74HC154; 74HCT154 4-to-16 line decoder/demultiplexer Rev. 06 — 12 February 2007 Product data sheet 1. General description The 74HC154; 74HCT154 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). The 74HC154; 74HCT154 decoders accept four active HIGH binary address inputs and provide 16 mutually-exclusive active LOW outputs. The two-input enable gate can be used to strobe the decoder to eliminate the normal decoding ‘glitches’ on the outputs, or can be used for the expansion of the decoder. The enable gate has two ANDed inputs which must be LOW to enable the outputs. The 74HC154; 74HCT154 can be used as a 1-to-16 demultiplexer by using one of the enable inputs as the multiplexed data input. When the other enable input is LOW, the addressed output will follow the state of the applied data. 2. Features n n n n n 16-line demultiplexing capability Decodes 4 binary-coded inputs into 16 mutually-exclusive outputs Complies with JEDEC standard no. 7A Specified from −40 °C to +85 °C and −40 °C to +125 °C ESD protection: u HBM EIA/JESD22-A114D exceeds 2000 V u MM EIA/JESD22-A115-A exceeds 200 V 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC154N −40 °C to +125 °C DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 74HC154D −40 °C to +125 °C SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 74HC154DB −40 °C to +125 °C SSOP24 plastic shrink small outline package; 24 leads; body width SOT340-1 5.3 mm 74HC154PW −40 °C to +125 °C TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm 74HC154 SOT355-1 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer Table 1. Ordering information …continued Type number Package Temperature range Name Description Version −40 °C to +125 °C DHVQFN24 plastic dual in-line compatible thermal enhanced very thin SOT815-1 quad flat package; no leads; 24 terminals; body 3.5 × 5.5 × 0.85 mm 74HCT154N −40 °C to +125 °C DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 74HCT154D −40 °C to +125 °C SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 74HCT154DB −40 °C to +125 °C SSOP24 plastic shrink small outline package; 24 leads; body width SOT340-1 5.3 mm 74HCT154PW −40 °C to +125 °C TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm 74HCT154BQ −40 °C to +125 °C DHVQFN24 plastic dual in-line compatible thermal enhanced very thin SOT815-1 quad flat package; no leads; 24 terminals; body 3.5 × 5.5 × 0.85 mm 74HC154BQ 74HCT154 SOT355-1 4. Functional diagram 23 22 A0 18 19 A1 21 A2 20 A3 E0 DECODER E1 Y0 1 Y1 2 Y2 3 Y3 4 Y4 5 Y5 6 Y6 7 Y7 8 Y8 9 Y9 10 Y10 Y11 Y12 Y13 Y14 Y15 11 13 14 15 16 17 001aab071 Fig 1. Functional diagram 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 2 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer DX 23 22 G 21 20 23 A0 22 A1 21 A2 20 A3 18 19 E0 E1 X/Y 0 0 15 3 0 1 23 1 0 1 1 2 22 2 1 2 2 3 21 4 2 3 3 4 20 8 3 4 4 5 4 5 5 6 5 6 6 7 6 7 7 8 7 8 Y0 1 8 9 8 9 Y1 2 9 10 9 10 10 11 10 11 11 13 11 13 12 14 12 14 13 15 13 15 14 16 15 17 Y14 16 Y15 17 & 18 & EN 19 14 16 18 15 17 19 EN 001aab069 001aab070 Fig 2. Logic symbol E0 Y0 Y1 Fig 3. IEC logic symbol A0 E1 Y2 Y3 Y4 A1 Y5 Y6 A2 Y7 Y8 A3 Y9 Y10 Y11 Y12 Y13 Y14 Y15 001aab072 Fig 4. Logic diagram 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 3 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer 5. Pinning information 5.1 Pinning 1 Y0 terminal 1 index area 24 VCC 74HC154BQ 74HCT154BQ 1 24 VCC Y1 2 23 A0 Y2 3 22 A1 Y3 4 Y4 5 Y5 6 Y6 7 Y7 8 Y8 9 74HC154D 74HCT154D 74HC154DB 74HCT154DB 74HC154N 74HCT154N 74HC154PW 74HCT154PW 21 A2 20 A3 19 E1 18 E0 17 Y15 Y10 11 14 Y12 GND 12 13 Y11 23 A0 3 22 A1 Y3 4 21 