Yes

LTM4632 25LD LGA 6.25mm X 6.25mm X 1.82mm (TABLE OF MATERIAL DECLARATION)
This Package is RoHS compliant per EU RoHS Directive 2003/95/EC.
It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+)
polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE)
Component
Material Mass
No.
Part Name
Material Name
Materials Analysis (element)
CAS Number
Weight (gram)
(gram)
1
Substrate
Circuit Board
0.0367
105391-33-1
Bismaleimide/Triazine Resin/Filler Substances (Silica
0.00685
1156-51-0/9003-36-5/21645-51-2
Crystalline)
*non-disclosure
Continuous Filament Fiber Glass
65997-17-3
0.00608
Copper Metal
7440-50-8
0.01902
Zinc
7440-66-6
0.00000
Chromium(III) oxide
1308-38-9
0.00000
Epoxy Resin
*non-disclosure
0.00002
Barium Compounds
7727-43-7
0.00121
Silica amorphous
7631-86-9
0.00004
Calcium caobonate
471-34-1
0.00000
Amine compounds
*non-disclosure
0.00002
Leveling agent and others
*non-disclosure
0.00005
Acrylic Resin
*non-disclosure
0.00231
Copper Compounds
147-14-8
0.00001
Talc;not containing fibers like asbestos
14807-96-6
0.00014
Aromatic carbonyl compounds
*non-disclosure
0.00013
Cyanoguanidine
461-58-5
0.00000
Nickel
7440-02-0
0.00068
Phosphorus
*non-disclosure
0.00005
Gold
7440-57-5
0.00003
Palladium
7440-05-3
0.00001
7440-38-2
**Ecotoxic substances
0.00001
7439-92-1
2
Solder Paste
Alloy
0.0033
Tin (Sn)
7440-31-5
0.00312
Antimony (Sb)
7440-36-0
0.00016
3
Components
Passive/Active
0.0760
Iron Powder (Fe)
7439-89-6
0.05293
Copper (Cu)
7440-50-8
0.01570
Nickel (Ni)
7440-02-0
0.00088
Tin (Sn)
7440-31-5
0.00065
Ceramic (Ba) Compounds
12047-27-7
0.00585
4
Active Ics
Silicon
0.0024
Silicon (Si)
7440-21-3
0.00240
5
Wire
Gold
0.0006
Gold (Au)
7440-57-5
0.00062
7
Encapsulation
Epoxy Resin
0.0931
Fused Silica
60676-86-0
0.07184
Epoxy Resin
non-disclosure
0.00828
Phenol Resin
non-disclosure
0.00828
Crytalline Silica
14808-60-7
0.00279
Carbon Black
1333-86-4
0.00047
Metal Hydroxide
non-disclosure
0.00140
Total Package Weight
0.2120
Note: Composition derived from MSDS and material C of C from Vendors
Component Weight based on assembly of generic parts
Materials Analysis
(weight %)
18.69
16.58
51.86
0.00
0.00
0.06
3.30
0.11
0.01
0.05
0.15
6.29
0.03
0.38
0.36
0.01
1.85
0.14
0.09
0.03
0.02
95.00
5.00
69.65
20.65
1.16
0.85
7.69
100.00
99.99
77.20
8.90
8.90
3.00
0.50
1.50