FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 14-Oct-2005 SUBJECT: ON Semiconductor Final Product/Process Change Notification #15016 TITLE: Qualification of FlipChip International (FCI) for Bumped Products EFFECTIVE DATE: 18-Oct-2005 AFFECTED CHANGE CATEGORY(S): Sub Assembly AFFECTED PRODUCT DIVISION(S): Analog Power Management ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Elizabeth Becker <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office or Todd Manes <[email protected]> FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Todd Manes <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 60 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: This is the Final PCN to notify customers that the changes described in PCN# 13436 (which can be found at www.onsemi.com), have been completed for the listed devices. ON Semiconductor is pleased to announce that it has successfully completed the qualification for FlipChip International (FCI) facility located in Phoenix, Arizona as an additional source for bump processing of micro-bump devices. FCI is a fully certified ISO9002 and QS9000 supplier. There will be no changes in the wafer/die source; therefore, device functionality will be identical to that of the existing production material. Device parameters will continue to meet all Data Book specifications, and reliability will continue to meet or exceed ON Semiconductor standards. Issue Date: Oct. 14, 2005 Rev.08-24-05 Page 1 of 3 Final Product/Process Change Notification #15031 This change is classified as a capacity expansion since the products listed below may be bumped at either FCI or the existing ASE qualified site once the final PCN expires. RELIABILITY DATA SUMMARY: FCI Reliability Summary: Temperature Cycle Tests (in all cases, TA=-40C-to-+125C, 500cycles): Device Lot Result 1. NCP2890AFCT2G A 0/90 2. NCP2890AFCT2G B 0/90 3. NCP2890AFCT2G C 0/90 4. NCP2890AFCT2 A 0/90 5. NCP2890AFCT2 B 0/90 6. NUF4105FCT1 A 0/90 7. NUF6105FCT1 A 0/90 8. NUF6106FCT1 A 0/90 Ball Shear Tests (in-line monitoring): Device Lot Result 1. NCP2890AFCT2G A 0/5 2. NCP2890AFCT2 A 0/5 3. NUF4105FCT1 A 0/5 4. NUF6105FCT1 A 0/5 5. NUF6106FCT1 A 0/5 ELECTRICAL CHARACTERISTIC SUMMARY: N/A CHANGED PART IDENTIFICATION: Devices marked with date code 0541 or later may be bumped at either qualified site (FCI or ASE). Issue Date: Oct. 14, 2005 Rev.08-24-05 Page 2 of 3 Final Product/Process Change Notification #15031 AFFECTED DEVICE LIST PART NCP2890AFCT2 NCP2890AFCT2G NUF4105FCT1 NUF6105FCT1 NUF6106FCT1 Issue Date: Oct. 14, 2005 Rev.08-24-05 Page 3 of 3