FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 08-NOV-2001 SUBJECT: ON Semiconductor Final Product/Process Change Notification #12040 TITLE: Final Notification – Phase#3 - Bipolar Power Wafer Fab Transfer TLS-BP6 to PHXBP/ZR Fab EFFECTIVE DATE: 07-Jan-2002 AFFECTED CHANGE CATEGORY(S): On Semiconductor Fab Site, Subcontractor Fab Site AFFECTED PRODUCT DIVISION: Bipolar Discrete Products ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Terry Franks <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office or Jose Ramirez <[email protected]> FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact Sales Office or Fred Marchesi <[email protected]> DISCLAIMER: Final Product/Process Change Notification (FPCN) - Final Notification completing the notification process. Distributed at least 60 days from the effective date of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: ON Semiconductor wishes to notify its Customers that the 3rd Phase of the Bipolar Power Wafer Manufacturing Operation Transfer from Toulouse-France to Phoenix-Arizona is taking place as announced in IPCN # 10863, and Product Lines using the Power Base Technology will be transferred as indicated. ON Semiconductor continues to make substantial investments in both new technologies and improved manufacturing capabilities to provide you the highest quality and reliability in the Semiconductor industry. We believe these actions will also improve our ability to serve you better in the future. QUALIFICATION PLAN: Test* Conditions Parametric verification Per device specification @ 25DegC HTRB 1000 hrs Vcb=80% T=150DegC Temp Cycle 1K cycles - 65DegC to 150DegC IOL 15K cycles Dtj=100DegC Thermal Resistance Die Shear Pre & Post process change comp. Wire Bond Strength Pre & Post process change comp. Wire Bond Shear Method 3 Issue Date: 08 November, 2001 Exceptions Delta VBE Page 1 of 3 Final Product/Process Change Notification #12040 Qualification Vehicle Justification: Family PNP NPN Qualification Device MJ21193 MJ21194 Reason Chosen Large Die size, high voltage Large Die size, high voltage RELIABILITY DATA SUMMARY: Reliability Data: Interim Reliability Tests results after completion of 504 hrs. Final Reliability Report available after completion of 1000 hours. MJ21194 MJ21193 * Test Description Interval Control Lot#1 Lot#2 Control Lot# 1 HTRB 504 hrs 0/77 0/77 0/77 IOL 2500 cyc 0/77 0/77 0/77 Temp Cycle 500 cyc 0/77 0/77 0/77 * Reliability Data for device MJ21193 will be available on Nov 30 ELECTRICAL CHARACTERISTIC SUMMARY: MJ21193 Test IEBO ICEO BVCBO BVCEO HFE Cond1 Ic=8A Group Cond2 Vbe=5V Vce=200V Ic=100ua Ic=100mA Vce=5V Limit=<100uA <100uA >250V >250V 25-75 Eval Mean 1.6E-8 9.6E-7 330.3 325.5 36.8 Lot StDev 6.1E-8 4.5E-7 13.4 11.0 1.8 Cpk 546 74 2.0 2.3 2.2 Control Lot Mean 6.5E-9 StDev 6.4E-9 Cpk 5208 MJ21194 Test IEBO Cond1 Group Cond2 Vbe=5V Limit=<100uA Eval Mean 3.6E-8 Lot StDev 6.4E-8 Cpk 521 Control Lot Mean 1.9E-8 StDev 1.3E-9 Cpk 25636 4.1E-6 1.4E-6 22 326.4 9.5 2.7 326.6 7.8 3.3 32.0 1.6 1.5 HFE VBE(on)VCE(sat) Ic=16A Ic=8A Ic=8A Vce=5V Vce=5V Ib=0.8A >8 <2.2V <1.4V 18.1 1.302 0.515 0.9 0.019 0.060 3.7 15.7 4.9 16.6 0.7 4.1 1.353 0.025 11.3 0.410 0.053 6.2 ICEO BVCBO BVCEO HFE HFE VBE(on)VCE(sat) Ic=8A Ic=16A Ic=8A Ic=8A Vce=200V Ic=100ua Ic=100mA Vce=5V Vce=5V Vce=5V Ib=0.8A <100uA >250V >250V 25-75 >8 <2.2V <1.4V 2.2E-07 763.4 344.8 44.4 20.5 1.347 0.247 7.6E-08 78.7 5.3 2.6 1.1 0.022 0.006 438 2.2 6.0 2.5 3.8 12.9 64 1.7E-6 3.5E-7 94 713.2 88.5 1.7 317.1 4.3 5.2 50.0 3.7 2.3 19.2 1.9 2.0 1.452 0.046 5.4 0.302 0.007 55 CHANGED PART IDENTIFICATION: Customers may receive Bipolar - Power Base Products with the silicon Chip manufactured at the Phoenix BP/ZR Fab starting with product marked with Date Code 0202. Issue Date: 08 November, 2001 Page 2 of 3 Final Product/Process Change Notification #12040 AFFECTED DEVICE LIST(WITHOUT SPECIALS): PART 2N6609 MJ11021 MJ11022 MJ15003 MJ15004 MJ15011 MJ15012 MJ15022 MJ15023 MJ15024 MJ15025 MJ21193 MJ21194 MJ21195 MJ21196 MJC11021WP MJC11022WP MJC15003WP MJC15004WP MJE4343 MJH11017 MJH11018 MJH11019 MJH11020 MJH11021 MJH11022 MJL1302A MJL21193 MJL21194 MJL21195 MJL21196 MJL3281A MJW1302A MJW21191 MJW21192 MJW21193 MJW21194 MJW21195 MJW21196 MJW3281A Issue Date: 08 November, 2001 Page 3 of 3