INTEGRATED CIRCUITS DATA SHEET TDA6508; TDA6508A; TDA6509; TDA6509A 3-band mixer/oscillator and PLL for terrestrial tuners Product specification Supersedes data of 2005 Feb 23 2005 Mar 25 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAM 7 PINNING 8 I2C-BUS DATA FORMAT 8.1 8.2 8.3 8.4 I2C-bus address selection Write mode Read mode Power-on reset 9 LIMITING VALUES 10 HANDLING 11 THERMAL CHARACTERISTICS 12 CHARACTERISTICS 2005 Mar 25 TDA6508; TDA6508A; TDA6509; TDA6509A 13 TEST AND APPLICATION INFORMATION 13.1 Measurement circuit 14 INTERNAL PIN CONFIGURATION 15 PACKAGE OUTLINES 16 SOLDERING 16.1 Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods 16.2 16.3 16.4 16.5 2 17 DATA SHEET STATUS 18 DEFINITIONS 19 DISCLAIMERS Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners 1 TDA6508; TDA6508A; TDA6509; TDA6509A FEATURES • Single-chip 5 V mixer / oscillator and synthesizer for TV, VCR tuners, DVD-R and PC TV. • I2C bus protocol compatible with 3.3 V and 5 V microcontrollers – Address with 4 data bytes transmission (I2C-bus ‘write’ mode) 2 – Address with 1 status byte (I2C-bus ‘read’ mode) • 3-band tuner for terrestrial TV, DVD-R, VCR and PC TV. – 4 independent I2C-bus addresses. • 5 Positive-channel Metal Oxide Semiconductor (PMOS) output ports 3 GENERAL DESCRIPTION This device is a programmable 3-band mixer oscillator and synthesizer intended for LOW, MID and HIGH band TV and VCR tuners. It has three double balanced mixers and three oscillators for the LOW, MID and HIGH band respectively, a PLL synthesizer, and an IF amplifier. There are four package variants: TDA6508, TDA6509, TDA6508A and TDA6509A. Versions TDA6508; TDA6509 have a symmetrical IF amplifier; versions TDA6508A; TDA6509A have an asymmetrical IF amplifier, (see Fig.1). – 3 buffers for band selection (20 mA) – 2 buffers for general purpose, e.g. FM sound trap (5 mA). • 33 V tuning voltage output • In-lock flag • 5-step analog-to-digital converter (3 bits in I2C-bus mode) • 15-bit programmable divider The common output of all three mixers can be connected, via two output pins, to an external IF filter to enable shunted IF bandpass and/or serial filtering for improved signal handling. Two input pins are available for connecting the output of the external filter to the input of the IF amplifier. The mixer output has an impedance of 300 Ω. The IF amplifier input has an impedance of 2.5 kΩ (5 pF). • Programmable reference divider ratio (64, 80 or 128) • Programmable charge-pump current (20 or 100 µA) • Balanced mixer with a common emitter input for LOW band (single input) • Balanced mixer with a common emitter input for MID band (balanced input) • Balanced mixer with a common base input for HIGH band (balanced input) The overall gain of the tuner can be increased at low signal amplitude conditions to improve TV reception by activating a weak signal booster via the I2C-bus. • 2-pin asymmetrical oscillator for LOW band • 2-pin symmetrical oscillator for MID band There are five open-drain PMOS output ports; each port has a different drive capability. I2C-bus bit P0 enables port P0 (20 mA drain current) and the LOW band mixer oscillator. Bit P1 enables port P1 (20 mA drain current) and the MID band mixer oscillator. When ports P0 and P1 are both disabled, the HIGH band mixer oscillator is enabled. Bit P2 enables port P2 (20 mA drain current). Bit P3 enables port P3 (5 mA drain current) for general use, and bit P4 enables port P4 (5 mA drain current) for general use, and is also combined with the ADC input. When the ports are used, the sum of the drain currents must be limited to 30 mA. • 2-pin symmetrical oscillator for HIGH band • External 4-pin IF filter between mixer output (medium impedance) and IF amplifier input (high impedance) • Weak signal booster (I2C controlled switchable gain amplifier) • Low power • Low radiation • Small size • TDA6508; TDA6509: symmetrical IF amplifier output to drive a SAW filter (1.25 kΩ) The PLL synthesizer comprises a 15-bit programmable divider, a crystal oscillator, programmable reference divider, phase comparator (phase/frequency detector) combined with a charge-pump which drives an internal tuning amplifier and an output at pin CP. The CP signal current can be integrated by connecting an external RC • TDA6508A; TDA6509A: single-ended IF amplifier to drive low ohmic load (75 Ω). 