UCC28810

UCC28810
UCC28811
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LED LIGHTING POWER CONTROLLER
FEATURES
APPLICATIONS
•
•
1
•
•
•
•
•
•
•
•
•
Transition Mode Controller for Low
Implementation Cost of AC Input LED Lighting
Applications
Implements Single Stage Power Factor
Corrected LED Driver
Enhanced Transient Response With Slew-Rate
Comparator
Interfaces with Traditional Wall Dimmers
Accurate Internal VREF for Tight Output
Regulation
Two UVLO Options
Overvoltage Protection (OVP), Open-Feedback
Protection and Enable Circuits
±750-mA Peak Gate Drive Current
Low Start-Up and Operating Currents
Lead (Pb)-Free Packages
•
•
AC Input General Lighting Applications Using
HB LEDs
Industrial, Commercial and Residential
Lighting Fixtures
Outdoor Lighting: Street, Roadway, Parking,
Construction and Ornamental LED Lighting
Fixtures
DESCRIPTION
The UCC28810 and UCC28811 are general lighting
power controllers for low to medium power lumens
applications requiring power factor correction and
EMC compliance. It is designed for controlling a
flyback, buck or boost converter operating in critical
conduction mode. It features a transconductance
voltage amplifier for feedback error processing, a
simple current reference generator for generating a
current command proportional to the input voltage, a
current-sense (PWM) comparator, PWM logic and a
totem-pole driver for driving an external FET.
SIMPLIFIED APPLICATION DIAGRAM
Bias
UCC28810
1
VSENSE
VDD
8
2
EAOUT GDRV
7
3
VINS
GND
6
4
ISENSE
TZE
5
Low Pass
Filter
LED
Current
Sense
Triac Dimming
Detect
Bias
+
+
UDG-08120
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
UCC28810
UCC28811
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DESCRIPTION (CONTINUED)
In the critical conduction mode operation, the PWM circuit is self-oscillating with the turn-on being governed by a
transformer zero energy detector (TZE pin) and the turn-off being governed by the current sense comparator.
Additionally, the controller provides features such as peak current limit, restart timer, overvoltage protection
(OVP), and enable.
The efficient system performance is attained by incorporation of zero power detect function which allows the
controller output to shut down at light load conditions without running into overvoltage. The device also features
an innovative slew rate enhancement circuit which improves the large signal transient performance of the voltage
error amplifier. The low start-up and operating currents of the device result in low power consumption and ease
of start-up. The highly-accurate internal bandgap reference leads to tight regulation of the output voltage in
normal and OVP conditions, resulting in higher system reliability. The enable comparator ensures that the
controller is off if the feedback sense path is broken or if the input voltage is very low.
There are two key parametric differences between UCC28810 and UCC28811, the UVLO turn-on threshold and
the gM amplifier source current. The UVLO turn-on threshold of the UCC28810 is 15.8 V and for the UCC28811 it
is 12.5 V. The gM amplifier source current for UCC28810 is typically 1.3 mA, and for the UCC28811 it is 300µA.
The higher UVLO turn-on threshold of the UCC28810 allows quicker and easier start-up with a smaller VDD
capacitance while the lower UVLO turn-on threshold of UCC28811 allows operation of the critical conduction
mode controller to be easily controlled by the downstream PWM controller in two-stage power converters. The
UCC28810 gM amplifier also provides a full 1.3-mA typical source current for faster start-up and improved
transient response when the output is low either at start-up or during transient conditions. The UCC28811 is
suitable for applications such as street lights and larger area luminaires where a two-stage power conversion is
needed. The UCC28810 is suitable for applications such as commercial or residential retrofit luminaires where
there is no down-stream PWM conversion and the advantages of smaller VDD capacitor and improved transient
response can be realized.
Devices are available in the industrial temperature range of –40°C to 105°C. Package offering is an 8-pin SOIC
(D) package.
ORDERING INFORMATION (1)
TA = TJ
UVLO THRESHOLD
gM AMPLIFIER
VOLTAGE (V)
SOURCE CURRENT
(µA)
ON
OFF
15.8
9.7
–1300
12.5
9.7
–300
–40°C to 105°C
(1)
PACKAGE
D
PIN
COUNT
8
SUPPLY
ORDERABLE
DEVICE NUMBER
Tube of 80
UCC28810D
Reel of 2500
UCC28810DR
Tube of 80
UCC28811D
Reel of 2500
UCC28811DR
D (SOIC-8) package is available taped and reeled. Add R suffix to device type (e.g. UCC28810DR) to order quantities of 2,500 devices
per reel.
ABSOLUTE MAXIMUM RATINGS (1)
VALUE
Input voltage
Minimum input
voltage
VDD (Internally clamped)
20
VSENSE, VINS, ISENSE
5
VSENSE, VINS, ISENSE
–5
UNIT
V
VDD
30
TZE
±10
Output current
GDRV
±750
mA
Output voltage
GDRV
–5
V
Input current
Tstg
Storage temperature
–55 to 150
TJ
Operating temperature
–65 to 150
Soldering temperature
(1)
2
mA
°C
300
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Exposure to conditions beyond the operational
limits for extended periods of time may affect device reliability. Currents are positive into, and negative out of the specified terminal.
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PACKAGE DISSIPATION RATINGS (1)
(1)
PACKAGE
THERMAL IMPEDANCE JUNCTION-TO-AMBIENT (°C/W)
Plastic 8-Pin Small Outline
150
TI device packages are modeled and tested for thermal performance using printed circuit board
designs outlined in JEDEC standards JESD 51-3 and JESD 51-7.