A2 Y4 5 20 A3 Y5 6 19 E1 Y6 7 18 E0 Y7 8 17 Y15 Y8 9 16 Y14 VCC(1) 15 Y13 Y10 11 14 Y12 GND 12 15 Y13 2 Y2 Y9 10 16 Y14 Y9 10 Y1 Y11 13 Y0 001aab068 Transparent top view 001aab067 (1) The die substrate is attached to this pad using conductive die attach material. It cannot be used as a supply pin or input. Fig 5. Pin configuration for SO24, DIP24, SSOP24 and TSSOP24 Fig 6. Pin configuration for DHVQFN24 5.2 Pin description Table 2. Pin description Symbol Pin Description Y0 1 data output (active LOW) Y1 2 data output (active LOW) Y2 3 data output (active LOW) Y3 4 data output (active LOW) Y4 5 data output (active LOW) Y5 6 data output (active LOW) Y6 7 data output (active LOW) Y7 8 data output (active LOW) Y8 9 data output (active LOW) Y9 10 data output (active LOW) Y10 11 data output (active LOW) GND 12 ground (0 V) Y11 13 data output (active LOW) Y12 14 data output (active LOW) 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 4 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer Table 2. Pin description …continued Symbol Pin Description Y13 15 data output (active LOW) Y14 16 data output (active LOW) Y15 17 data output (active LOW) E0 18 enable input (active LOW) E1 19 enable input (active LOW) A3 20 address input A2 21 address input A1 22 address input A0 23 address input VCC 24 supply voltage 6. Functional description Function table[1] Table 3. Input Output E0 E1 A0 A1 A2 A3 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15 H H X X X X H H H H H H H H H H H H H H H H H L X X X X H H H H H H H H H H H H H H H H L H X X X X H H H H H H H H H H H H H H H H L L L L L L L H H H H H H H H H H H H H H H H L L L H L H H H H H H H H H H H H H H L H L L H H L H H H H H H H H H H H H H H H L L H H H L H H H H H H H H H H H H L L H L H H H H L H H H H H H H H H H H H L H L H H H H H L H H H H H H H H H H L H H L H H H H H H L H H H H H H H H H H H H L H H H H H H H L H H H H H H H H L L L H H H H H H H H H L H H H H H H H H L L H H H H H H H H H H L H H H H H H L H L H H H H H H H H H H H L H H H H H H H L H H H H H H H H H H H H L H H H H L L H H H H H H H H H H H H H H L H H H H L H H H H H H H H H H H H H H H L H H L H H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H H H H H L [1] H = HIGH voltage level L = LOW voltage level X = don’t care. 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 5 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit −0.5 +7.0 V IIK input clamping current VI < −0.5 V or VI > VCC + 0.5 V [1] - ±20 mA IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V [1] - ±20 mA output current −0.5 V < VO < VCC + 0.5 V [1] - ±25 mA supply current [1] - 50 mA IGND ground current [1] - −50 mA Tstg storage temperature −65 +150 °C - 300 mW IO ICC total power dissipation Ptot Tamb = −40 °C to +125 °C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For DIP24 packages: Ptot derates linearly at 12 mW/K above 70 °C. For SO24 packages: Ptot derates linearly at 8 mW/K above 70 °C. For SSOP24 and TSSOP24 packages: Ptot derates linearly at 5.5 mW/K above 60 °C. For DHVQFN24 packages: Ptot derates linearly at 4.5 mW/K above 60 °C. 8. Recommended operating conditions Table 5. Symbol Operating conditions Parameter Conditions Min Typ Max Unit 74HC154 VCC supply voltage 2.0 5.0 6.0 V VI input voltage 0 - VCC V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C tr rise time VCC = 2.0 V - - 1000 ns VCC = 4.5 V - 6.0 500 ns VCC = 6.0 V - - 400 ns VCC = 2.0 V - - 1000 ns VCC = 4.5 V - 6.0 500 ns VCC = 6.0 V - - 400 ns tf fall time 74HCT154 VCC supply voltage 4.5 5.0 5.5 V VI input voltage 0 - VCC