HV2601 / HV2701
Low-Charge Injection, 16-Channel,
High-Voltage Analog Switch
Features
Description
• High-Voltage CMOS technology for high performance
• 16-channel high voltage analog switch
• 3.3V input logic level compatible
• 20 MHz data shift clock frequency
• Very low quiescent power dissipation (-10 µA)
• Low parasitic capacitance
• DC to 50 MHz small signal frequency response
• -60dB typical OFF-isolation at 5.0 MHz
• CMOS logic circuitry for low power
• Excellent noise immunity
• Cascadable serial data register with latches
• Flexible operating supply voltages
• Integrated bleed resistors on the outputs
(HV2701 only)
HV2601/HV2701 are low-charge injection, 16-channel,
high-voltage analog switch integrated circuits (ICs).
These devices are designed for use in applications
requiring high-voltage switching controlled by low-voltage control signals, such as medical ultrasound imaging and other piezoelectric transducer drivers. HV2701
has integrated bleed resistors which eliminate voltage
build-up on capacitive loads such as piezoelectric
transducers.
Applications
•
•
•
•
Medical ultrasound imaging
NDT metal flaw detection
Piezoelectric transducer drivers
Optical MEMS modules
These ICs shift input data into a 16-bit shift register that
can then be retained in a 16-bit latch. To reduce any
possible clock feed-through noise, the latch enable bar
should be left high until all bits are clocked in. Data is
clocked in during the rising edge of the clock. Using
High-Voltage CMOS technology, this device combines
high-voltage, bilateral DMOS switches and low power
CMOS logic to provide efficient control of high voltage
analog signals.
The device is suitable for various combinations of high
voltage supplies, e.g., VPP/VNN: +40V/-160V, +100V/100V, and +160V/-40V.
Package Types
48
3
2
1
6
7
13
12
5
10
11
16
1
4
9
8
15
14
18
17
22
21
20
19
26
25
24
23
34
33
32
31
30
29
28
27
42
41
40
39
38
37
36
35
42-Ball Bumped Die
(Top View)
48-Lead LQFP
(Top View)
See Table 2-1 and Table 2-2 for pin information
2015-2016 Microchip Technology Inc.
DS20005391B-page 1
HV2601 / HV2701
Block Diagram
Level
Shifters
Latches
D
LE
CLR
Output
Switches
Bleed
Resistors
SW0
D
LE
CLR
SW1
D
LE
CLR
SW2
D
LE
CLR
SW14
D
LE
CLR
SW15
DIN
CLK
16-Bit
Shift
Register
DOUT
VDD GND
LE CLR
VNN VPP
RGND
HV2701 only
Note:
Bleed resistors and RGND apply to HV2701 only.
DS20005391B-page 2
2015-2016 Microchip Technology Inc.
HV2601 / HV2701
1.0
ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS†
VDD logic supply ........................................................................................................................................-0.5V to +7.0V
VPP - VNN differential supply.................................................................................................................................... 220V
VPP positive supply ......................................................................................................................... -0.5V to VNN + 200V
VNN negative supply.................................................................................................................................+0.5V to -200V
Logic input voltage ........................................................................................................................... -0.5V to VDD + 0.3V
Analog signal range ....................................................................................................................................... VNN to VPP
Peak analog signal current/channel ......................................................................................................................... 3.0A
Storage temperature ............................................................................................................................. -65°C to +150°C
Power dissipation 42-Ball Bumped Die ................................................................................................................... 1.5W
Power dissipation 48-Lead LQFP ........................................................................................................................... 1.0W
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
RECOMMENDED OPERATING CONDITIONS (Notes 1 – 3)
Symbol
Parameter
Value
VDD
Logic power supply voltage
3.0V to 5.5V
VPP
Positive high voltage supply
+40V to VNN +200V
VNN
Negative high voltage supply
-40V to -160V
VIH
High level input voltage
0.9VDD to VDD
VIL
Low level input voltage
0V to 0.1 VDD
Analog signal voltage peak-to-peak
VNN +10V to VPP -10V
Operating free air temperature
0°C to 70°C
VSIG
TA
Note 1: Power up/down sequence is arbitrary except GND must be powered-up first and powered-down last.
