1.5 Register 3 - Configuration register This register configures the directions of the I/O pins. If a bit in this register is set, the corresponding port pin is enabled as an input with high-impedance output driver. If a bit in this register is cleared, the corresponding port pin is enabled as an output. At reset, the I/Os are configured as inputs with a weak pull-up to VDD. Table 7. Register 3 - Configuration register bit description Legend: * default value. Bit Symbol Access Value Description 7 C7 R/W 1* configures the directions of the I/O pins 6 C6 R/W 1* 0 = corresponding port pin enabled as an output 5 C5 R/W 1* 4 C4 R/W 1* 1 = corresponding port pin configured as input (default value) 3 C3 R/W 1* 2 C2 R/W 1* 1 C1 R/W 1* 0 C0 R/W 1* 6.2 Power-on reset When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9554/PCA9554A in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCA9554/PCA9554A registers and state machine will initialize to their default states. Thereafter, VDD must be lowered below 0.2 V to reset the device. For a power reset cycle, VDD must be lowered below 0.2 V and then restored to the operating voltage. PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 8 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 6.3 Interrupt output The open-drain interrupt output is activated when one of the port pins change state and the pin is configured as an input. The interrupt is deactivated when the input returns to its previous state or the Input Port register is read. Note that changing an I/O from and output to an input may cause a false interrupt to occur if the state of the pin does not match the contents of the Input Port register. 6.4 I/O port When an I/O is configured as an input, FETs Q1 and Q2 are off, creating a high-impedance input with a weak pull-up (100 kΩ typ.) to VDD. The input voltage may be raised above VDD to a maximum of 5.5 V. If the I/O is configured as an output, then either Q1 or Q2 is enabled, depending on the state of the Output Port register. Care should be exercised if an external voltage is applied to an I/O configured as an output because of the low-impedance paths that exist between the pin and either VDD or VSS. data from shift register output port register data configuration register data from shift register D VDD Q1 Q FF write configuration pulse CK 100 kΩ D Q Q FF IO0 to IO7 write pulse CK Q2 output port register input port register D Q FF read pulse CK VSS input port register data to INT polarity inversion register data from shift register D Q polarity inversion register data FF write polarity pulse CK 002aac493 Remark: At power-on reset, all registers return to default values. Fig 9. Simplified schematic of IO0 to IO7 PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 9 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 6.5 Device address slave address 0 1 0 0 slave address A2 fixed A1 A0 R/W 0 1 1 1 fixed hardware selectable A2 A1 A0 R/W programmable 002aac494 002aac495 Fig 10. PCA9554 device address Fig 11. PCA9554A device address 6.6 Bus transactions Data is transmitted to the PCA9554/PCA9554A registers using the Write mode as shown in Figure 12 and Figure 13. Data is read from the PCA9554/PCA9554A registers using the Read mode as shown in Figure 14 and Figure 15. These devices do not implement an auto-increment function, so once a command byte has been sent, the register which was addressed will continue to be accessed by reads until a new command byte has been sent. SCL 1 2 3 4 5 6 7 8 9 slave address SDA S 0 1 0 command byte 0 A2 A1 A0 0 START condition A 0 0 0 0 0 0 data to port 0 1 A acknowledge from slave R/W acknowledge from slave A DATA 1 acknowledge from slave P STOP condition write to port tv(Q) data out from port data 1 valid 002aac472 Fig 12. Write to Output Port register SCL 1 2 3 4 5 6 7 8 9 slave address SDA S 0 1 0 0 A2 A1 A0 0 START condition data to register data to register command byte A R/W acknowledge from slave 0 0 0 0 0 0 1 1/0 A acknowledge from slave DATA A acknowledge from slave P STOP condition 002aac473 Fig 13. Write to Configuration register or Polarity Inversion register PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 10 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt slave address SDA S 0 1 0 0 A2 A1 A0 0 START condition A acknowledge from slave R/W acknowledge from slave data from register slave address (cont.) S 0 1 0 0 A2 A1 A0 1 (repeated) START condition (cont.) A command byte data from register DATA (first byte) A R/W DATA (last byte) A acknowledge from master acknowledge from slave NA no acknowledge from master at this moment master-transmitter becomes master-receiver and slave-receiver becomes slave-transmitter P STOP condition 002aac474 Fig 14. Read from register SCL 1 2 3 4 5 6 7 8 9 slave address SDA S 0 1 0 data from port 0 A2 A1 A0 1 START condition DATA 1 A A DATA 2 tv(INT_N) NA P no acknowledge from master STOP condition tsu(D) th(D) data into port DATA 4 acknowledge from master R/W acknowledge from slave read from port data from port DATA 3 DATA 4 trst(INT_N) INT 002aac475 