View PDF

FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Generic Copy
09-JUL-2001
SUBJECT: Product/Process Change Notification #11504
TITLE: Final Notification – Phase#1 - Bipolar Power Wafer Fab Transfer TLS-BP6 to PHXBP/ZR Fab
EFFECTIVE DATE: 21-Aug-2001
AFFECTED CHANGE CATEGORY: On Semiconductor Fab Site, Subcontractor Fab Site, and
Wafer Process
AFFECTED PRODUCT DIVISION: Bipolar Discrete Products
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or LAURA RIVERS <[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office or
Jose Ramirez <[email protected]>
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact Sales Office or Jose Ramirez <[email protected]>
DISCLAIMER:
Initial Product/Process Change Notification (IPCN) - First Notification distributed to customers.
Distributed at least 120 days from the effective date of the change.
Final Product/Process Change Notification (FPCN) - Final Notification completing the notification
process. Distributed at least 60 days from the effective date of the change. ON Semiconductor will
consider this change approved unless specific conditions of acceptance are provided in writing within
30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office.
DESCRIPTION AND PURPOSE:
ON Semiconductor wishes to notify its Customers that the 1st Phase of the Bipolar Power Wafer
Manufacturing Operation Transfer from Toulouse-France to Phoenix-Arizona is taking place as
announced in IPCN # 10863, and Product Lines using the Epi Base Technology will be transferred as
indicated. ON Semiconductor continues to make substantial investments in both newtechnologies and
improved manufacturing capabilities to provide you the highest quality and reliability in the
Semiconductor industry. We believe these actions will also improve our ability to serve you better in
the future.
Issue Date: 09 July, 2001
Page 1 of 8
Product/Process Change Notification #11504
QUALIFICATION PLAN:
*Per AEC-Q101 guidelines.
Test*
Conditions
Exceptions
Parametric verification
Per device specification @ 25DegC
HTRB
1000 hrs Vcb=80% T=150 deg C
Temp Cycle
1K cycles - 65 to 150 deg C
Autoclave
96 hrs RH=100% P=15psi Ta=121 deg C
H3TRB
1000 hrs Vcb=80% RH=85%
IOL
15K cycles Delta tj=100 deg C
D.P.A.
Random H3TRB and IOL samples
Thermal Resistance
Delta VBE
Die Shear
Pre and Post process change comp.
Wire Bond Strength
Pre and Post process change comp.
Wire Bond Shear
Method 3
(Parametric measurements are per device specification @ 25 deg C)
Qualification Vehicle Justification:
Family
PNP
NPN
Qualification Device
TIP42C
TIP122
Reason Chosen
Large Die size, highest voltage
Highest Voltage
