RH1021-10 DICE - SPEC NO. 05-08-5118

SPEC NO. 05-08-5118 REV. J
RH1021C-10, PRECISION 10V REFERENCE DICE
REVISION RECORD
REV
DESCRIPTION
DATE
0
INITIAL RELEASE
09/22/99
A
PAGE 9: FIGURE 1, TO5 CASE OUTLINE, CHANGED θja FROM 180°C/W TO 150°C/W.
11/15/99
B
PAGE 3, PARAGRAPH 3.8 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 1.
PAGE 4, PARAGRAPH 5.Ø CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 3.
PARAGRAPH 5.2 ADDED “HEREIN” AFTER TABLE 2.
PAGE 5, PARAGRAPH 6.2, 6.3 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 3.
• PAGE 3, PARAGRAPH 3.7.1, CHANGED THE DOSAGE RATE FROM “APPROXIMATELY 20
RADS PER SECOND” TO “LESS THAN OR EQUAL TO 10 RADS PER SECOND”.
• PAGE 4, PARAGRAPH 6.1 CHANGED QUALITY ASSURANCE PROVISIONS TO STATE THAT
LTC IS QML CERTIFIED AND THAT RAD HARD CANDIDATES ARE ASSEMBLED ON
QUALIFIED ON CLASS S MANUFACTURING LINES.
• PAGE 7, FIGURE 2, TOTAL DOSE BIAS CURRENT REVISED BY ENGINEERING.
• PAGE 11, TABLE II, CHANGED ELECTRICAL CHARACTERISTICS, POST IRRADIATION,
PARAMETER – VOUT, LIMITS, AT 10K, 20K, 50K, 100K, AND 200K RADS TO MATCH THE
DATASHEET.
• CONVERSION OF SPECIFICATION FROM WORD PERFECT TO MICROSOFT WORD.
• PAGE 3, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC.
01/04/00
C
D
•
E
F
G
H
I
J
03/26/02
03/21/05
PAGE 3, ADDED NOTE: ABSOLUTE MAXIMUM RATINGS ARE THOSE VALUES
BEYOND WHICH THE LIFE OF A DEVICE MAY BE IMPAIRED.
08/17/05
• PAGE 3, PARAGRAPH 3.7.1 CHANGED VERBIAGE.
• PAGE 12, CHANGED RH CANNED SAMPLE TABLE III FOR QUALIFYING DICE SALES
ADDED TEMPERATURE CYCLE, CONSTANT ACCELERATION & REMOVED PIND TEST.
• PAGE 2, AMENDED SECTION 3.3, SPECIAL HANDLING OF DICE, TO MORE ACCURATELY
DESCRIBE OUR CURRENT PROCEDURES AND REQUIREMENTS.
• PAGE 12, REPLACED ILLEDGIBLE “RH CANNED SAMPLE TABLE FOR QUALIFYING DICE
SALES” WITH A LEDGIBLE “RH CANNED SAMPLE TABLE FOR QUALIFYING DICE
SALES”
Page 12, Changed RH Canned Sample Table for Qualifying Dice Sales: Subgroup 6 Sample Size
Series changed from 45 (3) to 65 (3). First note had the Sample Size Series from “15%” to “10%”.
05/06/08
02/04/09
03/30/12
05/23/12
7/2/13
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
INDEX
REVISION
INDEX
PAGE NO.
REVISION
PAGE NO.
REVISION
1
J
2
J
3
J
4
J
5
J
6
J
7
J
APPLICATION
9
J
10
J
11
J
12
J
LINEAR TECHNOLOGY
CORPORATION
MILPITAS, CALIFORNIA
ORIG
DSGN
ENGR
MFG
CM
QA
PROG
FUNCT
8
J
TITLE:
MICROCIRCUIT, LINEAR,
RH1021C-10, PRECISION 10V
REFERENCE DICE
SIZE
SIGNOFFS
DATE
CAGE
CODE
94155
CONTRACT:
DRAWING
NUMBER
05-08-5118
FOR OFFICIAL USE ONLY
LINEAR TECHNOLOGY CORPORATION
PAGE 1 of 12
REV
J
SPEC NO. 05-08-5118 REV. J
1.0
SCOPE:
1.1
2.0
RH1021C-10, PRECISION 10V REFERENCE DICE
This specification defines the performance and test requirements for a microcircuit processed to a
space level manufacturing flow.
APPLICABLE DOCUMENTS:
2.1
Government Specifications and Standards: the following documents listed in the Department of
Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation,
form a part of this specification to the extent specified herein.
SPECIFICATIONS:
2.2
3.0
MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification
for
MIL-STD-883
Test Method and Procedures for Microcircuits
MIL-STD-1835
Microcircuits Case Outlines
Order of Precedence: In the event of a conflict between the documents referenced herein and the
contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535
and other referenced specifications.
REQUIREMENTS:
3.1
General Description: This specification details the requirements for the RH1021C-10, Precision
10V Reference Dice and Element Evaluation Test Samples, processed to space level manufacturing
flow as specified herein.
