SPEC NO. 05-08-5117 REV. K RH1021C-5 PRECISION 5V REFERENCE DICE REVISION RECORD REV DESCRIPTION DATE 0 INITIAL RELEASE 09/22/99 A PAGE 9: FIGURE 1, TO5 CASE OUTLINE, CHANGED θja FROM 180°C/W TO 150°C/W. 11/17/99 B PAGE 3, PARAGRAPH 3.8 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 1. PAGE 4, PARAGRAPH 5.Ø CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 3. PARAGRAPH 5.2 ADDED “HEREIN” AFTER TABLE 2. PAGE 5, PARAGRAPH 6.2, 6.3 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 3. • PAGE 3, PARAGRAPH 3.7.1, CHANGED THE DOSAGE RATE FROM “APPROXIMATELY 20 RADS PER SECOND” TO “LESS THAN OR EQUAL TO 10 RADS PER SECOND”. • PAGE 5, PARAGRAPH 6.1 CHANGED QUALITY ASSURANCE PROVISIONS TO STATE THAT LTC IS QML CERTIFIED AND THAT RAD HARD CANDIDATES ARE ASSEMBLED ON QUALIFIED ON CLASS S MANUFACTURING LINES. • PAGE 7, FIGURE 2, TOTAL DOSE BIAS CURRENT REVISED BY ENGINEERING. • CHANGED PAGE 11, TABLE II, ELECTRICAL CHARACTERISTICS, POST IRRADIATION, PARAMETER – VOUT, LIMITS, AT 10K, 20K, 50K, 100K, AND 200K RADS TO MATCH THE DATASHEET. • CONVERSION OF SPECIFICATION FROM WORD PERFECT TO MICROSOFT WORD. • PAGE 3, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC. • Page 3, Changed shunt mode current voltage from 16v to 10v and added Note: Absolute maximum ratings are those values beyond which the life of a device may be impaired. • Page 3, Changed (Shunt Mode Current Voltage) to (Sink Mode Current Limit) per data sheet rev D. And changed Table II Electrical Characteristics – Post-Irradiation per data sheet. • PAGE 3, PARAGRAPH 3.7.1 CHANGED VERBIAGE • PAGE 12, CHANGED RH CANNED SAMPLE TABLE III FOR QUALIFYING DICE SALES ADDED TEMPERATURE CYCLE, CONSTANT ACCELERATION & REMOVED PIND TEST. PAGE 2, AMENDED SECTION 3.3, SPECIAL HANDLING OF DICE, TO MORE ACCURATELY DESCRIBE OUR CURRENT PROCEDURES AND REQUIREMENTS. • PAGE 12, REPLACED ILLEDGIBLE “RH CANNED SAMPLE TABLE FOR QUALIFYING DICE SALES” WITH A LEDGIBLE “RH CANNED SAMPLE TABLE FOR QUALIFYING DICE SALES” Page 12, Changed RH Canned Sample Table for Qualifying Dice Sales: Subgroup 6 Sample Size Series changed from 45 (3) to 65 (3). First note had the Sample Size Series from “15%” to “10%”. 01/04/00 C D E F G H I J K 03/26/02 03/21/05 08/17/05 01/24/06 05/06/08 02/12/09 03/30/12 05/23/12 7/2/13 CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART REVISION INDEX REVISION INDEX PAGE NO. REVISION PAGE NO. REVISION 1 K 2 K 3 K 4 K 5 K 6 K 7 K APPLICATION 9 K 10 K 11 K 12 K LINEAR TECHNOLOGY CORPORATION MILPITAS, CALIFORNIA ORIG DSGN ENGR MFG CM QA PROG FUNCT 8 K TITLE: MICROCIRCUIT, LINEAR, RH1021C-5, PRECISION 5V REFERENCE DICE SIZE SIGNOFFS DATE CAGE CODE 94155 CONTRACT: DRAWING NUMBER REV 05-08-5117 K FOR OFFICIAL USE ONLY LINEAR TECHNOLOGY CORPORATION PAGE 1 of 12 SPEC NO. 05-08-5117 REV. K 1.0 SCOPE: 1.1 2.0 RH1021C-5 PRECISION 5V REFERENCE DICE This specification defines the performance and test requirements for a microcircuit processed to a space level manufacturing flow. APPLICABLE DOCUMENTS: 2.1 Government Specifications and Standards: the following documents listed in the Department of Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this specification to the extent specified herein. SPECIFICATIONS: 2.2 3.0 MIL-PRF-38535 Integrated Circuits (Microcircuits) Manufacturing, General Specification for MIL-STD-883 Test Method and Procedures for Microcircuits MIL-STD-1835 Microcircuits Case Outlines Order of Precedence: In the event of a conflict between the documents referenced herein and the contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other referenced specifications. REQUIREMENTS: 3.1 General Description: This specification details the requirements for the RH1021C-5 Precision 5V Reference Dice and Element Evaluation Test Samples, processed to space level manufacturing flow as specified herein. 