RH3083MK - Dice Spec NO. 05-08-5744

SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
REVISION RECORD
REV
DESCRIPTION
DATE
0
INITIAL RELEASE
09/04/14
A
Changed „Table IV‟ to „Table V‟ in paragraphs 5.0, 6.2 and 6.3. Added „Table IV‟ to paragraph
5.2. Added section 5.8, Die Bonding Pad Locations and Electrical Functions. Added Table A to pg
8. Updated image for Figure 3, Burn-In Circuit. Updated image for Figure 6, Noise Test Circuit.
Added Note „11‟ to Tables I, II and III. Updated the Notes section below Tables I, II and III.
Updated entire Table II. Added „T A = 25°C‟ to Table III. Changed Table IV to new table,
„Electrical Test Requirements.‟ Changed „RH Element Evaluation Table Qualification of Dice
Sales‟ to Table V. Specification page count went from 15 to 17 pages because of updates.
Updated Die Sales table on pg 17.
Changed typo RH3080 to RH3083 on pg. 2.
12/30/14
B
C
06/01/15
10/23/15
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
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TITLE:
MICROCIRCUIT, LINEAR, RH3083MK
ADJUSTABLE 2.8A SINGLE RESISTOR
LOW DROPOUT REGULATOR DICE
SIZE
QA
PROG
FUNCT
9
C
LINEAR TECHNOLOGY
CORPORATION
MILPITAS, CALIFORNIA
ORIG
DSGN
ENGR
MFG
CM
APPLICATION
8
C
SIGNOFFS
DATE
CAGE
CODE
64155
CONTRACT:
DRAWING
NUMBER
05-08-5744
FOR OFFICIAL USE ONLY
LINEAR TECHNOLOGY CORPORATION
PAGE 1 of 17
REV
C
SPEC NO. 05-08-5744 REV. C
1.0
SCOPE:
1.1
2.0
RH3083MK LOW DROPOUT REGULATOR DICE
This specification defines the performance and test requirements for a microcircuit processed to a
space level manufacturing flow.
APPLICABLE DOCUMENTS:
2.1
Government Specifications and Standards: the following documents listed in the Department of
Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation,
form a part of this specification to the extent specified herein.
SPECIFICATIONS:
2.2
3.0
MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification
for
MIL-STD-883
Test Method and Procedures for Microcircuits
MIL-STD-1835
Microcircuits Case Outlines
Order of Precedence: In the event of a conflict between the documents referenced herein and the
contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535
and other referenced specifications.
REQUIREMENTS:
3.1
General Description: This specification details the requirements for the RH3083 LOW DROPOUT
REGULATOR DICE and Element Evaluation Test Samples, processed to space level manufacturing
flow as specified herein.
3.2
Part Number:
3.3
Special Handling of Dice: Rad Hard dice require special handling as compared to standard IC
dice. Rad Hard dice are susceptible to surface damage due to the absence of silicon nitride
passivation that is present on most standard dice. Silicon nitride protects the dice surface from
scratches by its hard and dense properties. The passivation on Linear Technology‟s Rad Hard dice
is silicon dioxide which is much “softer” than silicon nitride. During the visual and preparation for
shipment, ESD safe Tweezers are used and only the edges of the die are touched.
RH3083MK Dice
LTC recommends that dice handling be performed with extreme care so as to protect the die surface
from scratches. If the need arises to move the die in or out of the chip shipment tray (waffle pack),
use an ESD-Safe-Plastic-tipped Bent Metal Vacuum Probe, preferably .020” OD x .010” ID (for
use with tiny parts). The wand should be compatible with continuous air vacuums. The tip material
should be static dissipative Delrin (or equivalent) plastic.
During die attach, care must be exercised to ensure no tweezers, or other equipment, touch the top
of the dice.
LINEAR TECHNOLOGY CORPORATION
PAGE 2 of 17
SPEC NO. 05-08-5744 REV. C
3.4
RH3083MK LOW DROPOUT REGULATOR DICE
The Absolute Maximum Ratings:
(Note 1) (All voltages relative to VOUT)
VCONTROL Pin Voltage
. . . . . . . . .
. . . . . . . . . . .
IN Pin Voltage
No Overload or Short-Circuit . . . . . . .
SET Pin Current (Note 6) . . . . . . . .
. .
