Yes

No.
Part Name
1
Substrate
2
Solder Paste
3
Components
3(i)
FC-DFN
Active Ics
Solder Paste
LTM4648 68LD BGA-PBF 15mm X 9mm X 4.92mm (TABLE OF MATERIAL DECLARATION)
This Package is RoHS compliant per EU RoHS Directive 2003/95/EC.
It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+)
polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE)
Component
Material Mass
Material Name
Materials Analysis (element)
CAS Number
Weight (gram)
(gram)
Circuit Board
0.1270
Barium Compounds
7727-43-7
0.00498
105391-33-1
Bismaleimide/Triazine Resin/Filler Substances (Silica
1156-51-0/9003-36-5/21645-51-2
0.03009
Crystalline)
*non-disclosure
Copper Metal
7440-50-8
0.05163
Copper Compounds
147-14-8
0.00004
**Ecotoxic substances
7439-92-1
0.00000
Phosphorus
7723-14-0
0.00018
Palladium
7440-05-3
0.00003
Gold metal or alloy
7440-57-5
0.00009
Nickel
7440-02-0
0.00193
Zinc
7440-66-6
0.00001
Continuous Filament Fiber Glass
65997-17-3
0.02668
Acrylic Resin
*non-disclosure
0.00947
Epoxy Resin
*non-disclosure
0.00015
Chromium(III) oxide
1308-38-9
0.00000
Silica amorphous
7631-86-9
0.00025
Talc;not containing fibers like asbestos
14807-96-6
0.00057
Aromatic carbonyl compounds
non-disclosure
0.00055
Cyanoguanidine
461-58-5
0.00002
Calcium caobonate
471-34-1
0.00003
Amine compounds
*non-disclosure
0.00008
Leveling agent and others
*non-disclosure
0.00022
Alloy
0.0113
Tin (Sn)
7440-31-5
0.01077
Antimony (Sb)
7440-36-0
0.00057
Passive/Active
0.5926
Iron Powder (Fe)
7439-89-6
0.45595
Copper (Cu)
7440-50-8
0.11535
Nickel (Ni)
7440-02-0
0.00259
Tin (Sn)
7440-31-5
0.00410
Ceramic (Ba) Compounds
12047-27-7
0.01460
0.0235
Silicon
Silicon (Si)
7440-21-3
0.00117
Alloy
Phenolic Resin
54208-63-8
0.00004
Encapsulation
Epoxy Resin
Lead frame
Lead frame
Terminal Finish
Precious Metals
Silver (Ag)
Carbon Black
Epoxy Resin
Silica (Si)
Copper (Cu)
Iron (Fe)
Zinc (Zn)
Gold (Au)
Nickel(Ni)
Paladium(Pd)
7440-22-4
1333-86-4
29690-82-2
60676-86-0
7440-50-8
7439-89-6
7440-66-6
7440-57-5
7440-02-0
5/3/7440
0.00018
0.00013
0.00244
0.01024
0.00831
0.00020
0.00001
0.00000
0.00020
0.00002
Materials Analysis
(weight %)
3.92
23.69
40.65
0.03
0.00
0.14
0.02
0.07
1.52
0.01
21.01
7.46
0.12
0.00
0.20
0.45
0.43
0.01
0.02
0.06
0.18
95.00
5.00
76.94
19.46
0.44
0.69
2.46
4.98
0.19
0.75
0.55
10.39
43.65
35.44
0.87
0.05
0.01
0.85
0.08
Wire
3(ii)
Copper
Active Ics
Copper (Cu)
7440-50-8
0.00051
2.19
Silicon (Si)
Copper (Cu)
Iron (Fe)
Zinc (Zn)
Lead (Pb)
Silver (Ag)
Tin (Sn)
Carbon Black
epoxy resin
Phenol
Silica (Si)
Copper (Cu)
Iron (Fe)
Zinc (Zn)
Tin (Sn)
Silicon (Si)
Gold (Au)
Tin (Sn)
Silver (Ag)
Copper (Cu)
Fused Silica
Epoxy Resin
Phenol Resin
Crytalline Silica
Carbon Black
Metal Hydroxide
7440-21-3
7440-50-8
7439-89-6
7440-66-6
7439-92-1
7440-22-4
7440-31-5
1333-86-4
29690-82-2
9003-35-4
60676-86-0
7440-50-8
7439-89-6
7440-66-6
7440-31-5
7440-21-3
7440-57-5
7440-31-5
7440-22-4
7440-50-8
60676-86-0
non-disclosure
non-disclosure
14808-60-7
1333-86-4
non-disclosure
0.00055
0.00440
0.00011
0.00001
0.00103
0.00003
0.00006
0.00008
0.00040
0.00040
0.00706
0.01098
0.00027
0.00001
0.01399
0.00186
0.00110
0.11066
0.00344
0.00057
0.62493
0.07205
0.07205
0.02429
0.00405
0.01214
1.40
11.17
0.28
0.01
2.61
0.07
0.14
0.20
1.01
1.01
17.94
27.89
0.69
0.04
35.54
100.00
99.99
96.50
3.00
0.50
77.20
8.90
8.90
3.00
0.50
1.50
0.0394
FC-DFN
Silicon
Copper Clip
Clip
Solder Paste
Alloy
Encapsulation
Epoxy Resin
Lead frame
Lead frame
4
5
6
Terminal Finish
Active Ics
Wire
Solder Ball
Copper Alloy
Silicon
Gold
Alloy
0.0019
0.0011
0.1147
7
Encapsulation
Epoxy Resin
0.8095
Total Package Weight
1.7209
Note: Composition derived from MSDS and material C of C from Vendors
Component Weight based on assembly of generic parts