SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE REVISION RECORD REV DESCRIPTION DATE 0 INITIAL RELEASE 10/05/10 A Page 2, amended section 3.3 Special Handling of Dice to more accurately describe our current procedures and requirements. PAGES 11 & 12, ADDED 2 PARAMETERS TO TABLES I & II: Error Amplifier RMS Output Noise (Note 7), Reference Current RMS Output Noise (Note 7), and added Note 7. Page 13, Changed RH Canned Sample Table for Qualifying Dice Sales: Subgroup 6 Sample Size Series changed from 45 (3) to 65 (3). First note had the Sample Size Series from “15%” to “10%”. Updated ‘Absolute Maximum Ratings’ table to match data sheet: added (Note 1) (All voltages relative to VOUT), (Note 6) and (Note 2, 10), changed Operating Junction Temp Range from “-40°C to 125°C” to “-55°C to 125°C”. Added “Refer to the LT3080 Datasheet for Power Dissipation (PD) Calculation”. Changed ‘Table III’ to ‘Table VI’ in paragraphs 5.0, 6.2 and 6.3. Added ‘Table III, Table IV and Table V’ to paragraph 5.2. Corrected package type from ‘TO5’ to ‘TO-3’ in paragraph 5.5. Added section 5.8 ‘Die Bonding Pad Locations and Electrical Functions’ to pg 4-5. Updated Figure 1, DICE OUTLINE DIMENSIONS AND PAD FUNCTIONS, on pg 7. Added Table A, DIE LAYOUT – X-Y COORDINATES, to pg 8. Updated BURN-IN CIRCUIT, Figure 3, on pg 10. Updated NOISE TEST CIRCUIT, Figure 6, to correct for opposing polarity. Changed Table I from ‘DICE ELECTRICAL CHARACTERISTICS (Preirradiation)’ to ‘DICE / DWF ELECTRICAL TEST LIMITS’ and added the new Notes section. Changed Table II from ‘ELECTRICAL CHARACTERISTICS – Post-Irradiation’ to ‘ELECTRICAL CHARACTERISTICS (Preirradiation)’ and added new Notes section. Changed Table III from ‘RH ELEMENT EVALUATION QUALIFICATION OF DICE SALE’ to ‘ELECTRICAL CHARACTERISTICS (Postirradiation)’ and added the new Notes section. Added Table IV ‘POST BURN-IN ENDPOINTS AND DELTA LIMIT REQUIREMENTS’ with new Notes section, Table V ‘ELECTRICAL TEST REQUIREMENTS’ and Table VI ‘RH ELEMENT EVAL05-08-5115UATION QUALIFICATION OF DICE SALE’. Updated Burn-In Circuit, figure 3, on pg10. Updated Die Sales table on pg 17. 04/05/12 B C D E 05/11/12 07/02/13 01/07/15 06/01/15 CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART REVISION PAGE NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 INDEX REVISION E E E E E E E E E E E E E E E E E REVISION PAGE NO. INDEX REVISION LINEAR TECHNOLOGY CORPORATION MILPITAS, CALIFORNIA ORIG DSGN ENGR MFG CM TITLE: MICROCIRCUIT, LINEAR, RH 3080MK ADJUSTABLE 0.9A SINGLE RESISTOR LOW DROPOUT REGULATOR DICE SIZE QA APPLICATION PROG FUNCT SIGNOFFS DATE CAGE CODE 64155 CONTRACT: DRAWING NUMBER 05-08-5246 REV E FOR OFFICIAL USE ONLY _____________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION PAGE 1 of 17 SPEC NO. 05-08-5246 REV. E 1.0 SCOPE: 1.1 2.0 RH3080MK LOW DROPOUT REGULATOR DICE This specification defines the performance and test requirements for a microcircuit processed to a space level manufacturing flow. APPLICABLE DOCUMENTS: 2.1 Government Specifications and Standards: the following documents listed in the Department of Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this specification to the extent specified herein. SPECIFICATIONS: 2.2 3.0 MIL-PRF-38535 Integrated Circuits (Microcircuits) Manufacturing, General Specification for MIL-STD-883 Test Method and Procedures for Microcircuits MIL-STD-1835 Microcircuits Case Outlines Order of Precedence: In the event of a conflict between the documents referenced herein and the contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other referenced specifications. REQUIREMENTS: 3.1 General Description: This specification details the requirements for the RH3080 LOW DROPOUT REGULATOR DICE and Element Evaluation Test Samples, processed to space level manufacturing flow as specified herein. 3.2 Part Number: 3.3 Special Handling of Dice: Rad Hard dice require special handling as compared to standard IC dice. Rad Hard dice are susceptible to surface damage due to the absence of silicon nitride passivation that is present on most standard dice. Silicon nitride protects the dice surface from scratches by its hard and dense properties. The passivation on Linear Technology’s Rad Hard dice is silicon dioxide which is much “softer” than silicon nitride. During the visual and preparation for shipment, ESD safe Tweezers are used and only the edges of the die are touched. RH3080MK Dice LTC recommends that dice handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the die in or out of the chip shipment tray (waffle pack), use an