V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C tr input rise time VCC = 4.5 V - 6.0 500 ns tf input fall time VCC = 4.5 V - 6.0 500 ns 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 6 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer 9. Static characteristics Table 6. Static characteristics 74HC154 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit Tamb = 25 °C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VCC = 2.0 V 1.5 1.2 - V VCC = 4.5 V 3.15 2.4 - V VCC = 6.0 V 4.2 3.2 - V VCC = 2.0 V - 0.8 0.5 V VCC = 4.5 V - 2.1 1.35 V VCC = 6.0 V - 2.8 1.8 V VCC = 2.0 V; IO = −20 µA 1.9 2.0 - V VCC = 4.5 V; IO = −20 µA 4.4 4.5 - V VCC = 6.0 V; IO = −20 µA 5.9 6.0 - V VCC = 4.5 V; IO = −4.0 mA 3.98 4.32 - V VCC = 6.0 V; IO = −5.2 mA 5.48 5.81 - V VCC = 2.0 V; IO = 20 µA - 0 0.1 V VCC = 4.5 V; IO = 20 µA - 0 0.1 V VCC = 6.0 V; IO = 20 µA - 0 0.1 V VI = VIH or VIL VI = VIH or VIL VCC = 4.5 V; IO = 4.0 mA - 0.15 0.26 V VCC = 6.0 V; IO = 5.2 mA - 0.16 0.26 V II input leakage current VCC = 6.0 V; VI = VCC or GND - - ±0.1 µA ICC supply current VCC = 6.0 V; VI = VCC or GND; IO = 0 A - - 8.0 µA CI input capacitance - 3.5 - pF VCC = 2.0 V 1.5 - - V VCC = 4.5 V 3.15 - - V Tamb = −40 °C to +85 °C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VCC = 6.0 V 4.2 - - V VCC = 2.0 V - - 0.5 V VCC = 4.5 V - - 1.35 V VCC = 6.0 V - - 1.8 V VCC = 2.0 V; IO = −20 µA 1.9 - - V VCC = 4.5 V; IO = −20 µA 4.4 - - V VCC = 6.0 V; IO = −20 µA 5.9 - - V VCC = 4.5 V; IO = −4.0 mA 3.84 - - V VCC = 6.0 V; IO = −5.2 mA 5.34 - - V VI = VIH or VIL 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 7 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer Table 6. Static characteristics 74HC154 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit VOL LOW-level output voltage VI = VIH or VIL VCC = 2.0 V; IO = 20 µA - - 0.1 V VCC = 4.5 V; IO = 20 µA - - 0.1 V VCC = 6.0 V; IO = 20 µA - - 0.1 V VCC = 4.5 V; IO = 4.0 mA - - 0.33 V VCC = 6.0 V; IO = 5.2 mA - - 0.33 V II input leakage current VCC = 6.0 V; VI = VCC or GND - - ±1.0 µA ICC supply current VCC = 6.0 V; VI = VCC or GND; IO = 0 A - - 80 µA VCC = 2.0 V 1.5 - - V VCC = 4.5 V 3.15 - - V VCC = 6.0 V 4.2 - - V VCC = 2.0 V - - 0.5 V VCC = 4.5 V - - 1.35 V VCC = 6.0 V - - 1.8 V VCC = 2.0 V; IO = −20 µA 1.9 - - V VCC = 4.5 V; IO = −20 µA 4.4 - - V VCC = 6.0 V; IO = −20 µA 5.9 - - V VCC = 4.5 V; IO = −4.0 mA 3.7 - - V VCC = 6.0 V; IO = −5.2 mA 5.2 - - V VCC = 2.0 V; IO = 20 µA - - 0.1 V VCC = 4.5 V; IO = 20 µA - - 0.1 V VCC = 6.0 V; IO = 20 µA - - 0.1 V VCC = 4.5 V; IO = 4.0 mA - - 0.4 V Tamb = −40 °C to +125 °C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VI = VIH or VIL VI = VIH or VIL VCC = 6.0 V; IO = 5.2 mA - - 0.4 V II input leakage current VCC = 6.0 V; VI = VCC or GND - - ±0.1 µA ICC supply current VCC = 6.0 V; VI = VCC or GND; IO = 0 A - - 160 µA Table 7. Static characteristics 74HCT154 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 V VOH HIGH-level output voltage VI = VIH or VIL VCC = 4.5 V; IO = −20 µA 4.4 4.5 - V VCC = 4.5 V; IO = −4 mA 3.98 4.32 - V Tamb = 25 °C 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 8 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer Table 7. Static characteristics 74HCT154 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit VOL LOW-level output voltage VI = VIH or VIL VCC = 4.5 V; IO = 20 µA - 0 0.1 V VCC = 4.5 V; IO = 4 mA - 0.15 0.25 V II input leakage current VCC = 5.5 V; VI = VCC or GND - - ±0.1 µA ICC supply current VCC = 5.5 V; VI = VCC or GND; IO = 0 A - - 8.0 µA ∆ICC additional supply current per input pin; VCC = 4.5 V to 5.5 V; VI = VCC − 2.1 V; IO = 0 A - - 360 µA CI input capacitance - 3.5 - pF Tamb = −40 °C to +85 °C VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL VCC = 4.5 V; IO = −20 µA 4.4 - - V VCC = 4.5 V; IO = −4 mA 3.84 - - V VCC = 4.5 V; IO = 20 µA - - 0.1 V VCC = 4.5 V; IO = 4 mA - - 0.33 V VCC = 5.5 V; VI = VCC or GND - - ±1.0 µA VOL LOW-level output voltage VI = VIH or VIL II input leakage current ICC supply current VCC = 5.5 V; VI = VCC or GND; IO = 0 A - - 80 µA ∆ICC additional supply current per input pin; VCC = 4.5 V to 5.5 V; VI = VCC − 2.1 V; IO = 0 A - - 450 µA Tamb = −40 °C to +125 °C VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL VCC = 4.5 V; IO = −20 µA 4.4 - - V VCC = 4.5 V; IO = −4 mA 3.7 - - V VCC = 4.5 V; IO = 20 µA - - 0.1 V VCC = 4.5 V; IO = 4 mA - - 0.4 V VOL LOW-level output voltage VI = VIH or VIL II input leakage current VCC = 5.5 V; VI = VCC or GND - - ±1.0 µA ICC supply current VCC = 5.5 V; VI = VCC or GND; IO = 0 A - - 160 µA ∆ICC additional supply current per input pin; VCC = 4.5 V to 5.5 V; VI = VCC − 2.1 V; IO = 0 A - - 490 µA 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 9 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer 10. Dynamic characteristics Table 8. Dynamic characteristics GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 9. Symbol Parameter 25 °C Conditions Min Typ −40 °C to +125 °C Max Min Max (85 °C) Unit Max (125 °C) 74HC154 propagation delay tpd An to Yn; see Figure 7 [1] VCC = 2.0 V - 36 150 - 190 225 ns VCC = 4.5 V - 13 30 - 38 45 ns VCC = 5 V; CL = 15 pF - 11 - - - - ns VCC = 6.0 V - 10 26 - 33 38 ns En to Yn; see Figure 8 VCC = 2.0 V - 39 150 - 190 225 ns VCC = 4.5 V - 14 30 - 38 45 ns VCC = 5 V; CL = 15 pF - 11 - - - - ns - 11 26 - 33 38 ns VCC = 2.0 V - 19 75 - 95 110 ns VCC = 4.5 V - 7 15 - 19 22 ns - 6 13 - 16 19 ns - 60 - - - - pF VCC = 6.0 V transition time tt see Figure 7 and 8 [2] VCC = 6.0 V CPD power dissipation capacitance per gate; VI = GND to VCC [3] propagation delay An to Yn; see Figure 7 [1] 74HCT154 tpd VCC = 4.5 V - 16 35 - 44 53 ns VCC = 5 V; CL = 15 pF - 13 - - - - ns - 15 32 - 40 48 ns - 13 - - - - ns - 7 15 - 19 22 ns - 60 - - - - pF En to Yn; see Figure 8 VCC = 4.5 V VCC = 5 V; CL = 15 pF transition time tt see Figure 7 and 8 [2] VCC = 4.5 V power dissipation capacitance CPD per gate; VI = GND to (VCC − 1.5 V) [1] tpd is the same as tPLH and tPHL [2] tt is the same as tTLH and tTHL [3] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of load switching outputs; Σ(CL × VCC2 × fo) = sum of the outputs. [3] 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 10 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer 11. Waveforms VI An input VI VM VM GND GND t PHL VOH Yn output t PLH 90 % 90 % VM 10 % VOL VM 90 % 90 % VM Yn output 10 % VOL t TLH t THL 001aab073 Measurement points are given in Table 9. tPLH tPHL VOH 10 % t THL VM 10 % t TLH 001aab074 Measurement points are given in Table 9. Fig 7. Propagation delay address input (An) to output (Yn) and transition time output (Yn) Table 9. VM VM En input Fig 8. Propagation delay enable input (En) to output (Yn) and transition time output (Yn) Measurement points Type Input Output VM VM 74HC154 0.5VCC 0.5VCC 74HCT154 1.3 V 1.3 V 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 11 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC PULSE GENERATOR VI VO RL S1 open DUT RT CL 001aad983 Test data is given in Table 10. Definitions for test circuit: RT = Termination resistance; should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistor. S1 = Test selection switch. Fig 9. Load circuitry for measuring switching times Table 10. