PACKAGE OPTION ADDENDUM www.ti.com 27-Apr-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MSP430F5513IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5513 MSP430F5513IZQE ACTIVE BGA MICROSTAR JUNIOR ZQE 80 360 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5513 MSP430F5513IZQER ACTIVE BGA MICROSTAR JUNIOR ZQE 80 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5513 MSP430F5514IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5514 MSP430F5514IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5514 MSP430F5514IZQE ACTIVE BGA MICROSTAR JUNIOR ZQE 80 360 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5514 MSP430F5514IZQER ACTIVE BGA MICROSTAR JUNIOR ZQE 80 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5514 MSP430F5515IPN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5515 MSP430F5515IPNR ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5515 MSP430F5517IPN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5517 MSP430F5517IPNR ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5517 MSP430F5519IPN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5519 MSP430F5519IPNR ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5519 MSP430F5521IPN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5521 MSP430F5521IPNR ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5521 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 27-Apr-2015 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MSP430F5522IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5522 MSP430F5522IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5522 MSP430F5522IZQE ACTIVE BGA MICROSTAR JUNIOR ZQE 80 360 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5522 MSP430F5522IZQER ACTIVE BGA MICROSTAR JUNIOR ZQE 80 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5522 MSP430F5524IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5524 MSP430F5524IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5524 MSP430F5524IYFFR ACTIVE DSBGA YFF 64 2500 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM MSP430F5524IZQE ACTIVE BGA MICROSTAR JUNIOR ZQE 80 360 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5524 MSP430F5524IZQER ACTIVE BGA MICROSTAR JUNIOR ZQE 80 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5524 MSP430F5525IPN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5525 MSP430F5525IPNR ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5525 MSP430F5526IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5526 MSP430F5526IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5526 MSP430F5526IYFFR ACTIVE DSBGA YFF 64 2500 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM MSP430F5526IZQE ACTIVE BGA MICROSTAR JUNIOR ZQE 80 360 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR Addendum-Page 2 M430F5524 M430F5526 -40 to 85 M430F5526 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 27-Apr-2015 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MSP430F5526IZQER ACTIVE BGA MICROSTAR JUNIOR ZQE 80 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5526 MSP430F5527IPN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5527 MSP430F5527IPNR ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5527 MSP430F5528IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5528 MSP430F5528IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5528 MSP430F5528IYFFR ACTIVE DSBGA YFF 64 2500 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 M430F5528 MSP430F5528IZQE ACTIVE BGA MICROSTAR JUNIOR ZQE 80 360 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5528 MSP430F5528IZQER ACTIVE BGA MICROSTAR JUNIOR ZQE 80 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 M430F5528 MSP430F5529IPN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5529 MSP430F5529IPNR ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F5529 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 27-Apr-2015 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4