ESD-Safe-Plastic-tipped Bent Metal Vacuum Probe, preferably .020” OD x .010” ID (for use with tiny parts). The wand should be compatible with continuous air vacuums. The tip material should be static dissipative Delrin (or equivalent) plastic. During die attach, care must be exercised to ensure no tweezers, or other equipment, touch the top of the dice. _____________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION PAGE 2 of 17 SPEC NO. 05-08-5246 REV. E 3.4 RH3080MK LOW DROPOUT REGULATOR DICE The Absolute Maximum Ratings: (Note 1) (All voltages relative to VOUT) VCONTROL Pin Voltage . . . . . . . . . . IN Pin Voltage . . . . . . . . . . . . SET Pin Current (Note 6) . . . . . . . . . SET Pin Voltage (Relative to OUT, Note 6) . . . Output Short-Circuit Duration . . . . . . . Operating Junction Temperature Range (Notes 2, 10) Storage Temperature Range . . . . . . . . Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V, -0.3V 40V, -0.3V ±10mA ±0.3V Indefinite -55C to 125C -65C to 150C 300°C Refer to the LT3080 Datasheet for Power Dissipation (PD) Calculation 3.5 Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and electrical requirements shall be specified herein. 3.6 Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall be specified in Figure 1. 3.7 Radiation Hardness Assurance (RHA): 3.7.1 The manufacturer shall perform a lot sample test as an internal process monitor for total dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as a guideline. 3.7.2 For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation, the manufacturer will provide certified RAD testing and report through an independent test laboratory when required as a customer purchase order line item. 3.7.3 Total dose bias circuit is specified in Figure 2. 3.8 Wafer (or Dice) Probe: Dice shall be 100% probed at TA = +25C to the limits shown in Table I herein. All reject dice shall be removed from the lot. This testing is normally performed prior to dicing the wafer into chips. Final specifications after assembly are sample tested during the element evaluation. 3.9 Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A, except for the following: Top side glassivation thickness shall be a minimum of 4KÅ. 3.10 Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when specified as a customer purchase order line item. 3.11 Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality Conformance Inspection. 4.0 QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests and inspections specified herein. 5.0 SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and subjected to element evaluation per Table VI herein. _____________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION PAGE 3 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE 5.1 100 Percent Visual Inspection: All dice supplied to this specification shall be inspected in accordance with MIL-STD-883, Method 2010, Condition A. All reject dice shall be removed from the lot. 5.2 Electrical Performance Characteristics for Element Evaluation: The electrical performance characteristics shall be as specified in Table I, Table II, Table III, Table IV and Table V herein. 5.3 Sample Testing: Each wafer supplying dice for delivery to this specification shall be subjected to element evaluation sample testing. No dice shall be delivered until all the lot sample testing has been performed and the results found to be acceptable unless the customer supplies a written approval for shipment prior to completion of wafer qualification as specified in this specification. 5.4 Part Marking of Element Evaluation Sample Includes: 5.4.1 LTC Logo 5.4.2 LTC Part Number 5.4.3 Date Code 5.4.4 Serial Number 5.4.5 ESD Identifier per MIL-PRF-38535, Appendix A 5.4.6 Diffusion Lot Number 5.4.7 Wafer Number 5.5 Burn-In Requirement: Burn-In circuit for TO-3 package is specified in Figure 3. 5.6 Mechanical/Packaging Requirements: Case Outline and Dimensions are in accordance with Figure 4. 5.7 Terminal Connections: The terminal connections shall be as specified in Figure 5. 