This figure assumes the command byte has previously been programmed with 00h. Transfer of data can be stopped at any moment by a STOP condition. Fig 15. Read Input Port register PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 11 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 7. Application design-in information VDD (5 V) 10 kΩ 10 kΩ 10 kΩ 2 kΩ 10 kΩ VDD VDD MASTER CONTROLLER SCL SCL IO0 SUBSYSTEM 1 (e.g., temp. sensor) SDA SDA IO1 INT PCA9554 IO2 INT RESET IO3 INT SUBSYSTEM 2 (e.g., counter) IO4 VSS IO5 A IO6 IO7 A2 controlled switch (e.g., CBT device) enable A1 B A0 VSS ALARM SUBSYSTEM 3 (e.g., alarm system) VDD 002aac496 Device address configured as 0100 100X for this example. IO0, IO1, IO2 configured as outputs. IO3, IO4, IO5 configured as inputs. IO6 and IO7 are not used and must be configured as outputs. Fig 16. Typical application 8. Limiting values Table 8. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD Conditions Min Max Unit supply voltage −0.5 +6.0 V II input current - ±20 mA VI/O voltage on an input/output pin VSS − 0.5 5.5 V IO(IOn) output current on pin IOn - ±50 mA IDD supply current - 85 mA ISS ground supply current - 100 mA Ptot total power dissipation - 200 mW Tstg storage temperature −65 +150 °C Tamb ambient temperature −40 +85 °C operating PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 12 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 9. Static characteristics Table 9. Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supplies VDD supply voltage 2.3 - 5.5 V IDD supply current operating mode; VDD = 5.5 V; no load; fSCL = 100 kHz - 104 175 µA Istb standby current Standby mode; VDD = 5.5 V; no load; VI = VSS; fSCL = 0 kHz; I/O = inputs - 550 700 µA Standby mode; VDD = 5.5 V; no load; VI = VDD; fSCL = 0 kHz; I/O = inputs - 0.25 1 µA - 1.5 1.65 V VPOR power-on reset voltage no load; VI = VDD or VSS [1] Input SCL; input/output SDA VIL LOW-level input voltage −0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V IOL LOW-level output current VOL = 0.4 V 3 6 - mA IL leakage current VI = VDD = VSS −1 - +1 µA Ci input capacitance VI = VSS - 6 10 pF −0.5 - +0.8 V I/Os VIL LOW-level input voltage VIH HIGH-level input voltage IOL LOW-level output current VOH HIGH-level output voltage 2.0 - 5.5 V VOL = 0.5 V; VDD = 2.3 V [2] 8 10 - mA VOL = 0.7 V; VDD = 2.3 V [2] 10 13 - mA VOL = 0.5 V; VDD = 3.0 V [2] 8 14 - mA VOL = 0.7 V; VDD = 3.0 V [2] 10 19 - mA VOL = 0.5 V; VDD = 4.5 V [2] 8 17 - mA VOL = 0.7 V; VDD = 4.5 V [2] 10 24 - mA IOH = −8 mA; VDD = 2.3 V [3] 1.8 - - V IOH = −10 mA; VDD = 2.3 V [3] 1.7 - - V IOH = −8 mA; VDD = 3.0 V [3] 2.6 - - V IOH = −10 mA; VDD = 3.0 V [3] 2.5 - - V IOH = −8 mA; VDD = 4.75 V [3] 4.1 - - V IOH = −10 mA; VDD = 4.75 V [3] 4.0 - - V IIH input leakage current VDD = 3.6 V; VI = VDD - - 1 µA IIL input leakage current VDD = 5.5 V; VI = VSS - - −100 µA Ci input capacitance - 3.7 5 pF Co output capacitance - 3.7 5 pF 3 - - mA Interrupt INT IOL LOW-level output current VOL = 0.4 V PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 13 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt Table 9. Static characteristics …continued VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Select inputs A0, A1, A2 VIL LOW-level input voltage −0.5 - 0.8 V VIH HIGH-level input voltage 2.0 - 5.5 V ILI input leakage current −1 - 1 µA [1] VDD must be lowered to 0.2 V in order to reset part. [2] Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA. [3] The total current sourced by all I/Os must be limited to 85 mA. 10. Dynamic characteristics Table 10. Dynamic characteristics Symbol Parameter Conditions Standard-mode I2C-bus Min Max Fast-mode I2C-bus Min Max Unit fSCL SCL clock frequency 0 100 0 400 tBUF bus free time between a STOP and START condition 4.7 - 1.3 - kHz µs tHD;STA hold time (repeated) START condition 4.0 - 0.6 - µs tSU;STA set-up time for a repeated START condition 4.7 - 0.6 - µs tSU;STO set-up time for STOP condition 4.0 - 0.6 - µs tHD;DAT data hold time 0 - 0 - µs 0.3 3.45 0.1 0.9 µs 300 - 50 - ns tVD:ACK data valid acknowledge time [1] tVD;DAT data valid time [2] tSU;DAT data set-up time 250 - 100 - ns tLOW LOW period of the SCL clock 4.7 - 1.3 - µs tHIGH HIGH period of the SCL clock 4.0 - 0.6 - µs tr rise time of both SDA and SCL signals - 1000 20 + 0.1Cb[3] 300 ns tf fall time of both SDA and SCL signals - 300 20 + 0.1Cb[3] 300 µs tSP pulse width of spikes that must be suppressed by the input filter - 50 - 50 ns tv(Q) data output valid time - 200 - 200 ns tsu(D) data input setup time 100 - 100 - ns th(D) data input hold time 1 - 1 - µs Port timing Interrupt timing tv(INT_N) valid time on pin INT - 4 - 4 µs trst(INT_N) reset time on pin INT - 4 - 4 µs [1] tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW. [2] tVD;DAT = minimum time for SDA data output to be valid following SCL LOW. [3] Cb = total capacitance of one bus line in pF. PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 14 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt SDA tr tBUF tf tHD;STA tSP tLOW SCL tHD;STA P S tSU;STA tHD;DAT tHIGH tSU;DAT Sr tSU;STO P 002aaa986 Fig 17. Definition of timing PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 15 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 11. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.02 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.1 0.3 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT38-1 050G09 MO-001 SC-503-16 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 18. Package outline SOT38-1 (DIP16) PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 16 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp L 8 1 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 19. Package outline SOT162-1 (SO16) PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 17 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 8 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.00 0.55 8 o 0 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC JEITA MO-150 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 20. Package outline SOT338-1 (SSOP16) PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 18 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 1.5 0.15 0 1.4 1.2 0.25 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 o 0 o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC JEITA MO-152 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 21. Package outline SOT266-1 (SSOP20) PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 19 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 22. Package outline SOT403-1 (TSSOP16) PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 20 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm A B D SOT629-1 terminal 1 index area A A 1 E c detail X e1 C 1/2 e e 8 y y1 C v M C A B w M C b 5 L 9 4 e e2 Eh 1/2 e 1 12 terminal 1 index area 16 13 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.38 0.23 c D (1) Dh E (1) Eh 0.2 4.1 3.9 2.25 1.95 4.1 3.9 2.25 1.95 e e1 0.65 1.95 e2 L v w y y1 1.95 0.75 0.50 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT629-1 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-22 Fig 23. Package outline SOT629-1 (HVQFN16) PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 21 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm A B D SOT758-1 terminal 1 index area A E A1 c detail X e1 C 1/2 e e 5 y y1 C v M C A B w M C b 8 L 4 9 e e2 Eh 1/2 e 12 1 16 terminal 1 index area 13 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 3.1 2.9 1.75 1.45 3.1 2.9 1.75 1.45 e e1 1.5 0.5 e2 L v w y y1 1.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT758-1 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 02-03-25 02-10-21 Fig 24. Package outline SOT758-1 (HVQFN16) PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 22 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 12. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe you must take normal precautions appropriate to handling integrated circuits. 13. Soldering 13.1 Introduction There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 Through-hole mount packages 13.2.1 Soldering by dipping or by solder wave Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.2.2 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 °C and 400 °C, contact may be up to 5 seconds. 13.3 Surface mount packages 13.3.1 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 25) than a PbSn process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 23 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 11 and 12 Table 11. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) ≥ 350 < 350 < 2.5 235 220 ≥ 2.5 220 220 Table 12. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 25. temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 25. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 24 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 13.3.2 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.3.3 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 13.4 Package related soldering information Table 13. Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Through-hole mount Through-hole-surface mount Package[1] Soldering method Wave Reflow[2] Dipping CPGA, HCPGA suitable − − DBS, DIP, HDIP, RDBS, SDIP, SIL suitable[3] − suitable PMFP[4] not suitable not suitable − PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 25 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt Table 13. Suitability of IC packages for wave, reflow and dipping soldering methods …continued Mounting Package[1] Soldering method Wave Surface mount HTSSON..T[5], not suitable BGA, LBGA, LFBGA, SQFP, SSOP..T[5], TFBGA, VFBGA, XSON Reflow[2] Dipping suitable − DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable[6] suitable − PLCC[7], SO, SOJ suitable suitable − not recommended[7][8] suitable − SSOP, TSSOP, VSO, VSSOP not recommended[9] suitable − CWQCCN..L[10], not suitable not suitable − LQFP, QFP, TQFP WQCCN..L[10] [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your NXP Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). [3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [4] Hot bar soldering or