2: VSIG must be VNN and VPP or floating during power up/down transition.
3: Rise and fall times of power supplies VDD, VPP, and VNN should not be less than 1.0msec.
2015-2016 Microchip Technology Inc.
DS20005391B-page 3
HV2601 / HV2701
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions unless otherwise noted.
Parameter
Symbol
0°C
25°C
70°C
Min
Max
Min
Typ
Max
Min
Max
Units Conditions
-
30
-
26
38
-
48
-
25
-
22
27
-
32
-
25
-
22
27
-
30
-
18
-
18
24
-
27
-
23
-
20
25
-
30
-
22
-
16
25
-
27
Small signal switch
ON-resistance
∆RONS
matching
-
20
-
5.0
20
-
20
%
ISIG= 5.0mA, VPP= +100V,
VNN= -100V
Large signal switch
ON-resistance
RONL
-
-
-
15
-
-
-
Ω
VSIG= VPP-10V, ISIG= 1.0A
Value of output
bleed resistor
(HV2701 only)
RINT
-
-
20
35
50
-
-
kΩ
Output Switch to RGND
IRINT= 0.5 mA
Switch OFF leakage per switch
ISOL
-
5.0
-
1.0
10
-
15
µA
VSIG= VPP-10V and
VNN+10V (Note 1)
-
300
-
100
300
-
300
mV
-
500
-
100
500
-
500
mV
HV2601:100 kΩ load
HV2701: no load
(Note 1)
Small signal switch
ON-resistance
DC offset switch
OFF
DC offset switch
ON
RONS
ISIG= 5.0 mA VPP= +40V
ISIG= 200 mA VNN= -160V
Ω
ISIG= 5.0 mA
VPP= +100V
ISIG= 200 mA VNN= -100V
ISIG= 5.0 mA
VPP= +160V
ISIG= 200 mA VNN= -40V
VOS
Quiescent VPP
supply current
IPPQ
-
-
-
10
50
-
-
µA
All switches OFF
Quiescent VNN
supply current
INNQ
-
-
-
-10
-50
-
-
µA
All switches OFF
Quiescent VPP
supply current
IPPQ
-
-
-
10
50
-
-
µA
All switches ON, ISW= 5.0 mA
Quiescent VNN
supply current
INNQ
-
-
-
-10
-50
-
-
µA
All switches ON, ISW= 5.0 mA
Switch output peak
current
ISW
-
3.0
-
3.0
2.0
-
2.0
A
VSIG duty cycle < 0.1%
Output switching
frequency
fSW
-
-
-
-
50
-
-
kHz Duty cycle = 50%
-
6.5
-
-
7.0
-
8.0
VPP= +40V
VNN= -160V
-
4.0
-
-
5.5
-
5.5
-
4.0
-
-
5.0
-
5.5
VPP= +160V
VNN= -40V
-
6.5
-
-
7.0
-
8.0
VPP= +40V
VNN= -160V
-
4.0
-
-
5.0
-
5.5
-
4.0
-
-
5.0
-
5.5
-
4.0
-
-
4.0
-
4.0
Average VPP supply
current
Average VNN supply
current
Average VDD supply
current
DS20005391B-page 4
IPP
INN
IDD
mA
mA
VPP= +100V
VNN= -100V
VPP= +100V
VNN= -100V
VPP= +160V
VNN= -40V
mA
All output
switches are
turning ON
and OFF at
50 kHz with
no load.
All output
switches are
turning ON
and OFF at
50 kHz with
no load.
fCLK= 5.0 MHz, VDD= 5.0V
2015-2016 Microchip Technology Inc.