3.2
Part Number:
3.3
Special Handling of Dice: Rad Hard dice require special handling as compared to standard IC
dice. Rad Hard dice are susceptible to surface damage due to the absence of silicon nitride
passivation that is present on most standard dice. Silicon nitride protects the dice surface from
scratches by its hard and dense properties. The passivation on Linear Technology’s Rad Hard dice
is silicon dioxide which is much “softer” than silicon nitride. During the visual and preparation for
shipment, ESD safe Tweezers are used and only the edge of the die are touched.
RH1021C-10 Dice
LTC recommends that dice handling be performed with extreme care so as to protect the die surface
from scratches. If the need arises to move the die in or out of the chip shipment tray (waffle pack),
use an ESD-Safe-Plastic-tipped Bent Metal Vacuum Probe, preferably .020” OD x .010” ID (for
use with tiny parts). The wand should be compatible with continuous air vacuums. The tip material
should be static dissipative Delrin (or equivalent) plastic.
During die attach, care must be exercised to ensure no tweezers, or other equipment, touch the top
of the dice.
LINEAR TECHNOLOGY CORPORATION
PAGE 2 of 12
SPEC NO. 05-08-5118 REV. J
3.4
RH1021C-10, PRECISION 10V REFERENCE DICE
The Absolute Maximum Ratings:
Input Voltage
. . . . . . . . . . . . . . . . 40V
Input-Output Voltage Differential
. . . . . . . . . . 35V
Output to Ground Voltage
(Shunt Mode Current Voltage) . . . . . . . . . 16V
Trim Pin to Ground Voltage
Positive
. . . . . . . . . . . . . . . Equal to VOUT
Negative
. . . . . . . . . . . . . . . -20V
Output Short Circuit Duration
VIN = 35V
. . . . . . . . . . . . . . . 10 sec
VIN = < 20V
. . . . . . . . . . . . . . Indefinite
Operating Temperature Range
. . . . . . . . . . . -55°C to 125°C
Storage Temperature Range
. . . . . . . . . . . . -65°C to 150°C
NOTE: Absolute maximum ratings are those values beyond which the life of a device
may be impaired.
3.5
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions,
and electrical requirements shall be specified herein.
3.6
Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall
be specified in Figure 1.
3.7
Radiation Hardness Assurance (RHA):
3.7.1
The manufacturer shall perform a lot sample test as an internal process monitor for total
dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019
Condition A as a guideline.
3.7.2
For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose
irradiation, the manufacturer will provide certified RAD testing and report through an
independent test laboratory when required as a customer purchase order line item.
3.7.3
Total dose bias circuit is specified in Figure 2.
3.8
Wafer (or Dice) Probe: Dice shall be 100% probed at Ta = +25°C to the limits shown in Table I
herein. All reject dice shall be removed from the lot. This testing is normally performed prior to
dicing the wafer into chips. Final specifications after assembly are sample tested during the
element evaluation.
3.9
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535,
Appendix A, except for the following: Top side glassivation thickness shall be a minimum of
4KÅ.
3.10
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of
SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data
Pack when specified as a customer purchase order line item.
3.11
Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality
Conformance Inspection.
LINEAR TECHNOLOGY CORPORATION
PAGE 3 of 12
SPEC NO. 05-08-5118 REV. J
RH1021C-10, PRECISION 10V REFERENCE DICE
4.0
QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests
and inspections specified herein.
5.0
SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and
subjected to element evaluation per Table III herein.
6.0
5.1
100 Percent Visual Inspection: All dice supplied to this specification shall be inspected in
accordance with MIL-STD-883, Method 2010, Condition A. All reject dice shall be removed from
the lot.
5.2
Electrical Performance Characteristics for Element Evaluation: The electrical performance
characteristics shall be as specified in Table I and Table II herein.
5.3
Sample Testing: Each wafer supplying dice for delivery to this specification shall be subjected to
element evaluation sample testing. No dice shall be delivered until all the lot sample testing has
been performed and the results found to be acceptable unless the customer supplies a written
approval for shipment prior to completion of wafer qualification as specified in this specification.
5.4
Part Marking of Element Evaluation Sample Includes:
5.4.1
LTC Logo
5.4.2
LTC Part Number
5.4.3
Date Code
5.4.4
Serial Number
5.4.5
ESD Identifier per MIL-PRF-38535, Appendix A
5.4.6
Diffusion Lot Number
5.4.7
Wafer Number
5.5
Burn-In Requirement: Burn-In circuit for TO5 package is specified in Figure 3.
5.6
Mechanical/Packaging Requirements: Case Outline and Dimensions are in accordance with
Figure 4.
5.7
Terminal Connections: The terminal connections shall be as specified in Figure 5.
5.8
Lead Material and Finish: The lead material and finish shall be Kovar with hot solder dip (Finish
letter A) in accordance with MIL-PRF-38535.
