DICE SPECIFICATION RH1009 2.5V Reference 2 DIE CROSS REFERENCE 3 LTC Finished Part Number Order DICE CANDIDATE Part Number Below RH1009 DICE RH1009 DWF RH1009 RH1009 PAD FUNCTION 1. V + 2. ADJ 3. V – NOTE: CONNECT SUBSTRATE TO V – 1 50 × 54 mils W DICE ELECTRICAL TEST LI ITS SYMBOL PARAMETER VZ ∆V Z ∆IR TJ = 25°C. Preirradiation CONDITIONS MIN MAX Reverse Breakdown Voltage IR = 1mA 2.495 2.505 Reverse Breakdown Voltage Change with Current 400µA ≤ IR ≤ 10mA Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 6 UNITS V mV 1 DICE SPECIFICATION RH1009 Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet subject to change. Please consult factory for current revision in production. I.D.No. 66-13-1009 2 Linear Technology Corporation LT/LT 0203 PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 2003