HV2601 / HV2701
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Over recommended operating conditions unless otherwise noted.
Parameter
Symbol
0°C
25°C
70°C
Min
Max
Min
Typ
Max
Min
Max
Units Conditions
Quiescent VDD
supply current
IDDQ
-
10
-
-
10
-
10
µA
All logic inputs are static
Data out source
current
ISOR
0.45
-
0.45
0.70
-
0.40
-
mA
VOUT= VDD- 0.7V
Data out sink current
ISINK
0.45
-
0.45
0.70
-
0.40
-
mA
VOUT= 0.7V
CIN
-
10
-
-
10
-
10
pF
–
Logic input
capacitance
Note 1: See Figure 3-1.
2015-2016 Microchip Technology Inc.
DS20005391B-page 5
HV2601 / HV2701
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: VDD=5.0V, tR = tF≤5.0 ns, 50% duty cycle, CLOAD = 20 pF, unless otherwise noted.
Parameter
Symbol
Set up time before
LE rises
tSD
0°C
25°C
70°C
Min
Max
Min
Typ
Max
Min
Max
25
-
25
-
-
25
-
56
12
50
15
55
21
7.0
100
40
-
50
15
55
-
56
12
78
30
21
7.0
100
40
-
56
12
50
15
55
21
7.0
100
40
-
Units Conditions
ns
–
VDD= 3.0V
VDD= 5.0V
VDD= 3.0V
VDD= 5.0V
–
VDD= 3.0V
VDD= 5.0V
Time width of LE
tWLE
Clock delay time to
data out
tDO
Time width of CLR
tWCLR
Set up time data to
clock
tSU
Hold time data
from clock
tH
2.0
-
2.0
-
-
2.0
-
ns
Clock frequency
fCLK
-
8.0
20
-
-
8.0
20
-
8.0
20
MHz
Clock rise and fall
times
tR,tF
-
50
-
-
50
-
50
ns
Turn ON time
TON
-
5.0
-
-
5.0
-
5.0
Turn OFF time
TOFF
-
5.0
-
-
5.0
-
5.0
dv/dt
-
20
20
20
-
-
20
20
20
-
20
20
20
-30
-
-30
-33
-
-30
-
KCR
-58
-60
-
-58
-60
-70
-
-58
-60
-
dB
IID
-
300
-
-
300
-
300
mA
300ns pulse width,
2.0% duty cycle (Note 1)
CSG(OFF)
5.0
17
5.0
12
17
5.0
17
pF
0V, f = 1.0MHz
CSG(ON)
25
50
25
38
50
25
50
pF
0V, f = 1.0MHz
+VSPK
-VSPK
-
-
-
-
150
-
-
+VSPK
-VSPK
-
-
-
-
150
-
-
+VSPK
-VSPK
-
-
-
-
150
-
-
-
-
-
820
-
-
-
-
-
-
600
-
-
-
-
-
-
350
-
-
-
Maximum VSIG
slew rate
OFF isolation
Switch crosstalk
Output switch isolation diode current
OFF capacitance
SW to GND
ON capacitance
SW to GND
Output voltage
spike
Charge injection
KO
QC
ns
ns
ns
ns
VDD= 3.0 or 5.0V
VDD= 3.0V
VDD= 5.0V
–
VSIG= VPP-10V, RLOAD=
10kΩ (Note 1)
VSIG= VPP-10V, RLOAD=
µs
10kΩ (Note 1)
VPP= +40V, VNN= -160V
v/ns VPP= +100V, VNN= -100V
VPP= +160V, VNN= -40V
µs
dB
f = 5.0MHz, 1.0kΩ//15pF load
(Note 1)
f = 5.0MHz, 50Ω load (Note 1)
f = 5.0MHz, 50Ω load (Note 1)
VPP= +40V, VNN= -160V,
RLOAD= 50Ω (Note 1)
mV
VPP= +100V, VNN= -100V,
RLOAD= 50Ω (Note 1)
VPP= +160V, VNN= -40V,
RLOAD= 50Ω (Note 1)
pC
VPP= +40V, VNN= -160V,
VSIG= 0V (Note 1)
VPP= +100V, VNN= -100V,
VSIG= 0V (Note 1)
VPP= +160V, VNN= -40V,
VSIG= 0V (Note 1)
Note 1: See Figure 3-1.
