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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Generic Copy
08-NOV-2001
SUBJECT: ON Semiconductor Final Product/Process Change Notification #12040
TITLE: Final Notification – Phase#3 - Bipolar Power Wafer Fab Transfer TLS-BP6 to PHXBP/ZR Fab
EFFECTIVE DATE: 07-Jan-2002
AFFECTED CHANGE CATEGORY(S): On Semiconductor Fab Site, Subcontractor Fab Site
AFFECTED PRODUCT DIVISION: Bipolar Discrete Products
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Terry Franks <[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office or
Jose Ramirez <[email protected]>
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact Sales Office or Fred Marchesi <[email protected]>
DISCLAIMER:
Final Product/Process Change Notification (FPCN) - Final Notification completing the notification
process. Distributed at least 60 days from the effective date of the change. ON Semiconductor will
consider this change approved unless specific conditions of acceptance are provided in writing within
30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office.
DESCRIPTION AND PURPOSE:
ON Semiconductor wishes to notify its Customers that the 3rd Phase of the Bipolar Power Wafer
Manufacturing Operation Transfer from Toulouse-France to Phoenix-Arizona is taking place as
announced in IPCN # 10863, and Product Lines using the Power Base Technology will be transferred
as indicated. ON Semiconductor continues to make substantial investments in both new technologies
and improved manufacturing capabilities to provide you the highest quality and reliability in the
Semiconductor industry. We believe these actions will also improve our ability to serve you better in
the future.
QUALIFICATION PLAN:
Test*
Conditions
Parametric verification
Per device specification @ 25DegC
HTRB
1000 hrs Vcb=80% T=150DegC
Temp Cycle
1K cycles - 65DegC to 150DegC
IOL
15K cycles Dtj=100DegC
Thermal Resistance
Die Shear
Pre & Post process change comp.
Wire Bond Strength
Pre & Post process change comp.
Wire Bond Shear
Method 3
Issue Date: 08 November, 2001
Exceptions
Delta VBE
Page 1 of 3
Final Product/Process Change Notification #12040
Qualification Vehicle Justification:
Family
PNP
NPN
Qualification Device
MJ21193
MJ21194
Reason Chosen
Large Die size, high voltage
Large Die size, high voltage
RELIABILITY DATA SUMMARY:
Reliability Data: Interim Reliability Tests results after completion of 504 hrs. Final Reliability Report
available after completion of 1000 hours.
MJ21194
MJ21193 *
Test Description
Interval Control Lot#1 Lot#2 Control Lot# 1
HTRB
504 hrs 0/77
0/77
0/77
IOL
2500 cyc 0/77
0/77
0/77
Temp Cycle
500 cyc 0/77
0/77
0/77
* Reliability Data for device MJ21193 will be available on Nov 30
ELECTRICAL CHARACTERISTIC SUMMARY:
MJ21193 Test IEBO
ICEO
BVCBO BVCEO HFE
Cond1
Ic=8A
Group
Cond2 Vbe=5V Vce=200V Ic=100ua Ic=100mA Vce=5V
Limit=<100uA <100uA
>250V
>250V
25-75
Eval
Mean 1.6E-8 9.6E-7
330.3
325.5
36.8
Lot
StDev 6.1E-8 4.5E-7
13.4
11.0
1.8
Cpk
546
74
2.0
2.3
2.2
Control
Lot
Mean 6.5E-9
StDev 6.4E-9
Cpk
5208
MJ21194 Test IEBO
Cond1
Group
Cond2 Vbe=5V
Limit=<100uA
Eval
Mean 3.6E-8
Lot
StDev 6.4E-8
Cpk
521
Control
Lot
Mean 1.9E-8
StDev 1.3E-9
Cpk
25636
4.1E-6
1.4E-6
22
326.4
9.5
2.7
326.6
7.8
3.3
32.0
1.6
1.5
HFE
VBE(on)VCE(sat)
Ic=16A Ic=8A Ic=8A
Vce=5V Vce=5V Ib=0.8A
>8
<2.2V <1.4V
18.1
1.302
0.515
0.9
0.019
0.060
3.7
15.7
4.9
16.6
0.7
4.1
1.353
0.025
11.3
0.410
0.053
6.2
ICEO
BVCBO BVCEO HFE
HFE
VBE(on)VCE(sat)
Ic=8A Ic=16A Ic=8A Ic=8A
Vce=200V Ic=100ua Ic=100mA Vce=5V Vce=5V Vce=5V Ib=0.8A
<100uA
>250V
>250V
25-75
>8
<2.2V <1.4V
2.2E-07
763.4
344.8
44.4
20.5
1.347
0.247
7.6E-08
78.7
5.3
2.6
1.1
0.022
0.006
438
2.2
6.0
2.5
3.8
12.9
64
1.7E-6
3.5E-7
94
713.2
88.5
1.7
317.1
4.3
5.2
50.0
3.7
2.3
19.2
1.9
2.0
1.452
0.046
5.4
0.302
0.007
55
CHANGED PART IDENTIFICATION:
Customers may receive Bipolar - Power Base Products with the silicon Chip manufactured at the
Phoenix BP/ZR Fab starting with product marked with Date Code 0202.
Issue Date: 08 November, 2001
Page 2 of 3
Final Product/Process Change Notification #12040
AFFECTED DEVICE LIST(WITHOUT SPECIALS):
PART
2N6609
MJ11021
MJ11022
MJ15003
MJ15004
MJ15011
MJ15012
MJ15022
MJ15023
MJ15024
MJ15025
MJ21193
MJ21194
MJ21195
MJ21196
MJC11021WP
MJC11022WP
MJC15003WP
MJC15004WP
MJE4343
MJH11017
MJH11018
MJH11019
MJH11020
MJH11021
MJH11022
MJL1302A
MJL21193
MJL21194
MJL21195
MJL21196
MJL3281A
MJW1302A
MJW21191
MJW21192
MJW21193
MJW21194
MJW21195
MJW21196
MJW3281A
Issue Date: 08 November, 2001
Page 3 of 3