RELIABILITY DATA SUMMARY:
Interim Reliability Tests results after completion of 500 hrs.
Final Reliability Report available after completion of 1000 hours.
Test Desc.
HTRB
H3TRB
Autoclave
IOL
Temp Cycle
Interval
500 hrs
500 hrs
96 hrs
4286 cyc
500 cyc
Lot#1
0/77
0/77
0/77
0/77
0/77
TIP42C
Lot#2 Lot#3 Control Lot#1
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
0/77
TIP122
Lot#2
0/77
0/77
0/77
0/77
0/77
Lot#3
0/77
0/77
0/77
0/77
0/77
Control
0/77
0/77
0/77
0/77
0/77
ELECTRICAL CHARACTERISTIC SUMMARY:
TIP42C Test IEBO
ICEO
ICES
BVCEO HFE
Cond1
Ic=0.3A
Group Cond2 Vbe=5V Vce=60V Vce=100V Ic=30mA Vce=4V
Limit= <1mA
<700uA <400uA >100V
>30
Mean 1.0 E-6
1.1 E-7
9.8 E-8
129.7
235.3
Lot#1 StDev 5.5 E-14 3.8 E-15 1.4 E-8
1.3
8.7
Cpk
6.1 E+9
6.1 E+10 9.4 E+3
7.8
9.0
HFE VBE(on) VCE(sat)
Ic=3A Ic=6A
Ic=6A
Vce=4V Vce=4V Ib=0.6A
15-75 <2.0V
<1.5V
53.8
1.319
1.054
2.0
0.013
0.042
8.9
17.7
3.52
Mean 1.0 E-06 9.8 E-8 9.8 E-8
Lot#2 StDev 5.5 E-14 2.5 E-8 1.4 E-8
Cpk
6.1 E+9 9.5 E+3 9.4 E+3
119.9
2.4
2.8
207.4
21.1
3.28
50.2
3.4
4.9
1.326
0.015
14.7
1.062
0.066
2.22
Mean 1.0 E-6
Lot#3 StDev 2.0 E-7
Cpk
1.7 E+3
120.4
1.8
3.7
232.7
15.2
5.1
57.4
2.6
7.3
1.290
0.012
20.5
1.024
0.040
3.94
Mean 1.0 E-6
1.1 E-6 1.0 E-7
106.1
Control StDev 5.5 E-14 4.8 E-7 3.8 E-15 6.3
Cpk 6.1 E+9 4.9 E+2 3.5 E+10 0.3
322.9
30.2
3.6
58.7
4.2
4.6
1.309
0.018
12.5
0.933
0.087
2.2
Issue Date: 09 July, 2001
1.0 E-7 9.8 E-8
2.0 E-8 1.4 E-8
1.2 E+4 9.4 E+3
Page 2 of 8
Product/Process Change Notification #11504
TIP122 Test ICBO
IEBO
ICEO BVCEO HFE
HFE VCE(sat) VCE(sat)VBE(on)
Cond1
Ic=0.5A Ic=3A Ic=3A Ic=5A
Ic=3A
Group Cond2 Vcb=100V Veb=5V Vce=50V Ic=0.1A Vce=3V Vce=3V Ib=12mA Ib=20m Vce=3V
Limit 1uA
2mA
1uA
100V
>1000 >1000 <2.0V
<4.0V <2.5V
Mean 1.0 E-8
8.6 E-4 5.7 E-9 114.9
4395.4 10104 1.041 1.269
1.625
Lot#1 StDev 2.5 E-9
3.3 E-5 2.6 E-9
2.23
162.0
240
0.004
0.007 0.005
Cpk
132.2
11.7
127.3
2.22
7.0
12.6
79.9
132.9
52.5
Mean 1.3 E-8
8.2 E-4 7.3 E-9 117.9
4298.7 8800
1.045
1.275
1.634
Lot#2 StDev 2.7 E-9
7.1 E-5 2.7 E-9 2.79
307.8
734
0.007
0.010 0.006
Cpk
124.2
5.6
123.7
2.14
3.6
3.5
49.3
88.4
41.7
Mean 1.2 E-8
7.9 E-4 6.5 E-9 114.5 4788.4 10841 1.038
1.266
1.622
Lot#3 StDev 2.3 E-9
1.4 E-5 2.3 E-9 3.07
92.5
326
0.002
0.004
0.003
Cpk
146.1
29.1
13.3
1.57
13.6
10.1
132.7
242.5
75.6
Mean 1.2 E-8
1.0 E-3 4.6 E-9 126.1 3883.7 7308 1.164
1.456
1.703
Control StDev 1.4 E-8
3.4 E-5 2.2 E-9 0.67 146.1 258
0.006 0.010
0.005
Cpk 24.2
9.5
14.2
13.0
8.9
8.2
46.2
83.6
49.4
CHANGED PART IDENTIFICATION:
Customers may receive Bipolar Power Epi Base Products with the silicon Chip manufactured at the
Phoenix BP/ZR Fab starting with product marked with Date Code 0135.