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ELECTRICAL CHARACTERISTICS
–40°C ≤ TA = TJ ≤ 105°C, VVDD = 12 VDC, CGDRV = 0.1-µF from VDD to GND, all voltages are with respect to GND.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
VVDD
Operating voltage
IVDD
18
Shunt voltage
IVDD = 25 mA
18
19
20
Supply current, off
VVDD = VVDD turn-on threshold –300 mV
Supply current, disabled
VVSENSE = 0.5 V
75
125
2
4
Supply current, on
Supply current, dynamic operating
75 kHz, CGDRV = 0 nF
4
6
75 kHz, CGDRV = 1 nF
5
7
V
µA
mA
UVLO
VDD turn-on threshold
UCC28810
15.4
15.8
16.4
UCC28811
12.0
12.5
13.0
9.4
9.7
10.0
UCC28810
5.8
6.3
6.8
UCC28811
2.3
2.8
3.3
2.45
2.50
2.55
V
0.5
µA
5.5
V
1.80
2.45
V
130
VDD turn-off threshold
VUVLO
UVLO hysteresis
V
V
VOLTAGE AMPLIFIER (VSENSE)
VREF
Internal voltage reference
IBIAS
Input bias current
gM
EAOUT high
VVSENSE = 2.1 V
EAOUT low
VVSENSE = 2.55 V
Transconductance
IEAOUT,SRC
Source current
IEAOUT,SNK
Sink current
TJ = 25°C, VEAOUT = 3.5 V
4.5
µS
60
90
–0.2
–1.0
–200
–300
0.2
1.0
UCC28810
VVREF+
0.165
VVREF
+0.190
VVREF
+0.210
UCC28811
VVREF+
0.150
VVREF+
0.180
VVREF+
0.210
UCC28810
175
200
225
UCC28811
150
180
210
UCC28810
0.62
0.67
0.72
UCC28811
0.18
0.23
0.28
0.05
0.10
0.20
V
0.87
1/V
UCC28810
UCC28811
VVSENSE = 2.1 V, VEAOUT = 3.5 V
VVSENSE = 2.1 V, VEAOUT = 3.5 V
mA
–400
µA
mA
OVERVOLTAGE PROTECTION / ENABLE (VSENSE)
VOV(ref)
Overvoltage reference
Hysteresis
Enable threshold
Enable hysteresis
V
mV
V
CURRENT REFERENCE GENERATOR
K
VEAOUT
Current reference generator gain constant
0.43
0.65
Dynamic input range, VVINS INPUT
VVINS = 0.5 V, VEAOUT = 3.5 V
0 to 2.5
0 to 3.5
V
Error amplifier dynamic input range
2.5 to
3.8
2.5 to
4.0
V
Input bias current, VINS
4
0.1
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1.0
µA
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ELECTRICAL CHARACTERISTICS (continued)
–40°C ≤ TA = TJ ≤ 105°C, VVDD = 12 VDC, CGDRV = 0.1-µF from VDD to GND, all voltages are with respect to GND.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
2.1
2.3
2.5
Input threshold (rising edge) (1)
1.00
1.25
1.80
V
Hysteresis (1)
250
350
450
mV
5
6
0.30
0.65
0.90
200
400
ZERO POWER
VEAOUT
Zero power comparator threshold (1)
V
TRANSFORMER ZERO ENERGY DETECT
tRSRT
Input high clamp
ITZE = 3 mA
Input low clamp
ITZE = –3 mA
Restart time delay
V
V
µs
CURRENT SENSE COMPARATOR
IBIAS
Input bias current
VISENSE = 0 V
Input offset voltage (1)
tDLY
1.0
µA
10
mV
300
400
ns
1.70
1.80
V
5
12
Ω
0.1
–10
Delay to output
ISENSE to GDRV
Maximum current sense threshold voltage
1.55
PFC GATE DRIVER
RPULLUP
GDRV pull up resistance
IGDRV = –125 mA
RPULLDN
GDRV pull down resistance
IGDRV = 125 mA
2
10
Ω
tRISE
GDRV output rise time
CGDRV = 1 nF, RGRDV = 10 Ω
25
75
ns
tFALL
GDRV output fall time
CGDRV = 1 nF, RGRDV = 10 Ω
10
50
ns
(1)
Ensured by design. Not production tested.
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Table 1. PIN DESCRIPTIONS
TERMINAL
NAME
NO.
I/O
DESCRIPTION
EAOUT
2
O
Output of the transconductance error amplifier. The output current capability of this pin is 10 µA under normal
conditions, but increases to 1 mA when the voltage on VSENSE rises above 2.5 V. The EAOUT voltage is one of
the inputs to the current reference generator, with a dynamic input range of 2.5 V to 4.0 V. During zero energy or
overvoltage conditions, this pin goes below 2.5 V, nominal. When it goes below 2.3 V, the zero energy detect
comparator is activated which prevents the gate drive from switching. Loop compensation components are
connected between this pin and ground, or can be connected directly to the collector of the opto coupler in isolated
applications.
GND
6
–
The device reference ground. All bypassing elements are connected to the GND pin with the shortest traces
possible.
GDRV
7
O
The gate drive output driving the flyback, buck, or boost switch. This output is capable of delivering up to 750-mA
peak currents during turn-on and turn-off. An external gate drive resistor may be needed to limit the peak current
depending upon the VDD voltage being used. Below the UVLO threshold, the output is held low.
