View PDF

FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20386
Generic Copy
Issue Date: 20-Feb-2014
TITLE: Qualification of ON Semiconductor Vietnam (OSV) for the Assembly and Test of TMOS,
HD3E, HVFET, SCR and TRIAC packaged in DPAK case 369C, 369AA & 369AD.
PROPOSED FIRST SHIP DATE: 20-May-2014
AFFECTED CHANGE CATEGORY(S): ON Semiconductor Assembly & Test
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or following contact Product Engineers:
FET (TMOS, HD3E, HVFET)
TRIAC & SCR
Sew Seng Tam
Raja Roziah
t.sew-seng @onsemi.com
[email protected]
SAMPLES: Contact your local ON Semiconductor Sales Office
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Reliability Engineer Chean Ching Sim
<[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers.
implementation of the change.
FPCNs are issued at least 90 days prior to
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
This FPCN announces the planned capacity expansion of ON Semiconductor’s assembly and test
operations of DPAK discrete packaged products, currently built at ON Semiconductor Seremban,
Malaysia facility to ON Semiconductor Vietnam (OSV).
Upon the expiration of this FPCN, Trench Mosfet, Ultrafast Rectifier, Bipolar Power Transistor
devices may be processed at either location. These products have been qualified to
commodity/commercial requirements. These products will continue being Pb-free, Halide free and
RoHS compliant.
Issue Date: 20-Feb-2014
Rev. 06-Jan-2010
Page 1 of 5
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20386
RELIABILITY DATA SUMMARY:
Reliability Test Results:
Device MBRD5H100T4G
Test:
HTRB
Autoclave
H3TRB
IOL
TC
HTSL
RSH
Solderability
Conditions:
Ta=90°C 80% Rated Voltage
Ta=121°C RH=100% 15 psig
Ta=85°C RH=85%
bias=80% rated V or 100V Max
Ta=25°C, Delta TJ = 100°C,
Ton/off = 2 min.
Ta= -65°C to 150°C
Ta = 150°C
Ta=260°C, 10 sec dwell
Ta=245°C, 10 sec dwell
Interval:
Results
1008 hrs
96 hrs
1008 hrs
0/84
0/84
0/84
15,000 cycles
0/84
1000 cycles
1008 hrs
0/84
0/84
0/30
0/15
Device MAC4DSNT4G
Test:
HTRB
HTFB
Autoclave
H3TRB
IOL
TC
HTSL
RSH
Solderability
Conditions:
Ta=100°C 80% Rated Voltage
Ta=100°C 80% Rated Voltage
Ta=121°C RH=100% 15 psig
Ta=85°C RH=85%
bias=80% rated V or 100V Max
Ta=25°C, Delta TJ = 100°C,
Ton/off = 2 min.
Ta= -65°C to 150°C
Ta = 150°C
Ta=260°C, 10 sec dwell
Ta=245°C, 10 sec dwell
Interval:
Results
1008 hrs
1008 hrs
96 hrs
1008 hrs
0/84
0/84
0/84
0/84
15,000 cycles
0/84
1000 cycles
1008 hrs
0/84
0/84
0/30
0/15
Device MCR12DSNT4G
Test:
Conditions:
Interval:
Results
HTRB
HTFB
Autoclave
H3TRB
Ta=100°C 80% Rated Voltage
Ta=100°C 80% Rated Voltage
Ta=121°C RH=100% 15 psig
Ta=85°C RH=85%
bias=80% rated V or 100V Max
Ta=25°C, Delta TJ = 100°C,
Ton/off = 2 min.
Ta= -65°C to 150°C
Ta = 150°C
Ta=260°C, 10 sec dwell
Ta=245°C, 10 sec dwell
1008 hrs
1008 hrs
96 hrs
1008 hrs
0/252
0/84
0/252
0/252
15,000 cycles
0/252
1000 cycles
1008 hrs
0/252
0/252
0/90
0/45
IOL
TC
HTSL
RSH
Solderability
Issue Date: 20-Feb-2014
Rev. 06-Jan-2010
Page 2 of 5
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20386
RELIABILITY DATA SUMMARY:
Reliability Test Results:
Device NTD110N02RT4G
Test:
Conditions:
HTRB
HTGB
Autoclave
H3TRB
Ta=175°C 80% Rated Voltage
Ta=175°C 100% Rated Voltage
Ta=121°C RH=100% 15 psig
Ta=85°C RH=85%
bias=80% rated V or 100V Max
Ta=25°C, Delta TJ = 100°C,
Ton/off = 2 min.
Ta= -55°C to 150°C
Ta = 150°C
Ta=260°C, 10 sec dwell
Ta=245°C, 10 sec dwell
IOL
TC
HTSL
RSH
Solderability
Interval:
1008 hrs
1008 hrs
96 hrs
1008 hrs
Results
0/84
0/84
0/84
0/84
15,000 cycles
0/84
1000 cycles
1008 hrs
0/84
0/84
0/30
0/15
Device NTD6414ANT4G
Test:
Conditions:
HTRB
HTGB
Autoclave
H3TRB
Ta=175°C 80% Rated Voltage
Ta=175°C 100% Rated Voltage
Ta=121°C RH=100% 15 psig
Ta=85°C RH=85%
bias=80% rated V or 100V Max
Ta=25°C, Delta TJ = 100°C,
Ton/off = 2 min.