2005 Mar 25 APPLICATIONS 3 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A loop filter between pin CP and pin VTUNE as shown in Fig.27. The tuning amplifier can supply up to 33 V (max.) at pin VT for controlling any of the internal oscillators via external tank circuits. The phase comparator can operate at 62.5, 50 or 31.25 kHz with a 4 MHz crystal, depending on the reference divider ratio of either 64, 80 or 128; see Table 4. An externally sourced signal having a frequency between 3.58 MHz and 4.43 MHz can be used as a reference frequency for the internal crystal oscillator at any of the reference divider ratios. Automatic frequency control is provided using an internal Analog-to-Digital Converter controlled by the voltage on pin ADC. The ADC code is read during a READ operation; see Table 8. The device requires to be addressed by five sequential serial bytes (including the address byte) via the I2C-bus to set the crystal oscillator frequency, program the five ports and to set the charge-pump current; see Table 1. The address byte can have one of four possible device addresses which are selected by applying a specific voltage to pin AS; see Table 3. In test mode, port P3 will output either half the crystal reference frequency (1⁄2fref) or half the reference divider frequency (1⁄2fdiv); see Table 5. The device can be controlled according to the I2C-bus format; see Table 1. The in-lock flag bit FL is set to logic 1 when the PLL is locked. This flag is read from the status byte on pin SDA during a READ operation; see Table 6 and Table 7. 4 QUICK REFERENCE DATA Measured over full voltage and temperature ranges. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC supply voltage 4.5 5 5.5 V ICC supply current VCC = 5 V; all ports off 43 58 74 mA fxtal crystal oscillator frequency Rxtal = 25 Ω to 300 Ω 3.58 4.0 4.43 MHz Ptot total power dissipation − 290 385 mW Tstg IC storage temperature −40 − +150 °C Tamb ambient temperature −20 − +85 °C 5 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA6508TT TSSOP32 plastic thin shrink small outline package; 32 leads body width 6.1 mm SOT487-1 TSSOP32 plastic thin shrink small outline package; 32 leads body width 6.1 mm SOT487-1 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 × 5 × 0.85 mm SOT617-1 DESCRIPTION VERSION TDA6508ATT TDA6509TT TDA6509ATT TDA6509HN TDA6509AHN 2005 Mar 25 4 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners 6 TDA6508; TDA6508A; TDA6509; TDA6509A BLOCK DIAGRAM VCC 25 (8) LOW_RFIN RF_GND MID_RFIN1 MID_RFIN2 HIGH_RFIN1 HIGH_RFIN2 5 (28) RF INPUT VHF LOW BAND 6 (27) 3 (30) 4 (29) 1 (32) 2 (31) RF INPUT VHF HIGH BAND VHF LOW BAND MIXER TDA6508 TDA6508A (TDA6509) (TDA6509A) VHF LOW BAND OSCILLATOR 31 (2) 32 (1) 30 (3) VHF HIGH BAND MIXER VHF HIGH BAND OSCILLATOR UHF MIXER UHF OSCILLATOR 28 (5) 29 (4) 26 (7) RF INPUT UHF BAND 27 (6) LOW_OSCOUT LOW_OSCIN OSC_GND MID_OSCIN1 MID_OSCIN2 HIGH_OSCIN1 HIGH_OSCIN2 SYMMETRICAL/ASYMMETRICAL IFAMPLIFIER FILTER BUFFER WEAK SIGNAL BOOSTER SAW DRIVER 23 (10) 24 (9) 9 (24) 10 (23) 7 (26) 8 (25) WSB 19 (14) PLL SYNTHESIZER XTAL_REF 17 (16) CRYSTAL OSCILLATOR 4 MHz REFERENCE DIVIDER 64, 80, 128 RSA 20 (13) fref fdiv PHASE COMPARATOR SCL SDA IN-LOCK DETECTOR AS 15-BIT FREQUENCY REGISTER T0 T1 T2 CP VT TUNE AMP CONTROL REGISTER CP I2C-BUS / 3-WIRE BUS TRANSCEIVER FL fref T2 1/2fdiv T1 T0 RSA RSB WSB PORT REGISTER 21 (12) 3-BIT ADC GATE 22 (11) T0, T1, T2 18 (15) 14 (19) 11 (22) 12 (21) 13 (20) ADC/P4 P3 (1) ‘A’ versions only. The pin numbers in parenthesis refer to versions TDA6509 and TDA6509A. Fig.1 Block diagram. 2005 Mar 25 IFAMP_IN1 IFAMP_IN2 MIX_OUT1 MIX_OUT2 CP FL 16 (17) 15 (18) IFAMP_OUT2/ IF_GND RSB 15-BIT PROGRAMMABLE DIVIDER FL CHARGE PUMP IFAMP_OUT1 5 P2 P1 P0 PLL_GND mdb250 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners 7 TDA6508; TDA6508A; TDA6509; TDA6509A PINNING PIN SYMBOL DESCRIPTION TDA6508; TDA6508A TDA6509; TDA6509A HIGH_RFIN1 1 32 HIGH band RF input 1 HIGH_RFIN2 2 31 HIGH band RF input 2 MID_RFIN1 3 30 MID band RF input 1 MID_RFIN2 4 29 MID band RF input 2 LOW_RFIN 5 28 LOW band RF input RF_GND 6 27 RF ground MIX_OUT1 7 26 mixer output 1 (to external IF filter) MIX_OUT2 8 25 mixer IF output 2 (to external IF filter) IFAMP_IN1 9 24 IF amplifier input 1 (from external IF filter) IFAMP_IN2 10 23 IF amplifier input 2 (from external IF filter) P2 11 22 HIGH band port output P1 12 21 MID band port output P0 13 20 LOW band port output P3 14 19 general purpose port - test mode output SDA 15 18 serial data input/output SCL 16 17 serial clock input XTAL_REF 17 16 crystal oscillator reference signal input ADC/P4 18 15 ADC input/general purpose port output CP 19 14 charge-pump output VT 20 13 tuning voltage output AS 21 12 address selection input PLL_GND 22 11 PLL ground IFAMP_OUT1 23 10 IF amplifier output 1 IFAMP_OUT2 24 9 IF amplifier output 2 (TDA6508 and TDA6509 