INTEGRATED CIRCUITS DATA SHEET TDA2614 6 W hi-fi audio power amplifier Product specification File under Integrated Circuits, IC01 July 1994 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 FEATURES GENERAL DESCRIPTION • Requires very few external components The TDA2614 is a power amplifier in a 9-lead single-in-line (SIL9) plastic medium power package. It has been especially designed for mains fed applications, such as TV and radio. • No switch-on/switch-off clicks • Input mute during switch-on and switch-off • Low offset voltage between output and ground • Hi-fi in accordance with IEC 268 and DIN 45500 • Short-circuit proof and thermal protected • Mute possibility. QUICK REFERENCE DATA SYMBOL PARAMETER VP positive supply voltage range PO output power CONDITIONS VS = 24 V; THD = 0.5% MIN. TYP. MAX. UNIT 15 − 42 V − 6.5 − W Gv internal voltage gain − 30 − dB SVRR supply voltage ripple rejection − 45 − dB Vno noise output voltage − 70 − µV ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA2614 9 SIL plastic SOT110(1) Note 1. SOT110-1; 1996 August 21. July 1994 2 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 + VP handbook, full pagewidth 7 MUTE 4 kΩ 2 5 kΩ + VP TDA2614 V ref3 10 kΩ + VP + V ref2 1/2 V P / GND 3 Vref1 THERMAL PROTECTION voltage comparator VA V B 10 kΩ – V ref2 – VP – VP 20 kΩ INV INV n.c. n.c. 6 9 8 1 4 CM 680 Ω VB 20 kΩ Vref1 substrate VA 5 MCD371 - 1 GND / V P Fig.1 Block diagram. July 1994 3 OUT Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 PINNING FUNCTIONAL DESCRIPTION SYMBOL PIN The TDA2614 is a hi-fi power amplifier designed for mains fed applications, such as radio and TV. The circuit is optimally designed for asymmetrical power supplies, but is also well-suited to symmetrical power supply systems. DESCRIPTION n.c. 1 not connected MUTE 2 mute input 1/2VP/GND 3 1/2 supply (or ground at symmetrical power supplies) n.c. 4 not connected GND/−VP 5 ground (or negative supply rail at symmetrical power supplies) OUT 6 output VP 7 supply voltage INV 8 inverting input −INV 9 non-inverting input An output power of 6 W (THD = 0.5%) can be delivered into an 8 Ω load with a supply of 24 V. The gain is internally fixed at 30 dB, thus offering a low gain spread. A special feature is the input mute circuit. This circuit disconnects the non-inverting input when the supply voltage drops below 10 V, while the amplifier still retains its DC operating adjustment. The circuit features suppression of unwanted signals at the input, during switch-on and switch-off. The mute circuit can also be activated via pin 2. When a current at 300 µA is present at pin 2, the circuit is in the mute condition. The device is provided with two thermal protection circuits. One circuit measures the average temperature of the crystal and the other measure the momentary temperature of the power transistors. These control circuits attack at temperatures in excess of 150 °C, so a crystal operating temperature of max. 150 °C can be used without extra distortion. handbook, halfpage n.c. 1 MUTE 2 1/2 VP / GND 3 n.c. 4 GND / – VP 5 OUT 6 VP 7 INV 8 – INV 9 With the derating value of 8 K/W, the heatsink can be calculated as follows: TDA2614 at RL = 8 Ω and VS = 24 V, dissipation is 4.1 W. With a maximum ambient temperature of 60 °C, the thermal resistance of the heatsink is: 150 – 60 R th = ---------------------- – 8 = 14 K/W. 4.1 MCD367 - 1 Fig.2 Pin configuration. July 1994 4 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 LIMITING VALUES In accordance with the Absolute maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP positive supply voltage − 42 V IOSM non-repetitive peak output current − 4 A Ptot total power dissipation − 15 W Tstg storage temperature range −55 +150 °C TXTAL crystal temperature − +150 °C Tamb ambient operating temperature range −25 +150 °C tsc short circuit time − 1 h see Fig.3 short circuit to ground; note 1 Note to the limiting values 1. For asymmetrical power supplies (with the load short-circuited), the maximum unloaded supply voltage is limited to VP = 28 V, and with an internal supply resistance of RS ≥ 4 Ω, the maximum unloaded supply voltage is limited to 32 V (with the load short-circuited). For symmetrical power supplies, the circuit is short-circuit-proof up to VP = ±21 V. THERMAL RESISTANCE SYMBOL Rth j-c MGA091 - 2 16 handbook, halfpage Ptot (W) 12 infinite heatsink 8 4 R th-hs = 14 K/W 0 – 25 0 50 100 150 Tamb ( o C) Fig.3 Power derating curve. July 1994 5 PARAMETER THERMAL