SET Pin Voltage (Relative to OUT, Note 6)
. . . . . .
Output Short-Circuit Duration
Operating Junction Temperature Range (Notes 2, 10)
Storage Temperature Range
. . . . . . .
. . . . . ±28V
. . . . . 18V, -0.3V
. . . . . 23V, -0.3V
. . . . . ±25mA
. . . . . ±10V
. . . . . Indefinite
. . . . -55C to 125C
. . . . . -65C to 150C
3.5
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions,
and electrical requirements shall be specified herein.
3.6
Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall
be specified in Figure 1.
3.7
Radiation Hardness Assurance (RHA):
3.7.1
The manufacturer shall perform a lot sample test as an internal process monitor for total
dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019
Condition A as a guideline.
3.7.2
For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose
irradiation, the manufacturer will provide certified RAD testing and report through an
independent test laboratory when required as a customer purchase order line item.
3.7.3
Total dose bias circuit is specified in Figure 2.
3.8
Wafer (or Dice) Probe: Dice shall be 100% probed at TA = +25C to the limits shown in Table I
herein. All reject dice shall be removed from the lot. This testing is normally performed prior to
dicing the wafer into chips. Final specifications after assembly are sample tested during the
element evaluation.
3.9
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535,
Appendix A, except for the following: Top side glassivation thickness shall be a minimum of
4KÅ.
3.10
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of
SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data
Pack when specified as a customer purchase order line item.
3.11
Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality
Conformance Inspection.
4.0
QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests
and inspections specified herein.
5.0
SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and
subjected to element evaluation per Table V herein.
LINEAR TECHNOLOGY CORPORATION
PAGE 3 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
5.1
100 Percent Visual Inspection: All dice supplied to this specification shall be inspected in
accordance with MIL-STD-883, Method 2010, Condition A. All reject dice shall be removed from
the lot.
5.2
Electrical Performance Characteristics for Element Evaluation: The electrical performance
characteristics shall be as specified in Table I, Table II, Table III and Table IV herein.
5.3
Sample Testing: Each wafer supplying dice for delivery to this specification shall be subjected to
element evaluation sample testing. No dice shall be delivered until all the lot sample testing has
been performed and the results found to be acceptable unless the customer supplies a written
approval for shipment prior to completion of wafer qualification as specified in this specification.
5.4
Part Marking of Element Evaluation Sample Includes:
5.4.1
LTC Logo
5.4.2
LTC Part Number
5.4.3
Date Code
5.4.4
Serial Number
5.4.5
ESD Identifier per MIL-PRF-38535, Appendix A
5.4.6
Diffusion Lot Number
5.4.7
Wafer Number
5.5
Burn-In Requirement: Burn-In circuit for TO-3 package is specified in Figure 3.
5.6
Mechanical/Packaging Requirements: Case Outline and Dimensions are in accordance with
Figure 4.
5.7
Terminal Connections: The terminal connections shall be as specified in Figure 5.
5.8
Die Bonding Pad Locations and Electrical Functions: Die layout (X-Y Coordinates) is specified in
Table A
5.8.1
Die physical dimensions:
5.8.1.1 Die size: 66 mils x 113 mils
5.8.1.2 Scribe width: 3 mils
5.8.1.3 Die thickness: 12 mils
5.8.2
Interface materials:
5.8.2.1 Bond Pad Opening (BPO): ≥ 112 x 112 μm
5.8.2.2 Top metallization: AlSiCu (98.5%/1%/0.5%)
5.8.2.3 Backside metallization: (Substrate) Alloyed gold layer
LINEAR TECHNOLOGY CORPORATION
PAGE 4 of 17
SPEC NO. 05-08-5744 REV. C
5.8.3
RH3083MK LOW DROPOUT REGULATOR DICE
Glassivation:
5.8.3.1 Type: SiO2
5.8.3.2 Thickness: Minimum of 4 kÅ
5.8.4
Substrate: Single crystal silicon
5.8.5
Assembly related information:
5.8.5.1 Substrate potential: OUT
5.8.5.2 BOND-Sensitive
5.8.5.3 Jumper Chip Size: RSense
5.8.5.4 Die Attach: AuSi 30 x 30 x 2 mils
5.8.5.5 Bond wire size: 1.25 mil AlSi
5.9
6.0
Lead Material and Finish: The lead material and finish shall be Kovar with hot solder dip (Finish
letter A) in accordance with MIL-PRF-38535.