only) IF_GND 24 9 IF ground (TDA6508A and TDA6509A only) VCC 25 8 supply voltage HIGH_OSCIN1 26 7 HIGH band oscillator input 1 HIGH_OSCIN2 27 6 HIGH band oscillator input 2 MID_OSCIN1 28 5 MID band oscillator input 1 MID_OSCIN2 29 4 MID band oscillator input 2 OSC_GND 30 3 oscillator ground LOW_OSCOUT 31 2 LOW band oscillator output LOW_OSCIN 32 1 LOW band oscillator input 2005 Mar 25 6 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A handbook, halfpage HIGH_RFIN1 1 32 LOW_OSCIN HIGH_RFIN2 2 31 LOW_OSCOUT MID_RFIN1 3 30 OSC_GND MID_RFIN2 4 LOW_RFIN handbook, halfpage LOW_OSCIN 1 32 HIGH_RFIN1 LOW_OSCOUT 2 31 HIGH_RFIN2 OSC_GND 3 30 MID_RFIN1 29 MID_OSCIN2 MID_OSCIN2 4 29 MID_RFIN2 5 28 MID_OSCIN1 MID_OSCIN1 5 28 LOW_RFIN RF_GND 6 27 HIGH_OSCIN2 HIGH_OSCIN2 6 27 RF_GND MIX_OUT1 7 26 HIGH_OSCIN1 HIGH_OSCIN1 7 26 MIX_OUT1 MIX_OUT2 8 VCC 8 IFAMP_IN1 9 IF_GND/IFAMP_OUT2 9 TDA6509 TDA6509A 24 IFAMP_IN1 IFAMP_OUT1 10 23 IFAMP_IN2 25 V CC TDA6508 TDA6508A 24 IFAMP_OUT2/IF_GND 23 IFAMP_OUT1 IFAMP_IN2 10 P2 11 22 PLL_GND P1 12 PLL_GND 11 22 P2 21 AS AS 12 21 P1 P0 13 20 VT VT 13 20 P0 P3 14 19 CP CP 14 19 P3 SDA 15 18 ADC/P4 SCL 16 17 XTAL_REF MDB226 Fig.2 ADC/P4 15 18 SDA XTAL_REF 16 17 SCL MDB227 Pin configuration for TDA6508 and TDA6508A (TSSOP32). 2005 Mar 25 25 MIX_OUT2 Fig.3 Pin configuration for TDA6509 and TDA6509A (TSSOP32). 7 Philips Semiconductors Product specification 16 XTAL_REF 15 ADC/P4 14 CP 13 VT 11 PLL_GND TDA6508; TDA6508A; TDA6509; TDA6509A 12 AS 10 IFAMP_OUT1 handbook, halfpage 9 IF_GND/IFAMP_OUT2 3-band mixer/oscillator and PLL for terrestrial tuners VCC 8 17 SCL HIGH_OSCIN1 7 18 SDA HIGH_OSCIN2 6 19 P3 MID_OSCIN1 5 20 P0 TDA6509 TDA6509A MID_OSCIN2 4 21 P1 OSC_GND 3 22 P2 MIX_OUT2 25 MIX_OUT1 26 RF_GND 27 LOW_RFIN 28 MID_RFIN2 29 MID_RFIN1 30 24 IFAMP_IN1 HIGH_RFIN2 31 23 IFAMP_IN2 LOW_OSCIN 1 HIGH_RFIN1 32 LOW_OSCOUT 2 MDB225 Fig.4 Pin configuration for TDA6509 and TDA6509A (HVQFN32). 8 8.1 The MSB of the first data byte DB1 indicates whether frequency data (MSB = 0) or control and band switch data will follow. Additional data bytes can be entered without the need to re-address the device until an I2C-bus STOP command is sent by the controller. I2C-BUS DATA FORMAT I2C-bus address selection The address byte ADB contains programmable module address bits MA1 and MA0 which allow up to four synthesizers to be used in the same system, and are configured by applying one of four possible voltages on pin AS; see Tables 1 and 2. For each voltage on pin AS, the resultant values of bits MA1 and MA0 are shown in Table 3. 8.2 The frequency divider register is loaded after the 8th clock pulse of byte DB2. The control register is loaded after the 8th clock pulse of byte CB, and the band switch register is loaded after the 8th clock pulse of byte BB. Write mode The write mode is defined by setting bit R/W to logic 0 in address byte ADB; see Table 1. Data bytes can be sent to the device after sending the first address byte. Four data bytes are required to fully program the device. The bus transceiver has an auto-increment facility which allows the device to be programmed by one transmission (address byte with 4 data bytes). The device can be partially programmed provided that the first data byte following the address byte is divider byte DB1 or control byte CB. 2005 Mar 25 8 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners Table 1 TDA6508; TDA6508A; TDA6509; TDA6509A I2C-bus data format for write mode BITS(1) NAME BYTE MSB LSB Address byte ADB 1 1 0 0 0 MA1 MA0 R/W = 0 Divider byte 1 DB1 0 N14 N13 N12 N11 N10 N9 N8 Divider byte 2 DB2 N7 N6 N5 N4 N3 N2 N1 N0 Control byte CB 1 CP T2 T1 T0 RSA RSB WSB Band switch byte BB X X X P4 P3 P2 P1 P0 Note 1. X = don’t care. Table 2 Function of write mode bits used in Table 1 BIT FUNCTION MA1 and MA0 module address; see Table 3 R/W read/write mode; 0 = write mode N14 to N0 programmable divider bits: N = N14 × 214 + N13 × 213 + ... + N1 × 21 + N0 CP charge-pump current control: 0: charge-pump current is 20 µA 1: charge-pump current is 100 µA T2, T1 and T0 test mode; see Table 5 RSA and RSB reference divider ratio; see Table 4 WSB Weak Signal Booster control: 0: normal mode - no gain increase: external IF filter used 1: Weak Signal Booster activated: IF filter by-passed P0, P1, P2, P3, P4 port P0 to P4 control: 0: corresponding port is off; high impedance state (default) 1: corresponding port is on. Table 3 Module address selection bits MA1 MA0 VOLTAGE APPLIED TO PIN AS 0 0 0 V to 0.1VCC 0 1 0.2VCC to 0.3VCC or open-circuit 1 0 0.4VCC to 0.6VCC 1 1 0.9VCC to 1.0VCC 2005 Mar 25 9 