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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Generic Copy
26 Jun 2008
SUBJECT: ON Semiconductor Final Product/Process Change Notification # 16127
TITLE: Qualification of FlipChip International (FCI) for Flipchip Products
PROPOSED FIRST SHIP DATE: 26 Sep 2008
AFFECTED CHANGE CATEGORY(S): Subcontractor Assembly Site
AFFECTED PRODUCT DIVISION(S): DCG
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Angela Tam<[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office
ADDITIONAL RELIABILITY DATA: Available upon request
Contact your local ON Semiconductor Sales Office or Laura Rivers <[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation
of the change.
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact your local ON
Semiconductor Sales Office.
DESCRIPTION AND PURPOSE:
This is a Final Product Change Notification announcing the qualification of FlipChip
International (FCI) for the listed flipchip products. FCI currently manufactures other bump
products for ON Semiconductor.
FCI is a fully certified ISO9001-2000 supplier. There will be no change in the wafer/die source
therefore; no electrical performance or specifications will be changed.
This change is classified as a capacity expansion since the products listed below may be
bumped at either FCI or the existing ASE qualified site once the final PCN expires.
Issue Date: 26 Jun 2008
Rev.14 Jun 2007
Page 1 of 3
Final Product/Process Change Notification # 16127
RELIABILITY DATA SUMMARY:
Reliability Test Results:
The qualification for FlipChip International (FCI) facility located in Phoenix, Arizona as an
additional source for bump processing of micro-bump devices was previously qualified per
FPCN# 15016, issued 14-Oct-2005; results as shown below. This FPCN is extending that
qualification to additional devices in the same technology family, with additional Temp Cycle
testing.
FCI Reliability Summary:
Temperature Cycle Tests (in all cases, TA=-40C to +125C, 500cycles):
Device Lot Result
1. NCP2890AFCT2G A 0/90
2. NCP2890AFCT2G B 0/90
3. NCP2890AFCT2G C 0/90
4. NCP2890AFCT2 A 0/90
5. NCP2890AFCT2 B 0/90
6. NUF4105FCT1 A 0/90
7. NUF6105FCT1 A 0/90
8. NUF6106FCT1 A 0/90
Ball Shear Tests (in-line monitoring):
Device Lot Result
1. NCP2890AFCT2G A 0/5
2. NCP2890AFCT2 A 0/5
3. NUF4105FCT1 A 0/5
4. NUF6105FCT1 A 0/5
5. NUF6106FCT1 A 0/5
For Additional Products covered by this FPCN:
Temperature Cycle Tests (in all cases, TA=-40C to +125C, 500cycles):
Device Lot Result
1. NUF4105FCT1 A 0/90
2. NUF6105FCT1 A 0/90
3. NUF6106FCT1 A 0/90
4. NUF2441FCT1G A 0/80
5. NUF2441FCT1G B 0/80
6. NUF2441FCT1G C 0/80
7. NUF9001FCT1G A 0/80
8. NUF9001FCT1G B 0/80
9. NUF9001FCT1G C 0/80
ELECTRICAL CHARACTERISTIC SUMMARY:
N/A
CHANGED PART IDENTIFICATION:
Devices marked with date code 837 or later may be bumped at either qualified site (FCI or
ASE)
Issue Date: 26 Jun 2008
Rev.14 Jun 2007
Page 2 of 3
Final Product/Process Change Notification # FPCN16127
AFFECTED DEVICE LIST
NUF2222FCT1G
NUF2441FCT1G
NUF3101FCT1G
NUF4107FCT1G
NUF6105FCT1G
NUF6106FCT1G
NUF9001FCT1G
NUF9002FCT1G
NUP4103FCT1G
Issue Date: 26 Jun 2008
Rev.14 Jun 2007
Page 3 of 3