Yes

LTM9011-BGA-PBF 140LD 11.25mm X 9mm X 2.72mm (TABLE OF MATERIAL DECLARATION)
The LTM9011 is RoHS compliant per EU RoHS Directive 2003/95/EC.
It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+),
polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE)
Material Mass
Component
Materials Analysis (element)
CAS Number
No.
Part Name
Material Name
(gram)
Weight (gram)
Barium Compounds
7727-43-7
0.00259
0.0954
1
Substrate
Circuit Board
Bismaleimide/Triazine/Resin/Filler Substance(Silica 105391-33-1,1156-51-0/9003-36-5/21645-510.01746
Crystalline)
2
Copper Metal
7440-50-8
0.06308
Copper Compounds
1328-53-6
0.00002
Ecotoxic substances
7440-38-2, 7440-28-0
0.00001
Gold metal or alloy
7440-57-5
0.00030
Nickel
7440-02-0
0.00191
Zinc
7440-66-6
0.00015
Continuous Filament Fiber Glass
65997-17-3
0.00948
Chromium(III) Oxide
1308-38-9
0.00000
Silica amorphous
7631-86-9
0.00005
Talc;not containing fibers like asbestos
14807-96-9
0.00030
Cyanoguanidine
461-58-5
0.00001
Calcium caobonate
471-34-1
0.00000
Solder Paste
2
Alloy
0.0045
Sn
7440-31-5
0.00425
Sb
7440-36-0
0.00022
0.0002
3
Epoxy I
Di-ester resin
non-disclosure
0.00002
Functionalized ester
non-disclosure
0.00002
Silver
7440-22-4
0.00014
Epoxy II
0.0010
4
Ethyl acetate
112-15-2
0.00029
Phenol bis polymer
25036-25-3
0.00029
Bisphenol-A
25068-38-6
0.00019
epoxy resin
Aromatic amine Proprietary
non-disclosure
0.00019
5
Passive/Active
0.0308
7440-50-8
0.00986
Copper (Cu)
Components
7440-02-0
0.00246
Nickel (Ni)
7440-31-5
0.00074
Tin (Sn)
12047-27-7
0.01774
Ceramic (Ba) Compounds
6
Active Ics
Silicon
0.0106
Silicon
7440-21-3
0.01062
7
Wire
Gold
0.0064
Au
7440-57-5
0.00636
Sn
SAC305
0.0674
8
Solder Ball
7440-31-5
0.06502
Ag
7440-22-4
0.00202
Cu
7440-50-8
0.00034
Epoxy Resin
0.3786
9
Encapsulation
Fused Silica
60676-86-0
0.29230
Epoxy Resin
non-disclosure
0.03370
Phenol Resin
non-disclosure
0.03370
Crytalline Silica
14808-60-7
0.01136
Carbon Black
1333-86-4
0.00189
Metal Hydroxide
non-disclosure
0.00568
Total Package Weight
0.5948
Note: Composition derived from MSDS and material C of C from Vendors
Component Weight based on assembly of generic parts
Materials Analysis
(weight %)
2.72
18.31
66.14
0.02
0.02
0.31
2.00
0.16
9.94
0.01
0.06
0.31
0.01
0.00
95.00
5.00
10.00
10.00
80.00
30.00
30.00
20.00
20.00
32.00
8.00
2.40
57.60
100.00
99.99
96.50
3.00
0.50
77.20
8.90
8.90
3.00
0.50
1.50