Freescale Semiconductor
Advance Information
Document Number: MC10XSC425
Rev. 2.0, 9/2013
Quad High Side Switch
(Dual 10 mOhm, Dual 25 mOhm)
10XSC425
The 10XSC425 is one in a family of devices designed for low-voltage
lighting or factory automation applications. Its four low RDS(ON)
MOSFETs (dual 10 m/dual 25 m) can control four separate 55 W /
28 W bulbs, and/or Xenon modules, and/or LEDs, and/or DC low
voltage motors.
Programming, control and diagnostics are accomplished using a 16-bit
SPI interface. Its output with selectable slew-rate improves
electromagnetic compatibility (EMC) behavior. Additionally, each
output has its own parallel input or SPI control for pulse-width
modulation (PWM) control if desired. The 10XSC425 allows the user to
program via the SPI the fault current trip levels and duration of
acceptable inrush. The device has fail-safe mode to provide fail-safe
functionality of the outputs in case of MCU damaged.
This device is powered by SMARTMOS technology.
HIGH SIDE SWITCH
EK SUFFIX (PB-FREE)
98ASA00368D
32-PIN SOICW-EP
Features
• Four protected 10 m and 25 m high side switches (at 25 °C)
• Operating voltage range of 6.0 to 20 V with sleep current
< 5.0 A, extended mode from 4.0 to 28 V
• 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting
with daisy chain capability
• PWM module using external clock or calibratable internal
oscillator with programmable output delay management
• Smart overcurrent shutdown, severe short-circuit,
overtemperature protections with time limited autoretry, and failsafe mode, in case of MCU damage
• Output OFF or ON open-load detection compliant to bulbs or leds
and short to battery detection.
• Analog current feedback with selectable ratio and board
temperature feedback
Applications
• Low-voltage industrial lighting
• Halogen lamps
• Incandescent bulbs
• Light-emitting diodes (LEDs)
• HID Xenon ballasts
• Low voltage factory automation
.
VDD
VDD
VPWR
VDD
VPWR
10XSC425
VDD
I/O
SCLK
CSB
SI
I/O
MCU SO
I/O
I/O
I/O
I/O
A/D
VPWR
HS0
WAKE
FSB
SCLK
CSB
SO
RSTB
SI
IN0
IN1
IN2
IN3
CSNS
FSI
GND
LOAD
HS1
LOAD
HS2
LOAD
HS3
LOAD
GND
Figure 1. 10XSC425 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2013. All rights reserved.
10XSC425
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table of Contents
1
2
3
Orderable Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Internal Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Pinout Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 Static Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.3 Dynamic Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.4 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2 Functional Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.1Output Current Monitoring (CSNS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.2Direct Inputs (IN0, IN1, IN2, IN3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.3Fault Status (FSB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.4WAKE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.5Reset (RSTB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.6Chip Select (CSB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.7Serial Clock (SCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2.8Serial Input (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2.9Digital Drain Voltage (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2.10Ground (GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2.11Positive Power Supply (VPWR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2.12Serial Output (SO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2.13High Side Outputs (HS3, HS1, HS0, HS2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2.14Fail-safe Input (FSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.3 Functional Internal Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.3.1 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.3.2 High Side Switches (HS0–HS3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.3.3 MCU Interface and Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6 Functional Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.1 SPI Protocol Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.2 Operational Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.2.1Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.2.2Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.2.3Fail-safe Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.2.4Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.2.5Normal and Fail-safe Mode Transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.2.6Fault Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.2.7Start-up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.3 Protection and Diagnostic Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
6.3.1Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
6.3.2Auto-retry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.3.3Diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.3.4Analog Current Recopy and Temperature Feedbacks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.3.5Active Clamp ON VPWR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
6.3.6Reverse Battery ON VPWR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.7Ground Disconnect Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.8Loss of Supply Lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3.9EMC PERFORMANCES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4 LOGIC COMMANDS AND REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.1 Serial Input Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.2 Device Register Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.3 Serial Output Communication (Device Status Return Data) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4.4 Serial Output Bit Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7 Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.1 Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.2 Marking Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.3 Package Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
39
40
40
40
40
40
42
46
47
50
50
51
51
51
51
55
10XSC425
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
1
Orderable Parts
This section describes the part numbers available to be purchased along with their differences.
Table 1. Orderable Part Variations
Part Number (1)
Temperature (TA)
Package
Quad version
MC10XSC425EK
-40 to 125°C
32 pin SOIC exposed pad
Notes
1. To Order parts in Tape & Real, add the R2 suffix to the part number.
Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://
www.freescale.com and perform a part number search for the following device numbers: 07XS and 17XS.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
2
Internal Block Diagram
VDD
IUP
VPWR
VDD Failure
Detection
Internal
Regulator
POR
Over/Undervoltage
Protections
VPWR
Voltage Clamp
Charge
Pump
VREG
CSB
SCLK
Selectable Slew Rate
Gate Driver
IDWN
Selectable Overcurrent
Detection
SO
SI
RSTB
WAKE
FSB
IN0
HS0
Severe Short-circuit
Detection
Logic
Short to VPWR
Detection
Overtemperature
Detection
IN1
IN2
Open-Load
Detections
IN3
HS0
RDWN IDWN
RDWN
HS1
Calibratable
Oscillator
HS1
PWM
Module
HS2
VREG
HS2
HS3
FSI
HS3
Programmable
Watchdog
Selectable Output
Current Recopy
Temperature
Feedback
Overtemperature
Prewarning
Analog MUX
VDD
GND
CSNS
Figure 2. 10XSC425 Simplified Internal Block Diagram
10XSC425
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
Pin Connections
3.1
Pinout Diagram
Transparent Top View of Package
WAKE
1
32
FSB
RSTB
2
31
IN3
CSB
3
30
IN2
SCLK
4
29
IN1
SI
5
28
IN0
VDD
6
27
CSNS
SO
7
26
FSI
GND
8
25
GND
VPWR
9
24
NC
HS3
10
23
HS2
HS3
11
22
HS2
HS3
12
21
HS2
HS3
13
20
HS2
HS1
14
19
HS0
HS1
15
18
HS0
HS1
16
17
HS0
Figure 3. 10XSC425 Pin Connections
3.2
Pin Definitions
Table 2. 10XSC425 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 28.
Pin
Number
Pin Name
Pin
Function
Formal Name
1
WAKE
Input
Wake
This input pin controls the device mode.
2
RSTB
Input
Reset
This input pin is used to initialize the device configuration and fault registers,
as well as drive the device into a low-current Sleep mode.
3
CSB
Input
Chip Select
(Active Low)
This input pin is connected to a chip select output of a master microcontroller
(MCU).
4
SCLK
Input
Serial Clock
This input pin is connected to the MCU providing the required bit shift clock for
SPI communication.
5
SI
Input
Serial Input
This pin is a command data input pin connected to the SPI Serial Data Output
of the MCU or to the SO pin of the previous device of a daisy-chain of devices.
6
VDD
Power
Digital Drain Voltage
This pin is an external voltage input pin used to supply power interfaces to the
SPI bus.
7
SO
Output
Serial Output
This output pin is connected to the SPI Serial Data Input pin of the MCU or to
the SI pin of the next device of a daisy-chain of devices.
Definition
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
Table 2. 10XSC425 Pin Definitions (continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on page 28.
Pin
Number
Pin Name
Pin
Function
Formal Name
Definition
8, 25
GND
Ground
Ground
These pins, internally shorted, are the ground for the logic and analog circuitry
of the device. These ground pins must be also shorted in the board.
9, 33
VPWR
Power
Positive Power Supply
This pin connects to the positive power supply and is the source of operational
power for the device. Pins 9 and 33 must be externally connected.
10, 11, 12,
13
HS3
Output
High Side Output
Protected 25 m high side power output pins to the load.
14, 15, 16
HS1
Output
High Side Output
Protected 10 m high side power output pins to the load.
17, 18, 19
HS0
Output
High Side Output
Protected 10 m high side power output pins to the load.
20, 21, 22,
23
HS2
Output
High Side Output
Protected 25 m high side power output pins to the load.
24
NC
N/A
No Connect
26
FSI
Input
Fail-safe Input
This input enables the watchdog timeout feature.
27
CSNS
Output
Output Current
Monitoring
This pin reports an analog value proportional to the designated HS[0:3] output
current or the temperature of the GND flag (pin 14). It is used externally to
generate a ground-referenced voltage for the microcontroller (MCU) . Current
recopy and temperature feedback is SPI programmable.
28
29
30
31
IN0
IN1
IN2
IN3
Input
Direct Inputs
Each direct input controls the device mode. The IN[0 : 3] high side input pins
are used to directly control HS0 : HS3 high side output pins.
The PWM frequency can be generated from IN0 pin to PWM module in case
of external clock is set.
32
FSB
Output
Fault Status
(Active Low)
This pin is an open drain configured output requiring an external pull-up
resistor to VDD for fault reporting.
This pin may not be connected.
10XSC425
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Analog Integrated Circuit Device Data
Freescale Semiconductor
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Electrical Characteristics
4.1
Maximum Ratings
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Symbol
Ratings
Value
Unit
Notes
ELECTRICAL RATINGS
VPWR(SS)
VPWR Supply Voltage Range
• Load Dump at 25 °C (400 ms)
• Maximum Operating Voltage
• Reverse Battery
V
41
28
-18
VDD
VDD Supply Voltage Range
-0.3 to 5.5
V
VDIG
Input / Output Voltage
-0.3 to 5.5
V
VSO
SO and CSNS Output Voltage
-0.3 to VDD + 0.3
V
IDIG
Digital Input/ Output Current in Clamp Mode
100
µA
ICL(WAKE)
WAKE Input Clamp Current
2.5
mA
ICL(CSNS)
CSNS Input Clamp Current
2.5
mA
HS [0:3] Voltage
• Positive
• Negative
41
-24
High Side Breakdown Voltage
47
V
IHS[0:3]
Output Current
6.0
A
(2)
ECL [0:1]
HS[0,1] Output Clamp Energy using single pulse method
60
mJ
(3)
ECL [2:3]
HS[2,3] Output Clamp Energy using single pulse method
25
mJ
(3)
V
(4)
VHS[0:3]
VPWR - VHS
VESD1
VESD2
VESD3
VESD4
ESD Voltage (VPWR Pins 9 and 33 must be externally connected.)
• Human Body Model (HBM) for HS[0:3], VPWR and GND
• Human Body Model (HBM) for other pins
• Charge Device Model (CDM)
Corner Pins (1, 13, 19, 21)
All Other Pins (2-12, 14-18, 20, 22-24)
(5)
V
± 8000
± 2000
± 750
± 500
Notes
2. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using package thermal resistance is required.
3. Active clamp energy using single-pulse method (L = 2.0 mH, RL = 0 , VPWR = 14 V, TJ = 150 C initial).
4.
Pins 9 and 33 must be externally connected. ESD testing is performed in accordance with the Human Body Model (HBM)
(CZAP = 100 pF, RZAP = 1500 ), the Machine Model (MM) (CZAP = 200 pF, RZAP = 0 ), and the Charge Device Model (CDM), Robotic
(CZAP = 4.0 pF).
5.
Input / Output pins are: IN[0:3], RSTB, FSI, SI, SCLK, CSB, and FSB
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Symbol
Ratings
Value
Unit
Notes
C
(5)
THERMAL RATINGS
TA
TJ
TSTG
Operating Temperature
• Ambient
• Junction
- 40 to 125
- 40 to 150
Storage Temperature
- 55 to 150
C
THERMAL RESISTANCE
RJC
RJA
TSOLDER
Thermal Resistance
• Junction to Case
• Junction to Ambient
<2.5
30
Peak Pin Reflow Temperature During Solder Mounting
260
C/ W
(7)
C
(8)
Notes
6. To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not
exceed 125C.
7. Device mounted on a 2s2p test board per JEDEC JESD51-2. 15 °C/W of RθJA can be reached in a real application case (4 layers board).
8. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
10XSC425
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
4.2
Static Electrical Characteristics
Table 4. Static Electrical Characteristics
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
V
(9)
V
(10)
POWER INPUTS
Battery Supply Voltage Range
• Fully Operational
• Extended mode
6.0
4.0
–
–
20
28
VPWR
(CLAMP)
Battery Clamp Voltage
41
47
53
IPWR(ON)
VPWR Operating Supply Current
• Outputs commanded ON, HS[0 : 3] open, IN[0:3] > VIH
–
6.5
20
VPWR
IPWR(SBY)
IPWR(SLEEP)
VPWR Supply Current
• Outputs commanded OFF, OFF Open-load Detection Disabled,
HS[0 : 3] shorted to the ground with VDD = 5.5 V
WAKE > VIH or RSTB > VIH and IN[0:3] < VIL
Sleep State Supply Current
VPWR = 12 V, RSTB = WAKE = IN[0:3] < VIL, HS[0 : 3] shorted to ground
• TA = 25 °C
mA
mA
–
6.5
7.5
A
• TA = 85 °C
–
–
1.0
–
5.0
30
VDD(ON)
VDD Supply Voltage
3.0
–
5.5
IDD(ON)
VDD Supply Current at VDD = 5.5 V
• No SPI Communication
• 8.0 MHz SPI Communication
–
–
1.6
5.0
2.2
–
IDD(SLEEP)
VDD Sleep State Current at VDD = 5.5 V
–
–
5.0
A
VPWR(OV)
Overvoltage Shutdown Threshold
28
32
36
V
VPWR
(OVHYS)
Overvoltage Shutdown Hysteresis
0.2
0.8
1.5
V
VPWR(UV)
Undervoltage Shutdown Threshold
3.3
3.9
4.3
V
VSUPPLY
VPWR and VDD Power on Reset Threshold
0.5
–
0.9
VPWR
Recovery Undervoltage Threshold
3.4
4.1
4.5
V
VDD Supply Failure Threshold ( for VPWR > VPWR(UV) )
2.2
2.5
2.8
V
(11)
mA
(POR)
VPWR(UV)
V
(12)
(UV)
_UP
VDD(FAIL)
Notes
9. In extended mode, the functionality is guaranteed but not the electrical parameters. From 4.0 to 6.0 V voltage range, the device is only
protected with the thermal shutdown detection.
10. Measured with the outputs open.
11. Typical value guaranteed per design.
12. Output will automatically recover with time limited autoretry to instructed state when VPWR voltage is restored to normal as long as the
VPWR degradation level did not go below the undervoltage power-ON reset threshold. This applies to all internal device logic that is
supplied by VPWR and assumes that the external VDD supply is within specification.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
–
–
–
–
–
–
–
–
36
16
10
10
–
–
–
–
–
–
–
–
62
27
17
17
Unit
Notes
OUTPUTS HS0 TO HS3
RDS_01(ON)
HS[0,1] Output Drain-to-Source ON Resistance (IHS = 5.0 A, TA = 25 C)
• VPWR = 4.5 V
• VPWR = 6.0 V
• VPWR = 10 V
• VPWR = 13 V
RDS_01(ON)
HS[0,1] Output Drain-to-Source ON Resistance (IHS = 5.0 A, TA = 150 C)
• VPWR = 4.5 V
• VPWR = 6.0 V
• VPWR = 10 V
• VPWR = 13 V
RSD_01(ON)
HS[0,1] Output Source-to-Drain ON Resistance (IHS = -5.0 A, VPWR= -18 V)
• TA = 25 C
• TA = 150 C
RDS_23(ON)
HS[2,3] Output Drain-to-Source ON Resistance (IHS = 5.0 A, TA = 25 C)
• VPWR = 4.5 V
• VPWR = 6.0 V
• VPWR = 10 V
• VPWR = 13 V
RDS_23(ON)
HS[2,3] Output Drain-to-Source ON Resistance (IHS = 5.0 A, TA = 150 C)
• VPWR = 4.5 V
• VPWR = 6.0 V
• VPWR = 10 V
• VPWR = 13 V
RSD_23(ON)
HS[2,3] Output Source-to-Drain ON Resistance (IHS = -5.0 A, VPWR= -18 V)
• TA = 25 C
• TA = 150 C
m
m
m
–
–
–
–
15
20
–
–
–
–
–
–
–
–
90
40
25
25
–
–
–
–
–
–
–
–
153
68
42.5
42.5
(13)
m
m
–
–
–
–
37.5
50
m
(13)
RSHORT_01
HS[0,1] Maximum Severe Short-circuit Impedance Detection
28
67
100
m
(14)
RSHORT_23
HS[2,3] Maximum Severe Short-circuit Impedance Detection
70
160
200
m
(14)
HS[0-3] Output Leakage Current in Off-state
• in sleep mode
• in normal mode (OS_dis = 1 and OLOFF_dis = 1)
–
–
–
–
5.0
30
IOFF
A
Notes
13. Source-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity VPWR.
14.
Short-circuit impedance calculated from HS[0:3] to GND pins. Value guaranteed per design.
10XSC425
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
77.6
46.4
43.6
40.2
31.6
26.2
19.2
12.1
10.3
6.2
101.6
62
55.6
48.8
40.4
33.2
24.3
15.3
13.1
8.3
125.6
77.6
67.6
57.4
49.2
40.2
29.4
18.4
15.9
10.3
38.8
23.2
21.8
18.6
15.8
13.1
4.6
4.6
4.6
2.9
50.8
31
27.8
23.8
20.2
16.6
6.3
6.3
6.3
4.1
62.8
38.8
33.8
29
24.6
20.1
8.0
8.0
8.0
5.3
Unit
Notes
OUTPUTS HS0 TO HS3 (CONTINUED)
OCHI1_0
OCHI2_0
OC1_0
OC2_0
OC3_0
OC4_0
OCLO4_0
OCLO3_0
OCLO2_0
OCLO1_0
OCHI1_1
OCHI2_1
OC1_1
OC2_1
OC3_1
OC4_1
OCLO4_1
OCLO3_1
OCLO2_1
OCLO1_1
CSR0_0
CSR1_0
CSR0_1
CSR1_1
CSR0_0_ACC
HS[0,1] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
• 28W bit = 0
• 28W bit = 1
HS[0,1] Current Sense Ratio (6.0 V < HS[0:3] < 20 V, CSNS < 5.0 V)
• 28W bit = 0
CSNS_ratio bit = 0
CSNS_ratio bit = 1
• 28W bit = 1
CSNS_ratio bit = 0
CSNS_ratio bit = 1
HS[0,1] Current Sense Ratio (CSR0) Accuracy (6.0 V < VHS[0:1] < 20 V)
with 28W bit = 0
At 25 C and 125 C
• IHS[0:1] = 12.5 A
• IHS[0:1] = 5.0 A
• IHS[0:1] = 3.0 A
• IHS[0:1] = 1.5 A
At -40 C
• IHS[0:1] = 12.5 A
• IHS[0:1] = 5.0 A
• IHS[0:1] = 3.0 A
• IHS[0:1] = 1.5 A
A
–
–
–
1/9900
1/58500
–
–
–
–
1/4950
1/29250
–
–
(15)
%
-18
-21
-22
-25
–
–
–
–
18
21
22
25
-23
-26
-30
-35
–
–
–
–
23
26
30
35
Notes
15. Current sense ratio = ICSNS / IHS[0:3]
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
%
(16)
%/C
(17)
OUTPUTS HS0 TO HS3 (CONTINUED)
CSR0_0_ACC
(CAL)
(CSR0_0)/
(T)
CSR0_1_ACC
HS[0,1] Current Recopy Accuracy with one calibration point
(6.0 V < VHS[0:1] < 20 V) with 28W bit = 0
• IHS[0:1] = 5.0 A
HS[0,1] CSR0 Current Recopy Temperature Drift (6.0 V < VHS[0:1] < 20 V)
with 28W bit = 0
• IHS[0:1] =5.0 A
HS[0,1] Current Sense Ratio (CSR0) Accuracy (6.0 V < VHS[0:1 < 20 V)
with 28W bit = 1
At 25 C and 125 C
• IHS[0:1] = 3.0 A
• IHS[0:1] = 1.5 A
At -40 C
• IHS[0:1] = 3.0 A
• IHS[0:1] = 1.5 A
CSR0_1_ACC
(CAL)
CSR1_0_ACC
HS[0,1] Current Recopy Accuracy with one calibration point
(6.0 V < VHS[0:1] < 20 V) with 28W bit = 1
• IHS[0:1] = 3.0 A
HS[0,1] Current Sense Ratio (CSR1) Accuracy (6.0 V < VHS[0:1] < 20 V)
with 28W bit = 0
At 25 C and 125 C
• IHS[0:1] = 12.5 A
• IHS[0:1] = 75A
At -40 C
• IHS[0:1] = 12.5 A
• IHS[0:1] = 75 A
CSR1_0_ACC
(CAL)
CSR1_1_ACC
HS[0,1] Current Recopy Accuracy with one calibration point
(6.0 V < VHS[0:1] < 20 V) with 28W bit = 0
• IHS[0:1] = 12.5 A
HS[0,1] Current Sense Ratio (CSR1) Accuracy (6.0 V < VHS[0:1] < 20 V)
with 28W bit = 1
At 25 C and 125 C
• IHS[0:1] = 12.5 A
• IHS[0:1] = 37.5 A
at -40 C
• IHS[0:1] = 12.5 A
• IHS[0:1] = 37.5 A
CSR1_1_ACC
(CAL)
HS[0,1] Current Recopy Accuracy with one calibration point
(6.0 V < VHS[0:1] < 20 V) with 28W bit = 1
• IHS[0:1] = 12.5 A
-5.0
–
–
–
5.0
0.04
%
-22
-25
–
–
22
25
-30
-35
–
–
30
35
%
-5.0
–
(16)
5.0
%
-20
-18
–
–
20
18
-30
-25
–
–
30
25
%
-5.0
–
(16)
5.0
%
-22
-20
–
–
22
20
-27
-25
–
–
27
25
%
-5.0
–
(16)
5.0
Notes
16. Based on statistical analysis. It is not production tested.
17. Based on statistical data: delta (CSR0)/delta (T) = {(measured ICSNS at T1 - measured ICSNS at T2) / measured ICSNS at room} / {T1-T2}.
Not production tested.
10XSC425
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
VDD+0.25
–
VDD+1.0
OFF OpenLoad Detection Source Current
30
–
100
A
OFF OpenLoad Fault Detection Voltage Threshold
2.0
3.0
4.0
V
2.5
5.0
10
mA
80
55
360
165
660
330
VPWR-1.2
VPWR-0.8
VPWR-0.4
Output Negative Clamp Voltage
• 0.5 A < IHS[0:3] < 5.0 A, Output programmed OFF
- 22
–
-16
Output Overtemperature Shutdown for 4.5 V < VPWR < 28 V
155
175
195
38.8
23.2
21.8
17.3
14.7
12.2
9.2
5.8
4.6
2.9
50.8
31
27.3
22.9
19.2
15.8
11.9
7.6
6.3
4.1
62.8
38.8
32.8
28.4
23.7
19.4
14.5
9.3
8.0
5.3
–
–
1/4670
1/27270
–
–
Notes
OUTPUTS HS0 TO HS3 (CONTINUED)
VCL(CSNS)
IOLD(OFF)
VOLD(THRES)
Current Sense Clamp Voltage
• CSNS Open; IHS[0:3] = 5.0 A with CSR0 ratio
IOLD(ON_LED) ON OpenLoad Fault Detection Current Threshold with LED (VHS[0:3] =
VPWR -0.75 V
IOLD(ON)
ON OpenLoad Fault Detection Current Threshold
• HS[0,1]
• HS[2,3]
VOSD(THRES) Output Short to VPWR Detection Voltage Threshold
• Output programmed OFF
VCL
TSD
V
mA
V
V
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
OCHI1_1
OCHI2_1
OC1_1
OC2_1
OC3_1
OC4_1
OCLO4_1
OCLO3_1
OCLO2_1
OCLO1_1
CSR0_x
CSR1_x
HS[2,3] Current Sense Ratio (6.0 V < HS[2:3] < 20 V, CSNS < 5.0 V)
CSNS_ratio bit = 0
CSNS_ratio bit = 1
(18)
C
A
–
(19)
Notes
18. Output OFF OpenLoad Detection Current is the current required to flow through the load for the purpose of detecting the existence of
an OpenLoad condition when the specific output is commanded OFF. Pull-up current is measured for VHS = VOLD(THRES)
19.
