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INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Generic Copy
06-OCT-2004
SUBJECT: ON Semiconductor Initial Product/Process Change Notification #13699
TITLE: SOT-723 Assembly/Test Qualification at Leshan
EFFECTIVE DATE: 06-Feb-2005
AFFECTED CHANGE CATEGORY:
ON Semiconductor Assembly/Test Site
AFFECTED PRODUCT DIVISION:
Discretes Products
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact Sales Office or Mark Dewitt <[email protected]>
NOTIFICATION TYPE:
Initial Product/Process Change Notification (IPCN)
First change notification sent to customers. IPCNs are issued at least 120 days prior to implementation
of the change. An IPCN is advance notification about an upcoming change and contains general
information regarding the change details and devices affected. It also contains the preliminary
reliability qualification plan.
The completed qualification and characterization data will be included in the Final Product/Process
Change Notification (FPCN).
This IPCN notification will be followed by a Final Product/Process Change Notification (FPCN) at
least 60 days prior to implementation of the change.
DESCRIPTION AND PURPOSE:
ON Semiconductor is pleased to announce additional Assembly/Test capacity of SOT-723
manufacturing in our factory located in Leshan China. This notification affects NPN/PNP General
Purpose Transistors and Digital Transistors. Our Leshan factory is both QS9000 certified and
AEC qualified and has been producing all the technologies in SOT-23 for customers worldwide for
many years. This expansion will provide additional flexibility and capacity needed to improve
responsiveness and on time delivery to our valuable customers.
There will be no change to the form, fit, and function of the devices. Device parameters will continue
to meet all Data Book specifications, and reliability will continue to meet or exceed ON
Semiconductors standards.
Issue Date: 06 Oct, 2004
Page 1 of 3
Initial Product/Process Change Notification #13699
QUALIFICATION PLAN:
Package = SOT723, Devices, BAS16, BC846, MMBT2907A, DAN222
Test
Conditions
Interval
Sample Size
(Lots x Units)
A/clave +PC
Ta=121 degC, P=15 psig, RH=100%
96 hrs
3x77
H3TRB+PC
Ta=85 degC, RH = 85%,
Bias = 80% rated voltage
1008 hrs
3x77
HTB
Ta = 150 deg C
1008 hrs
3x77
HTRB
Ta=150 degC,
bias = 80% rated voltage
1008 hrs
3x77
Temp Cycle +PC
Ta = -65 to +150 deg C
1000 cyc
3x77
IOL+PC
Ta=25 deg C, Ton=Toff=2min, delta
Tj=100 deg C max
15000 cyc
3x77
MSL1 (PC)
24 hr bake @125deg C + 168 hr 85/85 Readout 3x252
+ 3 IR @ 260 deg C + 1x Flux immersion
+ Alcohol + DI rinse + Visual
AFFECTED DEVICE LIST (WITHOUT SPECIALS):
PART
2SA2029M3T5G
2SC5658M3T5G
BC846BM3T5G
BC856BM3T5G
DTA114EM3T5G
DTA114TM3T5G
DTA114YM3T5G
DTA115EM3T5G
DTA123EM3T5G
DTA123JM3T5G
DTA124EM3T5G
DTA124XM3T5G
DTA143EM3T5G
DTA143TM3T5G
DTA143ZM3T5G
DTA144EM3T5G
DTA144TM3T5G
DTA144WM3T5G
DTC114EM3T5G
DTC114TM3T5G
DTC114YM3T5G
DTC115EM3T5G
DTC123EM3T5G
DTC123JM3T5G
DTC124EM3T5G
DTC124XM3T5G
Issue Date: 06 Oct, 2004
Page 2 of 3
Initial Product/Process Change Notification #13699
DTC143EM3T5G
DTC143TM3T5G
DTC143ZM3T5G
DTC144EM3T5G
DTC144TM3T5G
DTC144WM3T5G
Issue Date: 06 Oct, 2004
Page 3 of 3