INTEGRATED CIRCUITS DATA SHEET TDA1519A 22 W BTL or 2 x 11 W stereo car radio power amplifier Product specification File under Integrated Circuits, IC01 May 1992 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier TDA1519A GENERAL DESCRIPTION The TDA1519A is an integrated class-B dual output amplifier in a 9-lead single in-line (SIL) plastic power package. The device is primarily developed for car radio applications. Features • Requires very few external components for Bridge Tied Load (BTL) • Thermally protected • Stereo or BTL application • Capability to handle high energy on outputs (VP = 0 V) • Reverse polarity safe • High output power • No switch-on/switch-off plop • Low offset voltage at output (important for BTL) • Protected against electrostatic discharge • Fixed gain • Low thermal resistance • Good ripple rejection • Identical inputs (inverting and non-inverting) • Mute/stand-by switch • Compatible with TDA1519B (except output power). • Load dump protection • AC and DC short-circuit-safe to ground and VP QUICK REFERENCE DATA PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage range operating VP 6.0 14.4 17.5 V non-operating VP − − 30 V load dump protected VP − − 45 V Repetitive peak output current IORM − − 4 A Total quiescent current Itot − 40 80 mA Stand-by current Isb − 0.1 100 µA Switch-on current Isw − − 40 µA BTL |ZI| 25 − − kΩ stereo |ZI| 50 − − kΩ THD = 10%; 4 Ω Po − 6 − W THD = 10%; 2 Ω Po − 11 − W Channel separation α 40 − − dB Noise output voltage Vno(rms) − 150 − µV Input impedance Stereo application Output power May 1992 2 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier PARAMETER TDA1519A CONDITIONS SYMBOL MIN. TYP. MAX. UNIT BTL application Output power THD = 10%; 4 Ω Po − 22 − W Supply voltage ripple rejection RS = 0 Ω f = 100 Hz RR 34 − − dB f = 1 kHz to 10 kHz RR 48 − − dB DC output offset voltage |∆V0| − − 250 mV Crystal temperature Tc − − 150 °C PACKAGE OUTLINES 9 lead SIL; plastic power (SOT131); SOT131-2; 1996 July 22. 9-lead SIL-bent-to-DIL; plastic power (SOT157); SOT157-2; 1996 July 22. May 1992 3 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier Fig.1 Block diagram. May 1992 4 TDA1519A Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier TDA1519A PINNING 1 NINV non-inverting input 2 GND1 ground (signal) 3 RR supply voltage ripple rejection 4 OUT1 output 1 5 GND2 ground (substrate) 6 OUT2 output 2 7 VP positive supply voltage 8 M/SS mute/stand-by switch 9 INV inverting input FUNCTIONAL DESCRIPTION The TDA1519A contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/stand-by switch which has the following features: • Low stand-by current (< 100 µA) • Low mute/stand-by switching current (low cost supply switch) • Mute condition. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT Supply voltage operating VP − 17.5 V non-operating VP − 30 V VP − 45 V AC and DC short-circuit-safe voltage VPSC − 18 V Reverse polarity VPR − 6 V − 200 mJ load dump protected Energy handling capability at outputs during 50 ms; tr ≥ 2.5 ms VP = 0 V Non-repetitive peak output current IOSM − 6 A Repetitive peak output current IORM − 4 A Ptot − 25 W Crystal temperature Tc − 150 °C Storage temperature range Tstg −55 + 150 °C Total power dissipation May 1992 see Fig.2 5 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier TDA1519A Fig.2 Power derating curve. DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply Supply voltage range note 1 VP 6.0 14.4 17.5 V Itot − 40 80 mA VO − 6.95 − V |∆V4-6| − − 250 mV Switch-on voltage level VON 8.5 − − V Mute condition Vmute 3.3 − 6.4 V VO − − 20 mV |∆V4-6| − − 250 mV Total quiescent current DC output voltage note 2 DC output offset voltage Mute/stand-by switch Output signal in mute position VI = 1 V (max.); f = 20 Hz to 15 kHz DC output offset voltage May 1992 6 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier PARAMETER TDA1519A CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Stand-by condition Vsb 0 − 2 V DC current in stand-by condition Isb − − 100 µA Switch-on current Isw − 12 40 µA AC CHARACTERISTICS VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Stereo application Output power note 3 THD = 0.5% Po 4 