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners Table 4 TDA6508; TDA6508A; TDA6509; TDA6509A Reference divider ratio selection bits RSA RSB FREQUENCY STEP (kHz)(1) REFERENCE DIVIDER RATIO X 0 80 50 0 1 128 31.25 1 1 64 62.5 Note 1. Crystal oscillator frequency or externally sourced reference frequency of 4 MHz at pin XTAL_REF. Table 5 Test mode selection bits T2 T1 T0 TEST MODE 0 0 0 normal mode (read and write mode bytes allowed) 0 0 1 normal mode (read and write mode bytes allowed)(1) 0 1 0 charge-pump is off(2) 0 1 1 byte BB ignored 1 1 0 charge-pump sinks current 1 1 1 charge-pump sources current 1 0 0 1⁄ 2fref is output from port P3(3) 1 1⁄ 2fdiv is output from port P3(3) 1 0 Notes 1. This is the default mode at power-on reset. 2. 1⁄ 2fdiv is output from port P3 when the charge-pump is off. 3. Port P3 cannot be used when these test modes are active. 8.3 Read mode The internal ADC can be used to apply AFC information to a microcontroller in the IF section of the television via status byte bits A0, A1 and A2. Up to five voltage levels can be applied to the ADC input pin ADC; the resultant values of bits A2, A1 and A0 are shown in Table 8. The read mode is defined by setting bit R/W to logic 1 in address byte ADB; see Table 6. After the slave address has been recognized, the device generates an acknowledge pulse, and status byte SB is transferred on the SDA line (MSB first). Data is valid on the SDA line when pin SCL is HIGH. A second data byte can be read from the device if the microcontroller generates an acknowledge on the SDA line (master acknowledge). End of transmission will occur if no master acknowledge is asserted. The device will then release the data line to allow the microcontroller to generate a STOP condition. Bit POR is set to logic 1 at power-on. This bit is reset when an end-of-data is detected by the device at the end of a read sequence. Bit FL controls the PLL by indicating when the loop is locked (bit FL = 1). 2005 Mar 25 10 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners Table 6 TDA6508; TDA6508A; TDA6509; TDA6509A Read data format BIT NAME BYTE MSB(1) LSB Address byte ADB 1 1 0 0 0 MA1 MA0 R/W = 1 Status byte SB POR FL 1 1 1 A2 A1 A0 Note 1. MSB is transmitted first. Table 7 Description of the bits used in Table 6 BIT DESCRIPTION MA1 and MA0 programmable address bits; see Table 3 R/W read/write mode selection; 1 = read mode POR Power-on reset flag: 0: after end of the first read sequence 1: at Power-on FL in-lock flag: 0: loop is not locked 1: loop is locked A2, A1 and A0 Table 8 digital outputs of the 5-level ADC; see Table 8 Digital outputs for analog to digital converter (note 1) A2 A1 A0 VOLTAGE APPLIED TO PIN ADC 0 0 0 0 VCC to 0.15 VCC 0 0 1 0.15 VCC to 0.3 VCC 0 1 0 0.3 VCC to 0.45 VCC 0 1 1 0.45 VCC to 0.6 VCC 1 0 0 0.6 VCC to 1 VCC Note 1. Accuracy is ±0.03 × VCC. 8.4 Power-on reset The threshold level for the power-on reset supply voltage VPOR is set to 3.2 V at room temperature. Below this threshold, the device is reset to the power-on state. The following actions take place In the power-on state: • The charge-pump current is set to 100 µA • Test bits T2, T1 and T0 are set to logic 001; the charge-pump can either sink or source current • The Weak signal booster is disabled • All ports are off and the HIGH band is selected by default. 2005 Mar 25 11 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners Table 9 TDA6508; TDA6508A; TDA6509; TDA6509A Default setting of the bits at power-on reset BITS(1) NAME BYTE MSB LSB Address byte ADB 1 1 0 0 0 MA1 MA0 X Divider byte 1 DB1 0 X X X X X X X Divider byte 2 DB2 X X X X X X X X Control byte CB 1 1 0 0 1 X X 0 Band switch byte BB X X X 0 0 0 0 0 Note 1. X = don’t care. 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); note 1. PIN SYMBOL TDA6508; TDA6508A PARAMETER TDA6509; TDA6509A MIN. MAX. −0.3 +6 UNIT VCC 25 5.5 V VPn 11, 12, 13, 14, 18 22, 21, 20, 19, 15 PMOS port output voltage −0.3 VCC + 0.3 V IPn 11, 12, 13 22, 21, 20 −20 0 mA −5 0 mA 8 DC supply voltage operating supply PMOS port output current 4.5 V 14, 18 19, 15 VVT 20 13 tuning voltage output −0.3 +35 V VSCL 16 17 serial clock input voltage −0.3 +6 V VSDA 15 18 serial data input or output voltage −0.3 +6 V ISDA 15 18 serial data output current 0 VAS 21 12 address selection input voltage −0.3 +6 V Vxtal 17 16 crystal input voltage −0.3 VCC + 0.3 V tsc(max) − − maximum short-circuit time (all pins to VCC and all pins to all grounds) − 10 s Tstg − − storage temperature −40 +150 °C Tamb − − ambient temperature −20 +85 °C Tj − − junction temperature − +150 °C +10 mA Note 1. Maximum ratings can not be exceeded, not even momentarily without causing irreversible IC damage. Maximum ratings can not be accumulated. 