ISENSE
4
I
This pin senses the instantaneous switch current in the external switch and uses this signal as the internal ramp for
the current sense comparator. A small internal noise filter is provided. If additional filtering is needed, an external
R-C filter may be added to further suppress noise spikes. An internal clamp on the current reference generator
output terminates the switching cycle if VISENSE exceeds 1.7 V. An internal 75-mV offset is added to ISENSE signal
to limit the zero crossing distortion. The ISENSE threshold voltage is approximately equal to:
VISENSE @ 0.67 ´ (VEAOUT - 2.5 V )´ (VVINS + 75mV )
TZE
5
I
This pin is the input for the transformer zero energy detect comparator. A bias winding can be used to sense the
transformer zero energy. The transition is detected when the inductor current falls to zero and the TZE input goes
low. Internal active clamps are provided to prevent TZE from going below ground or rising too high. If zero energy is
not detected within 400 µs, a restart timer sets the latch and the gate drive high.
VDD
8
I
The supply voltage for the device. This pin must be bypassed with a high-frequency capacitor (not less than 0.1 µF)
and tied directly to GND with the shortest traces possible. The UCC28810 has a wide UVLO hysteresis, typically
6.3 V, which allows use of a lower value holdup capacitor on VDD, resulting in faster start up. The UCC28811 has a
narrow UVLO hysteresis, typically 2.8 V, and a typical turn-on threshold of 12.5 V for applications where the device
needs to be controlled by a downstream PWM controller. This narrower UVLO hysteresis requires a larger value
holdup capacitor.
VINS
3
I
This pin senses the instantaneous regulator input voltage through an external voltage divider. The VINS voltage
acts as one of the inputs to the current reference generator. The recommended operating range is 0 V to 3.8 V at
high line.
I
This pin is the inverting input to the transconductance amplifier, with a nominal value of 2.5 V, and is also the input
to the OVP comparator. Pulling this pin below the ENABLE threshold turns off the output switching, providing the
ability to externally disable the converter. This function also provides feedback fault protection, ensuring no runaway
if the feedback path is open. When using the internal error amplifier, this pin senses the output voltage through a
voltage divider.
VSENSE
1
SOIC-8 PACKAGE (TOP VIEW)
6
VSENSE
1
8
VDD
EAOUT
2
7
GDRV
VINS
3
6
GND
ISENSE
4
5
TZE
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BLOCK DESCRIPTION
BLOCK DIAGRAM
2.7/2.5 V
VSENSE
2.5 V
EAOUT
VINS
REF
VREF
GOOD
8
VDD
7
GDRV
6
GND
5
TZE
OVP
x
x
+
Current Sense Comparator
K
Current
Reference
Generator
2
+
R
Q
S
Q
3
Zero Energy
+ Detect
2.3 V
Restart Timer
+
+
40 kW
ISENSE
Init. Bias
gM VEA
1
UVLO
+
VREF and
Bias Reg
Enable
+
0.67/0.57 V
0.23/0.15 V
VREF
OVP
+
4
1.7/1.4 V
75 mV
5 pF
UDG-08130
UVLO and Reference Circuit
This circuitry generates a precision reference voltage used to obtain a tightly controlled UVLO threshold. In
addition to generating a 2.5-V reference for the noninverting terminal of the gM amplifier, it generates the
reference voltages for OVP, enable, zero energy detect and the current reference generator circuits. An internal
rail of 7.5 V is also generated to drive all the internal circuitry.
Error Amplifier
The voltage error amplifier in the UCC2881x is a transconductance amplifier with a typical transconductance
value of 90 µS. The advantage in using a transconductance amplifier is that the inverting input of the amplifier is
solely determined by the external resistive-divider from the output voltage and not the transient behavior of the
amplifier itself. This allows the VSENSE pin to be used for sensing over voltage conditions.
The sink and source capability of the error amplifier is approximately 10 µA during normal operation of the
amplifier. But when the VSENSE pin voltage is beyond the normal operating conditions (VVSENSE >1.05 × VREF,
VVSENSE < 0.88 × VREF), additional circuitry to enhance the slew-rate of the amplifier is activated. Enhanced
slew-rate of the compensation capacitor results in a faster start-up and transient response. This prevents the
output voltage from drifting too high or too low, which can happen if the compensation capacitor were to be
driven by the normal drive current of 10-µA. When VSENSE rises above the normal range, the enhanced sink
current capability increases to 1 mA, nominal. When VSENSE falls below the normal range, the UCC28810 can
source more than 1 mA and the UCC28811 sources approximately 300 µA. The limited source current in the
UCC28811 helps to gradually increase the error voltage on the EAOUT pin preventing a step increase in line
current. The actual rate of increase of the voltage on the EAOUT pin is dependent on the compensation network
externally connected to the EAOUT pin.
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Transformer Zero Energy Sense and Restart Timer Circuits
When all of the energy stored in the transformer has been delivered to the load, the voltage across the primary
winding falls to zero. This voltage can be sensed by monitoring the bias winding of the transformer. The internal
active clamp circuitry prevents the voltage from going to a negative or a high positive value. The clamp has the
capability to sink and source 10 mA. The resistor value in series with the bias winding should be chosen to limit
the pin current to less than 10 mA under all operating conditions. The rising edge threshold of the TZE sense
comparator can be as high as 2.0 V. If the bias winding is not used to power the controller then it should be
chosen such that the positive voltage (when the power MOSFET is off) at the TZE pin is greater than 2.0 V,
limited to less than 10 mA.