manual soldering is suitable for PMFP packages. [5] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. [6] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [7] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [8] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [9] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 26 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 14. Abbreviations Table 14. Abbreviations Acronym Description ACPI Advanced Configuration and Power Interface CDM Charged Device Model CMOS Complementary Metal Oxide Semiconductor ESD ElectroStatic Discharge FET Field-Effect Transistor GPIO General Purpose Input/Output HBM Human Body Model I2C-bus Inter-Integrated Circuit bus I/O Input/Output LED Light-Emitting Diode MM Machine Model PCB Printed-Circuit Board POR Power-On Reset SMBus System Management Bus PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 27 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 15. Revision history Table 15. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA9554_9554A_7 20061113 Product data sheet - PCA9554_9554A_6 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • • • • • • • • Legal texts have been adapted to the new company name where appropriate. Added HVQFN16 (SOT758-1) and bare die package offerings Pin names I/O0 through I/O7 changed to IO0 through IO7 Table 2 “Pin description”: added Table note 1 and its reference at HVQFN pin 6 (VSS) Symbol (tpv and tPV) changed to tv(Q) Symbol (tph and tPH) changed to th(D) Symbol (tps and tPS) changed to tsu(D) Symbol (tiv and tIV) changed to tv(INT_N) Symbol (tir and tIR) changed to trst(INT_N) Figure 16 “Typical application” modified (deleted “PCA9554A”) Table 8 “Limiting values”: – Changed parameter description for symbol VI/O from “DC voltage on an I/O” to “voltage on an input/output pin” – Changed symbol “II/O, DC output current on an I/O” to “IO(IOn), output current on pin IOn” – Changed parameter description of ISS from “supply current” to “ground supply current” • Table 9 “Static characteristics”: – Symbols “Istbl” and “Istbh” replaced with “Istb” • Added Section 14 “Abbreviations” PCA9554_9554A_6 (9397 750 13289) 20040930 Product data - PCA9554_9554A_5 (9397 750 10163) 20020726 Product data 853-2243 28672 of PCA9554_9554A_4 26 July 2002 PCA9554_9554A_4 (9397 750 09817) 20020513 Product specification - PCA9554_9554A_3 PCA9554_9554A_3 (9397 750 08342) 20010507 Product specification - PCA9554_9554A_2 PCA9554_9554A_2 (9397 750 08209) 20010319 Product specification - PCA9554_9554A_1 PCA9554_9554A_1 (9397 750 08159) 20010319 Product specification - - PCA9554_9554A_7 Product data sheet PCA9554_9554A_5 © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 28 of 30 PCA9554/PCA9554A NXP Semiconductors 8-bit I2C-bus and SMBus I/O port with interrupt 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] PCA9554_9554A_7 Product data sheet © NXP B.V. 2006. All rights reserved. Rev. 07 — 13 November 2006 29 of 30 NXP Semiconductors PCA9554/PCA9554A 8-bit I2C-bus and SMBus I/O port with interrupt 18. Contents 1 2 3 4 5 5.1 5.2 6 6.1 6.1.1 6.1.2 6.1.3 6.1.4 6.1.5 6.2 6.3 6.4 6.5 6.6 7 8 9 10 11 12 13 13.1 13.2 13.2.1 13.2.2 13.3 13.3.1 13.3.2 13.3.3 13.4 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 Functional description . . . . . . . . . . . . . . . . . . . 6 Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Command byte . . . . . . . . . . . . . . . . . . . . . . . . . 6 Register 0 - Input Port register . . . . . . . . . . . . . 7 Register 1 - Output Port register. . . . . . . . . . . . 7 Register 2 - Polarity Inversion register . . . . . . . 8 Register 3 - Configuration register . . . . . . . . . . 8 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . . 9 I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Device address . . . . . . . . . . . . . . . . . . . . . . . . 10 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 10 Application design-in information . . . . . . . . . 12 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12 Static characteristics. . . . . . . . . . . . . . . . . . . . 13 Dynamic characteristics . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Handling information. . . . . . . . . . . . . . . . . . . . 23 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Through-hole mount packages . . . . . . . . . . . . 23 Soldering by dipping or by solder wave . . . . . 23 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23 Surface mount packages . . . . . . . . . . . . . . . . 23 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 25 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 25 Package related soldering information . . . . . . 25 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28 Legal information. . . . . . . . . . . . . . . . . . . . . . . 29 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 29 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Contact information. . . . . . . . . . . . . . . . . . . . . 29 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 13 November 2006 Document identifier: PCA9554_9554A_7