10 HANDLING Human Body Model: C = 100 pF and R = 1500 Ω. All pins withstand 2000 V in accordance with specification EIA/JESD22-A114-A. Machine model: C = 200 pF and R = 0 Ω. All pins withstand 200 V in accordance with specification EIA/JESD22-A115-A. 2005 Mar 25 12 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A 11 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient TYP. UNIT SOT487-5(1) 115 K/W in free air - SOT487-4(1) 125 K/W in free air - SOT617-1 31 K/W in free air - Note 1. JEDEC conditions apply to single layer PCB. 12 CHARACTERISTICS VCC = 5 V, Tamb = 25 °C; TDA6508 and TDA6509 values measured with RL = 1.25 kΩ and TDA6508A and TDA6509A values measured with RL = 75 Ω; Weak signal booster off; measured using the PAL application circuit shown in Figure 27; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VCC supply voltage ICC supply current 4.5 5.0 5.5 V at VCC = 5 V; all ports off 43 58 74 mA FUNCTIONAL RANGE VPOR power-on reset supply voltage power-on reset activates below this voltage − 3.2 − V N divider ratio 15-bit frequency word 64 − 32767 − fxtal crystal oscillator frequency Rxtal = 25 Ω to 300 Ω 3.58 4.0 4.43 MHz Zxtal input impedance (absolute value) fxtal = 4 MHz 1000 1200 − Ω −10 − +120 µA one buffer output is on and sourcing 5 mA − 0.25 0.4 V one buffer output is on and sourcing 20 mA − 0.25 0.4 V PMOS PORTS: PINS P0, P1, P2, P3, P4 IL(Pn) leakage current VCC = 5.5 V; VPn = 0 V or 5.5 V VPn(sat) output saturation voltage VPn(sat) = VCC − VPn ADC INPUT: PIN ADC (IN I2C BUS MODE) VADC ADC input voltage see Table 8 0 − VCC V IADC(H) HIGH level input current VADC = VCC − − 100 µA IADC(L) LOW level input current VADC = 0 V −10 − − µA ADDRESS SELECTION INPUT: PIN AS IAS(H) HIGH level input current VAS = 5 V − − 10 µA IAS(L) LOW level input current VAS = 0 V −10 − − µA 2005 Mar 25 13 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners SYMBOL PARAMETER TDA6508; TDA6508A; TDA6509; TDA6509A CONDITIONS MIN. TYP. MAX. UNIT CLOCK AND DATA INPUTS: PINS SCL AND SDA VSCL(L), VSDA(L) LOW level input voltage 0 − 1.5 V VSCL(H), VSDA(H) HIGH level input voltage 2.3 − 5.5 V ISCL(H), ISDA(H) HIGH level input current Vbus = 5.5 V; VCC = 0 V − − 10 µA Vbus = 5.5 V; VCC = 5.5 V − − 10 µA ISCL(L), ISDA(L) LOW level input current Vbus = 1.5 V; VCC = 0 V − − 10 µA Vbus = 0 V; VCC = 5.5 V −10 − − µA DATA OUTPUT: PIN SDA IL(SDA) leakage current VSDA = 5.5 V − − 10 µA VSDA(H) HIGH level output voltage ISDA = 3 mA (sink current) − − 0.4 V − − 400 kHz CLOCK FREQUENCY (I2C-BUS MODE) fclk clock frequency CHARGE-PUMP OUTPUT: PIN CP |ICP(H)| HIGH level input current (absolute value) CP = 1 − 100 115 µA |ICP(L)| LOW level input current (absolute value) CP = 0 15 20 − µA IL(CP) off-state leakage current T2 = 0; T1 = 1; T0 = 0 −15 0 +15 nA TUNING VOLTAGE OUTPUT: PIN VT Itune(off) leakage current when switched-off T2 = 1; T1 = 1; T0 = 0; tuning supply is 33 V − − 10 µA Vo(tune) output voltage when loop is closed T2 = 0; T1 = 0; T0 = 1; RL = 33 kΩ; tuning supply is 33 V 0.3 − 32.7 V 40 − 800 MHz 43.25 − 161.25 MHz fRF = 46 MHz; see Fig.10 22 25 28 dB fRF = 164 MHz; see Fig.10 22 25 28 dB fRF = 46 MHz; see Fig.11 18 21 24 dB fRF = 164 MHz; see Fig.11 18 21 24 dB fRF = 50 MHz; see Figs 12 and 13 − 8 10 dB fRF = 150 MHz; see Fig.13 − 8 10 dB LOW MIXER (INCLUDING IF PREAMPLIFIER) fRF(o) RF operational frequency fRF RF frequency fpc; note 1 Gv voltage gain TDA6508; TDA6509; IF output loaded with 1.25 kΩ TDA6508A; TDA6509A; IF output loaded with 75 Ω NF 2005 Mar 25 noise figure 14 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners SYMBOL Vo PARAMETER TDA6508; TDA6508A; TDA6509; TDA6509A CONDITIONS output voltage (causing 1% TDA6508; TDA6509 cross-modulation in channel) fRF = 43.25 MHz; see Fig.15 fRF = 161.25 MHz; see Fig.15 MIN. TYP. MAX. UNIT 114 117 − dBµV 114 117 − dBµV TDA6508A; TDA6509A fRF = 43.25 MHz; see Fig.16 106 109 − dBµV fRF = 161.25 MHz; see Fig.16 106 109 − dBµV Vi input voltage (causing fRF = 161.25 MHz; note 2 pulling in channel at 750 Hz) − 90 − dBµV gos optimum source fRF = 50 MHz conductance for noise figure − 0.7 − mS gi input conductance fRF = 43.25 MHz; see Fig.5 − 0.3 − mS fRF = 161.25 MHz; see Fig.5 − 0.3 − mS fRF = 43.25 to 161.25 MHz; see Fig.5 − 1 − pF 60 − 600 MHz Ci input capacitance LOW OSCILLATOR fosc(o) oscillator operational frequency fosc oscillator frequency 82.15 − 200.15 MHz ∆fosc(V) oscillator frequency variation ∆VCC = 5%; note 4 with supply voltage ∆VCC = 10%; note 4 − 20 − kHz − 50 − kHz