74HC240; 74HCT240 Octal buffer/line driver; 3-state; inverting Rev. 03 — 2 August 2007 Product data sheet 1. General description The 74HC240; 74HCT240 is a high-speed Si-gate CMOS device and is pin compatible with Low-Power Schottky TTL (LSTTL). The 74HC240; 74HCT240 is a dual octal inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high impedance OFF-state. The 74HC240; 74HCT240 is similar to the 74HC244; 74HCT244 but has inverting outputs. 2. Features ■ ■ ■ ■ Inverting 3-state outputs Multiple package options Complies with JEDEC standard no. 7 A ESD protection: ◆ HBM JESD22-A114-D exceeds 2000 V ◆ MM JESD22-A115-A exceeds 200 V ■ Specified from −40 °C to +85 °C and from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC240N −40 °C to +125 °C DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 74HC240D −40 °C to +125 °C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 74HC240DB −40 °C to +125 °C SSOP20 plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 74HC240PW −40 °C to +125 °C TSSOP20 plastic thin shrink small outline package; 20 leads; SOT360-1 body width 4.4 mm 74HC240BQ −40 °C to +125 °C DHVQFN20 plastic dual-in-line compatible thermal enhanced SOT764-1 very thin quad flat package; no leads; 20 terminals; body 2.5 × 4.5 × 0.85 mm −40 °C to +125 °C DIP20 74HC240 74HCT240 74HCT240N plastic dual in-line package; 20 leads (300 mil) SOT146-1 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting Table 1. Ordering information …continued Type number Package Temperature range Name Description Version 74HCT240D −40 °C to +125 °C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 74HCT240DB −40 °C to +125 °C SSOP20 plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 74HCT240PW −40 °C to +125 °C TSSOP20 plastic thin shrink small outline package; 20 leads; SOT360-1 body width 4.4 mm 74HCT240BQ −40 °C to +125 °C DHVQFN20 plastic dual-in-line compatible thermal enhanced SOT764-1 very thin quad flat package; no leads; 20 terminals; body 2.5 × 4.5 × 0.85 mm 4. Functional diagram 1 1Y0 18 2Y0 3 2 1A0 17 2A0 4 1A1 15 2A1 1Y1 16 2Y1 5 6 1A2 1Y2 14 13 2A2 2Y2 8 1A3 11 2A3 1Y3 12 2Y3 9 1 1OE 19 2OE Fig 1. Logic symbol 18 4 16 6 14 8 12 EN 1Y0 18 4 1A1 1Y1 16 6 1A2 1Y2 14 8 1A3 1Y3 12 1 1OE 17 2A0 2Y0 3 15 2A1 2Y1 5 13 2A2 2Y2 7 11 2A3 2Y3 9 19 2OE 7 mgu779 11 9 13 7 15 5 17 3 mgu778 Fig 2. IEC logic symbol 74HC_HCT240_3 Product data sheet 1A0 EN 2 19 2 mgu780 Fig 3. Functional diagram © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 2 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting 5. Pinning information 5.1 Pinning terminal 1 index area 1 1OE 1 20 VCC 1A0 2 19 2OE 1A0 2 19 2OE 2Y0 3 18 1Y0 1A1 4 17 2A0 5 16 1Y1 15 2A1 2Y0 3 18 1Y0 2Y1 1A1 4 17 2A0 1A2 6 2Y1 5 16 1Y1 1A2 6 15 2A1 2Y2 7 14 1Y2 1A3 8 13 2A2 2Y3 9 12 1Y3 GND 10 11 2A3 7 8 2Y3 9 14 1Y2 GND(1) 13 2A2 12 1Y3 GND 10 2Y2 1A3 2A3 11 74HC240 74HCT240 20 VCC 1OE 74HC240 74HCT240 001aag234 Transparent top view 001aag233 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input Fig 4. Pin configuration DIP20, SO20, (T)SSOP20 Fig 5. Pin configuration DHVQFN20 5.2 Pin description Table 2. Pin description Symbol Pin Description 1OE 1 output enable input (active LOW) 1A0 2 data input 2Y0 3 bus output 1A1 4 data input 2Y1 5 bus output 1A2 6 data input 2Y2 7 bus output 1A3 8 data input 2Y3 9 bus output GND 10 ground (0 V) 2A3 11 data input 1Y3 12 bus output 2A2 13 data input 1Y2 14 bus output 2A1 15 data input 1Y1 16 bus output 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 3 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting Table 2. Pin description …continued Symbol Pin Description 2A0 17 data input 1Y0 18 bus output 2OE 19 output enable input (active LOW) VCC 20 supply voltage 6. Functional description Table 3. Function table[1] Input Output nOE nAn nYn L L H L H L H X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V - ±20 mA IO output current −0.5 V < VO < VCC + 0.5 V - ±35 mA ICC supply current - 70 mA IGND ground current −70 - mA Tstg storage temperature −65 +150 °C Ptot total power dissipation DIP20 package - 750 mW SO20, SSOP20, TSSOP20 and DHVQFN20 packages - 500 mW [1] Conditions VI < −0.5 V or VI > VCC + 0.5 V Min Max Unit −0.5 +7 V - ±20 mA [1] For DIP20 packages: above 70 °C, Ptot derates linearly with 12 mW/K. For SO20 packages: above 70 °C, Ptot derates linearly with 8 mW/K. For SSOP20 and TSSOP20 packages: above 60 °C, Ptot derates linearly with 5.5 mW/K. For DHVQFN20 packages: above 60 °C, Ptot derates linearly with 4.5 mW/K. 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 4 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit 2.0 5.0 6.0 V 74HC240 VCC supply voltage VI input voltage 0 - VCC V VO output voltage 0 - VCC V ∆t/∆V input transition rise and fall rate VCC = 2.0 V - - 625 ns/V VCC = 4.5 V - 1.67 139 ns/V VCC = 6.0 V - - 83 ns/V ambient temperature −40 - +125 °C VCC supply voltage 4.5 5.0 5.5 V Tamb 74HCT240 VI input voltage 0 - VCC V VO output voltage 0 - VCC V ∆t/∆V input transition rise and fall rate VCC = 4.5 V - 1.67 139 ns/V Tamb ambient temperature −40 - +125 °C 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V 74HC240 VIH VIL VOH HIGH-level input voltage LOW-level input voltage VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V HIGH-level VI = VIH or VIL output voltage IO = −20 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −20 µA; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = −6.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = −7.8 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 5 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VOL 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max LOW-level VI = VIH or VIL output voltage IO = 20 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 µA; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 6.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 7.8 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 6.0 V - - ±0.1 - ±1.0 - ±1.0 µA IOZ OFF-state output current per input pin; VI = VIH or VIL; VO = VCC or GND; other inputs at VCC or GND; VCC = 6.0 V; IO = 0 A - - ±0.5 - ±5.0 - ±10 µA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 8.0 - 80 - 160 µA CI input capacitance - 3.5 - - - - - pF 74HCT240 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = −20 µA 4.4 4.5 - 4.4 - 4.4 - V 3.98 4.32 - 3.84 - 3.7 - V IO = −6 mA VOL LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 20 µA - 0 0.1 - 0.1 - 0.1 V IO = 6.0 mA - 0.16 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 5.5 V - - ±0.1 - ±1.0 - ±1.0 µA IOZ OFF-state output current per input pin; VI = VIH or VIL; VO = VCC or GND; other inputs at VCC or GND; VCC = 5.5 V; IO = 0 A - - ±0.5 - ±5.0 - ±10 µA ICC supply current VI = VCC or GND; VCC = 5.5 V; IO = 0 A - - 8.0 - 80 - 160 µA ∆ICC additional per input pin; supply current VI = VCC − 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A nAn or inputs - 150 540 - 675 - 735 µA nOE input - 70 252 - 315 - 343 µA - 3.5 - - - - - pF CI input capacitance 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 6 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; for load circuit see Figure 8. Symbol Parameter 25 °C Conditions −40 °C to +125 °C Unit Min Typ Max Max (85 °C) Max (125 °C) VCC = 2.0 V - 30 100 125 150 ns VCC = 4.5 V - 11 20 25 30 ns VCC = 5.0 V; CL = 15 pF - 9 - - - ns - 9 17 21 26 ns VCC = 2.0 V - 39 150 190 225 ns VCC = 4.5 V - 14 30 38 45 ns - 11 26 33 38 ns VCC = 2.0 V - 41 150 190 225 ns VCC = 4.5 V - 15 30 38 45 ns - 12 26 33 38 ns VCC = 2.0 V - 14 60 75 90 ns VCC = 4.5 V - 5 12 15 18 ns - 4 10 13 15 ns - 30 - - - pF 74HC240 tpd [1] propagation delay nAn to nYn; see Figure 6 VCC = 6.0 V ten enable time nOE to nYn; see Figure 7 [2] VCC = 6.0 V tdis disable time nOE to nYn or see Figure 7 [3] VCC = 6.0 V tt transition time see Figure 6 [4] VCC = 6.0 V CPD power dissipation capacitance per transceiver; VI = GND to VCC [5] 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 7 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting Table 7. Dynamic characteristics …continued GND = 0 V; for load circuit see Figure 8. Symbol Parameter 25 °C Conditions −40 °C to +125 °C Unit Min Typ Max Max (85 °C) Max (125 °C) VCC = 4.5 V - 11 20 25 30 ns VCC = 5.0 V; CL = 15 pF - 9 - - - ns 74HCT240 [1] propagation delay nAn to nYn; tpd see Figure 6 ten enable time nOE to nYn; VCC = 4.5 V; see Figure 7 [2] - 13 30 38 45 ns tdis disable time nOE to nYn; VCC = 4.5 V; see Figure 7 [3] - 13 25 31 38 ns tt transition time VCC = 4.5 V; see Figure 6 [4] - 5 12 15 18 ns per transceiver; VI = GND to VCC − 1.5 V [5] - 30 - - - pF power dissipation capacitance CPD [1] tpd is the same as tPHL and tPLH. [2] ten is the same as tPZH and tPZL. [3] tdis is the same as tPHZ and tPLZ. [4] tt is the same as tTHL and tTLH. [5] CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi × N + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑ (CL × VCC2 × fo) = sum of outputs. 