Current sense ratio = ICSNS / IHS[0:3]
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
OUTPUTS HS0 TO HS3 (CONTINUED)
CSR0_x_ACC
HS[2,3] Current Sense Ratio (CSR0) Accuracy (6.0 V < VHS[2:3] < 20 V)
with 28W bit = x
At 25 C and 125 C
• IHS[2:3] = 6.25 A
• IHS[2:3] = 2.5 A
• IHS[2:3] = 1.5 A
• IHS[2:3] = 0.75 A
At -40 C
• IHS[2:3] = 6.25 A
• IHS[2:3] = 2.5 A
• IHS[2:3] = 1.5 A
• IHS[2:3] = 0.75 A
CSR0_x_ACC
(CAL)
(CSR0_x)/
(T)
CSR1_x_ACC
HS[2,3] Current Recopy Accuracy with one calibration point
(6.0 V < VHS[2:3] < 20 V)
• IHS[2:3] = 2.5 A
HS[2,3] CSR0 Current Recopy Temperature Drift (6.0 V < VHS[2:3] < 20 V)
with 28W bit = 0
• IHS[2:3] = 2.5 A
HS[2,3] Current Sense Ratio (CSR1) Accuracy (6.0 V < VHS[2:3] < 20 V)
At 25 C and 125 C
• IHS[2:3] = 6.25 A
• IHS[2:3] = 18.75 A
At -40 C
• IHS[2:3] = 6.25 A
• IHS[2:3] = 18.75 A
CSR1_x_ACC
(CAL)
HS[2,3] Current Recopy Accuracy with one calibration point
(6.0 V < VHS[2:3] < 20 V)
• IHS[2:3] = 6.2 A
%
-18
-21
-22
-25
–
–
–
–
18
21
22
25
-23
-26
-30
-35
–
–
–
–
23
26
30
35
-5.0
–
–
–
%
(20)
%/C
(20)
5.0
0.04
%
-22
-25
–
–
+22
+25
-25
-27
–
–
+25
+27
-5.0
–
5.0
%
(20)
CONTROL INTERFACE
VIH
Input Logic High-voltage
2.0
–
VDD+0.3
V
(21)
VIL
Input Logic Low-voltage
-0.3
–
0.8
V
(21)
Input Logic Pull-down Current (SCLK, SI)
5.0
–
20
A
(22)
IUP
Input Logic Pull-up Current (CSB)
5.0
–
20
A
(23)
CSO
SO, FSB Tri-state Capacitance
–
–
20
pF
(24)
IDWN
Notes
20. Based on statistical analysis. It is not production tested.
21. Upper and lower logic threshold voltage range applies to SI, CSB, SCLK, RSTB, IN[0:3], and WAKE input signals. The WAKE and RSTB
signals may be supplied by a derived voltage referenced to VPWR.
22.
Pull-down current is with VSI > 1.0 V and VSCLK > 1.0 V.
23.
Pull-up current is with VCSB < 2.0 V. CSB has an active internal pull-up to VDD.
24.
Input capacitance of SI, CSB, SCLK, RSTB, IN[0:3], and WAKE. This parameter is guaranteed by process monitoring but is not
production tested.
10XSC425
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
125
250
500
k
–
4.0
12
pF
(26)
V
(25)
CONTROL INTERFACE (CONTINUED)
RDWN
CIN
VCL(WAKE)
VF(WAKE)
Input Logic Pull-down Resistor (RSTB, WAKE and IN[0:3])
Input Capacitance
Wake Input Clamp Voltage
• ICL(WAKE) < 2.5 mA
VSOL
ISO(LEAK)
RFS
25
32
- 2.0
–
- 0.3
VDD-0.4
–
–
–
–
0.4
- 2.0
0
2.0
Wake Input Forward Voltage
• ICL(WAKE) = -2.5 mA
VSOH
18
SO High State Output Voltage
• IOH = 1.0 mA
SO and FSB Low State Output Voltage
• IOL = -1.0 mA
SO, CSNS and FSB Tri-state Leakage Current
• CSB = VIH and 0.0 V < VSO < VDD, or FSB = 5.5 V, or CSNS = 0.0 V
FSI External Pull-down Resistance
Watchdog Disabled
Watchdog Enabled
V
V
V
A
(27)
k
–
10
0
Infinite
1.0
–
Notes
25. The current must be limited by a series resistance when using voltages > 7.0 V.
26. Input capacitance of SI, CSB, SCLK, RSTB, IN[0:3], and WAKE. This parameter is guaranteed by process monitoring but is not
production tested.
27. In Fail-safe, HS[0:3] depends respectively on ON[0:3]. FSI has an active internal pull-up to VREG 3.0 V.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
4.3
Dynamic Electrical Characteristics
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
300
650
1200
300
720
1200
0.8
0.9
1.2
150
330
600
150
370
600
600
1250
2400
600
1450
2400
Unit
Notes
POWER OUTPUT TIMING HS0 TO HS3
SRR00
SRF00
DSR_00
SRR01
SRF01
SRR10
SRF10
Output Rising Medium Slew Rate (medium speed slew rate / SR[1:0] = 00)
Output Falling Medium Slew Rate (medium speed slew rate / SR[1:0] = 00)
Driver Output Matching Slew Rate (SRR /SRF)
• PWR = 14 V at 25 °C and for medium speed slew rate
(SR[1:0] = 00) V
SRR01
SRF01
mV/s
Output Falling Fast Slew Rate (medium speed slew rate / SR[1:0] = 10)
t DLY_OFF
DSR_00
mV/s
Output Rising Fast Slew Rate (medium speed slew rate / SR[1:0] = 10)
HS[0:1] Outputs Turn-OFF Delay Times
• VPWR = 14 for medium speed slew rate (SR[1:0] = 00) V
SRF00
mV/s
Output Falling Low Slew Rate (medium speed slew rate / SR[1:0] = 01)
HS[0:1] Outputs Turn-ON Delay Times
• VPWR = 14 for medium speed slew rate (SR[1:0] = 00) V
SRR00
mV/s
Output Rising Low Slew Rate (medium speed slew rate / SR[1:0] = 01)
t DLY_ON
t RF
mV/s
HS[0:1] Driver Output Matching Time (tDLY(ON) - tDLY(OFF))
• VPWR = 14 V, fPWM = 240 Hz, PWM duty cycle = 50%, at 25 °C for
medium speed slew rate (SR[1:0] = 00)
mV/s
40
64
10
32
s
(28),(29)
s
(28),(29)
s
(28),(29)
100
60
10
32
60
200
470
800
200
570
800
0.6
0.8
1.0
100
230
400
100
300
400
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
mV/s
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
mV/s
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
mV/s
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
mV/s
Notes
28. Turn ON delay time measured from rising edge of any signal (IN[0 : 3] and CSB) that would turn the output ON to VHS[0 : 3] = VPWR / 2 with
RL = 5.0 resistive load.
29.
Turn OFF delay time measured from falling edge of any signal (IN[0 : 3] and CSB) that would turn the output OFF to VHS[0 : 3] = VPWR / 2
with RL = 5.0 resistive load.
10XSC425
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
400
900
1600
400
1140
1600
40
87
160
15
36
65
10
51
110
Unit
Notes
POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED)
SRR10
SRF10
t DLY_ON
t DLY_OFF
t RF
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
mV/s
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
mV/s
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
s
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
s
HS[2,3] Output Overcurrent Detection Levels (6.0 V < VHS[0:3] < 20 V)
s
tFAULT
Fault Detection Blanking Time
1.0
5.0
20
s
(30)
tDETECT
Output Shutdown Delay Time
–
7.0
30
s
(31)
t CNSVAL
CSNS Valid Time
–
70
100
s
(32)
Watchdog Timeout
217
310
400
ms
(33)
ON OpenLoad Fault Cyclic Detection Time with LED
105
150
195
ms
t WDTO
TOLD(LED)
Notes
30. Time necessary to report the fault to FSB pin.
31. Time necessary to switch-off the output in case of OT, or OC, or SC, or UV fault detection (from negative edge of FSB pin to HS
voltage = 50% of VPWR.
32.
33.
Time necessary for CSNS to be within ±5.0% of the targeted value (from HS voltage = 50% of VPWR to ±5.0% of the targeted CSNS
value).
For FSI open, the Watchdog timeout delay measured from the rising edge of RST, to HS[0,2] output state depend on the corresponding
input command.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
4.40
1.62
2.10
2.88
4.58
10.16
73.2
6.30
2.32
3.00
4.12
6.56
14.52
104.6
8.02
3.00
3.90
5.36
8.54
18.88
134.0
Unit
Notes
POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED)
tOC1_00
tOC2_00
tOC3_00
tOC4_00
tOC5_00
tOC6_00
tOC7_00
HS[0,1] Output Overcurrent Time Step for 28W bit = 0
• OC[1:0] = 00 (slow by default)
ms
tOC1_01
tOC2_01
tOC3_01
tOC4_01
tOC5_01
tOC6_01
tOC7_01
• OC[1:0] = 01 (fast)
1.10
0.40
0.52
0.72
1.14
2.54
18.2
1.57
0.58
0.75
1.03
1.64
3.63
26.1
2.00
0.75
0.98
1.34
2.13
4.72
34.0
tOC1_10
tOC2_10
tOC3_10
tOC4_10
tOC5_10
tOC6_10
tOC7_10
• OC[1:0] = 10 (medium)
2.20
0.81
1.05
1.44
2.29
5.08
36.6
3.15
1.16
1.50
2.06
3.28
7.26
52.3
4.01
1.50
1.95
2.68
4.27
9.44
68.0
tOC1_11
tOC2_11
tOC3_11
tOC4_11
tOC5_11
tOC6_11
tOC7_11
• OC[1:0] = 11 (very slow)
8.8
3.2
4.2
5.7
9.1
20.3
146.4
12.6
4.6
6.0
8.2
13.1
29.0
209.2
16.4
21.4
7.8
10.7
17.0
37.7
272.0
10XSC425
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED)
tOC1_00
tOC2_00
tOC3_00
tOC4_00
tOC5_00
tOC6_00
tOC7_00
HS[0,1] Output Overcurrent Time Step for 28W bit = 1
HS[2,3] Output Overcurrent Time Step
• OC[1:0] = 00 (slow by default)
ms
3.4
1.1
1.4
2.0
3.4
8.5
62.4
4.9
1.6
2.1
2.9
4.9
12.2
89.2
6.4
2.1
2.8
3.8
6.4
15.9
116.0
tOC1_01
tOC2_01
tOC3_01
tOC4_01
tOC5_01
tOC6_01
tOC7_01
• OC[1:0] = 01 (fast)
0.86
0.28
0.36
0.51
0.78
2.14
20.2
1.24
0.40
0.52
0.74
1.12
3.06
22.2
1.61
0.52
0.68
0.96
1.46
3.98
28.9
tOC1_10
tOC2_10
tOC3_10
tOC4_10
tOC5_10
tOC6_10
tOC7_10
• OC[1:0] = 10 (medium)
1.7
0.5
0.7
1.0
1.7
4.2
31.2
2.5
0.8
1.0
1.5
2.5
6.1
44.6
3.3
1.0
1.3
2.0
3.3
6.0
58.0
tOC1_11
tOC2_11
tOC3_11
tOC4_11
tOC5_11
tOC6_11
tOC7_11
• OC[1:0] = 11 (very slow)
6.8
2.2
2.9
4.0
6.8
17.0
124.8
9.8
3.2
4.2
5.8
9.8
24.4
178.4
12.8
16.7
5.5
7.6
12.8
31.8
232.0
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
242
126
140
158
181
211
347
181
200
226
259
302
452
236
260
294
337
393
121
63
70
79
90
105
173
90
100
113
129
151
226
118
130
147
169
197
484
252
280
316
362
422
694
362
400
452
518
604
1904
472
520
588
674
786
291
156
178
208
251
314
417
224
255
298
359
449
542
292
332
388
467
584
146
78
88
101
126
226
209
112
127
145
180
324
272
146
166
189
234
422
583
312
357
417
501
628
834
448
510
596
717
898
1085
582
665
775
933
1170
Unit
Notes
POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED)
tBC1_00
tBC2_00
tBC3_00
tBC4_00
tBC5_00
tBC6_00
tBC1_01
tBC2_01
tBC3_01
tBC4_01
tBC5_01
tBC6_01
HS[0,1] Bulb Cooling Time Step for 28W bit = 0
• CB[1:0] = 00 or 11 (medium)
• CB[1:0] = 01 (fast)
ms
• CB[1:0] = 10 (slow)
tBC1_10
tBC2_10
tBC3_10
tBC4_10
tBC5_10
tBC6_10
HS[0,1] for 28W bit = 1 or for HS2-HS3
• CB[1:0] = 00 or 11 (medium)
tBC1_00
tBC2_00
tBC3_00
tBC4_00
tBC5_00
tBC6_00
• CB[1:0] = 01 (fast)
tBC1_01
tBC2_01
tBC3_01
tBC4_01
tBC5_01
tBC6_01
• CB[1:0] = 10 (slow)
tBC1_10
tBC2_10
tBC3_10
tBC4_10
tBC5_10
tBC6_10
10XSC425
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
Input PWM Clock Range on IN0
7.68
–
30.72
kHz
fIN0(LOW)
Input PWM Clock Low Frequency Detection Range on IN0
1.0
2.0
4.0
kHz
(35)
fIN0(HIGH)
Input PWM Clock High Frequency Detection Range on IN0
100
–
400
kHz
(35)
fPWM
Output PWM Frequency Range using External Clock on IN0
31.25
–
781
Hz
-10
–
+10
%
Default Output PWM Frequency using Internal Oscillator
84
120
156
Hz
t CSB(MIN)
CSB Calibration Low Minimum Time Detection Range
14
20
26
s
t CSB(MAX)
CSB Calibration Low Maximum Tine Detection Range
140
200
260
s
RPWM_1k
Output PWM Duty Cycle Range for fPWM = 1.0 kHz for high speed slew rate
10
–
94
%
(35)
RPWM_400
Output PWM Duty Cycle Range for fPWM = 400 Hz
6.0
–
98
%
(35)
RPWM_200
Output PWM Duty Cycle Range for fPWM = 200 Hz
5.0
–
98
%
(35)
175
250
325
ms
105
150
195
ms
Thermal Prewarning Detection
110
125
140
°C
Analog Temperature Feedback at TA = 25 °C with RCSNS = 2.5 k
1.15
1.20
1.25
V
Analog Temperature Feedback Derating with RCSNS = 2.5 k
-3.5
-3.7
-3.9
mV/°C
PWM MODULE TIMING
fIN0
AFPWM(CAL) Output PWM Frequency Accuracy using Calibrated Oscillator
fPWM(0)
INPUT TIMING
tIN
Direct Input Toggle Timeout
AUTORETRY TIMING
tAUTO
Autoretry Period
TEMPERATURE ON THE GND FLAG
TOTWAR
TFEED
DTFEED
(36)
(37)
Notes
34. Clock Fail detector available for PWM_en bit is set to logic [1] and CLOCK_sel is set to logic [0].
35. The PWM ratio is measured at VHS = 50% of VPWR and for the default SR value. It is possible to put the device fully on (PWM duty cycle
100%) and fully off (duty cycle 0%). For values outside this range, a calibration is needed between the PWM duty cycle programming and
the PWM on the output with RL = 5.0 resistive load.
