FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20386 Generic Copy Issue Date: 20-Feb-2014 TITLE: Qualification of ON Semiconductor Vietnam (OSV) for the Assembly and Test of TMOS, HD3E, HVFET, SCR and TRIAC packaged in DPAK case 369C, 369AA & 369AD. PROPOSED FIRST SHIP DATE: 20-May-2014 AFFECTED CHANGE CATEGORY(S): ON Semiconductor Assembly & Test FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or following contact Product Engineers: FET (TMOS, HD3E, HVFET) TRIAC & SCR Sew Seng Tam Raja Roziah t.sew-seng @onsemi.com [email protected] SAMPLES: Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Reliability Engineer Chean Ching Sim <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: This FPCN announces the planned capacity expansion of ON Semiconductor’s assembly and test operations of DPAK discrete packaged products, currently built at ON Semiconductor Seremban, Malaysia facility to ON Semiconductor Vietnam (OSV). Upon the expiration of this FPCN, Trench Mosfet, Ultrafast Rectifier, Bipolar Power Transistor devices may be processed at either location. These products have been qualified to commodity/commercial requirements. These products will continue being Pb-free, Halide free and RoHS compliant. Issue Date: 20-Feb-2014 Rev. 06-Jan-2010 Page 1 of 5 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20386 RELIABILITY DATA SUMMARY: Reliability Test Results: Device MBRD5H100T4G Test: HTRB Autoclave H3TRB IOL TC HTSL RSH Solderability Conditions: Ta=90°C 80% Rated Voltage Ta=121°C RH=100% 15 psig Ta=85°C RH=85% bias=80% rated V or 100V Max Ta=25°C, Delta TJ = 100°C, Ton/off = 2 min. Ta= -65°C to 150°C Ta = 150°C Ta=260°C, 10 sec dwell Ta=245°C, 10 sec dwell Interval: Results 1008 hrs 96 hrs 1008 hrs 0/84 0/84 0/84 15,000 cycles 0/84 1000 cycles 1008 hrs 0/84 0/84 0/30 0/15 Device MAC4DSNT4G Test: HTRB HTFB Autoclave H3TRB IOL TC HTSL RSH Solderability Conditions: Ta=100°C 80% Rated Voltage Ta=100°C 80% Rated Voltage Ta=121°C RH=100% 15 psig Ta=85°C RH=85% bias=80% rated V or 100V Max Ta=25°C, Delta TJ = 100°C, Ton/off = 2 min. Ta= -65°C to 150°C Ta = 150°C Ta=260°C, 10 sec dwell Ta=245°C, 10 sec dwell Interval: Results 1008 hrs 1008 hrs 96 hrs 1008 hrs 0/84 0/84 0/84 0/84 15,000 cycles 0/84 1000 cycles 1008 hrs 0/84 0/84 0/30 0/15 Device MCR12DSNT4G Test: Conditions: Interval: Results HTRB HTFB Autoclave H3TRB Ta=100°C 80% Rated Voltage Ta=100°C 80% Rated Voltage Ta=121°C RH=100% 15 psig Ta=85°C RH=85% bias=80% rated V or 100V Max Ta=25°C, Delta TJ = 100°C, Ton/off = 2 min. Ta= -65°C to 150°C Ta = 150°C Ta=260°C, 10 sec dwell Ta=245°C, 10 sec dwell 1008 hrs 1008 hrs 96 hrs 1008 hrs 0/252 0/84 0/252 0/252 15,000 cycles 0/252 1000 cycles 1008 hrs 0/252 0/252 0/90 0/45 IOL TC HTSL RSH Solderability Issue Date: 20-Feb-2014 Rev. 06-Jan-2010 Page 2 of 5 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20386 RELIABILITY DATA SUMMARY: Reliability Test Results: Device NTD110N02RT4G Test: Conditions: HTRB HTGB Autoclave H3TRB Ta=175°C 80% Rated Voltage Ta=175°C 100% Rated Voltage Ta=121°C RH=100% 15 psig Ta=85°C RH=85% bias=80% rated V or 100V Max Ta=25°C, Delta TJ = 100°C, Ton/off = 2 min. Ta= -55°C to 150°C Ta = 150°C