oscillator frequency variation ∆T = ±25 °C; with compensation; with temperature note 5 − 900 − kHz − 1700 − kHz − −110 −107 dBc/Hz − −90 −87 dBc/Hz 90 − mV − − 2.12 kHz 40 − 800 MHz 154.25 − 447.25 MHz ∆fosc(T) note 3 ∆T = 35 °C; without compensation; note 5 Φosc phase noise, carrier-to-noise worst case in the frequency range sideband ±100 kHz frequency offset ±10 kHz frequency offset RSC(p-p) ripple susceptibility of VCC (peak-to-peak value) 4.75 V <VCC <5.25 V; worst case in 15 the frequency range; ripple frequency 500 kHz; note 6 FMmod FM modulation caused by I2C communication worst case; note 7 MID MIXER (INCLUDING IF PREAMPLIFIER) fO(RF) RF operational frequency fRF RF frequency 2005 Mar 25 fpc; note 1 15 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners SYMBOL Gv PARAMETER voltage gain TDA6508; TDA6508A; TDA6509; TDA6509A CONDITIONS MIN. TYP. MAX. UNIT TDA6508; TDA6509; IF output loaded with 1.25 kΩ fRF = 157 MHz; see Fig.17 22 25 28 dB fRF = 450 MHz; see Fig.17 22 25 28 dB fRF = 157 MHz; see Fig.18 18 21 24 dB fRF = 450 MHz; see Fig.18 18 21 24 dB fRF = 150 MHz; see Figs 12 and 13 − 8 10 dB fRF = 300 MHz; see Figs 12 and 13 TDA6508A; TDA6509A; IF output loaded with 75 Ω NF noise figure − 8 10 dB Vo output voltage (causing 1% TDA6508; TDA6509 cross-modulation in channel) fRF = 154.25 MHz; see Fig.19 114 117 − dBµV fRF = 447.25 MHz; see Fig.19 114 117 − dBµV fRF = 154.25 MHz; see Fig.20 106 109 − dBµV fRF = 447.25 MHz; see Fig.20 106 109 − dBµV TDA6508; TDA6509A Vi input voltage (causing fRF = 447.25 MHz; note 2 pulling in channel at 750 Hz) − 90 − dBµV gos optimum source fRF = 150 MHz conductance for noise figure fRF = 300 MHz − 0.9 − mS − 1.5 − mS input conductance gi Ci input capacitance fRF = 154.25 MHz − 0.21 − mS fRF = 447.25 MHz − 1.8 − mS fRF = 154.25 to 447.25 MHz − 0.6 − pF 600 MHz MID OSCILLATOR fosc(o) oscillator operational frequency fosc oscillator frequency 193.15 − 486.15 MHz ∆fosc(V) oscillator frequency variation ∆VCC = 5%; note 4 with supply voltage ∆VCC = 10%; note 4 − 15 − kHz − 40 − kHz oscillator frequency variation ∆T = ±25 °C; with compensation; with temperature note 5 − 1200 − kHz − 2000 − kHz − −109 −106 dBc/Hz − −87 −86 dBc/Hz 70 − mV − 2.12 kHz ∆fosc(T) 60 note 3 ∆T = 35 °C; without compensation; note 5 Φosc phase noise, carrier-to-noise worst case in the frequency range sideband ±100 kHz frequency offset ±10 kHz frequency offset RSC(p-p) ripple susceptibility of VCC (peak-to-peak value) 4.75 V <VCC <5.25 V; worst case in 15 the frequency range; ripple frequency 500 kHz; note 6 FMmod FM modulation caused by I2C communication worst case; note 7 2005 Mar 25 16 − Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners SYMBOL PARAMETER TDA6508; TDA6508A; TDA6509; TDA6509A CONDITIONS MIN. TYP. MAX. UNIT HIGH MIXER (INCLUDING IF PREAMPLIFIER) fO(RF) RF operational frequency fRF RF frequency fpc; note 1 200 900 MHz 439.25 − 863.25 MHz Gv voltage gain TDA6508; TDA6509; IF output loaded with 1.25 kΩ fRF = 442 MHz; see Fig.21 33 36 39 dB fRF = 866 MHz; see Fig.21 33 36 39 dB fRF = 442 MHz; see Fig.22 29 32 35 dB fRF = 866 MHz; see Fig.22 29 32 35 dB fRF = 439.25 MHz; see Fig.23 − 7 9 dB fRF = 863.25 MHz; see Fig.23 TDA6508A; TDA6509A; IF output loaded with 75 Ω NF noise figure (not corrected for image) − 7 9 dB Vo output voltage (causing 1% TDA6508; TDA6509 cross-modulation in channel) fRF = 439.25 MHz; Fig.25 114 117 − dBµV fRF = 863.25 MHz; Fig.25 114 117 − dBµV 106 109 − dBµV TDA6508A; TDA6509A fRF = 439.25 MHz; Fig.26 106 109 − dBµV Vi input voltage (causing fRF = 863.25 MHz; note 2 pulling in channel at 750 Hz) − 75 − dBµV Zi input impedance (RS + jωLS) RS at fRF = 439.25 MHz − 28 − Ω fRF = 863.25 MHz; Fig.26 RS at fRF = 863.25 MHz − 34 − Ω LS at fRF = 439.25 MHz − 8 − nH LS at fRF = 863.25 MHz − 8 − nH 1000 MHz HIGH OSCILLATOR fosc(o) oscillator operational frequency fosc oscillator frequency ∆fosc(V) ∆fosc(T) 300 478.15 − 902.15 MHz oscillator frequency variation ∆VCC = 5%; note 4 with supply voltage ∆VCC = 10%; note 4 − 40 − kHz − 80 − kHz oscillator frequency variation ∆T = ±25 °C; with compensation; with temperature note 5 − 2700 − kHz − 4100 − kHz − −105 −102 dBc/Hz note 3 ∆T = 35 °C; without compensation; note 5 Φosc phase noise, carrier-to-noise worst case in the frequency range sideband ±100 kHz frequency offset ±10 kHz frequency offset RSC(p-p) 2005 Mar 25 ripple susceptibility of VCC (peak-to-peak value) − 4.75 V <VCC <5.25 V; worst case in 15 the frequency range; ripple frequency 500 kHz; note 6 17 −85 −82 dBc/Hz 50 − mV Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners SYMBOL FMmod