RESISTANCE from junction to case 8 K/W Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage range − 24 42 V IORM repetitive peak output current − 2.2 − A Operating position; note 1 VP supply voltage range 15 24 42 V IP total quiescent current 10 20 35 mA PO output power THD = 0.5% 5 6.5 − W THD = 10% 6.5 8.5 − W THD = 0.5%; RL = 4 Ω − 10 − W THD = 10%; RL = 4 Ω − 14 − W THD total harmonic distortion Po = 4 W − 0.15 0.2 % B power bandwidth THD = 0.5%; note 2 − 30 to − Hz Gv voltage gain 29 30 31 dB |∆V3-6| DC output offset voltage − 30 200 mV − 70 140 µV 14 20 26 kΩ 35 45 − dB − 0.3 − µA − 0.1 1.0 mV 20 000 Vno noise output voltage |Zi| input impedance SVRR supply voltage ripple rejection Ibias input bias current note 3 note 4 MUTE POSITION (AT IMUTE ≥ 300 µA) VO output voltage Z2-7 mute input impedance − 9 − kΩ IP total quiescent current 10 20 35 mA Vno noise output voltage note 3 − 70 140 µV SVRR supply voltage ripple rejection note 4 35 44 − dB |∆V3-6| DC output offset voltage − 40 200 mV |∆Voff| offset voltage with respect to operating position − 4 150 mV I2 current if pin 2 is connected to pin 5 − − 6 mA 4 − 10 V VI = 600 mV Mute position; note 5 VP positive supply voltage range IP total quiescent current RL = ∞ 5 15 20 mA VO output voltage VI = 600 mV − 0.1 1.0 mV Vno noise output voltage note 3 − 70 140 µV SVRR supply voltage ripple rejection note 4 35 44 − dB |∆V3-6| DC output offset voltage − 40 200 mV July 1994 6 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier SYMBOL TDA2614 PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Operating position; note 6 ±VP supply voltage range 7.5 12 21 V IP total quiescent current 10 20 35 mA PO output power THD = 0.5% 5 6.5 − W THD = 10% 6.5 8 − W THD total harmonic distortion Po = 4 W − 0.13 0.2 % B power bandwidth THD = 0.5%; note 2 − 40 to − Hz 20000 Gv voltage gain Vno noise output voltage |Zi| SVRR 29 30 31 dB − 70 140 µV input impedance 14 20 26 kΩ supply voltage ripple rejection 40 55 − dB Ibias input bias current − 0.3 − µA |VGND| DC output offset voltage − 30 200 mV note 3 MUTE POSITION (AT IMUTE ≥ 300 µA) VO output voltage VI = 600 mV − 0.1 1.0 mV Z2-7 mute input impedance note 7 6.7 9 11.3 kΩ IP total quiescent current RL = ∞ 10 20 35 mA Vno noise output voltage note 3 − 70 140 µV SVRR supply voltage ripple rejection note 4 40 55 − dB |∆VGND| DC output offset voltage − 40 200 mV |∆Voff| offset voltage with respect to operating position − 4 150 mV I2 current if pin 2 is connected to pin 5 − − 6 mA Notes to the characteristics 1. VP = 24 V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz; asymmetrical power supply IMUTE < 30 µA. See Fig.5 2. The power bandwidth is measured at an output power of PO max − 3 dB. 3. The noise output voltage (RMS value) is measured at RS = 2 kΩ, unweighted (20 Hz to 20 kHz). 4. The ripple rejection is measured at RS = 0 and f = 100 Hz to 20 kHz, at a ripple voltage of 200 mV. With symmetrical power supplies, the ripple (200 mV) is applied in phase to the positive and the negative supply rails. With asymmetrical power supplies, the ripple rejection is measured at f = 1 kHz. 5. VP = 8 V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz; asymmetrical power supply. See Fig.5 6. ±VP = 12 V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz; symmetrical power supply IMUTE < 30 µA. See Fig.4 7. The internal network at pin 2 is a resistor devider of typical 4 kΩ and 5 kΩ to the positive supply rail. At the connection of the 4 kΩ and 5 kΩ resistor a zener diode of typical 6.6 V is also connected to the positive supply rail. The spread of the zener voltage is 6.1 to 7.1 V. July 1994 7 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 + VP mute input handbook, full pagewidth 2 680 µF 7 3 TDA2614 20 kΩ 220 nF VI 100 nF 9 6 22 nF 8 680 Ω 20 kΩ 8.2 Ω R L= 8 Ω 5 MCD370 – VP 680 µF Fig.4 Test and application circuit with symmetrical power supply. RS VP mute input VS handbook, full pagewidth 100 nF 2 7 680 µF internal 1/2 P 3 100 µF TDA2614 20 kΩ 220 nF VI 9 6 22 nF 8 680 µF 680 Ω 20 kΩ 8.2 Ω R L= 8 Ω 5 MCD369 Fig.5 Test and application circuit with asymmetrical power supply. July 1994 8 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q P A2 P1 A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1.0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-25 SOT110-1 July 1994 EUROPEAN PROJECTION 9 Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2614 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1994 10