PHILIPS PUMH9

DISCRETE SEMICONDUCTORS
DATA SHEET
PIMH9; PUMH9; PEMH9
NPN/NPN resistor-equipped
transistors; R1 = 10 kΩ, R2 = 47 kΩ
Product data sheet
Supersedes data of 2003 Sep 15
2004 Apr 14
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
FEATURES
PIMH9; PUMH9;
PEMH9
QUICK REFERENCE DATA
• Built-in bias resistors
SYMBOL
• Simplifies circuit design
VCEO
TYP.
MAX.
UNIT
collector-emitter
voltage
−
50
V
IO
output current (DC)
−
100
mA
TR1
NPN
−
−
−
APPLICATIONS
TR2
NPN
−
−
−
• General purpose switching and amplification
R1
bias resistor
10
−
kΩ
• Inverter and interface circuits
R2
bias resistor
47
−
kΩ
• Reduces component count
• Reduces pick and place costs.
PARAMETER
• Circuit driver.
DESCRIPTION
NPN/NPN resistor-equipped transistor (see “Simplified
outline, symbol and pinning” for package details).
PRODUCT OVERVIEW
PACKAGE
TYPE NUMBER
PNP/PNP
COMPLEMENT
MARKING CODE
NPN/PNP
COMPLEMENT
PHILIPS
EIAJ
PEMH9
SOT666
−
H9
PEMB9
PEMD9
PIMH9
SOT457
SC-74
H9
−
−
SC-88
H*9(1)
PUMB9
PUMD9
PUMH9
SOT363
Note
1. * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
PINNING
TYPE NUMBER
SIMPLIFIED OUTLINE AND SYMBOL
PIN
PEMH9
PIMH9
handbook, halfpage
6
5
6
4
5
4
PUMH9
R1
R2
TR2
TR1
R2
1
2
3
1
Top view
2004 Apr 14
R1
MHC049
2
2
3
DESCRIPTION
1
emitter TR1
2
base TR1
3
collector TR2
4
emitter TR2
5
base TR2
6
collectorTR1
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PIMH9; PUMH9; PEMH9
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PEMH9
−
plastic surface mounted package; 6 leads
SOT666
PIMH9
−
plastic surface mounted package; 6 leads
SOT457
PUMH9
−
plastic surface mounted package; 6 leads
SOT363
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Per transistor
VCBO
collector-base voltage
open emitter
−
50
V
VCEO
collector-emitter voltage
open base
−
50
V
VEBO
emitter-base voltage
open collector
−
10
V
Vi
input voltage
positive
−
+40
V
negative
−
−10
V
IO
output current
−
100
mA
ICM
peak collector current
−
100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT363
note 1
−
200
mW
SOT457
note 1
−
300
mW
SOT666
notes 1 and 2
−
200
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
Per device
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT363
note 1
−
300
mW
SOT457
note 1
−
600
mW
SOT666
notes 1 and 2
−
300
mW
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
2004 Apr 14
3
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PIMH9; PUMH9; PEMH9
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Per transistor
Rth(j-a)
Tamb ≤ 25 °C
thermal resistance from junction to ambient
SOT363
note 1
625
K/W
SOT457
note 1
417
K/W
SOT666
notes 1 and 2
625
K/W
Per device
Rth(j-a)
Tamb ≤ 25 °C
thermal resistance from junction to ambient
SOT363
note 1
416
K/W
SOT457
note 1
208
K/W
SOT666
notes 1 and 2
416
K/W
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
ICBO
collector-base cut-off current
VCB = 50 V; IE = 0 A
−
−
100
nA
ICEO
collector-emitter cut-off current
VCE = 30 V; IB = 0 A
−
−
1
μA
VCE = 30 V; IB = 0 A; Tj = 150 °C
−
−
50
μA
IEBO
emitter-base cut-off current
VEB = 5 V; IC = 0 A
−
−
150
μA
hFE
DC current gain
VCE = 5 V; IC = 5 mA
100
−
−
VCEsat
collector-emitter saturation voltage IC = 5 mA; IB = 0.25 mA
−
−
100
mV
Vi(off)
input-off voltage
VCE = 5 V; IC = 100 μA
−
0.7
0.5
V
Vi(on)
input-on voltage
VCE = 0.3 V; IC = 1 mA
1.4
0.8
−
V
R1
input resistor
7
10
13
kΩ
R2
-------R1
resistor ratio
3.7
4.7
5.7
Cc
collector capacitance
−
−
2.5
2004 Apr 14
VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
4
pF
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PIMH9; PUMH9; PEMH9
PACKAGE OUTLINES
Plastic surface-mounted package; 6 leads
SOT666
D
E
A
X
Y S
S
HE
6
5
4
pin 1 index
A
1
2
e1
c
3
bp
w M A
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp
c
D
E
e
e1
HE
Lp
w
y
mm
0.6
0.5
0.27
0.17
0.18
0.08
1.7
1.5
1.3
1.1
1.0
0.5
1.7
1.5
0.3
0.1
0.1
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
04-11-08
06-03-16
SOT666
2004 Apr 14
EUROPEAN
PROJECTION
5
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PIMH9; PUMH9; PEMH9
Plastic surface-mounted package (TSOP6); 6 leads
D
SOT457
E
B
y
A
HE
6
X
v M A
4
5
Q
pin 1
index
A
A1
c
1
2
3
Lp
bp
e
w M B
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.1
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
SOT457
2004 Apr 14
REFERENCES
IEC
JEDEC
JEITA
SC-74
6
EUROPEAN
PROJECTION
ISSUE DATE
05-11-07
06-03-16
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PIMH9; PUMH9; PEMH9
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
SOT363
2004 Apr 14
REFERENCES
IEC
JEDEC
JEITA
SC-88
7
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PIMH9; PUMH9; PEMH9
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
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specifications and product descriptions, at any time and
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Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2004 Apr 14
8
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
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Printed in The Netherlands
R75/04/pp9
Date of release: 2004 Apr 14
Document order number: 9397 750 13091