36.
37.
Typical value guaranteed per design.
Value guaranteed per statistical analysis.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V VPWR 20 V, 3.0 V VDD 5.5 V, - 40 C TA 125 C, GND = 0 V, unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
SPI INTERFACE CHARACTERISTICS(38)
f SPI
Maximum Frequency of SPI Operation
–
–
8.0
MHz
t WRSTB
Required Low State Duration for RSTB
10
–
–
s
(39)
t CSB
Rising Edge of CSB to Falling Edge of CSB (Required Setup Time)
–
–
1.0
s
(40)
t ENBL
Rising Edge of RSTB to Falling Edge of CSB (Required Setup Time)
–
–
5.0
s
(40)
t LEAD
Falling Edge of CSB to Rising Edge of SCLK (Required Setup Time)
–
–
500
ns
(40)
t WSCLKh
Required High State Duration of SCLK (Required Setup Time)
–
–
50
ns
(40)
t WSCLKl
Required Low State Duration of SCLK (Required Setup Time)
–
–
50
ns
(40)
Falling Edge of SCLK to Rising Edge of CSB (Required Setup Time)
–
–
60
ns
(40)
t SI (SU)
SI to Falling Edge of SCLK (Required Setup Time)
–
–
37
ns
(41)
t SI (HOLD)
Falling Edge of SCLK to SI (Required Setup Time)
–
–
49
ns
(41)
SO Rise Time
• CL = 80 pF
–
–
13
SO Fall Time
• CL = 80 pF
–
–
13
t RSI
SI, CSB, SCLK, Incoming Signal Rise Time
–
–
13
ns
(41)
t FSI
SI, CSB, SCLK, Incoming Signal Fall Time
–
–
13
ns
(41)
t SO(EN)
Time from Falling Edge of CSB to SO Low-impedance
–
–
60
ns
(42)
t SO(DIS)
Time from Rising Edge of CSB to SO High-impedance
–
–
60
ns
(43)
t LAG
t RSO
t FSO
Notes
38.
39.
40.
41.
42.
43.
ns
ns
Parameters guaranteed by design.
RSTB low duration measured with outputs enabled and going to OFF or disabled condition.
Maximum setup time required for the 10XSC425 is the minimum guaranteed time needed from the microcontroller.
Rise and Fall time of incoming SI, CSB, and SCLK signals suggested for design consideration to prevent the occurrence of double
pulsing.
Time required for output status data to be available for use at SO. 1.0 kon pull-up on CSB.
Time required for output status data to be terminated at SO. 1.0 kon pull-up on CSB.
10XSC425
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
4.4
Timing Diagrams
IN[0:3]
High logic level
Low logic level
Time
or
CSB
High logic level
Low logic level
Time
VHS[0:3]
VPWR
RPWM
50%VPWR
Time
t DLY(ON)
VHS[0:3]
70% VPWR
t DLY(OFF)
SR F
SR R
30% VPWR
Time
Figure 4. Output Slew Rate and Time Delays
IOCH1
IOCH2
Load
Current
IOC1
IOC2
IOC3
IOC4
IOCLO4
IOCLO3
IOCLO2
IOCLO1
Time
t OC1
t OC2
t OC3
t OC4
t OC5
t OC6
t OC7
Figure 5. Overcurrent Shutdown Protection
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
IOCH1
IOCH2
IOC1
IOC2
IOC3
IOC4
IOCLO4
IOCLO3
IOCLO2
IOCLO1
t BC3
tB C1
t BC2
t BC4
tB C5
Previous OFF duration
(toff)
tB C6
Figure 6. Bulb Cooling Management
VIH
VIH
RSTB
RSTB
10%
0.2
VDDVDD
tWRSTB
TwRSTB
tENBL
VIL
VIL
tTCSB
CSB
TENBL
VIH
VIH
90%
VDD
0.7VDD
CSB
CSB
10%
VDD
0.7VDD
t WSCLKH
TwSCLKh
tTlead
LEAD
VIL
VIL
t RSI
TrSI
t LAG Tlag
90%
VDD
0.7VDD
SCLK
SCLK
VIH
VIH
10% VDD
0.2VDD
t TSIsu
SI(SU)
VIL
VIL
t WSCLKl
TwSCLKl
t SI(HOLD)
TSI(hold)
SI
SI
Don’t Care
90%
VDD
0.7 VDD
0.2VDD
10%
VDD
Valid
tTfSI
FSI
Don’t Care
Valid
Don’t Care
VIH
VIH
VIL
VIH
Figure 7. Input Timing Switching Characteristics
10XSC425
26
Analog Integrated Circuit Device Data
Freescale Semiconductor
tFSI
tRSI
TrSI
TfSI
VOH
VOH
90%
VDD
3.5V
50%
SCLK
SCLK
1.0V VDD
10%
VOL
VOL
t SO(EN)
TdlyLH
SO
SO
90%
VDD
0.7 VDD
0.210%
VDDVDD
VOH
VOH
VOL
VOL
Low-to-High
Low
to High
TrSO
t RSO
VALID
tTVALID
SO
TfSO
t FSO
SO
VOH
VOH
VDD
VDD
High to Low 0.790%
High-to-Low
0.2VDD
10% VDD
TdlyHL
VOL
VOL
t SO(DIS)
Figure 8. SCLK Waveform and Valid SO Data Delay Time
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
27
5
Functional Description
5.1
Introduction
The 10XSC425 is one in a family of devices designed for low-voltage lighting applications. Its four low RDS(ON) MOSFETs (dual
10 m, dual 25 m) can control four separate 55 W / 28 W bulbs and/or Xenon modules.
Programming, control, and diagnostics are accomplished using a 16-bit SPI interface. Its output with selectable slew rate
improves electromagnetic compatibility (EMC) behavior. Additionally, each output has its own parallel input or SPI control for
pulse-width modulation (PWM) control if desired. The 10XSC425 allows the user to program via the SPI the fault current trip
levels and duration of acceptable lamp inrush. The device has Fail-safe mode to provide Fail-safe functionality of the outputs in
case of MCU damaged.
5.2
Functional Pin Description
5.2.1
Output Current Monitoring (CSNS)
The current sense pin provides a current proportional to the designated HS0 : HS3 output or a voltage proportional to the
temperature on the GND flag. That current is fed into a ground-referenced resistor (3.3 k, typical) and its voltage is monitored
by an MCU's A/D. The output type is selected via the SPI. This pin can be tri-stated through the SPI.
5.2.2
Direct Inputs (IN0, IN1, IN2, IN3)
Each IN input wakes the device. The IN0 : IN3 high side input pins are also used to directly control HS0 : HS3 high side output
pins. If the outputs are controlled by the PWM module, the external PWM clock is applied to the IN0 pin. These pins are to be
driven with CMOS levels, and they have a passive internal pull-down, RDWN.
5.2.3
Fault Status (FSB)
This pin is an open drain configured output requiring an external pull-up resistor to VDD for fault reporting. If a device fault
condition is detected, this pin is active LOW. Specific device diagnostics and faults are reported via the SPI SO pin.
5.2.4
WAKE
The wake input wakes the device. An internal clamp protects this pin from high damaging voltages with a series resistor (10 k
typ). This input has a passive internal pull-down, RDWN.
5.2.5
Reset (RSTB)
The reset input wakes the device. This is used to initialize the device configuration and fault registers, as well as drive the device
into a low-current Sleep mode. The pin also starts the watchdog timer when transitioning from logic [0] to logic [1]. This pin has
a passive internal pull-down, RDWN.
5.2.6
Chip Select (CSB)
The CSB pin enables communication with the master microcontroller (MCU). When this pin is in a logic [0] state, the device is
capable of transferring information to, and receiving information from, the MCU. The 10XSC425 latches in data from the Input
Shift registers to the addressed registers on the rising edge of CSB. The device transfers status information from the power output
to the Shift register on the falling edge of CSB. The SO output driver is enabled when CSB is a logic [0]. CSB should transition
from a logic [1] to a logic [0] state only when SCLK is a logic [0]. CSB has an active internal pull-up from VDD, IUP.
10XSC425
28
Analog Integrated Circuit Device Data
Freescale Semiconductor
5.2.7
Serial Clock (SCLK)
The SCLK pin clocks the internal shift registers of the 10XSC425 device. The serial input (SI) pin accepts data into the input shift
register on the falling edge of the SCLK signal, while the serial output (SO) pin shifts data information out of the SO line driver
on the rising edge of the SCLK signal. It is important the SCLK pin be in a logic low state whenever CSB makes any transition.
For this reason, it is recommended the SCLK pin be in a logic [0] whenever the device is not accessed (CSB logic [1] state). SCLK
has an active internal pull-down. When CSB is logic [1], signals at the SCLK and SI pins are ignored and SO is tri-stated (highimpedance) (see Figure 10, page 31). SCLK input has an active internal pull-down, IDWN.
5.2.8
Serial Input (SI)
This is a serial interface (SI) command data input pin. Each SI bit is read on the falling edge of SCLK. A 16-bit stream of serial
data is required on the SI pin, starting with D15 (MSB) to D0 (LSB). The internal registers of the 10XSC425 are configured and
controlled using a 5-bit addressing scheme described in Table 10. Register addressing and configuration are described in
Table 11. SI input has an active internal pull-down, IDWN.
5.2.9
Digital Drain Voltage (VDD)
This pin is an external voltage input pin used to supply power to the SPI circuit. In the event VDD is lost (VDD Failure), the device
goes to Fail-safe mode.
5.2.10 Ground (GND)
These pins are the ground for the device.
5.2.11 Positive Power Supply (VPWR)
This pin connects to the positive power supply and is the source of operational power for the device. The VPWR contact is the
backside surface mount tab of the package.
5.2.12 Serial Output (SO)
The SO data pin is a tri-stateable output from the shift register. The SO pin remains in a high-impedance state until the CSB pin
is put into a logic [0] state. The SO data is capable of reporting the status of the output, the device configuration, the state of the
key inputs, etc. The SO pin changes state on the rising edge of SCLK and reads out on the falling edge of SCLK. SO reporting
descriptions are provided in Table 23.
5.2.13 High Side Outputs (HS3, HS1, HS0, HS2)
Protected 10 m and 25 m high side power outputs to the load.
5.2.14 Fail-safe Input (FSI)
This pin incorporates an active internal pull-up current source from internal supply (VREG). This enables the watchdog timeout
feature. When the FSI pin is opened, the Watchdog circuit is enabled. After a Watchdog timeout occurs, the output states
depends on IN[0:3]. When the FSI pin is connected to GND, the Watchdog circuit is disabled. The output states depends on
IN[0:3] in case of a VDD Failure condition. In case a VDD failure detection is activated (VDD_FAIL_en bit sets to logic [1]).
10XSC425
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Freescale Semiconductor
29
5.3
Functional Internal Block Description
10XSC425 - Functional Block Diagram
Power Supply
MCU Interface & Output Control
Self-Protected
High Side
Switches
HS0-HS3
SPI Interface
Parallel Control Inputs
MCU
Interface
PWM Controller
Supply
MCU Interface & Output Control
Self-Protected High Side Switches
Figure 9. Functional Block Diagram
5.3.1
Power Supply
The 10XSC425 is designed to operate from 4.0 to 28 V on the VPWR pin. Characteristics are provided from 6.0 to 20 V for the
device. The VPWR pin supplies power to internal regulator, analog, and logic circuit blocks. The VDD supply is used for Serial
Peripheral Interface (SPI) communication in order to configure and diagnose the device. This IC architecture provides a low
quiescent current Sleep mode. Applying VPWR and VDD to the device will place the device in the Normal mode. The device will
transit to Fail-safe mode during failures on the SPI or/and on VDD voltage.