Ta=260°C, 10 sec dwell Ta=245°C, 10 sec dwell IOL TC HTSL RSH Solderability Interval: 1008 hrs 1008 hrs 96 hrs 1008 hrs Results 0/84 0/84 0/84 0/84 15,000 cycles 0/84 1000 cycles 1008 hrs 0/84 0/84 0/30 0/15 Device NTD6414ANT4G Test: Conditions: HTRB HTGB Autoclave H3TRB Ta=175°C 80% Rated Voltage Ta=175°C 100% Rated Voltage Ta=121°C RH=100% 15 psig Ta=85°C RH=85% bias=80% rated V or 100V Max Ta=25°C, Delta TJ = 100°C, Ton/off = 2 min. Ta= -55°C to 150°C Ta = 150°C Ta=260°C, 10 sec dwell Ta=245°C, 10 sec dwell IOL TC HTSL RSH Solderability Interval: 1008 hrs 1008 hrs 96 hrs 1008 hrs Results 0/84 0/84 0/84 0/84 15,000 cycles 0/84 1000 cycles 1008 hrs 0/84 0/84 0/30 0/15 Device NDD03N80ZT4G Test: Conditions: HTRB HTGB Autoclave H3TRB Ta=150°C 80% Rated Voltage Ta=150°C 100% Rated Voltage Ta=121°C RH=100% 15 psig Ta=85°C RH=85% bias=80% rated V or 100V Max Ta=25°C, Delta TJ = 100°C, Ton/off = 2 min. Ta= -55°C to 150°C Ta = 150°C Ta=260°C, 10 sec dwell Ta=245°C, 10 sec dwell IOL TC HTSL RSH Solderability Issue Date: 20-Feb-2014 Interval: 1008 hrs 1008 hrs 96 hrs 1008 hrs Results 0/84 0/84 0/84 0/84 15,000 cycles 0/84 1000 cycles 1008 hrs 0/84 0/84 0/30 0/15 Rev. 06-Jan-2010 Page 3 of 5 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20386 RELIABILITY DATA SUMMARY: Reliability Test Results: Device MTD6N20ET4G Test: Conditions: HTRB HTGB Autoclave H3TRB Ta=150°C 80% Rated Voltage Ta=150°C 100% Rated Voltage Ta=121°C RH=100% 15 psig Ta=85°C RH=85% bias=80% rated V or 100V Max Ta=25°C, Delta TJ = 100°C, Ton/off = 2 min. Ta= -55°C to 150°C Ta = 150°C Ta=260°C, 10 sec dwell Ta=245°C, 10 sec dwell IOL TC HTSL RSH Solderability Interval: Results 1008 hrs 1008 hrs 96 hrs 1008 hrs 0/84 0/84 0/84 0/84 15,000 cycles 0/84 1000 cycles 1008 hrs 0/84 0/84 0/30 0/15 ELECTRICAL CHARACTERISTIC SUMMARY: There are no changes in electrical characteristics; product performance meets data sheet specifications. Characterization data is available upon request. CHANGED PART IDENTIFICATION: Product from On Semiconductor Vietnam will be marked with site code VN prior to date code AFFECTED DEVICE LIST MOSFET: List of affected General Parts: MTD6N15T4G MTD6N20ET4G NDD02N60ZT4G NDD03N50ZT4G NDD03N60ZT4G NDD03N80ZT4G NDD04N50ZT4G NDD04N60ZT4G NDD05N50ZT4G NDD60N360U1-35G NDD60N360U1T4G NDD60N550U1-35G NDD60N550U1T4G NDD60N745U1-35G NDD60N745U1T4G NDD60N900U1-35G Issue Date: 20-Feb-2014 NDD60N900U1T4G NTD110N02RT4G NTD14N03RT4G NTD18N06LT4G NTD20N03L27T4G NTD20N06LT4G NTD20N06T4G NTD20P06LT4G NTD24N06LT4G NTD24N06T4G NTD25P03LT4G NTD2955G NTD2955T4G NTD3055-094T4G NTD3055-150T4G NTD3055-150T4H Rev. 06-Jan-2010 NTD3055L104G NTD3055L104T4G NTD3055L170T4G NTD4302T4G NTD4904N-35G NTD4904NT4G NTD5406NT4G NTD5407NT4G NTD5806NT4G NTD5807NT4G NTD6414ANT4G NTD6415ANLT4G NTD6415ANT4G NTD6416ANLT4G NTD6416ANT4G Page 4 of 5 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20386 AFFECTED DEVICE LIST SCR & TRIAC: List of affected General Parts: MAC4DCMT4G MAC4DCNT4G MAC4DHMT4G MAC4DLMT4G MAC4DSMT4G MAC4DSNT4G MCR12DCNT4G MCR12DSMT4G MCR12DSNT4G Issue Date: 20-Feb-2014 MCR703AT4G MCR706AT4G MCR708AG MCR708AT4G MCR716T4G MCR718T4G MCR8DCMT4G MCR8DSMT4G Rev. 06-Jan-2010 Page 5 of 5