Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 64‐Lead, 9.0 x 9.0 mm Body, 7.1 mm Exposed Pad, Lead Pitch 0.50 mm, Quad Flat No Lead Package (VQFN) R‐QFN064 GPC ZGJ Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes ASE Kaohsiung REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Phenolic Resin Epoxy Silane Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 9003‐35‐4 2530‐83‐8 461‐58‐5 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica Fused Epoxy Resin A Epoxy Resin B Phenol Resin A Phenol Resin B Metal Hydroxide Carbon Black 60676‐86‐0 Proprietary Proprietary Proprietary Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 98.714 2.432 0.101 0.101 101.349 9.799 9.799 0.565 0.095 0.051 0.024 0.010 0.004 0.748 2.273 2.273 0.508 0.508 90.544 3.275 3.275 3.275 3.275 1.690 0.317 105.652 4.740 4.740 225.068 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 75.5 755000 12.7 127000 6.8 68000 3.2 32000 1.3 13000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 85.7 857000 3.1 31000 3.1 31000 3.1 31000 3.1 31000 1.6 16000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 43.86 438596 1.08 10807 0.05 450 0.05 450 45.03 450303 4.35 43536 4.35 43536 0.25 2508 0.04 422 0.02 226 0.01 106 0.00 43 0.00 17 0.33 3322 1.01 10098 1.01 10098 0.23 2256 0.23 2256 40.23 402296 1.46 14552 1.46 14552 1.46 14552 1.46 14552 0.75 7511 0.14 1408 46.94 469424 2.11 21061 2.11 21061 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 25, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 64‐Lead, 9.0 x 9.0 mm Body, 7.1 mm Exposed Pad, Lead Pitch 0.50 mm, Quad Flat No Lead Package (VQFN) R‐QFN064 GPC ZGJ Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes ASE Kaohsiung REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Poybutadiene Derivative Acrylate Acrylic Resin Butadiene Resin Additive Peroxide 7440‐22‐4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica Fused Silica Fused Phenol Resin Epoxy Resin A Epoxy Resin B Carbon Black Silica, Crystalline 60676‐86‐0 76361‐86‐9 Proprietary Proprietary Proprietary 1333‐86‐4 14808‐60‐7 Tin (Sn) 7440‐31‐5 Weight (mg) 98.714 2.432 0.101 0.101 101.349 9.799 9.799 0.472 0.056 0.044 0.044 0.016 0.007 0.003 0.641 2.273 2.273 0.231 0.006 0.237 80.824 11.410 5.811 3.487 3.487 0.317 0.317 105.652 4.740 4.740 224.690 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 73.7 737000 8.7 87000 6.8 68000 6.8 68000 2.5 25000 1.1 11000 0.4 4000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 76.5 765000 10.8 108000 5.5 55000 3.3 33000 3.3 33000 0.3 3000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 43.93 439333 1.08 10825 0.05 451 0.05 451 45.11 451061 4.36 43609 4.36 43609 0.21 2102 0.02 248 0.02 194 0.02 194 0.01 71 0.00 31 0.00 11 0.29 2852 1.01 10115 1.01 10115 0.10 1028 0.00 25 0.11 1053 35.97 359713 5.08 50783 2.59 25862 1.55 15517 1.55 15517 0.14 1411 0.14 1411 47.02 470213 2.11 21096 2.11 21096 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 25, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.