DS20005391B-page 6
2015-2016 Microchip Technology Inc.
HV2601 / HV2701
2.0
PIN DESCRIPTION
The locations of the pads/balls are listed in Package Types.
TABLE 2-1:
Pin #
PIN DESCRIPTION: 42-BALL BUMPED DIE PACKAGE
HV2601
HV2701
Description
1
NC
RGND
2
VPP
VPP
Positive supply voltage
No connect/Ground for bleed resistor
3
VNN
VNN
Negative supply voltage
4
DOUT
DOUT
Data out logic output
5
CLR
CLR
Latch clear logic input
6
CLK
CLK
Clock logic input for shift register
Ground
7
GND
GND
8
SW15A
SW15A
9
SW15B
SW15B
10
LE
LE
Analog switch 15 terminal A
Analog switch 15 terminal B
Latch-enable logic input, low active
11
VDD
VDD
12
SW0A
SW0A
Analog switch 0 terminal A
Logic supply voltage
13
SW0B
SW0B
Analog switch 0 terminal B
14
SW14A
SW14A
Analog switch 14 terminal A
15
SW14B
SW14B
16
DIN
DIN
17
SW1A
SW1A
Analog switch 1 terminal A
18
SW1B
SW1B
Analog switch 1 terminal B
19
SW13A
SW13A
Analog switch 13 terminal A
20
SW13B
SW13B
Analog switch 13 terminal B
21
SW2A
SW2A
Analog switch 2 terminal A
22
SW2B
SW2B
Analog switch 2 terminal B
23
SW12A
SW12A
Analog switch 12 terminal A
24
SW12B
SW12B
Analog switch 12 terminal B
25
SW3A
SW3A
Analog switch 3 terminal A
26
SW3B
SW3B
Analog switch 3 terminal B
27
SW11A
SW11A
Analog switch 11 terminal A
28
SW11B
SW11B
Analog switch 11 terminal B
29
SW9B
SW9B
Analog switch 9 terminal B
30
SW8B
SW8B
Analog switch 8 terminal B
31
SW7A
SW7A
Analog switch 7 terminal A
32
SW6A
SW6A
Analog switch 6 terminal A
33
SW4A
SW4A
Analog switch 4 terminal A
34
SW4B
SW4B
Analog switch 4 terminal B
35
SW10B
SW10B
Analog switch 10 terminal B
36
SW10A
SW10A
Analog switch 10 terminal A
37
SW9A
SW9A
Analog switch 9 terminal A
38
SW8A
SW8A
Analog switch 8 terminal A
39
SW7B
SW7B
Analog switch 7 terminal B
40
SW6B
SW6B
Analog switch 6 terminal B
41
SW5B
SW5B
Analog switch 5 terminal B
42
SW5A
SW5A
Analog switch 5 terminal A
2015-2016 Microchip Technology Inc.