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH 74HC154 VCC 6 ns 15 pF, 50 pF 1 kΩ open 74HCT154 3V 6 ns 15 pF, 50 pF 1 kΩ open 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 12 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer 12. Application information A0 Y0 A0 Y0 A1 Y1 A1 Y1 A2 A2 A3 A3 strobe E0 E1 Y14 data input Y15 001aab075 Fig 10. 1-of-16 decoder; LOW level output selected Y14 Y15 001aab076 Fig 11. 1-of-16 demultiplexer; logic level on selected outputs follow the logic level on the data input 74HC_HCT154_6 Product data sheet E0 E1 © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 13 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer 13. Package outline seating plane DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1 ME D A2 L A A1 c e Z b1 w M (e 1) b MH 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4 1.7 1.3 0.53 0.38 0.32 0.23 32.0 31.4 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 2.2 inches 0.2 0.02 0.16 0.066 0.051 0.021 0.015 0.013 0.009 1.26 1.24 0.56 0.54 0.1 0.6 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT101-1 051G02 MO-015 SC-509-24 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 12. Package outline SOT101-1 (DIP24) 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 14 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 13. Package outline SOT137-1 (SO24) 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 15 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.8 0.4 8 o 0 o Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC JEITA MO-150 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 14. Package outline SOT340-1 (SSOP24) 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 16 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE y v M A Z 13 24 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8o 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 15. Package outline SOT355-1 (TSSOP24) 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 17 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm B D SOT815-1 A A E A1 c detail X terminal 1 index area C e1 terminal 1 index area e y1 C v M C A B w M C b 2 y 11 L 12 1 e2 Eh 24 13 23 14 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 5.6 5.4 4.25 3.95 3.6 3.4 2.25 1.95 0.5 4.5 1.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT815-1 --- --- --- EUROPEAN PROJECTION ISSUE DATE 03-04-29 Fig 16. Package outline SOT815-1 (DHVQFN24) 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 18 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model LSTTL Low-power Schottky Transistor-Transistor Logic MM Machine Model 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT154_6 20070212 Product data sheet - 74HC_HCT154_5 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Table 3 on page 5: Corrected errors in output information. 74HC_HCT154_5 20041012 Product specification - 74HC_HCT154_4 74HC_HCT154_4 20041005 Product specification - 74HC_HCT154_3 74HC_HCT154_3 20040601 Product specification - 74HC_HCT154_CNV_2 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 19 of 21 74HC154; 74HCT154 NXP Semiconductors 4-to-16 line decoder/demultiplexer 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] 74HC_HCT154_6 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 06 — 12 February 2007 20 of 21 NXP Semiconductors 74HC154; 74HCT154 4-to-16 line decoder/demultiplexer 18. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Application information. . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 12 February 2007 Document identifier: 74HC_HCT154_6