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
6.1
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MILPRF-38535. Linear Technology is a QML certified company and all Rad Hard candidates are
assembled on qualified Class S manufacturing lines.
6.2
Sampling and Inspection: Sampling and Inspection shall be in accordance with Table V herein.
6.3
Screening: Screening requirements shall be in accordance with Table V herein.
6.4
Source Inspection:
6.5
6.4.1
The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal
internal visual.
6.4.2
The procuring activity has the right to perform source inspection at the supplier‟s facility
prior to shipment for each lot of deliverables when specified as a customer purchase order
line item. This may include wafer lot acceptance, die visual, and final data review.
Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:
6.5.1
Lot Serial Number Sheets identifying all Canned Sample devices accepted through final
inspection by serial number.
6.5.2
100% attributes (completed element evaluation traveler).
6.5.3
Element Evaluation variables data, including Burn-In and Op Life
6.5.4
SEM photographs (3.10 herein)
6.5.5
Wafer Lot Acceptance Report (3.9 herein)
LINEAR TECHNOLOGY CORPORATION
PAGE 5 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
6.5.6
A copy of outside test laboratory radiation report if ordered
6.5.7
Certificate of Conformance certifying that the devices meet all the requirements of this
specification and have successfully completed the mandatory tests and inspections herein.
Note: Items 6.5.1 and 6.5.7 will be delivered as a minimum, with each shipment.
7.0
Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All dice
shall be packaged in multicavity containers composed of conductive, anti-static, or static dissipative
material with an external conductive field shielding barrier.
LINEAR TECHNOLOGY CORPORATION
PAGE 6 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
DICE OUTLINE DIMENSIONS AND PAD FUNCTIONS
FIGURE 1
LINEAR TECHNOLOGY CORPORATION
PAGE 7 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
TABLE A. DIE LAYOUT – X-Y COORDINATES
Pad Name
SENSE
OUT
OUT
OUT
OUT
OUT
IN
IN
IN
IN
IN
VCONTROL
SET
X (μm)
-673
-382.5
-382.5
-382.5
-382.5
-382.5
501
501
501
501
501
636.5
-290.5
Y (μm) W (μm) H (μm)
-926.5
100
100
-624.5
100
100
-186
100
100
252.5
100
100
691
100
100
1129.5 100
100
1129.5 100
100
691
100
100
252.5
100
100
-186
100
100
-624.5
100
100
-927.5
100
100
-1275.5 100
100
Notes:
1. Origin of coordinates is the centroid of the dice.
LINEAR TECHNOLOGY CORPORATION
PAGE 8 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
TOTAL DOSE BIAS CIRCUIT
FIGURE 2
LINEAR TECHNOLOGY CORPORATION
PAGE 9 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
BURN-IN CIRCUIT
FIGURE 3
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PAGE 10 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
(K) TO3 / 4 LEADS CASE OUTLINE
FIGURE 4
TERMINAL CONNECTIONS
FIGURE 5
LINEAR TECHNOLOGY CORPORATION
PAGE 11 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
NOISE TEST CIRCUIT
FIGURE 6
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PAGE 12 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
TABLE I. DICE/DWF ELECTRICAL TEST LIMITS
TA = 25°C (Notes 2, 5, 8, 9, 11)
LINEAR TECHNOLOGY CORPORATION
PAGE 13 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
TABLE II. ELECTRICAL CHARACTRISTICS (Pre-irradiation)
(Notes 2, 9, 11)
LINEAR TECHNOLOGY CORPORATION
PAGE 14 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
TABLE III. ELECTRICAL CHARACTERISTICS (Post-irradiation)
TA = 25°C (Notes 2, 9, 11)
LINEAR TECHNOLOGY CORPORATION
PAGE 15 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
TABLE IV. ELECTRICAL TEST REQUIREMENTS
LINEAR TECHNOLOGY CORPORATION
PAGE 16 of 17
SPEC NO. 05-08-5744 REV. C
RH3083MK LOW DROPOUT REGULATOR DICE
TABLE V. RH ELEMENT EVALUATION TABLE QUALIFICATION OF DICE SALE
LINEAR TECHNOLOGY CORPORATION
PAGE 17 of 17