The restart timer attempts to set the gate drive high when the gate drive remains off for more than 400 µs
nominally. The minimum time period of the timer is 200 µs. This translates to a minimum switching frequency of 5
kHz. The primary inductance value is chosen for switching frequencies greater than 5 kHz.
Enable Circuit
The gate drive signal is held low if the voltage at the VSENSE pin is less than the ENABLE threshold. This
feature can be used to disable the converter by pulling VSENSE low. If the output feedback path is broken,
VSENSE is pulled to ground and the output is disabled to protect the power stage.
Zero Energy Detect Circuit
When the output of the gM amplifier goes below 2.3 V, the zero power comparator latches the gate drive signal
low. The slew rate enhancement circuitry of the gM amplifier that is activated during overvoltage conditions slews
the EAOUT pin to approximately 2.4 V. This ensures that the zero power comparator is not activated during
transient behavior (when the slew rate enhancement circuitry is activated).
Current Reference Generator Circuit
The current reference generator has two inputs. One is the error amplifier output voltage (VEAOUT), while the
other is instantaneous input voltage sense (VVINS) which is obtained by a resistive divider from the rectified line.
The current reference generator creates a current sense threshold signal that is approximately equal to 0.67 ×
VVINS × (VEAOUT–2.5 V). There is a positive offset of 75 mV added to the VINS signal in order to improve the
zero-crossing distortion and hence the THD performance of the controller in the application. The dynamic range
of the inputs can be found in the electrical characteristics table.
Overvoltage Protection (OVP) Circuit
The OVP feature in this device is not activated under most operating conditions because of the presence of the
slew rate enhancement circuitry present in the error amplifier. As soon as the output voltage reaches 5% to 7%
above the nominal value, as detected by VSENSE, the slew rate enhancement circuit is activated, and the error
amplifier output voltage is pulled below the dynamic range of the current reference generator. This prevents
further rise in the output voltage.
If the EAOUT pin is not pulled low fast enough, and the output voltage rises further, the OVP circuit acts as a
second line of protection. When the voltage at the VSENSE pin is more than 7.5% of the nominal value
[ >(VREF+0.190)], the OVP feature is activated. It stops the gate drive from switching as long as the voltage at the
VSENSE pin is above the nominal value (VREF). This prevents the output dc voltage from going above 7.5% of
the regulated value, and protects the other components of the system.
8
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TYPICAL CHARACTERISTICS
Unless otherwise noted, VVDD=12 V, –40°C ≤ TA = TJ ≤ 105°C
GDRV SATURATION VOLTAGE
vs
GDRV SOURCE CURRENT
GDRV SATURATION VOLTAGE
vs
GDRV SINK CURRENT
8
2.5
VGDRV – Saturation Voltage – V
VGDRV – Saturation Voltage – V
7
6
5
4
3
2
2.0
1.5
1.0
0.5
1
0
0
0
100
200
300
400
500
600
700
800
0
100
IGDRV,SOURCE – Source Current – mA
300
400
500
600
Figure 1.
Figure 2.
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
SUPPLY CURRENT
vs
JUNCTION TEMPERATURE
4.0
700
800
100
125
6
3.5
75 kHz,
CGDRV = 1 nF
5
3.0
IVDD– Supply Current – mA
IVDD– Supply Current – mA
200
IGDRV, SINK – Sink Current – mA
2.5
2.0
1.5
UCC28811
1.0
4
75 kHz, No Load
3
2
No Switching
1
0.5
UCC28810
0
0
4
8
12
16
20
0
-50
-25
VVDD – Supply Voltage – V
Figure 3.
0
25
50
75
TJ – Junction Temperature – °C
Figure 4.
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise noted, VVDD=12 V, –40°C ≤ TA = TJ ≤ 105°C
UVLO THRESHOLD VOLTAGE
vs
JUNCTION TEMPERATURE
INTERNAL REFERENCE VOLTAGE
vs
JUNCTION TEMPERATURE
20
2.60
2.58
UVLO ON (UCC28810)
16
14
UVLO ON (UCC28811)
12
UVLO OFF
10
8
6
UVLO Hysteresis (UCC28810)
4
2
VREF – Reference Voltage – V
VUVLO – UVLO Threshold Voltage – V
18
-25
0
25
50
75
100
2.54
2.52
2.50
2.48
2.46
2.44
2.42
UVLO Hysteresis (UCC28811)
0
-50
2.56
2.40
-50
125
-25
0
25
50
75
100
125
TJ – Junction Temperature – °C
TJ – Junction Temperature – °C
Figure 5.
Figure 6.
ISENSE INPUT VOLTAGE
vs
CURRENT REFERENCE GENERATOR INPUT VOLTAGE
CURRENT SENSE TO DRIVER DELAY TIME
vs
JUNCTION TEMPERATURE
1.8
450
VISENSE – Input Voltage – V
1.6
VEAOUT = 3.5 V
1.4
1.2
VEAOUT = 3.25 V
1.0
0.8
0.6
VEAOUT = 3 V
0.4
0.2
0.0
VEAOUT = 2.75 V
0
0.5
1.0
1.5
2.0
2.5
3.0
tDLY – ISENSE-to-GDRV Delay Time – ns
VEAOUT = 3.75 V
400
350
300
250
200
150
100
50
0
-50
-25
VINS – Current Reference Generator Input Voltage – V
Figure 7.
