SPEC NO. 05-08-5114 REV. G RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE REVISION RECORD REV DESCRIPTION 0 A B INITIAL RELEASE PAGE 9, FIGURE 4, CHANGED 0JA PAGE 3, PARAGRAPH 3. 8 CHANGED VERBIAGE ADDED “HEREIN “ AFTER TABLE 1. PAGE 4, PARAGRAPH 5. 0 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 3. PARAGRAPH 5.2 ADDED “HEREIN” AFTER TABLE 2. PAGE 5, PARAGRAPH 6.2, 6.3, CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 3. • PAGE 3, PARAGRAPH 3.7.1, CHANGED THE DOSAGE RATE FROM “APPROXIMATELY 20 RADS PER SECOND” TO “LESS THAN OR EQUAL TO 10 RADS PER SECOND”. • PAGE 4, PARAGRAPH 6.1 CHANGED QUALITY ASSURANCE PROVISIONS TO STATE THAT LTC IS QML CERTIFIED AND THAT RAD HARD CANDIDATES ARE ASSEMBLED ON QUALIFIED ON CLASS S MANUFACTURING LINES. • PAGES 6 THROUGH 10, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE. • PAGE 11, TABLES I AND II PUT ON ONE PAGE. • PAGE 12, NOTES FOR TABLE II PUT ON THIS PAGE. • CONVERSION OF SPECIFICATION FROM WORD PERFECT TO MICROSOFT WORD. • PAGE 3, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC. C D E F G DATE 09/29/99 01/04/00 02/19/03 03/22/05 • PAGE 3, PARAGRAPH 3.7.1 CHANGED VERBIAGE. • PAGE 13, CHANGED RH CANNED SAMPLE TABLE III FOR QUALIFYING DICE SALES ADDED TEMPERATURE CYCLE, CONSTANT ACCELERATION & REMOVED PIND TEST. Page 2, amended section 3.3, Special Handling of Dice, to more accurately describe our current procedures and requirements. 05/05/08 02/10/09 04/05/12 CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART REVISION INDEX REVISION INDEX PAGE NO. REVISION PAGE NO. REVISION 1 G 2 G 3 G 4 G 5 G 6 G 7 G APPLICATION 9 G 10 G 11 G 12 G 13 G LINEAR TECHNOLOGY CORPORATION MILPITAS, CALIFORNIA ORIG DSGN ENGR MFG CM QA PROG FUNCT 8 G TITLE: MICROCIRCUIT, LINEAR, RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE SIZE SIGNOFFS DATE CAGE CODE DRAWING NUMBER REV 64155 05-08-5114 G CONTRACT: FOR OFFICIAL USE ONLY LINEAR TECHNOLOGY CORPORATION Page 1 of 13 SPEC NO. 05-08-5114 REV. G 1.0 SCOPE: 1.1 2.0 RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE This specification defines the performance and test requirements for a microcircuit processed to a space level manufacturing flow. APPLICABLE DOCUMENTS: 2.1 Government Specifications and Standards: The following documents listed in the Department of Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this specification to the extent specified herein. SPECIFICATIONS: MIL-PRF-38535 Integrated Circuits (Microcircuits) Manufacturing, General Specification for MIL-STD-883 Test Method and Procedures for Microcircuits MIL-STD-1835 Microcircuits Case Outlines 2.2 3.0 Order of Precedence: In the event of a conflict between the documents referenced herein and the contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other referenced specifications. REQUIREMENTS: 3.1 General Description: This specification details the requirements for the RH27C Precision Operational Amplifier Dice and Element Evaluation Test Samples, processed to space level manufacturing flow as specified herein. 3.2 Part Number: RH27C Dice 3.3 Special Handling of Dice: Rad Hard dice require special handling as compared to standard IC dice. Rad Hard dice are susceptible to surface damage due to the absence of silicon nitride passivation that is present on most standard dice. Silicon nitride protects the dice surface from scratches by its hard and dense properties. The passivation on Linear Technology’s Rad Hard dice is silicon dioxide which is much “softer” than silicon nitride. During the visual and preparation for shipment, ESD safe Tweezers are used and only the edge of the die are touched. LTC recommends that dice handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the die in or out of the chip shipment tray (waffle pack), use an ESD-Safe-Plastic-tipped Bent Metal Vacuum Probe, preferably .020” OD x .010” ID (for use with tiny parts). The wand should be compatible with continuous air vacuums. The tip material should be static dissipative Delrin (or equivalent) plastic. During die attach, care must be exercised to ensure no tweezers, or other equipment, touch the top of the dice. LINEAR TECHNOLOGY CORPORATION Page 2 of 13 SPEC NO. 05-08-5114 REV. G 3.4 RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE The Absolute Maximum Ratings: Supply Voltage . . . . . . . . . . . . . +22V Internal Power Dissipation . . . . . . . . 