Reliability Report

AOS Semiconductor
Product Reliability Report
AOZ8904CIL, rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOZ8904CIL.
Review of the electrical test results confirm that AOZ8904CIL passes AOS quality and reliability
requirements for product release. The continuous qualification testing and reliability monitoring program
ensure that all outgoing products will continue to meet AOS quality and reliability standards.
Table of Contents:
I.
II.
III.
IV.
V.
Product Description
Package and Die information
Qualification Test Requirements
Qualification Tests Result
Reliability Evaluation
I. Product Description:
The AOZ8904 is a transient voltage suppressor array designed to protect high speed data lines from Electro
Static Discharge (ESD) and lightning.
-ROHS compliant
-Halogen free
Detailed information refers to the datasheet on website.
.
II. Package and Die Information:
Product ID
Package Type
Lead Frame
Die attach material
Bond wire
MSL level
AOZ8904CIL
SOT23_6L
Cu,
Epoxy
Cu wire
Up to Level 1
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III. Qualification Tests Result:
Test Item
Test Condition
Test duration Sample Size
PreConditioning
168hrs @85 °C
/85%RH+3 cyc
reflow@260°C
-
HTRB
Vdd= 80% Vbr max.
Temp = 150°C
168hrs
500hrs
1000hrs
15 lots (77 /lot)
Temperature
Cycle
'-65 °C to +150 °C,
air to air
500cycles
Pressure Pot
121°C, 29.7psi,
RH= 100%
HAST
'130 +/- 2°C, 85%RH,
33.3 psi, at VCC min
power dissipation.
Result
Standard
Pass
5 lots (Sum of
TC,PCT and HAST)
JESD22-A113
Pass
JESD22-A108
5 lots (77 /lot)
Pass
JESD22-A110
96hrs
5 lots (77 /lot)
Pass
JESD22-A102
100hrs
5lots (55 /lot)
Pass
JESD22-A104
IV. Reliability Evaluation
FIT rate (per billion): 6
MTTF = 18589 years
The presentation of FIT rate for the individual product reliability is restricted by the actual HTRB sample size
of the selected product. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion device hours.
Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2x (15x77x500) x258] = 6
MTTF = 109 / FIT = 1.63 x108hrs= 18589 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB tests
H = Duration of HTRB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C 70 deg C 85 deg C 100 deg
115 deg
130 deg
150 deg C
C
C
C
Af
258
87
32
13
5.64
2.59
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Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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