10
0
25
50
75
100
125
TJ – Junction Temperature – °C
Figure 8.
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise noted, VVDD=12 V, –40°C ≤ TA = TJ ≤ 105°C
TRANSCONDUCTANCE AMPLIFIER CURRENT
vs
OUTPUT SENSE VOLTAGE
120
1.5
110
1.0
IEAOUT – gM Amplifier Current – mA
gM – Transconductance – mS
TRANSCONDUCTANCE
vs
JUNCTION TEMPERATURE
100
90
80
70
0.5
UCC28811
0
-0.5
-1.0
UCC28810
60
-50
-25
0
25
50
75
100
-1.5
2.0
125
2.2
2.3
2.4
2.5
2.6
2.7
Figure 9.
Figure 10.
TRANSCONDUCTANCE AMPLIFIER CURRENT
vs
OUTPUT SENSE VOLTAGE
OVERVOLTAGE PROTECTION THRESHOLD
vs
JUNCTION TEMPERATURE
VOVP – Overvoltage Protection Threshold – V
Small Signal View
0.008
0.004
0
-0.004
-0.008
-0.012
2.40
2.8
2.80
0.012
IEAOUT – gM Amplifier Current – mA
2.1
VVSENSE – Output Sense Voltage – V
TJ – Junction Temperature – °C
2.45
2.50
2.55
2.60
2.75
2.70
2.65
OVP ON
2.60
2.55
OVP OFF
2.50
2.45
2.40
-50
-25
VVSENSE – Output Sense Voltage – V
Figure 11.
0
25
50
75
100
125
TJ – Junction Temperature – °C
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise noted, VVDD=12 V, –40°C ≤ TA = TJ ≤ 105°C
RESTART TIME
vs
JUNCTION TEMPERATURE
600
10
8
500
6
tRESTART – Restart Time – ms
ITZE – Transformer Zero Energy Detector Current – mA
TZE DETECTOR CURRENT
vs
TZE DETECTOR VOLTAGE
4
2
0
-2
-4
-6
400
300
200
100
-8
-10
0
1
2
3
4
5
6
7
0
-50
-25
VTZE – Transformer Zero Energy Detector Voltage – V
0
25
50
75
100
125
TJ – Junction Temperature – °C
Figure 13.
Figure 14.
5.5
CEAOUT = 10 nF
5.0
VVSENSE
Voltage – V
4.5
4.0
3.5
3.0
VEAOUT
2.5
2.0
1.5
t – Time – 25 ms/div
Figure 15. Voltage Amplifier Outputs
12
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REFERENCE DESIGNS
REFERENCE DESIGN 1
Introduction
This reference design, (schematic shown in Figure 16) uses the UCC28810 LED lighting power controller in a
25-W single stage triac dimmable PFC flyback converter. The input accepts a voltage range of 85 VAC to 305
VAC and the output provides a regulated 750-mA current source to drive the LEDs.
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13
14
C1
J2
47nF
J1
+
FH1
F1
1A
L3
33uH
L1
2.2mH
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C26
1nF
C11
R17
1M
R13
1M
VDD
R40
notused
10uF
C20
D17
BAT54
R2
499k
R26
REF5
U3
CNY17-3S
R30
100k
C15
1nF
D8
BZX84C12
Q2
MMBT3904
R6
1k
R3
499k
TP14
GND
C27
10nF
R45
24.9k
R41
0
R7
1k
JP1
R48
249k
R28
100
0.1uF
C28
TP3
22uF
C13
R19
notused
R9
1k
1nF
C5
TP17
C19
+
C23
R43
1k
0.1uF
C32
1nF
R49
330
1uF
C31
1uF
15V
D15
R18
3.01k
TP20
D6
US1M-13-F
C3
1000pF
R15
10
REF5
R29
20k
VDD
R51
49.9
TP19
R47
365k
R44
5.76k
REF5
C21
1000pF,Y1
TP9
T1
240uH
STRING-
1000uF
C6
4
3
R25
10k
1nF
C29
TP15
R52
10k
R46
200k
REF5
TP4
TP12
R23
1M
MR
REF5
C9
33uF
C8 +
U6
NC
REF5
GND
FB/NC
IN
OUT
C33
notused
CT
SNS
VDD
TP5
1uF
J4
J3
U2
TPS71550DCKR
D11
MURA120T3
TP2
STRING-
STRING+
TP1
TPS3808G50DBVR
RST
GND
1uF
C16
D13
MURA120T3
R16
20
51k
2.2uF
R12
0.39
R10
C7
TP8
10nF
C17
MURA120T3
R22
100k
D14
D12
MURA120T3
+
D1
MUR840G
5
1
U5
TLV3701CDBV2
0.1uF
C25
R34
0.62
TP16
Q5
SPA06N80C3
R39
100k
1uF
C10
TP18
0.1uF
R50
20k
R1
15k
D10
MURA120T3
R31
10k
C24
U4:A
TLV272CD
D18
BAS16
R24
10
100uF
C14
notused
D9
VDD
notused
R8
notused
R4
Q8
MMBT3906
Q9
MMBT3904
R37
249k
R32
4.99k
Q7
47pF
MMBT3904
R27
22k
VBIAS
MMBTA06
R14
notused
Q4
D5
BAV70
Q1
2SK3767
C30
R42
13.3k
R38
100k
R35
100k
47pF
C18
D16
BYS10-25
TP11
0.1uF
C12
TP7
Q3
MMBT3904
D19
notused
STRING+
R33
330
ISENSE TZE
VINS
EAOUT GDRV
VSENSE VDD
U1
UCC28810D
R20
180k
D7
BZX84C18T
C4
0.047uF
U4:B
TLV272CD
TP13
R36
1k
1nF
C22
Q6
MMBT2907
VR1
LM4040D20
R11
1k
VBIAS
100k
C2
0.1uF
TP10
TP6
D2
KBP06G
D4
RS1J
0.047uF
R21
11.3k
D3
RS1J
R5
33
L2
1mH
UCC28810
UCC28811
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Figure 16. Reference Design 1: 25-W PFC Flyback Converter
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UCC28810
UCC28811
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THEORY OF OPERATION
Transition Mode Operation
When the primary MOSFET switch is turned on, the drain current ramps from zero to a peak value determined by
the current reference generator output, which is the combination of the EAOUT pin voltage and the AC line
voltage waveform applied to the VINS pin. The EAOUT pin sets the power level to be transferred to the
secondary over the half sinewave cycle, and the current reference generator forces the peak switch current to
track the input line voltage to improve the power factor.