5.3.2
High Side Switches (HS0–HS3)
These pins are the high side outputs controlling lamps located for the front of vehicle, such as 65 W/55 W bulbs and Xenon-HID
modules. Those N-channel MOSFETs with 10 m and 25 m RDS(ON) are self-protected and present extended diagnostics in
order to detect bulb outage and short-circuit fault condition. The HS output is actively clamped during turn off of inductive loads
and inductive battery line. When driving DC motor or Solenoid loads demanding multiple switching, an external recirculation
device must be used to maintain the device in its Safe Operating Area.
5.3.3
MCU Interface and Output Control
In Normal mode, each bulb is controlled directly from the MCU through the SPI. A pulse-width modulation control module allows
improvement of lamp lifetime with bulb power regulation (PWM frequency range of 100 to 400 Hz) and addressing the dimming
application (day running light). An analog feedback output provides a current proportional to the load current or the temperature
of the board. The SPI is used to configure and to read the diagnostic status (faults) of high side outputs. The reported fault
conditions are: OpenLoad, short-circuit to battery, short-circuit to ground (overcurrent and severe short-circuit), thermal
shutdown, and under/overvoltage. Owing to accurate and configurable overcurrent detection circuitry and wire-harness
optimization, the vehicle is lighter.
In Fail-safe mode, each lamp is controlled with dedicated parallel input pins. The device is configured in Default mode.
10XSC425
30
Analog Integrated Circuit Device Data
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6
Functional Device Operation
6.1
SPI Protocol Description
The SPI interface has a full duplex, three-wire synchronous data transfer with four I/O lines associated with it: Serial Input (SI),
Serial Output (SO), Serial Clock (SCLK), and Chip Select (CSB).
The SI / SO pins of the 10XSC425 follow a first-in first-out (D15 to D0) protocol, with both input and output words transferring the
most significant bit (MSB) first. All inputs are compatible with 5.0 or 3.3 V CMOS logic levels.
CSB
CSB
CS
SCLK
SI
SO
D15
D14
D13
D12
D11
D10
D9
OD15 OD14 OD13 OD12 OD11 OD10 OD9
D8
OD8
D7
D6
OD7
D5
OD6
OD5
D4
OD4
D3
OD3
D2
OD2
D1
D0
OD1 OD0
Notes 1. RSTB is a logic [1] state during the above operation.
D15:D0
to the
most
ordered entry of data into the device.
NOTES: 1. 2.RSTB
is in arelate
logic H state
during
therecent
above operation.
OD15:OD0
relate
thetofirst
16 bits
ofordered
ordered
fault
and status
data
out
of the device.
device.
2. 3.DO,
D1, D2, ... , and
D15to
relate
the most
recent
entry
of program
data into
the LUX
IC
device.
3. OD0, OD1, OD2, ..., and OD15 relate to the first 16 bits of ordered fault and status data out of the LUX
IC
Figure 10. Single 16-Bit Word SPI Communication
6.2
Operational Modes
The 10XSC425 has four operating modes: Sleep, Normal, Fail-Safe and Fault. Table 6 and Figure 12 summarize details
contained in succeeding paragraphs.
The Figure 11 describes an internal signal called IN_ON[x] depending on IN[x] input.
IN[x]
tIN
IN_ON[x]
Figure 11. IN_ON[x] Internal Signal
The 10XSC425 transits to operating modes according to the following signals:
• wake-up = RSTB or WAKE or IN_ON[0] or IN_ON[1] or IN_ON[2] or IN_ON[3],
• fail = (VDD Failure and VDD_FAIL_en) or (Watchdog timeout and FSI input not shorted to ground),
• fault = OC[0:3] or OT[0:3] or SC[0:3] or UV or (OV and OV_dis).
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
31
Table 6. 10XSC425 Operating Modes
Mode
Wake-up Fail
Fault
Comments
Sleep
0
x
x
Device is in Sleep mode. All outputs are OFF.
Normal
1
0
0
Device is currently in Normal mode. Watchdog is active if enabled.
Fail-safe
1
1
0
Device is currently in Fail-safe mode due to Watchdog timeout or
VDD Failure conditions. The output states are defined with the RFS
resistor connected to FSI.
Fault
1
X
1
Device is currently in fault mode. The faulted output(s) is (are)
OFF. The safe autoretry circuitry is active to turn-on again the
output(s).
x = Don’t care.
(wake-up = 1) and
(fail = 1) and
(fault = 0)
(wake-up = 1)
and (fault = 1)
(wake-up = 0)
(fail = 1) and
(wake-up 0 = 1)
and (fault = 1)
Fail-safe
(fail = 0) and (wake-up = 1) and (fault = 0)
Sleep
(wake-up = 0)
Fault
(fail = 1) and
(wake-up = 1)
and (fault = 0)
(wake-up = 0)
(fail = 0) and
(wake-up = 1)
and (fault = 1)
Normal
(fail = 0) and
(wake-up = 1)
and (fault = 0)
(fail = 0) and (wake-up = 1) and (fault = 0)
(fail = 1) and (wake-up = 1) and (fault = 0)
Figure 12. Operating Modes
6.2.1
Sleep Mode
The 10XSC425 is in Sleep mode when:
• VPWR and VDD are within the normal voltage range,
• wake-up = 0,
• fail = X,
• fault = X.
This is the Default mode of the device after first applying battery voltage (VPWR) prior to any I/O transitions. This is also the state
of the device when the WAKE and RSTB and IN_ON[0:3] are logic [0]. In the Sleep mode, the output and all unused internal
circuitry, such as the internal regulator, are off to minimize draw current. In addition, all SPI-configurable features of the device
are as if set to logic [0].
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32
Analog Integrated Circuit Device Data
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6.2.2
Normal Mode
The 10XSC425 is in Normal mode when:
• VPWR and VDD are within the normal voltage range,
• wake-up = 1,
• fail = 0,
• fault = 0.
In this mode, the NM bit is set to lfault_contrologic [1] and the outputs HS[0:3] are under control, as defined by hson signal:
hson[x] = ( ( (IN[x] and DIR_dis[x]) or On bit[x] ) and PWM_en ) or (On bit [x] and Duty_cycle[x] and PWM_en).
In this mode and also in Fail-safe, the fault condition reset depends on fault_control signal, as defined by the following:
fault_control[x] = ( (IN_ON[x] and DIR_dis[x]) and PWM_en ) or (On bit [x]).
6.2.2.1
Programmable PWM Module
The outputs HS[0:3] are controlled by the programmable PWM module if PWM_en and the On bits are set to logic [1].
The clock frequency from IN0 input pin or from internal clock is the factor 27 (128) of the output PWM frequency (CLOCK_sel
bit). The outputs HS[0:3] can be controlled in the range of 5.0 to 98% with a resolution of seven bits of duty cycle (Table 7). The
state of other IN pin is ignored.
Table 7. Output PWM Resolution
On bit
Duty cycle
Output state
0
X
OFF
1
0000000
PWM (1/128 duty cycle)
1
0000001
PWM (2/128 duty cycle)
1
0000010
PWM (3/128 duty cycle)
1
n
PWM ((n+1)/128 duty cycle)
1
1111111
fully ON
The timing includes seven programmable PWM switching delay (number of PWM clock rising edges) to improve overall EMC
behavior of the light module (Table 8).
Table 8. Output PWM Switching Delay
Delay bits
Output delay
000
no delay
001
16 PWM clock periods
010
32 PWM clock periods
011
48 PWM clock periods
100
64 PWM clock periods
101
80 PWM clock periods
110
96 PWM clock periods
111
112 PWM clock periods
The clock frequency from IN0 is permanently monitored in order to report a clock failure in case the frequency is out of the
specified frequency range (from fIN0(LOW) to fIN0(HIGH)). In case of a clock failure, no PWM feature is provided, the On bit defines
the outputs state and the CLOCK_fail bit reports [1].
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
33
6.2.2.2
Calibratable Internal Clock
The internal clock can vary as much as 30%, corresponding to a typical fPWM(0) output switching period.
Using the existing SPI inputs and the precision timing reference already available to the MCU, the 10XSC425 allows clock period
setting within 10% accuracy. Calibrating the internal clock is initiated by defined word to CALR register. The calibration pulse is
provided by the MCU. The pulse is sent on the CSB pin after the SPI word is launched. At the moment, the CSB pin transitions
from a logic [1] to [0], until from a logic [0] to [1], determine the period of the internal clock with a multiplicative factor of 128.
CSB
SI
CALR
SI command
ignored
Internal
clock duration
In case a negative CSB pulse is outside a predefined time range (from t CSB(MIN) to t CSB(MAX)), the calibration event will be ignored
and the internal clock will be unaltered, or reset to the default value (fPWM(0)), if this was not calibrated before.
The calibratable clock is used instead of the clock from the IN0 input, when CLOCK_sel is set to [1].
6.2.3
Fail-safe Mode
The 10XSC425 is in Fail-safe mode when:
• VPWR is within the normal voltage range,
• wake-up = 1,
• fail = 1,
• fault = 0.
6.2.4
Watchdog
If the FSI input is not grounded, the watchdog timeout detection is active when either the WAKE, or IN_ON[0:3], or RSTB input
pin transitions from logic [0] to logic [1]. The WAKE input is capable of being pulled up to VPWR with a series of limiting resistance
limiting the internal clamp current according to the specification.
The Watchdog timeout is a multiple of an internal oscillator. As long as the WD bit (D15) of an incoming SPI message is toggled
within the minimum watchdog timeout period (WDTO), the device will operate normally.
6.2.4.1
Fail-Safe Conditions
If an internal watchdog timeout occurs before the WD bit for FSI open (Table 9) or in case of a VDD failure condition (VDD<
VDD(FAIL)) for VDD_FAIL_en bit is set to logic [1], the device will revert to a Fail-safe mode until the WD bit is written to a logic [1]
(see fail-safe to normal mode transition paragraph) and VDD is within the normal voltage range.
Table 9. SPI Watchdog Activation
Typical RFSI ()
Watchdog
0 (shorted to ground)
Disabled
(open)
Enable
During the Fail-safe mode, the outputs will depend on the corresponding input. The SPI register content is reset to their default
value (except POR bit) and fault protections are fully operational. The Fail-safe mode can be detected by monitoring the NM bit
is set to [0].
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6.2.5
6.2.5.1
Normal and Fail-safe Mode Transitions
Transition Fail-safe to Normal Mode
To leave the Fail-safe mode, VDD must be in nominal voltage and the microcontroller has to send a SPI command with the WDIN
bit set to logic [1]; the other bits are not considered. The previous latched faults are reset by the transition into Normal mode
(autoretry included).
Moreover, the device can be brought out of the Fail-safe mode due to a watchdog timeout issue, by forcing the FSI pin to logic [0].
6.2.5.2
Transition Normal to Fail-safe Mode
To leave the Normal mode, a fail-safe condition must occurred (fail=1). The previous latched faults are reset by the transition into
Fail-safe mode (autoretry included).
6.2.6
Fault Mode
The 10XSC425 is in Fault mode when:
• VPWR and VDD are within the normal voltage range,
• wake-up = 1,
• fail = X,
• fault=1.
This device indicates the faults below as they occur by driving the FSB pin to logic [0] for RSTB input is pulled up:
• Overtemperature fault,
• Overcurrent fault,
• Severe short-circuit fault,
• Output(s) shorted to VPWR fault in OFF state,
• OpenLoad fault in OFF state,
• Overvoltage fault (enabled by default),
• Undervoltage fault.
The FSB pin will automatically return to logic [1] when the fault condition is removed, except for overcurrent, severe short-circuit,
overtemperature, and undervoltage which will be reset by a new turn-on command (each fault_control signal to be toggled).
Fault information is retained in the SPI fault register and is available (and reset) via the SO pin during the first valid SPI
communication.
The OpenLoad fault in ON state is only reported through SPI register without effect on the corresponding output state (HS[x])
and the FSB pin.
6.2.7
Start-up Sequence
The 10XSC425 enters in Normal mode after start-up if following sequence is provided:
• VPWR and VDD power supplies must be above their undervoltage thresholds,
• generate wake-up event (wake-up = 1) from 0 to 1 on RSTB. The device switches to Normal mode with the SPI register
content reset (as defined in Table 11 and Table 23). All features of the 10XSC425 will be available after 50 s (typical), and
all SPI registers are set to default values (set to logic [0]).