500mW Input Voltage . . . . . . . . Equal to Supply Voltage Output Short Circuit Duration . . . . . . Indefinite Differential Input Current 1/ . . . . . +25mA Operating Temperature Range . . . . . . -55°C to 125°C Junction Temperature Range . . . . . . . -55°C to 150°C Storage Temperature Range . . . . . . . -65°C to 150°C Lead Temperature (Soldering, 10 sec.) . . 300°C 1/ The RH27’s inputs are protected by back-to-back diodes. Current Limiting resistors are not used in order to achieve low noise. If differential input voltage exceeds +0.7V, the input current should be limited to 25mA. 3.5 Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and electrical requirements shall be specified herein. 3.6 Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall be specified in Figure 1. 3.7 Radiation Hardness Assurance (RHA): 3.7.1 The manufacturer shall perform a lot sample test as an internal process monitor for total dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as a guideline. 3.7.2 For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation, the manufacturer will provide certified RAD testing and report through an independent test laboratory when required as a customer purchase order line item. 3.7.3 Total dose bias circuit is specified in Figure 2. 3.8 Wafer (or Dice) Probe: Dice shall be 100% probed at Ta = +25°C to the limits shown in Table I herein. All reject dice shall be removed from the lot. This testing is normally performed prior to dicing the wafer into chips. Final specifications after assembly are sample tested during the element evaluation. 3.9 Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A, except for the following: Top side glassivation thickness shall be a minimum of 4KÅ. 3.10 Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when specified as a customer purchase order line item. 3.11 Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality Conformance Inspection. LINEAR TECHNOLOGY CORPORATION Page 3 of 13 SPEC NO. 05-08-5114 REV. G RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE 4.0 QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests and inspections specified herein. 5.0 SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and subjected to element evaluation per Table III herein. 6.0 5.1 100 Percent Visual Inspection: All dice supplied to this specification shall be inspected in accordance with MIL-STD-883, Method 2010, Condition A. All reject dice shall be removed from the lot. 5.2 Electrical Performance Characteristics for Element Evaluation: The electrical performance characteristics shall be as specified in Table I and Table II herein. 5.3 Sample Testing: Each wafer supplying dice for delivery to this specification shall be subjected to element evaluation sample testing. No dice shall be delivered until all the lot sample testing has been performed and the results found to be acceptable unless the customer supplies a written approval for shipment prior to completion of wafer qualification as specified in this specification. 5.4 Part Marking of Element Evaluation Sample Includes: 5.4.1 LTC Logo 5.4.2 LTC Part Number 5.4.3 Date Code 5.4.4 Serial Number 5.4.5 ESD Identifier per MIL-PRF-38535, Appendix A 5.4.6 Diffusion Lot Number 5.4.7 Wafer Number 5.5 Burn-In Requirement: Burn-In circuit for TO5 package is specified in Figure 3. 