When the main switch is turned off, the peak current in the flyback inductor is transferred to the secondary side
and flows through the output diode to the output capacitors. This current drops to zero at the rate determined by
the output winding inductance and the output capacitor voltage. When the output current reaches zero, the diode
stops conducting, and all of the output windings and the drain of the MOSFET ring down towards ground. This
ringing is detected on the primary side by the TZE pin of the UCC28810 as it rings below approximately 1.4 V on
the bias winding. This triggers the next switch-on pulse to start very near the valley of the ringing waveform on
the drain of the FET, which lowers the switching losses due to COSS and reduces EMI generated by the turn on
of the FET
Input Filter Damping Network
Offline flyback converters typically need common mode and differential mode input EMI filters to meet EMI
specifications. When a triac dimmer is used with a typical L-C EMI filter, the sharp turn on edge that is generated
by the triac phase control causes the LC filter to ring back and set up an oscillation between the triac and the L-C
filter. For this reason, the differential part of the filter is damped with a R-L network across the inductor. This can
also be accomplished with an R-C damping network across the capacitor. L3 and R5 are the damping
components in the schematic shown in Figure 17.
+
Figure 17. Input Filter Damping Network
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High Voltage Startup Circuit
In LED lighting applications it is important that the light source starts quickly after the input power is switched on.
In the circuit shown in Figure 18, the FET Q1 is turned on at a rate determined by R2 plus R3 and C4. The
source follows the gate as it rises. When the source reaches approximately 18.7 V, Q3 prevents the source from
increasing, and the UCC28810 starts. When the supply begins to deliver power to the output, VBIAS is higher than
12.7 V, and Q2 lowers the gate voltage of Q1 to turn off the startup current path and improve efficiency. For
single range input supplies, or supplies that can start more slowly, R4, R8, and D9 can be populated to start the
supply. However, the power dissipation in normal operation is much higher and reduces the efficiency.
Figure 18. High-Voltage Startup Circuit
Primary-Side Soft Start
The circuit shown in Figure 19 provides an open-loop soft-start that allows the EAOUT pin to slowly rise on the
primary side until the secondary-side error amplifier and soft-start function can take over control of the power
stage.
When VVDD is applied to the device, C20 is slowly charged to one-half of the voltage on the VDD pin and holds
the EAOUT pin to the voltage on C20 plus the VBE of Q6. As the voltage on C20 slowly rises, the EAOUT pin
tracks it until the voltage on C20 is above the normal operating point of the EAOUT pin. At some point, the
secondary-side error amplifier takes control of the EAOUT pin as it also has a slowly ramping reference that
provides a closed-loop soft start.
Figure 19. Primary-Side Soft Start
16
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Primary-Side Bias Regulator
The bias for the UCC28810 device is provided by a winding on the flyback inductor that is well coupled to the
output winding. When the LED string voltage varies due to dimming or different configurations of LED strings, a
primary-side bias regulator formed by D15, R18, and Q4 is needed to limit the range of voltage that is applied to
the UCC28810. If dimming is not used, and the LED string forward voltage is well known, then the bias regulator
can be removed and R14 can be populated to connect the winding voltage directly to the input supply of the
device.
+
Figure 20. Primary Side Bias Regulator
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Leading Edge Blanking Circuit on the TZE Pin
At startup, the output voltage reflected to the bias winding is well below the 1.7-V threshold that allows the next
pulse to be triggered by TZE transitioning below 1.4 V. Leakage inductance can occur between the windings
causing a leading edge spike on the TZE pin that could potentially trigger the TZE threshold and start the next
pulse before the output winding current has reached 0 A. If this happens to several pulses in a row, the primary
current continues to increase cycle-by-cycle until the transformer saturates and the MOSFET passes it's safe
operating area and is destroyed. The leading edge blanking circuit shown in Figure 21, consists of a charge
pump, level shift, and timed blanking pulse. When the GDRV output to the MOSFET gate switches high, C19 is
discharged to VDD through D18. When the GDRV output transitions low, the base of Q8 is pulled down, and a
timer consisting of C19 and R31 is started.
For the time allowed, current set by R29 is fed through Q8 to the base of Q7, which pulls the TZE pin to GND.
