No. Part Name 1 Substrate 2 Solder Paste 3 Components 3(i) FC-DFN Active Ics Solder Paste LTM4648 68LD BGA-PBF 15mm X 9mm X 4.92mm (TABLE OF MATERIAL DECLARATION) This Package is RoHS compliant per EU RoHS Directive 2003/95/EC. It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+) polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) Component Material Mass Material Name Materials Analysis (element) CAS Number Weight (gram) (gram) Circuit Board 0.1270 Barium Compounds 7727-43-7 0.00498 105391-33-1 Bismaleimide/Triazine Resin/Filler Substances (Silica 1156-51-0/9003-36-5/21645-51-2 0.03009 Crystalline) *non-disclosure Copper Metal 7440-50-8 0.05163 Copper Compounds 147-14-8 0.00004 **Ecotoxic substances 7439-92-1 0.00000 Phosphorus 7723-14-0 0.00018 Palladium 7440-05-3 0.00003 Gold metal or alloy 7440-57-5 0.00009 Nickel 7440-02-0 0.00193 Zinc 7440-66-6 0.00001 Continuous Filament Fiber Glass 65997-17-3 0.02668 Acrylic Resin *non-disclosure 0.00947 Epoxy Resin *non-disclosure 0.00015 Chromium(III) oxide 1308-38-9 0.00000 Silica amorphous 7631-86-9 0.00025 Talc;not containing fibers like asbestos 14807-96-6 0.00057 Aromatic carbonyl compounds non-disclosure 0.00055 Cyanoguanidine 461-58-5 0.00002 Calcium caobonate 471-34-1 0.00003 Amine compounds *non-disclosure 0.00008 Leveling agent and others *non-disclosure 0.00022 Alloy 0.0113 Tin (Sn) 7440-31-5 0.01077 Antimony (Sb) 7440-36-0 0.00057 Passive/Active 0.5926 Iron Powder (Fe) 7439-89-6 0.45595 Copper (Cu) 7440-50-8 0.11535 Nickel (Ni) 7440-02-0 0.00259 Tin (Sn) 7440-31-5 0.00410 Ceramic (Ba) Compounds 12047-27-7 0.01460 0.0235 Silicon Silicon (Si) 7440-21-3 0.00117 Alloy Phenolic Resin 54208-63-8 0.00004 Encapsulation Epoxy Resin Lead frame Lead frame Terminal Finish Precious Metals Silver (Ag) Carbon Black Epoxy Resin Silica (Si) Copper (Cu) Iron (Fe) Zinc (Zn) Gold (Au) Nickel(Ni) Paladium(Pd) 7440-22-4 1333-86-4 29690-82-2 60676-86-0 7440-50-8 7439-89-6 7440-66-6 7440-57-5 7440-02-0 5/3/7440 0.00018 0.00013 0.00244 0.01024 0.00831 0.00020 0.00001 0.00000 0.00020 0.00002 Materials Analysis (weight %) 3.92 23.69 40.65 0.03 0.00 0.14 0.02 0.07 1.52 0.01 21.01 7.46 0.12 0.00 0.20 0.45 0.43 0.01 0.02 0.06 0.18 95.00 5.00 76.94 19.46 0.44 0.69 2.46 4.98 0.19 0.75 0.55 10.39 43.65 35.44 0.87 0.05 0.01 0.85 0.08 Wire 3(ii) Copper Active Ics Copper (Cu) 7440-50-8 0.00051 2.19 Silicon (Si) Copper (Cu) Iron (Fe) Zinc (Zn) Lead (Pb) Silver (Ag) Tin (Sn) Carbon Black epoxy resin Phenol Silica (Si) Copper (Cu) Iron (Fe) Zinc (Zn) Tin (Sn) Silicon (Si) Gold (Au) Tin (Sn) Silver (Ag) Copper (Cu) Fused Silica Epoxy Resin Phenol Resin Crytalline Silica Carbon Black Metal Hydroxide 7440-21-3 7440-50-8 7439-89-6 7440-66-6 7439-92-1 7440-22-4 7440-31-5 1333-86-4 29690-82-2 9003-35-4 60676-86-0 7440-50-8 7439-89-6 7440-66-6 7440-31-5 7440-21-3 7440-57-5 7440-31-5 7440-22-4 7440-50-8 60676-86-0 non-disclosure non-disclosure 14808-60-7 1333-86-4 non-disclosure 0.00055 0.00440 0.00011 0.00001 0.00103 0.00003 0.00006 0.00008 0.00040 0.00040 0.00706 0.01098 0.00027 0.00001 0.01399 0.00186 0.00110 0.11066 0.00344 0.00057 0.62493 0.07205 0.07205 0.02429 0.00405 0.01214 1.40 11.17 0.28 0.01 2.61 0.07 0.14 0.20 1.01 1.01 17.94 27.89 0.69 0.04 35.54 100.00 99.99 96.50 3.00 0.50 77.20 8.90 8.90 3.00 0.50 1.50 0.0394 FC-DFN Silicon Copper Clip Clip Solder Paste Alloy Encapsulation Epoxy Resin Lead frame Lead frame 4 5 6 Terminal Finish Active Ics Wire Solder Ball Copper Alloy Silicon Gold Alloy 0.0019 0.0011 0.1147 7 Encapsulation Epoxy Resin 0.8095 Total Package Weight 1.7209 Note: Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts