517AU

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.6x1.6, 0.5P
CASE 517AU−01
ISSUE O
6
DATE 16 OCT 2008
1
SCALE 4:1
A
B
D
2X
PIN ONE
REFERENCE
2X
0.10 C
ÏÏ
ÏÏ
E
DETAIL A
OPTIONAL
CONSTRUCTION
A
DETAIL B
0.05 C
(A3)
A1
0.05 C
A1
SIDE VIEW
C
F
3
1
DETAIL B
SEATING
PLANE
D2
DETAIL A
G
6X
D1
XX MG
G
b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
0.16
XX = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERMASK DEFINED
MOUNTING FOOTPRINT*
0.82
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.20
0.30
1.60 BSC
1.60 BSC
0.50 BSC
0.62
0.72
0.15
0.25
0.57
0.67
0.55 BSC
0.25 BSC
0.20
0.30
−−−
0.15
1
E2
0.10 C A B
4
A3
DIM
A
A1
A3
b
D
E
e
D1
D2
E2
F
G
L
L1
GENERIC
MARKING DIAGRAM*
L
6
MOLD CMPD
OPTIONAL
CONSTRUCTION
e
0.10 C A B
6X
ÏÏÏ
ÏÏÏ
EXPOSED Cu
TOP VIEW
NOTE 4
L1
L
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
0.43
0.68
2X
0.35
1.90
0.28
1
6X
0.32
0.50 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON35147E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN6, 1.6X1.6, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON35147E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY YW. LEE.
DATE
16 OCT 2008
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2008
October, 2008 − Rev. 01O
Case Outline Number:
517AU