Because the TZE pin sources current at approximately 0.5 V, a 100-Ω resistor, R28, is used to limit the current
and to allow C18 to be pulled below the TZE clamp by saturating Q7. When the time expires (approximately 1 µs
in the schematic shown in Figure 21) C18 is charged by R27 to the bias winding voltage. When this voltage
charges above 1.7 V, the PWM latch is ready to be set by the TZE pin falling below 1.4 V, and the leakage
inductance spike has been effectively blanked. When the pulse width is very small, it is possible that the time set
by the blanking circuit is longer than the secondary conduction time. When this happens, the next oscillation of
the winding is detected and the valley causes the main switch to fire. If no falling edge is detected, or the TZE pin
never rises above 1.7 V, then a 400-µs timer triggers a new pulse.
Figure 21. Leading Edge Blanking Circuit on TZE
18
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Secondary Bias Regulator
Normally, only D11 is needed for a secondary bias supply to charge the bias capacitor, C9, during the switch-on
time, based on the turns ratio between the output and bias winding. U2 provides a stable 5-V bias for the
secondary-side circuitry. For this application, D12, D13, D14 are added to provide a copy of the input voltage on
the secondary side during the switch on time. This input waveform is divided down and filtered to remove the
switching frequency waveform by R22, R25, and C17. The signal is then offset by R23 and fed into a
comparator, U5, shown in Figure 23, to detect triac dimming and adjust the feedback loop.
+
FB/NC
OUT
GND
NC
IN
Figure 22. Secondary Bias Regulator Schematic
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Triac Dimming Detection Circuit
The comparator U5 compares the copied input voltage waveform to a fixed threshold, and emits a positive pulse
any time the input waveform is detected to be below the threshold. This results in a small pulse at every zero
crossing in normal operation. When a triac dimmer is used, the pulse width matches the triac dimmer off-time.
This pulse sums in to the current-sense error amplifier and reduces the current regulated in the string
proportional to the off time of the triac. The programmable delay supervisory component, U6, blanks the dimming
at startup and allows the converter to start properly.
RST
VDD
GND
SNS
MR
CT
Figure 23. Triac Dimming Detection Circuit
20
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Current Error Amplifier, Soft-Start, and Voltage Limit Amplifier
Component U4A, shown in Figure 24, fulfills the function of current error amplifier in this application.. A fixed
threshold is set by R39 and R44 and the current on the sense resistor, as represented by the signal from the
triac dimmer detection circuit, is compared to this voltage by U4A. R47 sums in the PWM dimming signal from
the triac dimming comparator. The voltage divider formed by R37 and R48 provides a maximum output of 2.5 V,
and the transistor Q9 reduces the voltage at the non-inverting input of the TLV272 to regulate the current in the
LED string.
When the supply is starting up, C30 and C31 provide a soft start set by the divider resistance and capacitance
value. After the primary soft start charges up, this secondary closed-loop soft start takes control and prevents
overshoot of the supply at startup. The soft-start time provided by the secondary soft start should be longer than
the time it takes for the power stage to fully charge the output capacitors, so that overshoot does not occur.
The second comparator of the TLV272 component, shown as U4B in Figure 24, provides a voltage limit.
Because the voltage at the non-inverting input of the TLV272 cannot go higher than 2.5 V, U4B can provide an
effective maximum voltage limit by increasing the LED current in the optocoupler when the voltage is moving
through a range determined by R35, R38, and R42. The gain is set by R45, and C27 ensures stability on the
amplifier. The voltage limit amplifier is not an integrator, it has a fixed gain. Two integrators in series would cause
stability issues due to phase shift. R41 is provided as a provision for disconnecting the current error amplifier and
regulating output voltage if desired. R49 and Q9 could be depopulated, and R41 and C27 could be changed to
make a voltage error amplifier that is an integrator.
Figure 24. Current Error Amplifier, Soft-Start, and Voltage Limit Amplifier
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REFERENCE DESIGN 2
The PR788, shown in Figure 26 is a 100-W offline AC-to-DC LED current driver with power factor correction.
This design is a two stage converter design with a universal input boost follower PFC stage providing a 240-V to
400-V DC output and a low-side buck stage providing the current source to power the LEDs. This converter was
designed to support up to 30 high-brightness LEDs in series with up to 900-mA average current. The design
incorporates an interface for microprocessor control to allow for shutdown into a low power mode (< 0.5 W) and
PWM dimming of the LEDs.
PFC Stage
The PFC stage is a critical conduction mode boost converter with a boost follower feature implemented. The
boost follower is set to provide a DC output of 240 VDC to 400 VDC. The lower DC output at low input voltage
results in improved efficiency at low-line conditions. The minimum regulation point was set at 240 V to allow the
design to be scaled to power up to 50 LEDs in series.
The critical conduction mode (CRM) of operation offers advantages regarding losses over continuous conduction
mode. In CRM operation, since the inductor current reaches zero just before the beginning of the next cycle, the
boost diode reverse recovery loss is eliminated. Switching losses in the MOSFET are reduced as well by
programming a small delay after the inductor current reaches 0 A until the turn on of the MOSFET on the next
cycle. The voltage across the boost inductor begins discontinuous mode self oscillation which reduces the
MOSFET drain voltage at turn on, this delay is optimized to occur at the valley of the first self oscillation cycle.
In the PFC boost implementation, the controller programs the peak inductor current to twice the value of the
desired average line current. The current reference generator uses the VINS input and the EAOUT input to
program the peak current of the boost inductor. The VINS input is a divided sample of the rectified AC input
voltage which is determined by R9 and the sum of (R2 + R5), as shown in Figure 26.