Analog switch 14 terminal B
Data in logic input
DS20005391B-page 7
HV2601 / HV2701
TABLE 2-2:
PIN DESCRIPTION: 48-LEAD LQFP
Pin #
HV2601
HV2701
Description
1
NC
NC
No connect
2
NC
NC
No connect
3
SW4B
SW4B
Analog switch 4 terminal B
4
SW4A
SW4A
Analog switch 4 terminal A
5
SW3B
SW3B
Analog switch 3 terminal B
6
SW3A
SW3A
Analog switch 3 terminal A
7
SW2B
SW2B
Analog switch 2 terminal B
8
SW2A
SW2A
Analog switch 2 terminal A
9
SW1B
SW1B
Analog switch 1 terminal B
10
SW1A
SW1A
Analog switch 1 terminal A
11
SW0B
SW0B
Analog switch 0 terminal B
12
SW0A
SW0A
13
VNN
VNN
Negative supply voltage
14
NC
NC
No connect
15
VPP
VPP
Positive supply voltage
16
NC
NC
No connect
17
GND
GND
Ground
18
VDD
VDD
Logic supply voltage
19
DIN
DIN
Data in logic input
20
CLK
CLK
Clock logic input for shift register
Analog switch 0 terminal A
21
LE
LE
22
CLR
CLR
Latch clear logic input
23
DOUT
DOUT
Data out logic output
Latch-enable logic input, low active
24
NC
RGND
No connect/Ground for bleed resistor
25
SW15B
SW15B
Analog switch 15 terminal B
26
SW15A
SW15A
Analog switch 15 terminal A
27
SW14B
SW14B
Analog switch 14 terminal B
28
SW14A
SW14A
Analog switch 14 terminal A
29
SW13B
SW13B
Analog switch 13 terminal B
30
SW13A
SW13A
Analog switch 13 terminal A
31
SW12B
SW12B
Analog switch 12 terminal B
32
SW12A
SW12A
Analog switch 12 terminal A
33
SW11B
SW11B
Analog switch 11 terminal B
34
SW11A
SW11A
Analog switch 11 terminal A
35
NC
NC
No connect
No connect
36
NC
NC
37
SW10B
SW10B
38
SW10A
SW10A
Analog switch 10 terminal A
39
SW9B
SW9B
Analog switch 9 terminal B
40
SW9A
SW9A
Analog switch 9 terminal A
41
SW8B
SW8B
Analog switch 8 terminal B
42
SW8A
SW8A
Analog switch 8 terminal A
43
SW7B
SW7B
Analog switch 7 terminal B
DS20005391B-page 8
Analog switch 10 terminal B
2015-2016 Microchip Technology Inc.
HV2601 / HV2701
TABLE 2-2:
PIN DESCRIPTION: 48-LEAD LQFP
Pin #
HV2601
HV2701
44
SW7A
SW7A
Analog switch 7 terminal A
45
SW6B
SW6B
Analog switch 6 terminal B
46
SW6A
SW6A
Analog switch 6 terminal A
47
SW5B
SW5B
Analog switch 5 terminal B
48
SW5A
SW5A
Analog switch 5 terminal A
2015-2016 Microchip Technology Inc.
Description
DS20005391B-page 9
HV2601 / HV2701
3.0
DETAILED DESCRIPTION
3.1
Application Information
FIGURE 3-1:
TEST CIRCUITS
VPP -10V
VPP -10V
ISOL
10kΩ
RLOAD
VOUT
VOUT
Open
RLOAD
Open
(HV2601
only)
RGND
VPP
VPP
VDD
VNN
VNN
GND
5V
RGND
RGND
VPP
VPP
VDD
VNN
VNN
GND
Switch Off Leakage
per Switch
5V
VPP
VPP
VDD
VNN
VNN
GND
5V
TON/TOFF Test Circuit
DC Offset Switch
ON/OFF
VIN = 10VP-P
@5MHz
VIN = 10VP-P
@5MHz
VSIG
IID
VOUT
VNN
RLOAD
NC
50Ω
50Ω
RGND
RGND
VPP
VNN
RGND
VPP
VDD
VNN
VPP
5V
5V
GND
VPP
VDD
VNN
VNN
GND
VOUT
KCR = 20Log
VIN
Output Switch
Isolation Diode Current
OFF Isolation
5V
VOUT
VIN
Switch Crosstalk
+VSPK
ΔVOUT
VOUT
VOUT
–VSPK
1000pF
RLOAD
VSIG
50Ω
RGND
RGND
1kΩ
VPP
VPP
VDD
VNN
VNN
GND
Q = 1000pF x ΔVOUT
Charge Injection
DS20005391B-page 10
VDD
VNN
VNN
GND
KO = 20Log
VPP
VPP
5V
VPP
VPP
VDD
VNN
VNN
GND
5V
Output Voltage Spike
2015-2016 Microchip Technology Inc.
