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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16681
Generic Copy
Issue Date: 30-Jun-2011
TITLE: Final Notification for Transfer of Zener Filtering products from Hynix (Magna Chip) in Korea
to ON Semiconductor Pocatello (ID) in United State.
PROPOSED FIRST SHIP DATE: 30-Sep-2011
AFFECTED CHANGE CATEGORY(S): ON Semiconductor Fab Site
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or YEW HEE SOON <[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Francis Lualhati
<[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers.
implementation of the change.
FPCNs are issued at least 90 days prior to
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
ON Semiconductor is notifying customers of its plan to transfer fabrication of Zener EMI filter
products from Hynix (Magna Chip) located in Seoul, South Korea, to ON Semiconductor Fab 10
located in Pocatello, ID (USA).
Description of the change:
The transfer and qualification of the Zener Z1C processes and the associated integrated circuits
from the Hynix (Magna Chip) facility (South Korea) to the Fab 10 wafer fabrication site located in the
Pocatello, Idaho.
The Fab 10 facility is an ON Semiconductor owned wafer fab that has been producing products
since 2000 (formerly as AMI). Several existing technologies within ON Semiconductor’s product
families are currently sourced from Fab 10, including CMOS and LVFR products The Fab 10
Pocatello site is certified according to ISO9001:2008, 14001:2004, ISO/TS 16949:2009 and AS
9100B standards as well as MIL_PRF-38535, CTPAT and STACK.
Issue Date: 30-Jun-2011
Rev. 06-Jan-2010
Page 1 of 3
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16681
Qualification tests are designed to show that the reliability of transferred devices will continue to
meet or exceed ON Semiconductor standards.
Devices listed in this final PCN should be transferred to ON Semiconductor Fab 10 in Pocatello
starting Sept 2011. After 27 Sept 2011, customer may receive devices from either facility. Parts are
identifiable by date code 1139 (YYWW).
RELIABILITY DATA SUMMARY:
Package: CSP
Qual Vehicles: CM6317
Qualification Results and Analysis:
Test:
HTRB
HTSL
UHAST
TC
Autoclave
ESD IEC61000-4-2
Conditions:
TA=125°C, V=5.5
Volts
TA = 150°C
Ta=130C RH=85%,
unbiased
Ta= -40 C to 125 C
Ta=121C RH=100%
~15 psig
± 15KV min
Interval:
Results
1008 hrs
0/240
1008 hrs
0/240
1008 hrs
0/240
1000 cyc
0/240
96 hrs
0/240
± 15KV
ELECTRICAL CHARACTERISTIC SUMMARY:
Available upon request
CHANGED PART IDENTIFICATION:
There will be no changes to standard device markings. Normal assembly lot traceability codes will
identify the wafer fab source.
Issue Date: 30-Jun-2011
Rev. 06-Jan-2010
Page 2 of 3
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16681
List of affected General Parts:
PART
CM6317
CM6320
CM1451-06CP
CM1451-08CP
EMI6317
EMI6320
Issue Date: 30-Jun-2011
Rev. 06-Jan-2010
Page 3 of 3