11. Waveforms VI nAn input VM VM GND tPHL tPLH VOH nYn output VM VM VOL mgu781 Measurement points are given in Table 8. VOL and VOH are typical voltage output drop that occur with the output load. Fig 6. Input (nAn) to output (nYn) propagation delays and output transition times 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 8 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting VI nOE input VM GND t PLZ t PZL VCC nYn output LOW-to-OFF OFF-to-LOW VM VX VOL t PZH t PHZ VOH VY nYn output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs disabled outputs enabled 001aae014 Measurement points are given in Table 8. VOL and VOH are typical voltage output drop that occur with the output load. Fig 7. 3-state enable and disable times Table 8. Measurement points Type Input Output VM VM VX VY 74HC240 0.5 × VCC 0.5 × VCC 0.1 × VCC 0.9 × VCC 74HCT240 1.3 V 1.3 V 0.1 × VCC 0.9 × VCC 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 9 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC PULSE GENERATOR VI VO RL S1 open DUT RT CL 001aad983 Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 8. Load circuitry for measuring switching times Table 9. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74HC240 VCC 6 ns 15 pF, 50 pF 1 kΩ open GND VCC 74HCT240 3V 6 ns 15 pF, 50 pF 1 kΩ open GND VCC 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 10 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting 12. Package outline DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.02 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2 0.25 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC JEITA MS-001 SC-603 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 9. Package outline SOT146-1 (DIP20) 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 11 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 10 1 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 10. Package outline SOT163-1 (SO20) 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 12 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 w M bp e detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.9 0.5 8 o 0 o Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Fig 11. Package outline SOT339-1 (SSOP20) 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 13 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Fig 12. Package outline SOT360-1 (TSSOP20) 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 14 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 4.6 4.4 3.15 2.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT764-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 13. Package outline SOT764-1 (DHVQFN20) 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 15 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting 13. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT240_3 20070802 Product data sheet - Modifications: 74HC_HCT240_CNV_2 The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Added type number 74HC240BQ and 74HCT240BQ (DHVQFN20 package) 19970828 Product specification 74HC_HCT240_3 Product data sheet 74HC_HCT240_CNV_2 • - - © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 16 of 18 74HC240; 74HCT240 NXP Semiconductors Octal buffer/line driver; 3-state; inverting 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] 74HC_HCT240_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 2 August 2007 17 of 18 NXP Semiconductors 74HC240; 74HCT240 Octal buffer/line driver; 3-state; inverting 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 2 August 2007 Document identifier: 74HC_HCT240_3