Ta= -55°C to 150°C
Ta = 150°C
Ta=260°C, 10 sec dwell
Ta=245°C, 10 sec dwell
IOL
TC
HTSL
RSH
Solderability
Interval:
1008 hrs
1008 hrs
96 hrs
1008 hrs
Results
0/84
0/84
0/84
0/84
15,000 cycles
0/84
1000 cycles
1008 hrs
0/84
0/84
0/30
0/15
Device NDD03N80ZT4G
Test:
Conditions:
HTRB
HTGB
Autoclave
H3TRB
Ta=150°C 80% Rated Voltage
Ta=150°C 100% Rated Voltage
Ta=121°C RH=100% 15 psig
Ta=85°C RH=85%
bias=80% rated V or 100V Max
Ta=25°C, Delta TJ = 100°C,
Ton/off = 2 min.
Ta= -55°C to 150°C
Ta = 150°C
Ta=260°C, 10 sec dwell
Ta=245°C, 10 sec dwell
IOL
TC
HTSL
RSH
Solderability
Issue Date: 20-Feb-2014
Interval:
1008 hrs
1008 hrs
96 hrs
1008 hrs
Results
0/84
0/84
0/84
0/84
15,000 cycles
0/84
1000 cycles
1008 hrs
0/84
0/84
0/30
0/15
Rev. 06-Jan-2010
Page 3 of 5
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20386
RELIABILITY DATA SUMMARY:
Reliability Test Results:
Device MTD6N20ET4G
Test:
Conditions:
HTRB
HTGB
Autoclave
H3TRB
Ta=150°C 80% Rated Voltage
Ta=150°C 100% Rated Voltage
Ta=121°C RH=100% 15 psig
Ta=85°C RH=85%
bias=80% rated V or 100V Max
Ta=25°C, Delta TJ = 100°C,
Ton/off = 2 min.
Ta= -55°C to 150°C
Ta = 150°C
Ta=260°C, 10 sec dwell
Ta=245°C, 10 sec dwell
IOL
TC
HTSL
RSH
Solderability
Interval:
Results
1008 hrs
1008 hrs
96 hrs
1008 hrs
0/84
0/84
0/84
0/84
15,000 cycles
0/84
1000 cycles
1008 hrs
0/84
0/84
0/30
0/15
ELECTRICAL CHARACTERISTIC SUMMARY:
There are no changes in electrical characteristics; product performance meets data sheet
specifications. Characterization data is available upon request.
CHANGED PART IDENTIFICATION:
Product from On Semiconductor Vietnam will be marked with site code VN prior to date code
AFFECTED DEVICE LIST MOSFET:
List of affected General Parts:
MTD6N15T4G
MTD6N20ET4G
NDD02N60ZT4G
NDD03N50ZT4G
NDD03N60ZT4G
NDD03N80ZT4G
NDD04N50ZT4G
NDD04N60ZT4G
NDD05N50ZT4G
NDD60N360U1-35G
NDD60N360U1T4G
NDD60N550U1-35G
NDD60N550U1T4G
NDD60N745U1-35G
NDD60N745U1T4G
NDD60N900U1-35G
Issue Date: 20-Feb-2014
NDD60N900U1T4G
NTD110N02RT4G
NTD14N03RT4G
NTD18N06LT4G
NTD20N03L27T4G
NTD20N06LT4G
NTD20N06T4G
NTD20P06LT4G
NTD24N06LT4G
NTD24N06T4G
NTD25P03LT4G
NTD2955G
NTD2955T4G
NTD3055-094T4G
NTD3055-150T4G
NTD3055-150T4H
Rev. 06-Jan-2010
NTD3055L104G
NTD3055L104T4G
NTD3055L170T4G
NTD4302T4G
NTD4904N-35G
NTD4904NT4G
NTD5406NT4G
NTD5407NT4G
NTD5806NT4G
NTD5807NT4G
NTD6414ANT4G
NTD6415ANLT4G
NTD6415ANT4G
NTD6416ANLT4G
NTD6416ANT4G
Page 4 of 5
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 20386
AFFECTED DEVICE LIST SCR & TRIAC:
List of affected General Parts:
MAC4DCMT4G
MAC4DCNT4G
MAC4DHMT4G
MAC4DLMT4G
MAC4DSMT4G
MAC4DSNT4G
MCR12DCNT4G
MCR12DSMT4G
MCR12DSNT4G
Issue Date: 20-Feb-2014
MCR703AT4G
MCR706AT4G
MCR708AG
MCR708AT4G
MCR716T4G
MCR718T4G
MCR8DCMT4G
MCR8DSMT4G
Rev. 06-Jan-2010
Page 5 of 5