• toggle WD bit from 0 to 1.
And, in case of the PWM module is used (PWM_en bit is set to logic [1]) with an external reference clock:
• apply the PWM clock on the IN0 input pin after a maximum of 200 s (min. 50 s).
If the correct start-up sequence is not provided, the PWM function is not guaranteed.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
6.3
Protection and Diagnostic Features
6.3.1
Protections
6.3.1.1
Overtemperature Fault
The 10XSC425 incorporates overtemperature detection and shutdown circuitry for each output structure.
Two cases need to be considered when the output temperature is higher than TSD:
• If the output command is ON: the corresponding output is latched OFF. FSB will be also latched to logic [0]. To delatch the
fault and be able to turn the outputs ON again, the failure condition must disappear and the autoretry circuitry must be
active, or the corresponding output must be commanded OFF and then ON (toggling fault_control signal of corresponding
output), or VSUPPLY(POR) condition, if VDD = 0.
• If the output command is OFF: FSB will go to logic [0] till the corresponding output temperature will be below TSD.
For both cases, the fault register OT[0:3] bit into the status register will be set to [1]. The fault bits will be cleared in the status
register after a SPI read command.
6.3.1.2
Overcurrent Fault
The 10XSC425 incorporates output shutdown, to protect each output structure against a resistive short-circuit condition. This
protection is composed by eight predefined current levels (time dependent) to fit Xenon-HID manners by default or, 55 W or
28 W bulb profiles, selectable separately by Xenon bit and 28 W bits (as illustrated Figure 14).
At the first turn-on, the lamp filament is cold and the current will be huge. The fault_control signal transition from logic [0] to [1],
or an autoretry define this event. In this case, the overcurrent protection will be fitted to inrush current, as shown in Figure 5. This
overcurrent protection is programmable: OC[1:0] bits select the overcurrent slope speed and the OCHI1 current step can be
removed in case the OCHI bit is set to [1].
Over-current thresholds
fault_control
hson
signal
hson
PWM
In steady state, the wire harness will be protected by a OCLO2 current level by default. Three other DC overcurrent levels are
available: OCLO1, or OCLO3, or OCLO4, based on the state of the OCLO[1,0] bits.
If the load current level ever reaches the overcurrent detection level, the corresponding output will latch the output OFF and FSB
will be also latched to logic [0]. To delatch the fault and be able to turn the corresponding output ON again, the failure condition
must disappear and the autoretry circuitry must be active, or the corresponding output must be commanded OFF and then ON
(toggling fault_control signal of corresponding output), or VSUPPLY(POR) condition, if VDD = 0.
The SPI fault report (OC[0:3] bits) is removed after a read operation.
In Normal mode using the internal PWM module, the 10XSC425 also incorporates a cooling bulb filament management, if
OC_mode and Xenon are set to logic [1]. In this case, the first step of multi-step overcurrent protection will depend on the previous
OFF duration, as illustrated in Figure 6. The following figure illustrates the current level that will be used in the function to the
duration of the previous OFF state (tOFF). The slope of the cooling bulb emulator is configurable with OCOFFCB[1:0] bits.
10XSC425
36
Analog Integrated Circuit Device Data
Freescale Semiconductor
Depending
dependingon
to toff
toff
Over-current thresholds
Cooling
toff
hson
signal
fault_control
PWM
hson
6.3.1.3
Severe Short-circuit Fault
The 10XSC425 provides output shutdown to protect each output, in case of a severe short-circuit during the output switching.
If the short-circuit impedance is below RSHORT, the device will latch the output OFF, FSB will go to a logic [0] and the fault register
SC[0:3] bit will be set to [1]. To delatch the fault and be able to turn the outputs ON again, the failure condition must disappear,
and the corresponding output must be commanded OFF and then ON (toggling fault_control signal of corresponding output), or
VSUPPLY(POR) condition if VDD = 0.
The SPI fault report (SC[0:3] bits) is removed after a read operation.
6.3.1.4
Overvoltage Fault (Enabled by default)
By default, the overvoltage protection is enabled. The 10XSC425 shuts down all outputs and FSB will go to a logic [0] during an
overvoltage fault condition on the VPWR pin (VPWR > VPWR(OV)). The outputs remain in the OFF state until the overvoltage
condition is removed (VPWR < VPWR(OV) - VPWR(OVHYS)). When experiencing this fault, the OVF fault bit is set to logic [1] and
cleared after either a valid SPI read.
The overvoltage protection can be disabled through the SPI (OV_dis bit is disabled set to logic [1]). The fault register reflects any
overvoltage condition (VPWR > VPWR(OV)). This overvoltage diagnosis, as a warning, is removed after a read operation, if the fault
condition disappears. The HS[0:3] outputs are not commanded in RDS(ON) above the OV threshold.
6.3.1.5
Undervoltage Fault
The output(s) will latch off at some battery voltage below VPWR(UV). As long as the VDD level stays within the normal specified
range, the internal logic states within the device will remain (configuration and reporting).
In the case where battery voltage drops below the undervoltage threshold (VPWR < VPWR(UV)), the outputs will turn off, FSB will
go to logic [0], and the fault register UV bit will be set to [1].
Two cases need to be considered when the battery level recovers (VPWR > VPWR(UV)_UP):
• If the output command is low, FSB will go to a logic [1], but the UV bit will remain set to 1 until the next read operation
(warning report).
• If the output command is ON, FSB will remain at logic [0]. To delatch the fault and be able to turn the outputs ON again, the
failure condition must disappear and the autoretry circuitry must be active, or the corresponding output must be commanded
OFF and then ON (toggling fault_control signal of corresponding output), or a VSUPPLY(POR) condition, if VDD = 0.
In extended mode, the output is protected by overtemperature shutdown circuitry. All previous latched faults, occurred when
VPWR is within the normal voltage range, are guaranteed if VDD is within the operational voltage range, or until VSUPPLY(POR), if
VDD = 0. Any new OT fault is detected (VDD failure included) and reported through SPI above VPWR(UV). The output state is
not changed, as long as the VPWR voltage does not drop any lower than 3.5 V (typical).
All latched faults (overtemperature, overcurrent, severe short-circuit, over and undervoltage) are reset if:
• VDD < VDD(FAIL) with VPWR in nominal voltage range,
• VDD and VPWR supplies is below the VSUPPLY(POR) voltage value.
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Analog Integrated Circuit Device Data
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37
(fault_control=0)
(OpenLoadOFF = 1
or ShortVpwr = 1
or OV = 1)
(fault_control = 1 and OV = 0)
OFF
if hson = 0
(fault_control = 0 or OV = 1)
(OpenLoadOFF = 1
or ShortVpwr = 1
or OV = 1)
(OpenLoadON = 1)
ON
(SC = 1)
if hson=1
(Retry = 1)
(fault_control = 0)
Latched
OFF
(count = 16)
(SC = 1)
(OpenloadON = 1)
(after Retry Period and OV = 0)
Autoretry
(OV = 1)
OFF
Autoretry
ON
if hson=1
(OpenLoadOFF = 1
or ShortVpwr = 1
or OV = 1)
(Retry = 1)
=> count = count+1
(fault_control=0)
Figure 13. Auto-retry State Machine
6.3.2
Auto-retry
The auto-retry circuitry is used to reactivate the output(s) automatically, in case of an overcurrent, overtemperature, or
undervoltage failure conditions to provide a high availability of the load.
Auto-retry feature is available in Fault mode. It is activated in case of an internal retry signal is set to a logic [1]:
retry[x] = OC[x] or OT[x] or UV.
The feature retries to switch-on the output(s) after one auto-retry period (tAUTO) with a limitation in term of the number of
occurrences (16 for each output). The counter of retry occurrences is reset in case of Fail-safe to Normal or Normal to Fail-safe
mode transitions. At each auto-retry, the overcurrent detection will be set to default values in order to sustain the inrush current.
Figure 13 describes the auto-retry state machine.
6.3.3
6.3.3.1
Diagnostic
Output Shorted to VPWR Fault
The 10XSC425 incorporates output shorted to VPWR detection circuitry in the OFF state. An output shorted to VPWR fault is
detected if the output voltage is higher than VOSD(THRES) and reported as a fault condition when the output is disabled (OFF). The
output shorted to VPWR fault is latched into the status register after the internal gate voltage is pulled low enough to turn OFF
the output. The OS[0:3] and OL_OFF[0:3] fault bits are set in the status register and the FSB pin reports the fault in real time. If
the output shorted to VPWR fault is removed, the status register will be cleared after reading the register.
The open output shorted to VPWR protection can be disabled through the SPI (OS_DIS[0:3] bit).
6.3.3.2
OpenLoad Faults
The 10XSC425 incorporates three dedicated OpenLoad detection circuitries on the output to detect in OFF and in ON states.
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38
Analog Integrated Circuit Device Data
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6.3.3.3
OpenLoad Detection In Off State
The OFF output OpenLoad fault is detected when the output voltage is higher than VOLD(THRES) pulled up with internal current
source (IOLD(OFF)), and reported as a fault condition when the output is disabled (OFF). The OFF Output OpenLoad fault is latched
into the status register, or when the internal gate voltage is pulled low enough to turn the output OFF. The OL_OFF[0:3] fault bit
is set in the status register. If the OpenLoad fault is removed (FSB output pin goes to high), the status register will be cleared
after reading the register.
The OFF output OpenLoad protection can be disabled through the SPI (OLOFF_DIS[0:3] bit).
6.3.3.4
OpenLoad Detection In On State
The ON output OpenLoad current thresholds can be chosen by the SPI to detect a standard bulb or LED (OLLED[0:3] bit set to
logic [1]). In the case where the load current drops below the defined current threshold, the OLON bit is set to logic [1], the output
stays ON, and FSB is not disturbed.
6.3.3.5
OpenLoad Detection In On State For Led
OpenLoad for LEDs only (OLLED[0:3] set to logic [1]) is detected periodically at each t OLLED (fully-on, D[6:0]=7F). To detect
OLLED in a fully on state, the output must be ON at least t OLLED.
To delatch the diagnosis, the condition should be removed and a SPI read operation is needed (OL_ON[0:3] bit). The ON output
OpenLoad protection can be disabled through the SPI (OLON_DIS[0:3] bit).
6.3.4
Analog Current Recopy and Temperature Feedbacks
The CSNS pin is an analog output reporting a current proportional to the designed output current, or a voltage proportional to the
temperature of the GND flag (pin #14). The routing is SPI programmable (TEMP_en, CSNS_en, CSNS_s[1,0] and CSNS_ratio_s
bits).
In case the current recopy is active, the CSNS output delivers current only during the ON time of the output switch without
overshoot. The maximum current is 2.0 mA (typical). The typical value of the external CSNS resistor connected to ground is
2.5 k.
The current recopy is not active in Fail-safe mode.
6.3.4.1
Temperature Prewarning Detection
In Normal mode, the 10XSC425 provides a temperature prewarning reported via the SPI, in case the temperature of the GND
flag is higher than TOTWAR. This diagnosis (OTW bit set to [1]) is latched in the SPI DIAGR0 register. To delatch, a SPI read
command is needed.
6.3.5
Active Clamp ON VPWR
The device provides an active gate clamp circuit, to limit the maximum transient VPWR voltage at VPWR(CLAMP). In case of
an overload on an output the corresponding output is turned off, which leads to high voltage at VPWR with an inductive VPWR
line. When VPWR voltage exceeds the VPWR(CLAMP) threshold, the turn-off on the corresponding output is deactivated and all
HS[0:3] outputs are switched ON automatically, to demagnetize the inductive Battery line.
For long battery line (> 10 meters, corresponding to 10 µH of parasitic inductance) between the battery and the device, the smart
high side switch output may be damaged, in cases of short-circuit due to unexpected behavior of internal active gate clamp
circuitry. It is essential not to exceed the maximum rating on the VPWR pin (41 V).
6.3.6
Reverse Battery ON VPWR
The output survives the application of reverse voltage as low as -18 V. Under these conditions, the ON resistance of the output
is two times higher than the typical ohmic value in forward mode. No additional passive components are required except on the
VDD current path.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
39
6.3.7
Ground Disconnect Protection
In the event the 10XSC425 ground is disconnected from load ground, the device protects itself and safely turns OFF the output,
regardless of the state of the output at the time of disconnection (maximum VPWR = 16 V). A 10 k resistor needs to be added
between the MCU and each digital input pin, to ensure that the device turns off during ground disconnects and to prevent this pin
from exceeding maximum ratings.
6.3.8
6.3.8.1
Loss of Supply Lines
Loss of VDD
If the external VDD supply is disconnected (or not within specification: VDD < VDD(FAIL) with the VDD_FAIL_en bit set to a logic
[1]), all SPI register content is reset.