The C6 capacitor is used for high frequency bypass and should not affect the line frequency signal on VINS. The
minimum boost output voltage is determined by the feedback divider consisting of R11 and (R13 + R15)
connected to the VSENSE pin. The boost follower circuit is hown in Figure 25.The boost follower function is
accomplished by Q1 sinking current through the high side of the feedback divider (R13 + R15). The AC input
rectified voltage is filtered and divided by R1, R3, R4, and C3. Ideally the filter minimizes the line frequency ripple
and generates a DC sample of the RMS input voltage. The ratio of R4 and (R1 + R3) determines the line voltage
which Q1 begins increasing the output by sinking current thru R13 and R15. R7 is determined by
1. determining the current through R13 and R15 that provides the desired increase in the boost output
2. determine the voltage across R4 at high line
V - VBE
R7 = R4
IR15
(1)
.
22
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VAC Input
VSENSE
EAOUT
VINS
ISENSE
VDD
GDRV
GND
TZE
Figure 25. Boost Follower Circuit
The voltage error amplifier compensation network is R10, C4 and C7 connected from EAOUT to GND. The goal
is to provide a loop crossover frequency at 1/10 input line frequency (10 Hz) with 45° phase margin.
The current sense resistor (R21) is determined by the following equation which is based on peak inductor current
at low line, 1.7 V ISENSE threshold, and 20% margin.
R21 @
1.7 V
POUT ´ 2 ´ 2 ´ 1.2
h ´ VIN(min )
(2)
The boost inductor value can be determined based on the desired minimum operating frequency which occurs at
the peak of low line input voltage.
(V
L2 @
) (
OUT(min ) - 2 ´ VIN(min ) ´ h ´ VIN(min )
2
)
2 ´ fS ´ VOUT(min ) ´ POUT
(3)
.
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Figure 26. PR788 Reference Design Schematic
24
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Low-Side Buck Stage
The LED current is provided by a low-side buck converter operating in critical conduction mode, shown in
Figure 29. The buck controller is programmed to provide a peak current of two times (2 ×) the maximum average
load current of 0.9 A (nom). The critical conduction mode allows the current to reach 0 A before beginning the
next cycle. This method provides high-efficiency due to minimized voltage on the MOSFET drain at turn on.
Cycle-by-cycle current control to the LEDs is also a benefit of critical conduction mode. The average current of
the buck driver is controlled via the PWM input (J9, Pin 3).
The UCC28811 is configured to operate in peak current limit mode with the ability to shutdown and PWM control
the buck converter with the enable function on the VSENSE pin.
The voltage divider formed by R27 and R28 from the 5.1-V zener diode (D9) provides approx 2 V to VSENSE
which is below the internal reference and above the enable threshold. R29 and R30 is a divider which biases
VINS at approx 3 V.
The saturated EAOUT and VINS saturates the current reference generator so the UCC28811 VDRV termination
is determined by 1.7 V on ISENSE. RSENSE (R36 + R38) is determined by the current sense threshold and 2
times the desired average LED current
The minimum operating frequency of a given inductor value can be determined by summing the on and off time
of the buck switch to achieve the desired peak-to-peak current.
fSW (min ) @
1
æ L ´ IPK ö æ L ´ IPK ö
ç
÷+ç
÷
è VIN - VOUT ø è VOUT ø
(4)
R40 and R48 provide a small current from LED+ into the ISENSE filter to offset the change in peak current due
to the propagation delay of the ISENSE comparator. The change in di/dt from minimum to maximum VLED+ is
determined. The delta in di/dt results in a ΔV across RSENSE (R36 + R38). R40 and 48 are sized to match this ΔV
across (R36 + R37 + R38) with the current developed by VLED+(max)–VLED+(min).
Overvoltage protection is provided to protect against open circuit loads, shown in Figure 27. The circuit provides
detection of voltage between LED+ and LED– without a current path from LED- to ground in normal operation.
The trigger voltage is determined by the total zener voltage of D15 and D19, (150 V) in this example. Once the
zener breakdown is exceeded, the current through R43 will forward bias the VBE of Q6. The collector voltage of
Q6 is divided down with R44 and R42 and summed into the buck shutdown through D14.
A undervoltage lockout circuit is recommended for low-side buck LED current sources operating at output
voltages over 115 V. A simple, effective UVLO circuit is shown in Figure 28. When the 2N2222 transistor is off,
the collector is pulled high which disables the buck convertor through the common shutdown path . When the
total zener voltage is exceeded, the 2N2222 is turned on enabling the buck converter. The UVLO enable voltage
should be selected to be between the highest anticipated buck output and the minimum output voltage of the
PFC boost follower.
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Figure 27. Low-Side Buck OV Protection Circuit
26
Figure 28. Low-Side Buck UVLO Circuit
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Figure 29. Low-Side Buck Converter Operating in CCM
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27
PACKAGE OPTION ADDENDUM
www.ti.com
19-Sep-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
UCC28810D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
28810D
UCC28810DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
28810D
UCC28810DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
28810D
UCC28810DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
28810D
UCC28811D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
28811
UCC28811DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
28811
UCC28811DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
28811
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
19-Sep-2015
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
UCC28810DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC28811DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Sep-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UCC28810DR
SOIC
D
8
2500
340.5
338.1
20.6
UCC28811DR
SOIC
D
8
2500
340.5
338.1
20.6
Pack Materials-Page 2
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