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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Generic Copy
14-Oct-2005
SUBJECT: ON Semiconductor Final Product/Process Change Notification #15016
TITLE: Qualification of FlipChip International (FCI) for Bumped Products
EFFECTIVE DATE: 18-Oct-2005
AFFECTED CHANGE CATEGORY(S): Sub Assembly
AFFECTED PRODUCT DIVISION(S): Analog Power Management
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Elizabeth Becker <[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office or Todd Manes
<[email protected]>
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Todd Manes <[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers. FPCNs are issued at least 60 days prior to implementation
of the change.
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact your local ON
Semiconductor Sales Office.
DESCRIPTION AND PURPOSE:
This is the Final PCN to notify customers that the changes described in PCN# 13436 (which
can be found at www.onsemi.com), have been completed for the listed devices.
ON Semiconductor is pleased to announce that it has successfully completed the qualification
for FlipChip International (FCI) facility located in Phoenix, Arizona as an additional source
for bump processing of micro-bump devices. FCI is a fully certified ISO9002 and QS9000
supplier.
There will be no changes in the wafer/die source; therefore, device functionality will be
identical to that of the existing production material. Device parameters will continue to meet
all Data Book specifications, and reliability will continue to meet or exceed ON
Semiconductor standards.
Issue Date: Oct. 14, 2005
Rev.08-24-05
Page 1 of 3
Final Product/Process Change Notification #15031
This change is classified as a capacity expansion since the products listed below may be
bumped at either FCI or the existing ASE qualified site once the final PCN expires.
RELIABILITY DATA SUMMARY:
FCI Reliability Summary:
Temperature Cycle Tests (in all cases, TA=-40C-to-+125C, 500cycles):
Device Lot Result
1. NCP2890AFCT2G A 0/90
2. NCP2890AFCT2G B 0/90
3. NCP2890AFCT2G C 0/90
4. NCP2890AFCT2 A 0/90
5. NCP2890AFCT2 B 0/90
6. NUF4105FCT1 A 0/90
7. NUF6105FCT1 A 0/90
8. NUF6106FCT1 A 0/90
Ball Shear Tests (in-line monitoring):
Device Lot Result
1. NCP2890AFCT2G A 0/5
2. NCP2890AFCT2 A 0/5
3. NUF4105FCT1 A 0/5
4. NUF6105FCT1 A 0/5
5. NUF6106FCT1 A 0/5
ELECTRICAL CHARACTERISTIC SUMMARY:
N/A
CHANGED PART IDENTIFICATION:
Devices marked with date code 0541 or later may be bumped at either qualified site (FCI or
ASE).
Issue Date: Oct. 14, 2005
Rev.08-24-05
Page 2 of 3
Final Product/Process Change Notification #15031
AFFECTED DEVICE LIST
PART
NCP2890AFCT2
NCP2890AFCT2G
NUF4105FCT1
NUF6105FCT1
NUF6106FCT1
Issue Date: Oct. 14, 2005
Rev.08-24-05
Page 3 of 3