The outputs can still be driven by the direct inputs IN[0 : 3] if VPWR is within specified voltage range. The 10XSC425 uses the
battery input to power the output MOSFET-related current sense circuitry, and any other internal logic providing Fail-safe device
operation with no VDD supplied. In this state, the overtemperature, overcurrent, severe short-circuit, short to VPWR and OFF
OpenLoad circuitry, are fully operational with default values corresponding to all SPI bits. These are set to logic [0].
An unexpected Power-On Reset (VSUPPLY(POR)) may occur at 4.8 V of VPWR. The extended battery voltage range specified from
4.0 to 28 V is reduced from 5.0 to 28 V. If the battery voltage drops below 5.0 V, the outputs will be turned off by the POR instead
of undervoltage (UV). In this case, the outputs will turn on again once the battery voltage recovers to a nominal voltage. The
counter of auto-retry will be also reset. So, it is recommended to command “off” the outputs when the battery voltage is below
5.0 V.
No current is conducted from VPWR to VDD.
6.3.8.2
Loss of VPWR
If the external VPWR supply is disconnected (or not within specification), the SPI configuration, reporting, and daisy chain features
are provided for RSTB to set to a logic [1] under VDD in nominal conditions. This fault condition can be diagnosed with a UV fault
in SPI STATR_s registers. The SPI pull-up and pull-down current sources are not operational. The previous device configuration
is maintained. No current is conducted from VDD to VPWR.
6.3.8.3
Loss of VPWR and VDD
If the external VPWR and VDD supplies are disconnected (or not within specification: (VDD and VPWR) < VSUPPLY(POR)), all SPI
register contents are reset with default values corresponding to all SPI bits set to logic [0] and all latched faults are reset.
6.3.9
EMC PERFORMANCES
All following tests are performed on a Freescale evaluation board, in accordance with the typical application schematic.
The device is protected, in case of positive and negative transients on the VPWR line (per ISO 7637-2).
The 10XSC425 successfully meets the Class 5 of the CISPR25 emission standard and 200 V/m or BCI 200 mA injection level
for immunity tests.
6.4
LOGIC COMMANDS AND REGISTERS
6.4.1
Serial Input Communication
SPI communication is accomplished using 16-bit messages. A message is transmitted by the MCU starting with the MSB D15
and ending with the LSB, D0 (Table 10). Each incoming command message on the SI pin can be interpreted using the following
bit assignments: the MSB, D15, is the watchdog bit (WDIN). In some cases, output selection is done with bits D14 : D13. The next
three bits, D12: D10, are used to select the command register. The remaining nine bits, D8 : D0, are used to configure and control
the outputs and their protection features.
10XSC425
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Analog Integrated Circuit Device Data
Freescale Semiconductor
Multiple messages can be transmitted in succession to accommodate those applications where daisy chaining is desirable, or to
confirm transmitted data, as long as the messages are all multiples of 16 bits. Any attempt made to latch in a message that is
not 16 bits will be ignored.
The 10XSC425 has defined registers, which are used to configure the device and to control the state of the outputs. Table 11
summarizes the SI registers.
Table 10. SI Message Bit Assignment
Bit Sig
SI Msg Bit
MSB
D15
Message Bit Description
Watchdog in: toggled to satisfy watchdog requirements.
D14 : D13
Register address bits used in some cases for output selection (Table 11).
D12 : D10
Register address bits.
Not used (set to logic [0]).
D9
LSB
Used to configure the inputs, outputs, and the device protection features and SO status content.
D8:D0
Table 11. Serial Input Address and Configuration Bit Map
SI Data
SI
Register D15 D1 D1 D1 D1 D1 D9
4 3 2 1 0
STATR_s WDI X
N
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
SOA4
SOA3
SOA2
SOA1
SOA0
ON_s
PWM6_s
PWM3_s
PWM2_s
PWM1_s
PWM0_s
0
X
0
0
0
0
PWMR_s WDI A1 A0
N
0
0
1
0 28W_s
CONFR0 WDI A1 A0
_s
N
0
1
0
0
0
0
CONFR1 WDI A1 A0
_s
N
0
1
1
0
0
0
WDI A1 A0
N
1
0
0
0
Xenon BC1_s
_s
GCR
WDI 0
N
0
1
0
1
0
VDD_ PWM_e CLOCK_s TEMP_en CSNS_e
FAIL_
n
el
n
en
CALR
WDI 0
N
0
1
1
1
0
1
0
1
0
0
X
X
X
0
0
0
0
0
OCR_s
Register
state after
RSTB = 0
or
VDD(FAIL)
or
VSUPPLY(
0
0
PWM5_s PWM4_s
DIR_dis_
s
SR1_s
SR0_s
DELAY2_s DELAY1_ DELAY0_
s
s
Retry_dis OS_dis_s OLON_dis OLOFF_di OLLED_e CSNS_rati
Retry_
_s
_s
s_s
n_s
o_s
unlimited_
s
BC0_s
OC1_s
OC0_s
OCHI_s
OLCO1_s
OLCO0_ OC_mode
s
_s
CSNS1
CSNS0
X
OV_dis
1
1
0
1
1
0
0
0
0
0
POR)
condition
x = Don’t care.
s = Output selection with the bits A1A0 as defined in Table 12.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
41
6.4.2
Device Register Addressing
The following section describes the possible register addresses (D[14:10]) and their impact on device operation.
6.4.2.1
Address XX000 — Status Register (STATR_s)
The STATR register is used to read the device status and the various configuration register contents without disrupting the device
operation or the register contents. The register bits D[4:0] determine the content of the first sixteen bits of SO data. In addition to
the device status, this feature provides the ability to read the content of the PWMR_s, CONFR0_s, CONFR1_s, OCR_s, GCR
and CALR registers (Refer to the section entitled Serial Output Communication (Device Status Return Data).
6.4.2.2
Address A1A0001— Output PWM Control Register (PWMR_s)
The PWMR_s register allows the MCU to control the state of corresponding output through the SPI. Each output “s” is
independently selected for configuration, based on the state of the D14 : D13 bits (Table 12).
Table 12. Output Selection
A1 (D14)
A0 (D13)
HS Selection
0
0
HS0 (default)
0
1
HS1
1
0
HS2
1
1
HS3
A logic [1] on bit D8 (28W_s) selects the 28 W overcurrent protection profile: the overcurrent thresholds are divided by 2 and, the
inrush and cooling responses are dedicated to 28 W lamps for HS[0,1] outputs. This bit it not taken into account for HS[2,3]
outputs.
Bit D7 sets the output state. A logic [1] enables the corresponding output switch and a logic [0] turns it OFF (if IN input is also
pulled down). Bits D6:D0 set the output PWM duty-cycle to one of 128 levels for PWM_en is set to logic [1], as shown Table 7.
6.4.2.3
Address A1A0010— Output Configuration Register (CONFR0_S)
The CONFR0_s register allows the MCU to configure corresponding output switching through the SPI. Each output “s” is
independently selected for configuration based on the state of the D14 : D13 bits (Table 12).
For the selected output, a logic [0] on bit D5 (DIR_DIS_s) will enable the output for direct control. A logic [1] on bit D5 will disable
the output from direct control (in this case, the output is only controlled by the On bit).
D4:D3 bits (SR1_s and SR0_s) are used to select the high, medium, or low speed slew rate for the selected output, the default
value [00] corresponds to the medium speed slew rate (Table 13).
Table 13. Slew Rate Speed Selection
SR1_s (D4)
SR0_s (D3)
Slew Rate Speed
0
0
medium (default)
0
1
low
1
0
high
1
1
Not used
Incoming message bits D2 : D0 reflect the desired output that will be delayed of predefined PWM clock rising edges number, as
shown Table 8 (only available for PWM_en bit is set to logic [1]).
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Analog Integrated Circuit Device Data
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6.4.2.4
Address A1A0011 — Output Configuration Register (CONFR1_s)
The CONFR1_s register allows the MCU to configure corresponding output fault management through the SPI. Each output “s”
is independently selected for configuration, based on the state of the D14 : D13 bits (Table 12).
A logic [1] on bit D6 (RETRY_unlimited_s) disables the autoretry counter for the selected output, the default value [1] corresponds
to enable auto-retry feature without time limitation.
A logic [1] on bit D5 (RETRY_dis_s) disables the auto-retry for the selected output, the default value [0] corresponds to enable
this feature.
A logic [1] on bit D4 (OS_dis_s) disables the output hard shorted to VPWR protection for the selected output, the default value [0]
corresponds to enable this feature.
A logic [1] on bit D3 (OLON_dis_s) disables the ON output OpenLoad detection for the selected output, the default value [0]
corresponds to enable this feature (Table 14).
A logic [1] on bit D2 (OLOFF_dis_s) disables the OFF output OpenLoad detection for the selected output, the default value [0]
corresponds to enable this feature.
A logic [1] on bit D1 (OLLED_en_s) enables the ON output OpenLoad detection for LEDs for the selected output, the default value
[0] corresponds to ON output OpenLoad detection is set for bulbs (Table 14).
Table 14. ON OpenLoad Selection
OLON_dis_s (D3)
OLLED_en_s
(D1)
0
0
enable with bulb
threshold (default)
0
1
enable with LED
threshold
1
X
disable
ON OpenLoad detection
A logic [1] on bit D0 (CSNS_ratio_s) selects the high ratio on the CSNS pin for the corresponding output. The default value [0] is
the low ratio (Table 15).
Table 15. Current Sense Ratio Selection
6.4.2.4.1
CSNS_high_s (D0)
Current Sense Ratio
0
CRS0 (default)
1
CRS1
Address A1A0100 — Output Overcurrent Register (OCR)
The OCR_s register allows the MCU to configure corresponding output overcurrent protection through the SPI. Each output “s”
is independently selected for configuration based on the state of the D14 : D13 bits (Table 12).
A logic [1] on bit D8 (Xenon_s) disables enables the Xenon 55 W or 28 W bulb overcurrent profile, as described Figure 14.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
43
Xenon bit set to logic [0]:
IOCH1
IOCH2
IOC1
IOC2
IOCLO4
IOCLO3
IOCLO2
IOCLO1
t OC1
t OC3 t OC4 t OC5
t OC2
t OC6
Time
t OC7
Xenon bit set to logic [1]:
IOCH1
IOCH2
IOC1
IOC2
IOC3
IOC4
IOCL4
IOCL3
IOCL2
IOCL1
t OC1 t OC3 t OC4 t OC5
t OC2
t OC6
Time
t OC7
Figure 14. Overcurrent Profile Depending on Xenon Bit
D[7:6] bits allow to MCU to programmable the bulb cooling curve and D[5:4] bits inrush curve for the selected output, as shown
Table 16 and Table 17.
Table 16. Cooling Curve Selection
BC1_s (D7)
BC0_s (D6)
Profile Curves Speed
0
0
medium (default)
0
1
slow
1
0
fast
1
1
medium
Table 17. Inrush Curve Selection
OC1_s (D5)
OC0_s (D4)
Profile Curves Speed
0
0
slow (default)
0
1
fast
1
0
medium
1
1
very slow
A logic [1] on bit D3 (OCHI_s bit) the OCHI1 level is replaced by OCHI2 during tOC1, as shown Figure 15.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
IOCH1
IOCH2
IOC1
IOC2
IOC3
IOC4
IOCL4
IOCL3
IOCL2
IOCL1
t OC1 t OC3 t OC4 t OC5
t OC2
t OC6
t OC7
Time
Figure 15. Overcurrent Profile with OCHI Bit Set to ‘1’
The wire harness is protected by one of four possible current levels in steady state, as defined in Table 18.
Table 18. Output Steady State Selection
OCLO1 (D2) OCLO0 (D1)
Steady State Current
0
0
OCLO2 (default)
0
1
OCLO3
1
0
OCLO4
1
1
OCLO1
Bit D0 (OC_mode_sel) allows to select the overcurrent mode, as described Table 19.
Table 19. Overcurrent Mode Selection
OC_mode_s (D0)
Overcurrent Mode
0
only inrush current management (default)
1
inrush current and bulb cooling management
Address 00101 — GLObal configuration regIster (GCR)
The GCR register allows the MCU to configure the device through the SPI.
Bit D8 allows the MCU to enable or disable the VDD failure detector. A logic [1] on VDD_FAIL_en bit allows switch of the outputs
HS[0:3] with PWMR register device in Fail-safe mode in case of VDD < VDD(FAIL).
Bit D7 allows the MCU to enable or disable the PWM module. A logic [1] on PWM_en bit allows control of the outputs HS[0:3]
with PWMR register (the direct input states are ignored).
Bit D6 (CLOCK_sel) allows to select the clock used as reference by PWM module, as described in the following Table 20.