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
6.1
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MILPRF-38535. Linear Technology is a QML certified company and all Rad Hard candidates are
assembled on qualified Class S manufacturing lines.
6.2
Sampling and Inspection: Sampling and Inspection shall be in accordance with Table III herein.
6.3
Screening: Screening requirements shall be in accordance with Table III herein.
LINEAR TECHNOLOGY CORPORATION
PAGE 4 of 12
SPEC NO. 05-08-5118 REV. J
6.4
Source Inspection:
6.4.1 The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal
internal visual.
6.4.2
6.5
RH1021C-10, PRECISION 10V REFERENCE DICE
The procuring activity has the right to perform source inspection at the supplier’s facility
prior to shipment for each lot of deliverables when specified as a customer purchase order
line item. This may include wafer lot acceptance, die visual, and final data review.
Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:
6.5.1
Lot Serial Number Sheets identifying all Canned Sample devices accepted through final
inspection by serial number.
6.5.2
100% attributes (completed element evaluation traveler).
6.5.3
Element Evaluation variables data, including Burn-In and Op Life
6.5.4
SEM photographs (3.10 herein)
6.5.5
Wafer Lot Acceptance Report (3.9 herein)
6.5.6
A copy of outside test laboratory radiation report if ordered
6.5.7
Certificate of Conformance certifying that the devices meet all the requirements of this
specification and have successfully completed the mandatory tests and inspections herein.
Note: Items 6.5.1 and 6.5.7 will be delivered as a minimum, with each shipment.
7.0
Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All dice
shall be packaged in multicavity containers composed of conductive, anti-static, or static dissipative
material with an external conductive field shielding barrier.
LINEAR TECHNOLOGY CORPORATION
PAGE 5 of 12
SPEC NO. 05-08-5118 REV. J
RH1021C-10, PRECISION 10V REFERENCE DICE
DICE OUTLINE DIMENSIONS AND PAD FUNCTIONS
FIGURE 1
PAD FUNCTION:
2
INPUT
4
GROUND
5
TRIM
6
OUTPUT
LINEAR TECHNOLOGY CORPORATION
PAGE 6 of 12
SPEC NO. 05-08-5118 REV. J
RH1021C-10, PRECISION 10V REFERENCE DICE
TOTAL DOSE BIAS CIRCUIT
FIGURE 2
LINEAR TECHNOLOGY CORPORATION
PAGE 7 of 12
SPEC NO. 05-08-5118 REV. J
RH1021C-10, PRECISION 10V REFERENCE DICE
BURN-IN CIRCUIT
FIGURE 3
LINEAR TECHNOLOGY CORPORATION
PAGE 8 of 12
SPEC NO. 05-08-5118 REV. J
RH1021C-10, PRECISION 10V REFERENCE DICE
TO5, 8 LEADS, CASE OUTLINE
FIGURE 4
θja = +150°C/W
θjc = +40°C/W
LINEAR TECHNOLOGY CORPORATION
PAGE 9 of 12
SPEC NO. 05-08-5118 REV. J
RH1021C-10, PRECISION 10V REFERENCE DICE
TERMINAL CONNECTIONS
FIGURE 5
LINEAR TECHNOLOGY CORPORATION
PAGE 10 of 12
SPEC NO. 05-08-5118 REV. J
RH1021C-10, PRECISION 10V REFERENCE DICE
TABLE I DICE ELECTRICAL CHARACTERISTICS – Element Evaluation (Note 4)
Note 1: Output voltage is measured immediately after turn-on. Changes due to chip warm-up are typically less than
0.005%.
Note 2: Line and load regulation are measured on a pulse basis. Output changes due to die temperature change must be
taken into account separately.
Note 3: Shunt mode regulation is measured with the input open. With the input connected, shunt mode current can be
reduced to 0mA. Load regulation will remain the same.
Note 4: Dice are probe tested at 25°C to the limits shown. Final specs after assembly are sample tested during the element
evaluation. Refer to the standard RH1021-10 Data Sheet for absolute maximum rating, performance curves,
typical specifications, and finished product specifications.
TABLE II ELECTRICAL CHARACTERISTICS – Post-Irradiation (Note 3)
Note 1: Output voltage is measured immediately after turn-on. Changes due to chip warm-up are typically less than
0.005%.
Note 2: Line and load regulation are measured on a pulse basis. Output changes due to die temperature change must be
taken into account separately.
Note 3: VIN = 10V, IOUT = Ø, TA = 25°C, unless otherwise noted.
Note 4: IOUT(MAX) (Sourcing) is 5mA for exposures greater than 100Krad (Si).
LINEAR TECHNOLOGY CORPORATION
PAGE 11 of 12
SPEC NO. 05-08-5118 REV. J
RH1021C-10, PRECISION 10V REFERENCE DICE
TABLE III RH ELEMENT EVALUATION TABLE QUALIFICATION OF DICE SALES
LINEAR TECHNOLOGY CORPORATION
PAGE 12 of 12