74HC238; 74HCT238 3-to-8 line decoder/demultiplexer Rev. 03 — 16 July 2007 Product data sheet 1. General description 74HC238 and 74HCT238 are high-speed Si-gate CMOS devices and are pin compatible with Low-Power Schottky TTL (LSTTL). The 74HC238/74HCT238 decoders accept three binary weighted address inputs (A0, A1, A2) and when enabled, provide 8 mutually exclusive active HIGH outputs (Y0 to Y7). The 74HC238/74HCT238 features three enable inputs: two active LOW (E1 and E2) and one active HIGH (E3). Every output will be LOW unless E1 and E2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion of the “238” to a 1-to-32 (5 lines to 32 lines) decoder with just four “238” ICs and one inverter. The “238” can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Unused enable inputs must be permanently tied to their appropriate active HIGH or LOW state. The 74HC238/74HCT238 is similar to the 74HC138/74HCT138 but has non-inverting outputs. 2. Features n n n n n n n Demultiplexing capability Multiple input enable for easy expansion Ideal for memory chip select decoding Active HIGH mutually exclusive outputs Multiple package options Complies with JEDEC standard no. 7A ESD protection: u HBM JESD22-A114E exceeds 2000 V u MM JESD22-A115-A exceeds 200 V n Specified from −40 °C to +85 °C and from −40 °C to +125 °C 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC238N −40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HC238D −40 °C to +125 °C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HC238DB −40 °C to +125 °C SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 74HC238PW −40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 74HC238BQ −40 °C to +125 °C DHVQFN16 plastic dual in-line compatible thermal enhanced very thin SOT763-1 quad flat package; no leads; 16 terminals; body 2.5 × 3.5 × 0.85 mm 74HCT238N −40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HCT238D −40 °C to +125 °C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HCT238DB −40 °C to +125 °C SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 74HCT238PW −40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 74HCT238BQ −40 °C to +125 °C DHVQFN16 plastic dual in-line compatible thermal enhanced very thin SOT763-1 quad flat package; no leads; 16 terminals; body 2.5 × 3.5 × 0.85 mm 4. Functional diagram 15 A0 1 A1 2 3 TO 8 DECODER 3 A2 15 Y0 14 Y1 13 Y2 ENABLE 12 EXITING 11 Y3 10 Y5 9 Y6 7 Y7 14 A0 A1 A2 E2 E3 4 Fig 1. Logic symbol ENABLE EXITING 12 11 10 7 E3 Y1 Y2 Y3 Y4 Y5 Y6 Y7 4 5 6 001aag753 001aag752 Fig 2. Functional diagram 74HC_HCT238_3 Product data sheet 3 3 TO 8 DECODER 9 E2 5 6 2 Y4 E1 E1 13 1 Y0 © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 2 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer Y0 E1 Y1 E2 Y2 E3 Y3 Y4 Y5 A0 Y6 A1 Y7 A2 001aag754 Fig 3. Logic diagram 5. Pinning information 5.1 Pinning 74HC238 74HCT238 A0 terminal 1 index area 16 VCC 74HC238 74HCT238 1 16 VCC A1 2 15 Y0 A1 2 15 Y0 A2 3 14 Y1 A2 3 14 Y1 E1 4 13 Y2 E1 4 13 Y2 E2 5 12 Y3 E3 6 Y7 7 6 11 Y4 Y7 7 10 Y5 GND 8 9 Y6 GND(1) 11 Y4 10 Y5 9 E3 Y6 12 Y3 8 5 GND E2 1 A0 001aag756 Transparent top view 001aag755 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input Fig 4. Pin configuration DIP16, SO16, (T)SSOP16 Fig 5. Pin configuration DHVQFN16 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 3 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer 5.2 Pin description Table 2. Pin description Symbol Pin Description A[0:2] 1, 2, 3 address input E1 4 enable input (active LOW) E2 5 enable input (active LOW) E3 6 enable input (active HIGH) Y[0:7] 15, 14, 13, 12, 11, 10, 9, 7 output (active HIGH) GND 8 ground (0 V) VCC 16 supply voltage 6. Functional description Function table[1] Table 3. Inputs Outputs E1 E2 E3 A0 A1 A2 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 H X X X X X L L L L L L L L X H X X X X L L L L L L L L X X L X X X L L L L L L L L L L H L L L H L L L L L L L L L H H L L L H L L L L L L L L H L H L L L H L L L L L L L H H H L L L L H L L L L L L H L L H L L L L H L L L L L H H L H L L L L L H L L L L H L H H L L L L L L H L L L H H H H L L L L L L L H [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care. 