Reliability Investigation Results, Type: BZA862AL Time period Q4/2012 to Q3/2013 AEC Q101 Test Conditions Duration Quantity Rejects all parts see below 41480 0 #1 TEST Pre- and Post-Stress Electrical Test Ta = 25 °C N/A #2 PC Preconditioning JESD22 -A113 Bake Ta = 125 °C Soak Ta = 85 °C, RH = 85% Reflow soldering 24 hours 168 hours 3 cycles #5 #7 HTRB High Temperature Reverse Bias TC Temperature Cycling JESD22 -A108 Tj = Tjmax, Vr > 80% of max. breakdown Voltage 1000 hours 5840 0 JESD22- A104 -55 °C to Tjmax 1000 cycles 11040 0 #8 AC Autoclave JESD22- A102 Ta = 121 °C, RH = 100 % Pressure = 205 kPa (29.7 psia) 96 hours 11040 0 #9 H3TRB High Humidity High Temperature Reverse Bias JESD22- A101 Ta = 85 °C, 85% RH, Vr > 80% of rated breakdown voltage 1000 hours 11040 0 # 10 IOL Intermittent Operating Life MIL-STD-750 Method 1037 ton = toff, Devices powered to insure ΔTj = 125 °C for 7500 cycles or ΔTj = 100 °C for 15000 cycles 1000 hours 8720 0 JESD22-A111 / JESD22- B106 260 °C ± 5 °C 10 s 2700 0 J-STD-002 245 °C ± 5 °C 3s 3330 0 # 20 # 21 RSH Resistance to Solder Heat SD Solderability Calculation of FIT and MTBF Test considered for FIT calculation: High Temp. Reverse Bias (HTRB, AEC Q101 Test # 5) Confidence level 60%, derated to 55 °C, activation energy 0.7 eV, test time 168-1000 hours Wafer Fab Technology Quantity Rejects Failure Rate MTBF NXP DHAM Zener / Protection 5840 0 0.73 FIT 156880 years © 2014 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: Jun 2014