3.2 Part Number: 3.3 Special Handling of Dice: Rad Hard dice require special handling as compared to standard IC dice. Rad Hard dice are susceptible to surface damage due to the absence of silicon nitride passivation that is present on most standard dice. Silicon nitride protects the dice surface from scratches by its hard and dense properties. The passivation on Linear Technology’s Rad Hard dice is silicon dioxide which is much “softer” than silicon nitride. During the visual and preparation for shipment, ESD safe Tweezers are used and only the edge of the die are touched. RH1021C-5 Dice LTC recommends that dice handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the die in or out of the chip shipment tray (waffle pack), use an ESD-Safe-Plastic-tipped Bent Metal Vacuum Probe, preferably .020” OD x .010” ID (for use with tiny parts). The wand should be compatible with continuous air vacuums. The tip material should be static dissipative Delrin (or equivalent) plastic. During die attach, care must be exercised to ensure no tweezers, or other equipment, touch the top of the dice. LINEAR TECHNOLOGY CORPORATION PAGE 2 of 12 SPEC NO. 05-08-5117 REV. K 3.4 RH1021C-5 PRECISION 5V REFERENCE DICE The Absolute Maximum Ratings: Input Voltage . . . . . . . . . . . . . . . . 40V Input-Output Voltage Differential . . . . . . . . . . 35V Output to Ground Voltage (Sink Mode Current Limit) . . . . . . . . . 10V Trim Pin to Ground Voltage Positive . . . . . . . . . . . . . . . Equal to VOUT Negative . . . . . . . . . . . . . . . -20V Output Short Circuit Duration VIN = 35V . . . . . . . . . . . . . . . 10 sec VIN = < 20V . . . . . . . . . . . . . . Indefinite Operating Temperature Range . . . . . . . . . . . -55°C to 125°C Storage Temperature Range . . . . . . . . . . . . -65°C to 150°C NOTE: Absolute maximum ratings are those values beyond which the life of a device may be impaired. 3.5 Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and electrical requirements shall be specified herein. 3.6 Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall be specified in Figure 1. 3.7 Radiation Hardness Assurance (RHA): 3.7.1 The manufacturer shall perform a lot sample test as an internal process monitor for total dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as a guideline. 3.7.2 For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation, the manufacturer will provide certified RAD testing and report through an independent test laboratory when required as a customer purchase order line item. 3.7.3 Total dose bias circuit is specified in Figure 2. 3.8 Wafer (or Dice) Probe: Dice shall be 100% probed at Ta = +25°C to the limits shown in Table I herein. All reject dice shall be removed from the lot. This testing is normally performed prior to dicing the wafer into chips. Final specifications after assembly are sample tested during the element evaluation. 3.9 Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A, except for the following: Top side glassivation thickness shall be a minimum of 4KÅ. 3.10 Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when specified as a customer purchase order line item. 3.11 Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality Conformance Inspection. LINEAR TECHNOLOGY CORPORATION PAGE 3 of 12 SPEC NO. 05-08-5117 REV. K RH1021C-5 PRECISION 5V REFERENCE DICE 4.0 QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests and inspections specified herein. 5.0 SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and subjected to element evaluation per Table III herein. 6.0 5.1 100 Percent Visual Inspection: All dice supplied to this specification shall be inspected in accordance with MIL-STD-883, Method 2010, Condition A. All reject dice shall be removed from the lot. 5.2 Electrical Performance Characteristics for Element Evaluation: The electrical performance characteristics shall be as specified in Table I and Table II herein. 5.3 Sample Testing: Each wafer supplying dice for delivery to this specification shall be subjected to element evaluation sample testing. No dice shall be delivered until all the lot sample testing has been performed and the results found to be acceptable unless the customer supplies a written approval for shipment prior to completion of wafer qualification as specified in this specification. 5.4 Part Marking of Element Evaluation Sample Includes: 5.4.1 LTC Logo 5.4.2 LTC Part Number 5.4.3 Date Code 5.4.4 Serial Number 5.4.5 ESD Identifier per MIL-PRF-38535, Appendix A 5.4.6 Diffusion Lot Number 5.4.7 Wafer Number 5.5 Burn-In Requirement: Burn-In circuit for TO5 package is specified in Figure 3. 5.6 Mechanical/Packaging Requirements: Case Outline and Dimensions are in accordance with Figure 4. 5.7 Terminal Connections: The terminal connections shall be as specified in Figure 5. 