HV2601 / HV2701
TABLE 3-1:
D0
D1
L
LOGIC FUNCTION TABLE
...
D7
D8
...
D15
LE
CLR
SW0
SW1
-
-
-
-
L
L
OFF
H
-
-
L
-
-
-
L
L
-
-
-
L
L
-
H
-
-
-
L
-
-
-
-
L
-
-
-
-
-
L
L
-
-
-
L
-
-
L
L
-
-
-
-
L
L
-
-
-
-
-
L
L
-
-
-
...
SW7
SW8
...
SW15
-
-
-
-
ON
-
-
-
-
-
OFF
-
-
-
L
-
ON
-
-
-
L
-
-
-
-
-
-
-
-
-
-
OFF
-
-
H
-
-
L
-
-
H
-
L
L
-
-
-
-
-
L
L
-
-
-
-
-
-
L
L
-
-
-
-
-
L
L
-
-
-
-
-
L
L
-
-
-
-
-
-
-
-
-
L
L
L
-
-
-
-
OFF
-
-
-
-
ON
...
...
ON
-
-
OFF
-
-
ON
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
...
-
-
-
-
H
L
L
X
X
X
X
X
X
X
H
L
HOLD PREVIOUS STATE
X
X
X
X
X
X
X
X
H
ALL SWITCHES OFF
...
-
Note 1: The 16 switches operate independently.
2: Serial data is clocked in on the L to H transition of the CLK.
3: All 16 switches go to a state retaining their latched condition at the rising edge of LE. When LE is low the
shift registers data flow through the latch.
4: DOUT is high when data in the shift register 15 is high.
5: Shift registers clocking has no effect on the switch states if LE is high.
6: The CLR clear input overrides all other inputs.
FIGURE 3-2:
LOGIC TIMING WAVEFORMS
DN+1
DN
DATA IN
DIN
50%
LE
50%
DN-1
50%
50%
tWLE
tSD
CLOCK
CLK
50%
tSU
tDO
DATA OUT
DOUT
VOUT
(typ)
th
DO
50%
tOFF
OFF
tON
90%
10%
ON
CLR
50%
50%
2015-2016 Microchip Technology Inc.
tWCL
50%
DS20005391B-page 11
HV2601 / HV2701
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
42-ball Bumped Die
Example
XXXXXXX
XXXXX e1
YYWWNNN
HV2601
BD e1
1550343
48-lead LQFP
XXX
XXXXXXX
e3 YYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20005391B-page 12
Example
HV
2601FG
e3 1550
343
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
2015-2016 Microchip Technology Inc.
HV2601 / HV2701
42-Ball Bumped Die Package Outline (BD)
5.29x5.30mm body, 1.0mm height (max), 0.52 / 0.60mm pitch
D1
e
42
C/L
42
e
0,0
E
Note 1
(Ball 1
Index Area
D/4 x E/4)
C/L
E2 E1
e1
e1
e1
1
1
e
D
View B
Top View
Bottom View
Side View
View A
b
A2
A
A1
Seating
Plane
View A
View B
1RWHV)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJV6HHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQDWZZZPLFURFKLSFRPSDFNDJLQJ
Notes:
1. %DOOLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG%DOOLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURUD
printed indicator.
Symbol
Dimension
(mm)
Note:
A
A1
A2
b
D
MIN
0.9
0.21
0.
0.29
5.19
NOM
0.95
0.24
0.7
0.32
5.29
MAX
1.0
0.27
0.7
0.35
5.39
D1
E
4.20
BSC
5.30
5.20
5.40
E1
E2
e
e1
4.04
BSC
0.68
BSC
0.60
BSC
0.52
BSC
For more information about ball coordinates, contact Microchip sales.
