AOS Semiconductor Product Reliability Report AOZ8904CIL, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOZ8904CIL. Review of the electrical test results confirm that AOZ8904CIL passes AOS quality and reliability requirements for product release. The continuous qualification testing and reliability monitoring program ensure that all outgoing products will continue to meet AOS quality and reliability standards. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Qualification Test Requirements Qualification Tests Result Reliability Evaluation I. Product Description: The AOZ8904 is a transient voltage suppressor array designed to protect high speed data lines from Electro Static Discharge (ESD) and lightning. -ROHS compliant -Halogen free Detailed information refers to the datasheet on website. . II. Package and Die Information: Product ID Package Type Lead Frame Die attach material Bond wire MSL level AOZ8904CIL SOT23_6L Cu, Epoxy Cu wire Up to Level 1 2 III. Qualification Tests Result: Test Item Test Condition Test duration Sample Size PreConditioning 168hrs @85 °C /85%RH+3 cyc reflow@260°C - HTRB Vdd= 80% Vbr max. Temp = 150°C 168hrs 500hrs 1000hrs 15 lots (77 /lot) Temperature Cycle '-65 °C to +150 °C, air to air 500cycles Pressure Pot 121°C, 29.7psi, RH= 100% HAST '130 +/- 2°C, 85%RH, 33.3 psi, at VCC min power dissipation. Result Standard Pass 5 lots (Sum of TC,PCT and HAST) JESD22-A113 Pass JESD22-A108 5 lots (77 /lot) Pass JESD22-A110 96hrs 5 lots (77 /lot) Pass JESD22-A102 100hrs 5lots (55 /lot) Pass JESD22-A104 IV. Reliability Evaluation FIT rate (per billion): 6 MTTF = 18589 years The presentation of FIT rate for the individual product reliability is restricted by the actual HTRB sample size of the selected product. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion device hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2x (15x77x500) x258] = 6 MTTF = 109 / FIT = 1.63 x108hrs= 18589 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB tests H = Duration of HTRB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg 115 deg 130 deg 150 deg C C C C Af 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3