Table 20. PWM Module Selection
PWM_en (D7) CLOCK_sel (D6)
PWM module
0
X
PWM module disabled (default)
1
0
PWM module enabled with external
clock from IN0
1
1
PWM module enabled with
internal calibrated clock
Bits D5:D4 allow the MCU to select one of two analog feedbacks on CSNS output pin, as shown in Table 21.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
45
Table 21. CSNS Reporting Selection
TEMP_en (D5) CSNS_en (D4)
CSNS reporting
0
0
CSNS tri-stated (default)
X
1
current recopy of selected output (D3:2] bits)
1
0
temperature on GND flag
Table 22. Output Current Recopy Selection
CSNS1 (D3)
CSNS0 (D2)
CSNS reporting
0
0
HS0 (default)
0
1
HS1
1
0
HS2
1
1
HS3
The GCR register disables the overvoltage protection (D0). When this bits is [0], the overvoltage is enabled (default value).
6.4.2.5
Address 00111 — Calibration Register (CALR)
The CALR register allows the MCU to calibrate internal clock, as explained in Figure 13.
6.4.3
Serial Output Communication (Device Status Return Data)
When the CSB pin is pulled low, the output register is loaded. Meanwhile, the data is clocked out MSB- (OD15-) first, as the new
message data is clocked into the SI pin. The first sixteen bits of data clocking out of the SO, and following a CSB transition, is
dependent upon the previously written SPI word.
Any bits clocked out of the Serial Output (SO) pin after the first 16 bits will be representative of the initial message bits clocked
into the SI pin since the CSB pin first transitioned to a logic [0]. This feature is useful for daisy chaining devices as well as message
verification.
A valid message length is determined following a CSB transition of [0] to [1]. If there is a valid message length, the data is latched
into the appropriate registers. A valid message length is a multiple of 16 bits. At this time, the SO pin is tri-stated and the fault
status register is now able to accept new fault status information.
SO data will represent information ranging from fault status to register contents, user selected by writing to the STATR bits OD4,
OD3, OD2, OD1, and OD0. The value of the previous bits SOA4 and SOA3 will determine which output the SO information
applies to for the registers, which are output specific; viz., Fault, PWMR, CONFR0, CONFR1, and OCR registers.
Note that the SO data will continue to reflect the information for each output (depending on the previous SOA4, SOA3 state) that
was selected during the most recent STATR write until changed with an updated STATR write.
The output status register correctly reflects the status of the STATR-selected register data at the time that the CSB is pulled to a
logic [0] during SPI communication, and/or for the period of time since the last valid SPI communication, with the following
exception:
• The previous SPI communication was determined to be invalid. In this case, the status will be reported as though the invalid
SPI communication never occurred.
• The VPWR voltage is below 4.0 V, the status must be ignored by the MCU.
10XSC425
46
Analog Integrated Circuit Device Data
Freescale Semiconductor
6.4.4
Serial Output Bit Assignment
The 16 bits of serial output data depend on the previous serial input message, as explained in the following paragraphs. Table 23,
summarizes SO returned data for bits OD15 : OD0.
• Bit OD15 is the MSB; it reflects the state of the Watchdog bit from the previously clocked-in message.
• Bits OD14:OD10 reflect the state of the bits SOA4 : SOA0 from the previously clocked-in message.
• Bit OD9 is set to logic [1] in Normal mode (NM).
• The contents of bits OD8 : OD0 depend on bits D4 : D0 from the most recent STATR command SOA4 : SOA0 as explained
in the paragraphs following Table 23.
Table 23. Serial Output Bit Map Description
Previous
STATR
S
O
A
4
S
O
A
2
S
O
A
1
S
O OD OD OD OD OD OD O
OD8 OD7
A 15 14 13 12 11 10 D9
0
STATR
A1 A0 0
_s
0
0
WDI SO SOA SOA SO
N
A4
3
2
A1
SO
A0
N
M
POR
PWMR
A1 A0 0
_s
0
1
WDI SO SOA SOA SO
N
A4
3
2
A1
SO
A0
N
M
28W ON_ PWM
_s
s
6_s
CONF
A1 A0 0
R0_s
1
0
WDI SO SOA SOA SO
N
A4
3
2
A1
SO
A0
N
M
X
X
CONF
A1 A0 0
R1_s
1
1
WDI SO SOA SOA SO
N
A4
3
2
A1
SO
A0
N
M
X
X
OCR_s A1 A0 1
0
0
WDI SO SOA SOA SO
N
A4
3
2
A1
SO
A0
N Xeno BC1
M n_s
_s
0
1
WDI SO SOA SOA SO
N
A4
3
2
A1
SO
A0
N _FAI M_e K_sel
M L_e
n
GCR
0
S
O
A
3
SO Returned Data
0
1
UV
OD6
OD5
OD4
OD3
OD2
OD1
OD0
OV
OLON
_s
OLOF
F_s
OS_s
OT_s
SC_s
OC_s
PWM PWM
5_s
4_s
PWM3_s
PWM2_s
DIR_d SR1_
is_s
s
SR0_s
X
PWM1_s PWM0_s
DELAY2_s DELAY1 DELAY0
_s
_s
Retry_ Retry_ OS_di OLON_dis OLOFF_dis OLLED_ CSNS_r
_s
_s
en_s
atio_s
unlimit dis_s s_s
ed_s
BC0_ OC1_ OC0_
s
s
s
OCHI_s
OCLO1_s
OCLO0_ OC_mod
s
e_s
VDD PW CLOC TEMP CSNS
_en
_en
CSNS1
CSNS0
X
OV_dis
n
DIAGR
0
0
0
1
1
1
WDI SO SOA SOA SO
N
A4
3
2
A1
SO
A0
N
M
X
X
X
X
X
X
CLOCK_fail
CAL_fail
OTW
DIAGR
1
0
1
1
1
1
WDI SO SOA SOA SO
N
A4
3
2
A1
SO
A0
N
M
X
X
X
X
IN3
IN2
IN1
IN0
WD_en
DIAGR
2
1
0
1
1
1
WDI SO SOA SOA SO
N
A4
3
2
A1
SO
A0
N
M
X
X
X
X
X
X
0
1
1
0
0
0
0
Regist
er
state
after
RST=
0 or N/ N/ N/ N/ N/
VDD(F A A A A A
AIL) or
VSUPP
0
0
0
0
0
0
0
X
0
0
0
0
LY(POR
)
conditi
on
s = Output selection with the bits A1A0 as defined in Table 12
10XSC425
Analog Integrated Circuit Device Data
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47
6.4.4.1
Previous Address SOA4 : SOA0 = A1A0000 (STATR_s)
The returned data OD8 reports logic [1] in case of previous Power ON Reset condition (VSUPPLY(POR)). This bit is only reset by
a read operation.
Bits OD7: OD0 reflect the current state of the Fault register (FLTR) corresponding to the output previously selected with the bits
SOA4:SOA3 = A1A0 (Table 23).
• OC_s: overcurrent fault detection for a selected output,
• SC_s: severe short-circuit fault detection for a selected output,
• OS_s: output shorted to VPWR fault detection for a selected output,
• OLOFF_s: OpenLoad in OFF state fault detection for a selected output,
• OLON_s: OpenLoad in ON state fault detection (depending on current level threshold: bulb or LED) for a selected output,
• OV: overvoltage fault detection,
• UV: undervoltage fault detection
• POR: power on reset detection.
The FSB pin reports all faults. For latched faults, this pin is reset by a new Switch OFF command (toggling fault_control signal).
6.4.4.2
Previous Address SOA4 : SOA0 = A1A0001 (Pwmr_s)
The returned data contains the programmed values in the PWMR register for the output selected with A1A0.
6.4.4.3
Previous Address SOA4 : SOA0 = A1A0010 (confr0_s)
The returned data contains the programmed values in the CONFR0 register for the output selected with A1A0.
6.4.4.4
Previous Address SOA4 : SOA0 = A1A0011 (confr1_s)
The returned data contains the programmed values in the CONFR1 register for the output selected with A1A0.
6.4.4.5
Previous Address SOA4 : SOA0 = A1A0100 (ocr_s)
The returned data contains the programmed values in the OCR register for the output selected with A1A0.
6.4.4.6
Previous Address SOA4 : SOA0 = 00101 (gcr)
The returned data contains the programmed values in the GCR register.
6.4.4.7
Previous Address SOA4 : SOA0 = 00111 (diagr0)
The returned data OD2 reports logic [1] in case of PWM clock on IN0 pin is out of specified frequency range.
The returned data OD1 reports logic [1] in case of calibration failure.
The returned data OD0 reports logic [1] in case of overtemperature prewarning (temperature of GND flag is above TOTWAR).
6.4.4.8
Previous Address SOA4 : SOA0 = 01111 (diagr1)
The returned data OD4: OD1 report in real time the state of the direct input IN[3:0].
The OD0 indicates if the watchdog is enabled (set to logic [1]) or not (set to logic [0]). OD4:OD1 report the output state in case
of Fail-safe state due to watchdog time-out as explained in the following Table 24.
Table 24. Watchdog Activation Report
WD_en (OD0)
SPI Watchdog
0
disabled
1
enabled
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6.4.4.9
Previous Address SOA4 : SOA0 = 10111 (diagr2)
The returned data is the product ID. Bits OD2:OD0 are set to 011 for Protected Dual 10 m and 25 m high side Switches.
Default Device configuration
The default device configuration is explained by the following:
• HS output is commanded by corresponding IN input or On bit through the SPI. The medium slew rate is used,
• HS output is fully protected by the Xenon overcurrent profile by default, the severe short-circuit protection, the undervoltage,
and the overtemperature protection. The auto-retry feature is enabled,
• OpenLoad in ON and OFF state and HS shorted to VPWR detections are available,
• No current recopy and no analog temperature feedback active,
• Overvoltage protection is enabled,
• SO reporting fault status from HS0,
• VDD failure detection is disabled.
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
49
7
Typical Applications
7.1
Introduction
The following figure shows a typical lighting application (only one vehicle corner) using an external PWM clock from the main
MCU. A redundancy circuitry has been implemented to substitute light control (from MCU to watchdog) in case of a Fail-safe
condition.
It is recommended to locate a 22 nF decoupling capacitor to the module connector.
VPWR
VDD
Voltage regulator
100nF
10µF
100nF
VDD
10µF
VPWR
ignition
switch
VDD
10k
VPWR
VDD
VPWR
VDD
10k
100nF
100nF
100nF
VDD
WAKE
I/O
FS
IN0
IN1
IN2
IN3
10k
I/O
MCU
SCLK
CS
I/O
SO
SI
10k
10k
10k
10k
A/D
HS0
10XSC425
SCLK
CS
RST
SI
SO
CSNS
FSI
10k
22nF
22nF
LOAD 0
HS1
22nF
LOAD 1
HS2
22nF
LOAD 2
HS3
GND
22nF
LOAD 3
3.3k
VPWR
Watchdog
direct light commands (pedal, comodo,...)
Figure 16. Typical Lighting (One Corner)
10XSC425
50
Analog Integrated Circuit Device Data
Freescale Semiconductor
8
Packaging
8.1
Soldering Information
The 10XSC425 was qualified in accordance with JEDEC standards J-STD-020C Pb-free reflow profile. The maximum peak
temperature during the soldering process should not exceed 260 °C for 40 seconds maximum duration.
8.2
Marking Information
The device is identified by the part number: 10XSC425.
Device markings indicate build information containing the week and year of manufacture. The date is coded with the last four
characters of the nine character build information code (e.g. “CTKAH0929”). The date is coded as four numerical digits where
the first two digits indicate the year and the last two digits indicate the week. For instance, the date code “1329” indicates the 29th
week of the year 2013.
8.3
Package Mechanical Dimensions
Package dimensions are provided in package drawings. To find the most current package outline drawing, go to
www.freescale.com and perform a keyword search for the drawing’s document number.
Table 25. Package Outline
Package
Suffix
32-Pin SOIC-EP
EK
Package Outline Drawing Number
98ASA00368D
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
51
EK SUFFIX
32-PIN SOIC-EP
98ASA00368D
ISSUE 0
10XSC425
52
Analog Integrated Circuit Device Data
Freescale Semiconductor
EK SUFFIX
32-PIN SOIC-EP
98ASA00368D
ISSUE 0
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
53
EK SUFFIX
32-PIN SOIC-EP
98ASA00368D
ISSUE 0
10XSC425
54
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
Revision History
REVISION
1.0
2.0
DATE
8/2013
9/2013
DESCRIPTION OF CHANGES
•
Initial release based on the MC10XS3425 data sheet
•
Added the note “To achieve high reliability over 10 years of continuous operation, the device's
continuous operating junction temperature should not exceed 125C.” to Operating Temperature
10XSC425
Analog Integrated Circuit Device Data
Freescale Semiconductor
55
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© 2013 Freescale Semiconductor, Inc.
Document Number: MC10XSC425
Rev. 2.0
9/2013