2015-2016 Microchip Technology Inc.
DS20005391B-page 13
HV2601 / HV2701
48-Lead LQFP Package Outline (FG)
7.00x7.00mm body, 1.60mm height (max), 0.50mm pitch
D
D1
E1 E
Note 1
(Index Area
D1/4 x E1/4)
48
1
e
b
Top View
View B
L2
A A2
Seating
Plane
L
L1
A1
θ
Gauge
Plane
Seating
Plane
View B
Side View
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Note:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU
a printed indicator.
Symbol
MIN
Dimension
NOM
(mm)
MAX
A
A1
A2
b
D
D1
E
E1
1.40*
0.05
1.35
0.17
8.80*
6.80*
8.80*
6.80*
-
-
1.40
0.22
9.00
7.00
9.00
7.00
1.60
0.15
1.45
0.27
9.20*
7.20*
9.20*
7.20*
e
L
L1
L2
0.45
0.50
BSC
0.60
0.75
ș
0O
1.00
REF
0.25
BSC
3.5O
7O
JEDEC Registration MS-026, Variation BBC, Issue D, Jan. 2001.
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
Drawings are not to scale.
DS20005391B-page 14
2015-2016 Microchip Technology Inc.
HV2601 / HV2701
APPENDIX A:
REVISION HISTORY
Revision A (December 2015)
• Converted Supertex Doc #s DSFP-HV2601 and
DSFP-HV2701 to Microchip DS20005391B.
• Combined HV2601/HV2701 into one document.
• Revised Section 4.0 “Packaging Information”
• Removed package GA from the data sheet.
• Made minor text changes throughout.
Revision B (March 2016)
• Moved “Block Diagram” to page 2 and made a
minor change for clarity.
• Removed Confidential status from document.
2015-2016 Microchip Technology Inc.
DS20005391B-page 15
HV2601 / HV2701
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-
XX
Device
X
-
Package Environmental
Device:
X
Media
Type
HV2601 = 16-Channel HV Analog Switch
HV2701 = 16-Channel HV Analog Switch with Bleed
Resistors
Package:
BD
= 42-Ball Bumped Die
FG
= 48-lead LQFP
Environmental
G
= Lead (Pb)-free/ROHS-compliant package
(not used for BD packages)
Media Type:
(blank)
M931
M936
= 250/Tray for FG package
= 1000/Reel for FG package
= 2500/Reel for BD package
Note:
Examples:
a)
HV2601FG-G:
48-lead LQFP package, 250/Tray
b)
HV2601FG-G-M931:
c)
HV2701BD-M936
48-lead LQFP package, 1000/Reel
42-ball Bumped Die,
2500/Reel
HV2601BD and HV2701BD are RoHS-compliant products
DS20005391B-page 16
2015-2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTSYSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
2015-2016 Microchip Technology Inc.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0342-5
DS20005391B-page 17
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
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Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
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Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
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Tel: 91-11-4160-8631
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Tel: 49-2129-3766400
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Duluth, GA
Tel: 678-957-9614
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Tel: 852-2943-5100
Fax: 852-2401-3431
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Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
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Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
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Tel: 512-257-3370
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Westborough, MA
Tel: 774-760-0087
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Tel: 281-894-5983
Indianapolis
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Tel: 317-773-8323
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Los Angeles
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Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
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Canada - Toronto
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Tel: 82-53-744-4301
Fax: 82-53-744-4302
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
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Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
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Tel: 65-6334-8870
Fax: 65-6334-8850
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Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
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Tel: 886-3-5778-366
Fax: 886-3-5770-955
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Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
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Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Poland - Warsaw
Tel: 48-22-3325737
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Tel: 34-91-708-08-90
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Tel: 44-118-921-5800
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Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
DS20005391B-page 18
2015-2016 Microchip Technology Inc.