5.8 Lead Material and Finish: The lead material and finish shall be Kovar with hot solder dip (Finish letter A) in accordance with MIL-PRF-38535. VERIFICATION (QUALITY ASSURANCE PROVISIONS) 6.1 Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF38535. Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified Class S manufacturing lines. 6.2 Sampling and Inspection: Sampling and Inspection shall be in accordance with Table III herein. LINEAR TECHNOLOGY CORPORATION PAGE 4 of 12 SPEC NO. 05-08-5117 REV. K RH1021C-5 PRECISION 5V REFERENCE DICE 6.3 Screening: Screening requirements shall be in accordance with Table III herein. 6.4 Source Inspection: 6.5 6.4.1 The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal visual. 6.4.2 The procuring activity has the right to perform source inspection at the supplier’s facility prior to shipment for each lot of deliverables when specified as a customer purchase order line item. This may include wafer lot acceptance, die visual, and final data review. Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered: 6.5.1 Lot Serial Number Sheets identifying all Canned Sample devices accepted through final inspection by serial number. 6.5.2 100% attributes (completed element evaluation traveler). 6.5.3 Element Evaluation variables data, including Burn-In and Op Life 6.5.4 SEM photographs (3.10 herein) 6.5.5 Wafer Lot Acceptance Report (3.9 herein) 6.5.6 A copy of outside test laboratory radiation report if ordered 6.5.7 Certificate of Conformance certifying that the devices meet all the requirements of this specification and have successfully completed the mandatory tests and inspections herein. Note: Items 6.5.1 and 6.5.7 will be delivered as a minimum, with each shipment. 7.0 Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All dice shall be packaged in multicavity containers composed of conductive, anti-static, or static dissipative material with an external conductive field shielding barrier. LINEAR TECHNOLOGY CORPORATION PAGE 5 of 12 SPEC NO. 05-08-5117 REV. K RH1021C-5 PRECISION 5V REFERENCE DICE DICE OUTLINE DIMENSIONS AND PAD FUNCTIONS FIGURE 1 LINEAR TECHNOLOGY CORPORATION PAGE 6 of 12 SPEC NO. 05-08-5117 REV. K RH1021C-5 PRECISION 5V REFERENCE DICE TOTAL DOSE BIAS CIRCUIT FIGURE 2 LINEAR TECHNOLOGY CORPORATION PAGE 7 of 12 SPEC NO. 05-08-5117 REV. K RH1021C-5 PRECISION 5V REFERENCE DICE BURN-IN CIRCUIT FIGURE 3 LINEAR TECHNOLOGY CORPORATION PAGE 8 of 12 SPEC NO. 05-08-5117 REV. K RH1021C-5 PRECISION 5V REFERENCE DICE TO5, 8 LEADS, CASE OUTLINE FIGURE 4 θja = +150°C/W θjc = +40°C/W LINEAR TECHNOLOGY CORPORATION PAGE 9 of 12 SPEC NO. 05-08-5117 REV. K RH1021C-5 PRECISION 5V REFERENCE DICE TERMINAL CONNECTIONS FIGURE 5 LINEAR TECHNOLOGY CORPORATION PAGE 10 of 12 SPEC NO. 05-08-5117 REV. K RH1021C-5 PRECISION 5V REFERENCE DICE TABLE I DICE ELECTRICAL CHARACTERISTICS – Element Evaluation (Note 3) Note 1: Output voltage is measured immediately after turn-on. Changes due to chip warm-up are typically less than 0.005%. Note 2: Line and load regulation are measured on a pulse basis. Output changes due to die temperature change must be taken into account separately. Note 3: Dice are probe tested at 25°C to the limits shown. Final specs after assembly are sample tested during the element evaluation. Refer to the standard RH1021-5 Data Sheet for absolute maximum rating, performance curves, typical specifications, and finished product specifications. TABLE II ELECTRICAL CHARACTERISTICS – Post-Irradiation (Note 6) Note 1: Output voltage is measured immediately after turn-on. Changes due to chip warm-up are typically less than 0.005%. Note 2: Temperature coefficient is measured by dividing the change in output voltage over the temperature range by the change in temperature. Separate tests are done for hot and cold; TMIN to 25ºC and 25ºC to TMAX. Incremental slope is also measured at 25ºC. Note 3: Line and load regulation are measured on a pulse basis. Output change due to die temperature change must be taken into account separately. Package themal resistance is 150ºC/W for the TO-5 (H) package and 170ºC/W for the 10-lead flatpack (W) package. Note 6: VIN = 10V, IOUT = 0,TA =25ºC, unless otherwise noted. Note 7: IOUT(MAX) (Sourcing) is 5mA for exposures greater than 100Krad (Si). LINEAR TECHNOLOGY CORPORATION PAGE 11 of 12 SPEC NO. 05-08-5117 REV. K RH1021C-5 PRECISION 5V REFERENCE DICE TABLE III RH ELEMENT EVALUATION TABLE QUALIFICATION OF DICE SALES LINEAR TECHNOLOGY CORPORATION PAGE 12 of 12