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 4 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit −0.5 +7 V - ±20 mA - ±20 mA - ±25 mA mA IIK input clamping current VI < −0.5 V or VI > VCC + 0.5 V [1] IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V [1] IO output current −0.5 V < VO < VCC + 0.5 V ICC supply current - 50 IGND ground current −50 - mA Tstg storage temperature −65 +150 °C Ptot total power dissipation DIP16 package [2] - 750 mW SO16, SSOP16, TSSOP16 and DHVQFN16 packages [3] - 500 mW [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For DIP16 packages: above 70 °C the value of Ptot derates linearly at 12 mW/K. [3] For SO16 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K. For SSOP16 and TSSOP16 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K. For DHVQFN16 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K. 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions 74HC238 74HCT238 Unit Min Typ Max Min Typ Max 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 - VCC 0 - VCC V VO output voltage 0 - VCC 0 - VCC V Tamb ambient temperature −40 - +125 −40 - +125 °C ∆t/∆V input transition rise and fall rate VCC = 2.0 V - - 625 - - - VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V VCC = 6.0 V - - 83 - - - ns/V 74HC_HCT238_3 Product data sheet ns/V © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 5 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V HIGH-level VI = VIH or VIL output voltage IO = −20 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −20 µA; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = −4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = −5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V 74HC238 VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage LOW-level VI = VIH or VIL output voltage IO = 20 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 µA; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V - - ±0.1 - ±1.0 - ±1.0 µA II input leakage current VI = VCC or GND; VCC = 6.0 V ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 8.0 - 80 - 160 µA CI input capacitance - 3.5 - - - - - pF 74HCT238 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = −20 µA 4.4 4.5 - 4.4 - 4.4 - V 3.98 4.32 - 3.84 - 3.7 - V IO = −4.0 mA VOL II LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 20 µA input leakage current - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA - 0.16 0.26 - 0.33 - 0.4 V VI = VCC or GND; VCC = 5.5 V - - ±0.1 - ±1.0 - ±1.0 µA 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 6 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions Min Typ Max Min Max Min Max - - 8.0 - 80 - 160 µA An inputs - 70 252 - 315 - 343 µA E1, E2 inputs - 40 144 - 180 - 196 µA - 145 522 - 653 - 711 µA - 3.5 - - - - - pF ICC supply current VI = VCC or GND; VCC = 5.5 V; IO = 0 A ∆ICC additional per input pin; supply current VI = VCC − 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A E3 input CI −40 °C to +85 °C −40 °C to +125 °C Unit input capacitance 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; test circuit see Figure 8. Symbol Parameter 25 °C Conditions −40 °C to +125 °C Min Typ Max Max (85 °C) Max Unit (125 °C) VCC = 2.0 V - 47 150 190 225 ns VCC = 4.5 V - 17 30 38 45 ns VCC = 5.0 V; CL = 15 pF - 14 - - - ns - 14 26 33 38 ns VCC = 2.0 V - 52 160 200 240 ns VCC = 4.5 V - 19 32 40 48 ns VCC = 5.0 V; CL = 15 pF - 16 - - - ns - 15 27 34 41 ns VCC = 2.0 V - 50 155 195 235 ns VCC = 4.5 V - 18 31 39 47 ns VCC = 5.0 V; CL = 15 pF - 17 - - - ns VCC = 6.0 V - 14 26 33 40 ns VCC = 2.0 V - 19 75 95 110 ns VCC = 4.5 V - 7 15 19 22 ns VCC = 6.0 V - 6 13 16 19 ns - 72 - - - pF 74HC238 tpd propagation delay An to Yn; see Figure 6 [1] VCC = 6.0 V E3 to Yn; see Figure 6 [1] VCC = 6.0 V En to Yn or see Figure 7 tt CPD transition time power dissipation capacitance see Figure 6 and Figure 7 per package; VI = GND to VCC [1] [2] [3] 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 7 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer Table 7. Dynamic characteristics GND = 0 V; test circuit see Figure 8. Symbol Parameter 25 °C Conditions −40 °C to +125 °C Min Typ Max Max (85 °C) Max Unit (125 °C) - 19 35 44 53 ns - 18 - - - ns - 20 37 46 56 ns - 20 - - - ns 74HCT238 [1] propagation delay An to Yn; see Figure 6 tpd VCC = 4.5 V VCC = 5.0 V; CL = 15 pF [1] E3 to Yn; see Figure 6 VCC = 4.5 V VCC = 5.0 V; CL = 15 pF [1] En to Yn or see Figure 7 VCC = 4.5 V - 20 35 44 53 ns VCC = 5.0 V; CL = 15 pF - 21 - - - ns tt transition time VCC = 4.5 V; see Figure 6 and Figure 7 [2] - 7 15 19 22 ns CPD power dissipation capacitance per package; VI = GND to VCC − 1.5 V [3] - 76 - - - pF [1] tpd is the same as tPHL and tPLH. [2] tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi × N + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑ (CL × VCC2 × fo) = sum of outputs. 