5 − W THD = 10% Po 5.5 6.0 − W THD = 0.5% Po 7.5 8.5 − W THD = 10% Po 10 11 − W Total harmonic distortion Po = 1 W THD − 0.1 − % Low frequency roll-off note 4 −3 dB fL − 45 − Hz −1 dB fH 20 − − kHz Gv 39 40 41 dB Output power at RL = 2 Ω High frequency roll-off note 3 Closed loop voltage gain Supply voltage ripple rejection ON notes 5 and 6 RR 40 − − dB ON notes 5 and 7 RR 45 − − dB mute notes 5 and 8 RR 45 − − dB stand-by notes 5 and 8 RR 80 − − dB |Zi| 50 60 75 kΩ Input impedance Noise output voltage (RMS value) note 9 ON RS = 0 Ω Vno(rms) − 150 − µV ON RS = 10 kΩ Vno(rms) − 250 500 µV mute note 10 Vno(rms) − 120 − µV RS = 10 kΩ α 40 − − dB |∆Gv| − 0.1 1 dB Channel separation Channel unbalance May 1992 7 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier TDA1519A AC CHARACTERISTICS VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measurements taken using Fig.4; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT BTL application Output power Output power at VP = 13.2 V note 3 THD = 0.5% Po 15 17 − W THD = 10% Po 20 22 − W note 3 THD = 0.5% Po − 13 − W THD = 10% Po − 17.5 - W Total harmonic distortion Po = 1 W THD - 0.1 − % Power bandwidth THD = 0.5%; Po = −1 dB; 35 to Bw − 15 000 − Hz −1 dB fL − 45 − Hz −1 dB fH 20 − − kHz Gv 45 46 47 dB RR 34 − − dB w.r.t. 15 W Low frequency roll-off High frequency roll-off note 4 Closed loop voltage gain Supply voltage ripple rejection ON notes 5 and 6 ON notes 5 and 7 RR 48 − − dB mute notes 5 and 8 RR 48 − − dB stand-by notes 5 and 8 RR 80 − - dB |Zi| 25 30 38 kΩ Vno(rms) − 200 − µV Input impedance Noise output voltage (RMS value) note 9 ON RS = 0 Ω ON RS = 10 kΩ Vno(rms) − 350 700 µV mute note 10 Vno(rms) − 180 − µV Notes to the characteristics 1. The circuit is DC adjusted at VP = 6 V to 17.5 V and AC operating at VP = 8.5 V to 17.5 V. 2. At 17.5 V < VP < 30 V the DC output voltage ≤ VP/2. 3. Output power is measured directly at the output pins of the IC. 4. Frequency response externally fixed. 5. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V). 6. Frequency f = 100 Hz. 7. Frequency between 1 kHz and 10 kHz. 8. Frequency between 100 Hz and 10 kHz. 9. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 10. Noise output voltage independent of RS (VI = 0 V). May 1992 8 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier APPLICATION INFORMATION Fig.3 Stereo application circuit diagram. Fig.4 BTL application circuit diagram. May 1992 9 TDA1519A Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier TDA1519A Fig.5 Total quiescent current (Itot) as a function of supply voltage (VP). Fig.6 Output power (Po) as a function of supply voltage (VP) for BTL application at RL = 4 Ω; f = 1 kHz. May 1992 10 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier TDA1519A Fig.7 Total harmonic distortion (THD) as a function of output power (Po) for BTL application at RL = 4 Ω; f = 1 kHz. Fig.8 Total harmonic distortion (THD) as a function of operating frequency (f) for BTL application at RL = 4 Ω; Po = 1 W. May 1992 11 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier TDA1519A PACKAGE OUTLINES SIL9P: plastic single in-line power package; 9 leads SOT131-2 non-concave Dh x D Eh view B: mounting base side d A2 seating plane B E j A1 b L c 1 9 e Z Q w M bp 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A1 max. A2 b max. bp c D (1) d Dh E (1) e Eh j L Q w x Z (1) mm 2.0 4.6 4.2 1.1 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 6 3.4 3.1 17.2 16.5 2.1 1.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-03-11 SOT131-2 May 1992 EUROPEAN PROJECTION 12 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier TDA1519A DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) SOT157-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 9 e1 Z bp e e2 m w M 0 5 v M 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 5.08 e1 e2 2.54 5.08 Eh j L L3 m Q v w x Z (1) 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-10-12 95-03-11 SOT157-2 May 1992 EUROPEAN PROJECTION 13 Philips Semiconductors Product specification 22 W BTL or 2 x 11 W stereo car radio power amplifier TDA1519A The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. May 1992 14