5.8 Die Bonding Pad Locations and Electrical Functions: Die layout (X-Y Coordinates) is specified in Table A 5.8.1 Die physical dimensions: 5.8.1.1 Die size: 44 mils x 75 mils 5.8.1.2 Scribe width: 3 mils 5.8.1.3 Die thickness: 12 mils 5.8.2 Interface materials: 5.8.2.1 Top metallization: AlCu (99.5%/0.5%) 5.8.2.2 Backside metallization: (Substrate) Alloyed gold layer 5.8.3 Glassivation: _____________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION PAGE 4 of 17 SPEC NO. 05-08-5246 REV. E 5.8.3.1 Type: SiO2 RH3080MK LOW DROPOUT REGULATOR DICE 5.8.3.2 Thickness: Minimum of 4 kÅ 5.8.4 Substrate: Single crystal silicon 5.8.5 Assembly related information: 5.8.5.1 Substrate potential: OUT 5.8.5.2 BOND-Sensitive 5.8.5.3 Jumper Chip Size: RSense 5.8.5.4 Die Attach: AuSi 30 x 30 x 2 mils 5.8.5.5 Bond wire: 1.25 mil AlSi 5.9 6.0 Lead Material and Finish: The lead material and finish shall be Kovar with hot solder dip (Finish letter A) in accordance with MIL-PRF-38535. VERIFICATION (QUALITY ASSURANCE PROVISIONS) 6.1 Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MILPRF-38535. Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified Class S manufacturing lines. 6.2 Sampling and Inspection: Sampling and Inspection shall be in accordance with Table VI herein. 6.3 Screening: Screening requirements shall be in accordance with Table VI herein. 6.4 Source Inspection: 6.5 6.4.1 The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal visual. 6.4.2 The procuring activity has the right to perform source inspection at the supplier’s facility prior to shipment for each lot of deliverables when specified as a customer purchase order line item. This may include wafer lot acceptance, die visual, and final data review. Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered: 6.5.1 Lot Serial Number Sheets identifying all Canned Sample devices accepted through final inspection by serial number. 6.5.2 100% attributes (completed element evaluation traveler). 6.5.3 Element Evaluation variables data, including Burn-In and Op Life 6.5.4 SEM photographs (3.10 herein) 6.5.5 Wafer Lot Acceptance Report (3.9 herein) 6.5.6 A copy of outside test laboratory radiation report if ordered _____________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION PAGE 5 of 17 SPEC NO. 05-08-5246 REV. E 6.5.7 RH3080MK LOW DROPOUT REGULATOR DICE Certificate of Conformance certifying that the devices meet all the requirements of this specification and have successfully completed the mandatory tests and inspections herein. Note: Items 6.5.1 and 6.5.7 will be delivered as a minimum, with each shipment. 7.0 Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All dice shall be packaged in multicavity containers composed of conductive, anti-static, or static dissipative material with an external conductive field shielding barrier. _____________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION PAGE 6 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE DICE OUTLINE DIMENSIONS AND PAD FUNCTIONS PAD FUNCTION 44 mils x 75 mils Backside Metal: Alloyed Gold Layer Backside Potential: OUT Tie SENSE to OUT 1. 2. 3. 4. 5. IN OUT SENSE SET VCONTROL FIGURE 1 _____________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION PAGE 7 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE TABLE A: DIE LAYOUT – X-Y COORDINATES Pad Name SENSE OUT OUT IN IN VCONTROL SET X (μm) -440 -440 -440 308.5 308.5 389 -242.5 Y (μm) -288.5 63 612 612 63 -294.5 -806.5 W (μm) 100 100 100 100 100 100 100 H (μm) 100 100 100 100 100 100 100 Notes: 1. Origin of coordinates is the centroid of the dice. _____________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION PAGE 8 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE TOTAL DOSE BIAS CIRCUIT FIGURE 2 _____________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION PAGE 9 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE BURN-IN CIRCUIT FIGURE 3 _____________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION PAGE 10 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE TO3, 4 LEADS, CASE OUTLINE FIGURE 4 TERMINAL CONNECTIONS FIGURE 5 LINEAR TECHNOLOGY CORPORATION PAGE 11 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE NOISE TEST CIRCUIT FIGURE 6 LINEAR TECHNOLOGY CORPORATION PAGE 12 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE TABLE I. DICE /DWF ELECTRICAL TEST LIMITS TA = 25°C (Note 2, 8, 9) LINEAR TECHNOLOGY CORPORATION PAGE 13 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE TABLE II. ELECTRICAL CHARACTERISTICS (Preirradiation) LINEAR TECHNOLOGY CORPORATION PAGE 14 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE TABLE III. ELECTRICAL CHARACTERISTICS (Postirradiation) LINEAR TECHNOLOGY CORPORATION PAGE 15 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE TABLE IV. POST BURN-IN ENDPOINTS AND DELTA LIMIT REQUIREMENTS TA = 25°C TABLE V. ELECTRICAL TEST REQUIREMENTS LINEAR TECHNOLOGY CORPORATION PAGE 16 of 17 SPEC NO. 05-08-5246 REV. E RH3080MK LOW DROPOUT REGULATOR DICE TABLE VI. RH CANNED SAMPLE TABLE FOR QUALIFICATION OF DICE SALES LINEAR TECHNOLOGY CORPORATION PAGE 17 of 17