11. Waveforms An, E3 input VM tPHL tPLH VY VM VX Yn output tTHL tTLH 001aag757 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Input (An, E3) to output (Yn) propagation delays and output transition times 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 8 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer E1, E2 input VM tPHL tPLH VY VM VX Yn output tTHL tTLH 001aag758 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. Input (E1, E2) to output (Yn) propagation delays and output transition times Table 8. Measurement points Type Input Output VM VM VX VY 74HC238 0.5VCC 0.5VCC 0.1VCC 0.9VCC 74HCT238 1.3 V 1.3 V 0.1VCC 0.9VCC 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 9 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer VI tW 90 % negative pulse VM 0V VI tf tr tr tf 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC PULSE GENERATOR VI VO RL S1 open DUT RT CL 001aad983 Test data is given in Table 9. Definitions for test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch Fig 8. Load circuit for measuring switching times Table 9. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH 74HC238 VCC 6 ns 15 pF, 50 pF 1 kΩ open 74HCT238 3V 6 ns 15 pF, 50 pF 1 kΩ open 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 10 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer 12. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 1.25 0.85 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 0.76 inches 0.17 0.02 0.13 0.068 0.051 0.021 0.015 0.049 0.033 0.014 0.009 0.77 0.73 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.03 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 95-01-14 03-02-13 SOT38-4 Fig 9. Package outline SOT38-4 (DIP16) 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 11 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.16 0.15 0.05 0.244 0.041 0.228 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 10. Package outline SOT109-1 (SO16) 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 12 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 8 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.00 0.55 8 o 0 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Fig 11. Package outline SOT338-1 (SSOP16) 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 13 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 Fig 12. Package outline SOT403-1 (TSSOP16) 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 14 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 7 y y1 C v M C A B w M C b L 1 8 Eh e 16 9 15 10 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 3.6 3.4 2.15 1.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 2.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT763-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 13. Package outline SOT763-1 (DHVQFN16) 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 15 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer 13. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT238_3 20070716 Product data sheet - Modifications: 74HC_HCT238_CNV_2 The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Added type number 74HC238BQ and 74HCT238BQ (DHVQFN16 package) 19970828 Product specification 74HC_HCT238_3 Product data sheet 74HC_HCT238_CNV_2 • - - © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 16 of 18 74HC238; 74HCT238 NXP Semiconductors 3-to-8 line decoder/demultiplexer 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] 74HC_HCT238_3 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 03 — 16 July 2007 17 of 18 NXP Semiconductors 74HC238; 74HCT238 3-to-8 line decoder/demultiplexer 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 16 July 2007 Document identifier: 74HC_HCT238_3