ADDITIONAL INFORMATION:
Contact(s) at ON Semiconductor :
Americas
Europe
Name
Jose Ramirez
Daniel Zurawski
Email
[email protected] [email protected]
Phone
(602) 244 - 4819
33534611194
Country USA
France
AFFECTED DEVICE LIST(WITHOUT SPECIALS):
PART
2C3773WP
2N3055
2N3055A
2N3055H
2N3442
2N3771
2N3772
2N3773
2N4918
2N4919
2N4920
2N4921
2N4922
2N4923
2N5190
2N5191
2N5192
2N5194
2N5195
2N5302
2N5631
Issue Date: 09 July, 2001
Page 3 of 8
Product/Process Change Notification #11504
2N5684
2N5686
2N5883
2N5884
2N5885
2N5886
2N6031
2N6034
2N6035
2N6036
2N6038
2N6039
2N6040
2N6042
2N6043
2N6045
2N6052
2N6058
2N6107
2N6109
2N6111
2N6282
2N6284
2N6286
2N6287
2N6288
2N6292
2N6387
2N6388
2N6487
2N6488
2N6490
2N6491
2N6667
2N6668
BD179
BD180
BD234
BD237
BD238
BD241C
BD242B
BD242C
BD243B
BD243C
BD244B
BD244C
BD249C
BD435
BD435T
BD436
BD436T
BD437
BD437T
BD438
BD438T
Issue Date: 09 July, 2001
Page 4 of 8
Product/Process Change Notification #11504
BD439
BD440
BD441
BD442
BD675
BD675A
BD676
BD676A
BD677
BD677A
BD678
BD678A
BD679
BD679A
BD680
BD680A
BD680T
BD681
BD682
BD682T
BD809
BD810
BDV64B
BDV65B
BDW42
BDW46
BDW47
BDX33B
BDX33C
BDX34B
BDX34C
BDX53B
BDX53C
BDX54B
BDX54C
MJ11012
MJ11015
MJ11016
MJ11028
MJ11029
MJ11030
MJ11032
MJ11033
MJ14001
MJ14002
MJ14003
MJ15001
MJ15002
MJ15015
MJ15016
MJ2955
MJ4502
MJ802
MJB42C
MJB42CT4
MJC11015WP
Issue Date: 09 July, 2001
Page 5 of 8
Product/Process Change Notification #11504
MJC11016WP
MJC122WP
MJC15015WP
MJC2955WP
MJD112
MJD112-001
MJD112RL
MJD112T4
MJD117
MJD117-001
MJD117T4
MJD122
MJD122T4
MJD127
MJD127T4
MJD128T4
MJD148T4
MJD2955
MJD2955-001
MJD2955T4
MJD3055
MJD3055T4
MJD31C
MJD31C1
MJD31CRL
MJD31CT4
MJD31T4
MJD32C
MJD32C1
MJD32CRL
MJD32CT4
MJD32RL
MJD32T4
MJD41C1
MJD41CRL
MJD41CT4
MJD42C
MJD42C1
MJD42CRL
MJD42CT4
MJD6039T4
MJE2955T
MJE3055T
MJE371
MJE4353
MJE521
MJE700
MJE702
MJE703
MJE800
MJE802
MJE803
MJF122
MJF127
MJF2955
MJF3055
Issue Date: 09 July, 2001
Page 6 of 8
Product/Process Change Notification #11504
MJF31C
MJF32C
MJF6388
MJF6668
MJH6284
MJH6287
SJB42C
SJB42CT4
SJD31CT4
TE02514LFVK
TEAC3055WP
TIP100
TIP101
TIP102
TIP105
TIP106
TIP107
TIP110
TIP111
TIP112
TIP115
TIP116
TIP117
TIP120
TIP121
TIP122
TIP125
TIP126
TIP127
TIP131
TIP132
TIP137
TIP140
TIP141
TIP142
TIP145
TIP146
TIP147
TIP29
TIP2955
TIP29A
TIP29B
TIP29C
TIP30
TIP3055
TIP30A
TIP30B
TIP30C
TIP31
TIP31A
TIP31B
TIP31C
TIP32
TIP32A
TIP32B
Issue Date: 09 July, 2001
Page 7 of 8
Product/Process Change Notification #11504
TIP32C
TIP33A
TIP33C
TIP35A
TIP35C
TIP36A
TIP36C
TIP41
TIP41A
TIP41B
TIP41C
TIP42
TIP42A
TIP42B
TIP42C
TIPC122WP
TIPC127WP
Issue Date: 09 July, 2001
Page 8 of 8