INTEGRATED CIRCUITS DATA SHEET TDA1516CQ 24 W BTL car radio power amplifier Product specification File under Integrated Circuits, IC01 July 1994 Philips Semiconductors Product specification 24 W BTL car radio power amplifier TDA1516CQ FEATURES • Capability to handle high energy on outputs (VP = 0) • Requires very few external components for Bridge-TiedLoad (BTL) • Protected against electrostatic discharge • High output power (without bootstrap) • Flexible leads • Low offset voltage at output (important for BTL) • Low thermal resistance • Fixed gain • Identical inputs (inverting and non-inverting). • No switch-on/switch-off plop • Good ripple rejection • Mute/stand-by switch GENERAL DESCRIPTION • Load dump protection The TDA1516CQ is a monolithic integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package. The device is primarily developed for car radio applications. • AC and DC short-circuit-safe to ground and VP • Thermally protected • Reverse polarity safe QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT positive supply voltage range VP operating 6.0 14.4 18 V non-operating − − 30 V load dump − − 45 V A IORM repetitive peak output current − − 4 IP total quiescent current − 40 80 mA Isb stand-by current − 0.1 100 µA Isw switch-on current − − 60 µA ZI input impedance BTL 25 − − kΩ TXTAL crystal temperature − − +150 °C PO output power THD = 10%; 4 Ω − 22 − W SVRR supply voltage ripple rejection RS = 0; f = 100 Hz 45 − − dB 48 − − dB Vno noise output voltage − 70 − µV ∆Vos DC output offset voltage − − 100 mV f = 1 to 10 kHz ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA1516CQ 13 DIL plastic SOT141(1) Note 1. SOT141-6; 1996 August 21. July 1994 2 Philips Semiconductors Product specification 24 W BTL car radio power amplifier TDA1516CQ handbook, full pagewidth bootstrap switch 2 1 mute switch 60 kΩ Cm 100 Ω VA 5 6 2 kΩ power stage 18 kΩ VP bootstrap switch 11 stand-by switch stand-by reference voltage VA 15 kΩ x1 mute switch 12 15 kΩ mute reference voltage TDA1516CQ 18 kΩ power stage 2 kΩ 9 VA 13 8 60 kΩ 4 input reference voltage mute switch signal ground 3 100 Ω Cm bootstrap switch power ground (substrate) VP 10 7 MBC084 Fig.1 Block diagram. July 1994 3 Philips Semiconductors Product specification 24 W BTL car radio power amplifier TDA1516CQ PINNING FUNCTIONAL DESCRIPTION −INV1 1 non-inverting input 1 INV 2 inverting input GND1 3 ground (signal) The TDA1516CQ contains two identical amplifiers with differential input stages. It can be used for bridge applications. The gain of each amplifier is fixed at 20 dB. A special feature of this device is the mute/stand-by switch, which has the following features: Vref 4 reference voltage • low stand-by current (< 100 µA) OUT1 5 output 1 BS1 6 bootstrap 1 • low mute/stand-by switching current (low cost supply switch) GND2 7 ground (substrate) • mute condition. BS2 8 bootstrap 2 OUT2 9 output 2 VP 10 supply voltage M/SB 11 mute/stand-by switch RR 12 supply voltage ripple rejection −INV2 13 non-inverting input 2 INV1 1 INV 2 GND1 3 Vref 4 OUT1 5 BS1 6 GND2 7 BS2 8 OUT2 9 SYMBOL PIN DESCRIPTION handbook, halfpage TDA1516CQ VP 10 M/SS 11 RR 12 INV2 13 MLA704 Fig.2 Pin configuration. July 1994 4 Philips Semiconductors Product specification 24 W BTL car radio power amplifier TDA1516CQ LIMITING VALUES In accordance with the Absolute maximum System (IEC 134). SYMBOL VP PARAMETER CONDITIONS MIN. MAX. UNIT supply voltage operating − 18 V non-operating − 30 V load dump protected; during − 45 V − 18 V − 6 V 50 ms; rise time ≥ 2.5 ms VPSC AC and DC short-circuit safe voltage VPR reverse polarity − 200 mJ IOSM non-repetitive peak output current − 6 A IORM repetitive peak output current − 4 A Ptot total power dissipation − 25 W Tstg storage temperature range −55 +150 °C Tvj virtual junction temperature − +150 °C energy handling capability at outputs VP = 0 Tcase < 75 °C; (see Fig.3) Fig.3 Power derating curve. July 1994 5 Philips Semiconductors Product specification 24 W BTL car radio power amplifier TDA1516CQ DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; unless otherwise specified. See note 1. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP positive supply voltage range IP quiescent current VO DC output voltage ∆Vos DC output offset voltage (pins 5 and 9) note 2 note 3 6.0 14.4 18 V − 40 80 mA − 6.8 − V − − 100 mV 8.5 − − V 3.3 − 6.4 V − − 2 mV − − 100 mV 0 − 2 V − − 100 µA Mute/stand-by switch Vsw switch-on voltage level MUTE CONDITION Vmute mute voltage VO output signal in mute position VI = 1 V (max); f = 20 Hz to10 kHz ∆Vos DC output offset voltage (pins 5 and 9) STAND-BY CONDITION Vsb stand-by voltage Isb DC standby current 0.5 < V11 ≤ 2 V − − 500 µA Isw switch-on current V11 ≤ V10; note 4 − 25 60 µA IP supply current short-circuit to GND; note 5 − 5.5 − mA July 1994 V11 ≤ 0.5 V 6 Philips Semiconductors Product specification 24 W BTL car radio power amplifier TDA1516CQ AC CHARACTERISTICS VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; unless otherwise specified. See note 1. SYMBOL PO PARAMETER output power CONDITIONS MIN. TYP. MAX. UNIT THD = 0.5% 15 17 − W THD = 10% 20 22 − W THD = 10%; note 6 21 24 − W VP = 13.2 V; THD = 0.5% − 13.5 − W VP = 13.2 V; THD = 10% − 17 − W VP = 13.2 V; THD = 10%; − 19 − W note 6 THD total harmonic distortion PO = 1 W − 0.05 − % B power bandwidth THD = 0.5%; PO = −1 dB − 20 to − Hz with respect to 15 W 15 000 flow low frequency roll-off −3 dB; note 7 − 25 − Hz fhigh high frequency roll-off −1 dB 20 − − kHz Gv closed loop voltage gain 25 26 27 dB SVRR supply voltage ripple rejection ON; notes 8 and 9 45 − − dB ON; notes 8 and 10 48 − − dB MUTE; notes 8 to 10 48 − − dB 80 − − dB 25 30 38 kΩ ON; RS = 0; note 11 − 70 − µV RS = 10 kΩ; note 12 − 100 200 µV MUTE; note 12 − 60 − µV stand-by; notes 8 to 10 ZI input impedance Vno noise output voltage Notes 1. All characteristics are measured using the circuit shown in Fig.4 2. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V 3. At 18 V < V < 30 V, the DC output voltage ≤ VP/2 4. If V11 > V10, then I11 must be ≤ 10 mA 5. Conditions: V11 = 0; short-circuit output to GND; switch V11 to mute or on condition (rise time V11 > 10 µs) 6. With bootstrap and a resistor of 100 kΩ from VP/2 to the positive supply voltage (VP). (Bootstrap capacitor of 47 µF) 7. Frequency response externally fixed 8. Ripple rejection measured at the output with a source-impedance of 0 Ω (max. ripple amplitude of 2 V) 9. Frequency = 100 Hz 10. Frequency = 1 to 10 kHz 11. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz 12. Noise output voltage independent of RS (Vin = 0) July 1994 7 Philips Semiconductors Product specification 24 W BTL car radio power amplifier TDA1516CQ stand - by switch VP handbook, full pagewidth 4 11 12 input reference voltage 10 100 nF internal 1/2 V P 2 TDA1516CQ 1 60 kΩ 20 dB 20 dB 60 kΩ 13 220 nF input 2 to pin 13 3 7 6 5 9 to pin 2 8 MBC085 signal ground power ground to V P to V P R =4Ω L Fig.4 Application diagram. July 1994 8 2200 µF Philips Semiconductors Product specification 24 W BTL car radio power amplifier TDA1516CQ PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 v M 13 e1 Z e bp e2 m w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e e1 e2 Eh j L L3 m Q v w x Z (1) mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 3.4 1.7 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-03-11 97-12-16 SOT141-6 July 1994 EUROPEAN PROJECTION 9 Philips Semiconductors Product specification 24 W BTL car radio power amplifier TDA1516CQ The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1994 10