5.6 Mechanical/Packaging Requirements: Case Outline and Dimensions are in accordance with Figure 4. 5.7 Terminal Connections: The terminal connections shall be as specified in Figure 5. 5.8 Lead Material and Finish: The lead material and finish shall be Kovar with hot solder dip (Finish letter A) in accordance with MIL-PRF-38535. VERIFICATION (QUALITY ASSURANCE PROVISIONS) 6.1 Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF38535. Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified Class S manufacturing lines. LINEAR TECHNOLOGY CORPORATION Page 4 of 13 SPEC NO. 05-08-5114 REV. G RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE 6.2 Sampling and Inspection: Sampling and Inspection shall be in accordance with Table III herein. 6.3 Screening: Screening requirements shall be in accordance with Table III herein. 6.4 Source Inspection: 6.5 6.4.1 The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal visual. 6.4.2 The procuring activity has the right to perform source inspection at the supplier’s facility prior to shipment for each lot of deliverables when specified as a customer purchase order line item. This may include wafer lot acceptance, die visual, and final data review. Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered: 6.5.1 Lot Serial Number Sheets identifying all Canned Sample devices accepted through final inspection by serial number. 6.5.2 100% attributes (completed element evaluation traveler). 6.5.3 Element Evaluation variables data, including Burn-In and Op Life 6.5.4 SEM photographs (3.10 herein) 6.5.5 Wafer Lot Acceptance Report (3.9 herein) 6.5.6 A copy of outside test laboratory radiation report if ordered 6.5.7 Certificate of Conformance certifying that the devices meet all the requirements of this specification and have successfully completed the mandatory tests and inspections herein. Note: Items 6.5.1 and 6.5.7 will be delivered as a minimum, with each shipment. 7.0 Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All dice shall be packaged in multicavity containers composed of conductive, anti-static, or static dissipative material with an external conductive field shielding barrier. LINEAR TECHNOLOGY CORPORATION Page 5 of 13 SPEC NO. 05-08-5114 REV. G RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE DICE OUTLINE DIMENSIONS AND PAD FUNCTIONS FIGURE 1 LINEAR TECHNOLOGY CORPORATION Page 6 of 13 SPEC NO. 05-08-5114 REV. G RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE TOTAL DOSE BIAS CIRCUIT FIGURE 2 LINEAR TECHNOLOGY CORPORATION Page 7 of 13 SPEC NO. 05-08-5114 REV. G RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE BURN-IN CIRCUIT FIGURE 3 LINEAR TECHNOLOGY CORPORATION Page 8 of 13 SPEC NO. 05-08-5114 REV. G RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE TO5, 8 LEADS, CASE OUTLINE FIGURE 4 θja = +150°C/W θjc = +40°C/W LINEAR TECHNOLOGY CORPORATION Page 9 of 13 SPEC NO. 05-08-5114 REV. G RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE TERMINAL CONNECTIONS FIGURE 5 LINEAR TECHNOLOGY CORPORATION Page 10 of 13 SPEC NO. 05-08-5114 REV. G RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE TABLE I DICE ELECTRICAL CHARACTERISTICS – Element Evaluation (Note 10) TABLE II ELECTRICAL CHARACTERISTICS – Post-Irradiation (Note 10) NOTES FOR TABLE II ARE ON NEXT PAGE. LINEAR TECHNOLOGY CORPORATION Page 11 of 13 SPEC NO. 05-08-5114 REV. G RH27C LOW NOISE, HIGH SPEED PRECISION OP AMP DICE ONLY NOTES 1, 4, AND 10 PERTAIN TO TABLES I AND II ELECTRICAL CHARACTERISTICS. NOTES 2, 3, 5, 6, 7, 8, AND 9 PERTAIN TO THE ELECTRICAL CHARACTERISTICS FOR THE STANDARD RH27C PACKAGED DEVICE: LINEAR TECHNOLOGY CORPORATION Page 12 of 13 TABLE III RH ELEMENT EVALUATION TABLE QUALIFICATION OF DICE SALES LINEAR TECHNOLOGY CORPORATION Page 13 of 13