FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20286 Generic Copy Issue Date: 30-Oct-2013 TITLE: NCP347, NCP348 & Other DFN/ QFN Devices (Gold Wire) Qualification at ASE-SH and AMKOR-Philippines Assembly Facilities. PROPOSED FIRST SHIP DATE: 30-Jan-2014 AFFECTED CHANGE CATEGORY(S): Assembly Site FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Todd Manes <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Ken Fergus <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: This is to notify customers ON Semiconductor’s that NCP347x, NCP348x and other devices built in DFN packages (largest size is WDFN 2 x 2.5 x 0.8mm) with Gold Wire are now qualified at ASE (Shanghai, China) and Amkor, Philippines. The affected devices listed on this PCN are currently assembled at the ON Semiconductor Seremban, Malaysia facility and/ or UTAC Thailand Assembly facilities. At the expiration of this PCN, these devices may be processed at these locations or the newly qualified ASESH and Amkor facilities. The package outline and electrical performance of the part from the two new assembly sites fully meet datasheet specifications. Issue Date: 30-Oct-2013 Rev. 06-Jan-2010 Page 1 of 5 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20286 RELIABILITY DATA SUMMARY: Reliability Test Results: All qualification requirements were successfully met. Qual Vehicles • NCP347MTAHTBG – WDFN 2x2.5x.8mm Amkor Philippines # Test Name Test Conditions End Point Req’s 1 Prep Sample preparation and initial part testing various --- 2 HTOL High Temp Op Life TA = 125°C Tj=150°C c = 0, Room Test Results Initial Electrical Lot A (rej/ ss) 504 hrs 0/80 0/80 1008 hrs 0/80 0/80 504 hrs 1008 hrs 0/80 0/80 0/80 0/80 0/80 0/80 0/80 0/80 0/30 0/30 0/30 0/30 Done Lot B Lot C Control (rej/ ss) (rej/ ss) (rej/ ss) Done Done Done 3 HTSL High Temperature Storage Life TA = 150°C c = 0, Room 4 RSH Resistance to solder Heat 260C c = 0, Room 5 PC Moisture Preconditioning MSL 1 @ 260°C c = 0, Room After PC 0/240 0/240 0/240 0/240 6 UHASTPC Precond. Autoclave TA= +130°C, RH = 85%, PSIG= 18.8, No bias c = 0, Room 96 hrs 0/80 0/80 0/80 0/80 7 TC-PC Precond. Temp Cycle -65/+150°C air to air c = 0, Room 500 cy 0/80 0/80 0/80 0/80 8 HAST-PC Precond. HAST TA= +130°C, RH = 85%, PSIG= 18.8, bias c = 0, Room 96 hrs 0/80 0/80 0/80 0/80 Issue Date: 30-Oct-2013 Rev. 06-Jan-2010 Page 2 of 5 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20286 Amkor Philippines (contd) Test Results Initial Electrical Lot A (rej/ ss) Done Done Done 30 bonds from 5 units Results Pass Pass Pass 3 gm Pull Force min Cpk>1.67 30 bonds from 5 units Results Pass Pass Pass 3T° -40/Room/85°C Cpk >1.67 Critical parameters Results Pass Test Results Initial Electrical Lot A (rej/ ss) 504 hrs 0/80 0/80 1008 hrs 0/80 0/80 504 hrs 1008 hrs 0/80 0/80 0/80 0/80 0/80 0/80 0/80 0/80 0/30 0/30 0/30 0/30 0/240 0/240 0/240 0/240 # Test Name Test Conditions End Point Req’s 1 Prep Sample preparation and initial part testing various --- 9 BS Bond Shear test Cpk 1.33 10 WBPS 11 ED Wire Bond Pull Strength Electrical Distribution Lot B Lot C (rej/ ss) (rej/ ss) Control (rej/ ss) Done Pass ASESH # Test Name Test Conditions End Point Req’s 1 Prep Sample preparation and initial part testing various --- 2 HTOL High Temp Op Life TA = 125°C Tj=125°C c = 0, Room 3 HTSL High Temperature Storage Life TA = 150°C c = 0, Room 4 RSH Resistance to Solder Heat 260°C C=0 5 PC Moisture Preconditioning MSL 1 @ 260°C c = 0, Room Issue Date: 30-Oct-2013 Rev. 06-Jan-2010 After PC Done Lot B Lot C (rej/ ss) (rej/ ss) Done Done Page 3 of 5 Control (rej/ ss) Done FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20286 ASESH (contd) End Point Req’s Test Results various --- Initial Electrical Precond. Autoclave TA= +130°C, RH = 85%, PSIG= 18.8, No bias c = 0, Room TC-PC Precond. Temp Cycle -65/+150°C air to air c = 0, Room 8 HAST-PC Precond. HAST TA= +130°C, RH = 85%, PSIG= 18.8, bias 9 BS Bond Shear test 10 BPS 11 ED # Test Name 1 Prep Sample preparation and initial part testing 6 UHASTPC 7 Wire Bond Pull Strength Electrical Distribution Test Conditions Lot A Lot B Lot C Control (rej/ ss) (rej/ ss) (rej/ ss) (rej/ ss) Done Done Done Done 96 hrs 0/80 0/80 0/80 0/80 500 cy 0/80 0/80 0/80 0/80 c = 0, Room 96 hrs 0/80 0/80 0/80 0/80 Cpk 1.33 30 bonds from 5 units Results Pass Pass Pass 3 gm Pull Force min Cpk>1.67 30 bonds from 5 units Results Pass Pass Pass 3T° -40/Room/85°C Cpk >1.67 Critical parameters Results Pass ELECTRICAL CHARACTERISTIC SUMMARY: Electrical characteristic meet device specifications. Issue Date: 30-Oct-2013 Rev. 06-Jan-2010 Page 4 of 5 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #20286 CHANGED PART IDENTIFICATION: At the expiration of this FPCN devices can be assembled in the existing facilities or ASE, Shanghai or Amkor, Philippines. Devices assembled in the new facilities will have date code of WW05 (January 28), 2014 or later. AMKOR and ASE facilities will follow the ON Semiconductor standard marking for DFN / QFN packages. These devices have a one digit date code that can be a number or alphabet per ON Semiconductor’s date-code scheme. Assembly location can be identified by the orientation of the date code seen on the top marking, as shown below. The one digit date code is represented as M below. Seremban: M UTL: ASE, Shanghai: Amkor, Philippines: List of affected General Parts: NCP347MTAHTBG NCP347MTAETBG NCP347MTAFTBG NCP348AEMTTBG NCP348MTTBG NLAS5223BMNR2G NCN1154MUTAG NCN1188MUTAG NS5S1153MUTAG Issue Date: 30-Oct-2013 Rev. 06-Jan-2010 Page 5 of 5