PARAMETER FM modulation caused by I2C communication TDA6508; TDA6508A; TDA6509; TDA6509A CONDITIONS MIN. TYP. MAX. UNIT worst case; note 7 − − 3.0 kHz TDA6508; TDA6509; IF = 36.15 MHz 13 16 − dB TDA6508A; TDA6509A; IF = 36.15 MHz 7 10 − dB 60 MHz WEAK SIGNAL BOOSTER ∆Gv(WSB) gain increase when the weak signal booster mode is activated IF PREAMPLIFIER fO(IF) IF operational frequency Zo output impedance (RS + jωLS) 5 TDA6508; TDA6509 RS at 36.15 MHz − 100 − Ω LS at 36.15 MHz − 52 − nH RS at 36.15 MHz − 40 − Ω LS at 36.15 MHz − 12 − nH TDA6508A; TDA6509A REJECTION AT THE IF OUTPUT INTdiv level of divider interferences in the IF signal worst case; note 8 − 24 − dBµV IRxtal crystal oscillator interferences rejection worst case in the frequency range; note 9 60 80 − dBc Rref reference frequency rejection worst case in the frequency range; fref = 62.5 kHz; note 10 60 66 − dBc INTSO2 channel SO2 beat Vpc = 80 dBµV; note 11 60 66 − dBc Notes 1. The range of fRF is defined by the range of fosc and I; fpc = picture carrier frequency. 2. Vi is the level of fRF (100% amplitude modulated with 11.89 kHz) that causes the frequency of the oscillator signal to deviate by 750 Hz; it produces sidebands 30 dB below the level of the oscillator signal. 3. Limits are related to the tank circuits used in Fig.27; frequency bands may be adjusted by the choice of external components. 4. The oscillator frequency shift is defined as a change in oscillator frequency when the supply voltage varies from VCC = 5 V to 4.75 V (or 5 V to 4.5 V) or from VCC = 5 V to 5.25 V (or 5 V to 5.5 V). The oscillator is free running during this measurement. 5. The oscillator frequency drift is defined as a change in oscillator frequency when the ambient temperature varies from Tamb = 25 °C to 50 °C (60 °C max.) or from Tamb = 25 °C to 0 °C. The oscillator is free running during this measurement. For ∆T = ±25 °C measurements, the tank circuit has temperature compensated values; for ∆T = 35 °C measurements, the tank circuit has non-temperature compensated values. 6. The ripple susceptibility is measured with a 500 kHz ripple signal applied to the supply voltage. The level of the ripple signal is increased until a difference of 53.5 dB occurs between the level of the IF carrier, fixed at 110 dBµV for TDA6508; TDA6509 or 100 dBµV for TDA6508A; TDA6509A, and the sideband components. 7. FM modulation of the local oscillator resulting from I2C-bus communication is measured at the IF output using a modulation analyzer with a peak-to-peak detector and a post detection filter of 20 Hz to 100 kHz. I2C-bus messages sent to the tuner address the tuner without changing the contents of the PLL registers. The maximum I2C-bus clock rate is 400 kHz. The I2C-bus pull-up resistor values are 1.5 kΩ. 2005 Mar 25 18 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A 8. This is the level of signals close to the IF frequency which can interfere with the dividers. Typical interference signals are channel S3: fosc = 256.15 MHz, 5⁄32 fosc = 40.02 MHz. The LOW and MID RF inputs must not be connected to any load or cable; the HIGH RF inputs are connected to a hybrid (balun). 9. Crystal oscillator interference is the 4 MHz sidebands produced by the crystal oscillator. The rejection must be greater than 60 dB for an IF output signal of 110 dBµV for versions TDA6508; TDA6509 or 100 dBµV for versions TDA6508A; TDA6509A. 10. Reference frequency rejection measures the level of reference frequency sidebands with respect to the sound sub-carrier fssc. 11. Channel SO2 beat is the interfering product of the picture carrier frequency fpc, fIF and fOSC in channel SO2: fBEAT = fosc − 2 × fIF = 37.35 MHz. Another possible mechanism is: 2 × fpc − fosc. For the measurement, VRF = 80 dBµV. 1 handbook, full pagewidth 2 0.5 −j ∞ 2 1 0.5 43.25 MHz 0 +j 161.25 MHz 0.5 2 1 MDB220 Fig.5 Input admittance (S11) of the LOW band mixer (43.25 to 161.25 MHz); YO = 20 mS. 2005 Mar 25 19 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A 1 handbook, full pagewidth 2 0.5 −j ∞ 2 1 0.5 0 154.25 MHz +j 447.25 MHz 0.5 2 MDB221 1 Fig.6 Input admittance (S11) of the MID band mixer (154.25 to 447.25 MHz); YO = 10 mS. 1 handbook, full pagewidth 2 0.5 863.25 MHz 439.25 MHz +j 0.5 0 1 ∞ 2 −j 0.5 2 1 MDB222 Fig.7 Input impedance (S11) of the HIGH band mixer (439.25 to 863.25 MHz); ZO = 100 Ω. 2005 Mar 25 20 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A 1 handbook, full pagewidth 2 0.5 +j 36.15 MHz 0.5 0 1 ∞ 2 −j 0.5 2 MDB223 1 Fig.8 Output impedance of TDA6508; TDA6509; ZO = 100 Ω. 1 handbook, full pagewidth 2 0.5 +j 0.5 0 36.15 MHz 1 ∞ 2 −j 0.5 2 1 MDB224 Fig.9 Output impedance of TDA6508A; TDA6509A; ZO = 50 Ω. 2005 Mar 25 21 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A 13 TEST AND APPLICATION INFORMATION 50 Ω signal source LOW_RFIN IFAMP_OUT1 Vo Vi(meas) V e Vi 50 Ω D.U.T. 2x5 turns IFAMP_OUT2 GND RMS voltmeter spectrum analyzer Vo(meas) 50 Ω 2 turns N1/N2 = 5 mdb265 Zi >> 50 Ω ⇒ Vi = 2 × Vi(meas) = 80 dBµV. Vi = Vi(meas) + 6 dB = 80 dBµV. Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss). Vo Gv = 20 log -----Vi PAL fIF = 36.15 MHz. Fig.10 Gain measurement in the LOW-band of the TDA6508; TDA6509. handbook, full pagewidth 50 Ω signal source LOW_RFIN 27 Ω IFAMP_OUT1 e Vi(meas) V 50 Ω Vi D.U.T. RMS voltmeter spectrum analyzer Vo Vo(meas) 50 Ω MDB266 Zi >> 50 Ω ⇒ Vi = 2 × Vi(meas) = 80 dBµV. Vi = Vi(meas) + 6 dB = 80 dBµV. Vo = Vo(meas) + 3.75 dB. Vo Gv = 20 log -----Vi PAL fIF = 36.15 MHz. Fig.11 Gain measurement in the LOW-band of the TDA6508A; TDA6509A. 2005 Mar 25 22 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners I1 handbook, full pagewidth BNC TDA6508; TDA6508A; TDA6509; TDA6509A I3 PCB C1 BNC L1 plug C2 PCB C3 plug I2 RIM-RIM RIM-RIM C4 (a) (b) (a) fRF = 50 MHz: LOW band mixer frequency response measured = 57 MHz, loss = 0 dB. image suppression = 16 dB. C1 = 9 pF. C2 = 15 pF. L1 = 7 turns (∅ 5.5 mm, wire ∅ = 0.5 mm). l1 = semi-rigid (RIM) cable, length = 5 cm (33 dB/100 m, 50 Ω and 96 pF/m). FCE578 (b) For fRF = 150 MHz: MID band mixer frequency response measured = 150.3 MHz, loss = 0 dB. image suppression = 13 dB. C3 = 5 pF. C4 = 25 pF. l2 = semi-rigid (RIM) cable, length = 30 cm. l3 = semi-rigid (RIM) cable, length = 5 cm (33 dB/100 m, 50 Ω and 96 pF/m). Fig.12 Input circuit for optimum noise figure in LOW and MID-bands. NOISE SOURCE BNC RIM LOW_RFIN or MID_RFIN NOISE METER IFAMP_OUT1 INPUT CIRCUIT D.U.T. 2x5 turns 2 turns IFAMP_OUT2 GND N1/N2 = 5 mdb263 NF = NFmeas − input circuit loss (dB). Fig.13 Noise figure measurement in the LOW and MID-bands of the TDA6508; TDA6509. 2005 Mar 25 23 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners handbook, full pagewidth NOISE SOURCE BNC RIM TDA6508; TDA6508A; TDA6509; TDA6509A LOW_RFIN or MID_RFIN 27 Ω IFAMP_OUT1 INPUT CIRCUIT D.U.T. NOISE FIGURE METER MDB264 NF = fmeas − input circuit loss (dB). Fig.14 Noise figure measurement in the LOW and MID-bands of the TDA6508A; TDA6509A. unwanted signal 50 Ω source handbook, full pagewidth FILTER A AM = 30% eu 18 dB attenuator LOW_RFIN C IFAMP_OUT1 38.9 MHz HYBRID 50 Ω ew B wanted signal source Vi D Vo D.U.T. 2x5 turns IFAMP_OUT2 50 Ω 2 turns N1/N2 = 5 V Vo(meas) modulation analyzer 50 Ω RMS voltmeter MDB261 Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss). Wanted output signal at picture carrier frequency fRF(w); Vo(w) = 110 dBµV. Unwanted output signal at sound sub-carrier frequency fRF(u); AM = 30%; AF = 2 kHz. Measuring the level of unwanted signal causing 0.3% AM in the wanted signal. fRF(w) = 43.25 MHz (min); 161.25 MHz (max). fRF(u) = 48.75 MHz (min); 166.75 MHz (max). fosc = 82.15 MHz (min); 200.15 MHz (max.). Fig.15 Cross-modulation measurement in the LOW-band of the TDA6508; TDA6509. 2005 Mar 25 24 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners handbook, full pagewidth 50 Ω unwanted signal source FILTER A LOW_RFIN C AM = 30% eu TDA6508; TDA6508A; TDA6509; TDA6509A 27 Ω IFAMP_OUT1 HYBRID 38.9 MHz D.U.T. Vi 50 Ω B Vo D wanted signal source ew 18 dB attenuator modulation analyzer 50 Ω V Vo(meas) 50 Ω RMS voltmeter MDB262 Vo = Vo(meas) + 3.75 dB (transformer ratio N1/N2 and transformer loss). Wanted output signal at picture carrier frequency fRF(w); Vo(w) = 100 dBµV. Unwanted output signal at sound sub-carrier frequency fRF(u); AM = 30%; AF = 2 kHz. Measuring the level of unwanted signal causing 0.3% AM in the wanted signal. fRF(w) = 43.25 MHz (min.); 161.25 MHz (max.). fRF(u) = 48.75 MHz (min.); 166.75 MHz (max.). fosc = 82.15 MHz (min.); 200.15 MHz (max.). Fig.16 Cross-modulation measurement in the LOW-band of the TDA6508A; TDA6509A. 50 Ω signal source A MID_RFIN1 C IFAMP_OUT1 e Vi(meas) V 50 Ω HYBRID Vi D.U.T. spectrum analyzer Vo Vo(meas) 2x5 turns 2 turns IFAMP_OUT2 RMS voltmeter B D MID_RFIN2 N1/N2 = 5 50 Ω mdb259 Zi >> 50 Ω, symmetrical input. Hybrid loss = 1 dB. Vi = Vi(meas) − loss + 6 + 3 = 80 dBµV. Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss). Vo Gv = 20 log -----Vi PAL fIF = 36.15 MHz. Fig.17 Gain measurement in the MID-band of the TDA6508; TDA6509. 2005 Mar 25 25 50 Ω Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A handbook, full pagewidth 50 Ω signal source A MID_RFIN1 C 27 Ω IFAMP_OUT1 Vi(meas) V e 50 Ω D.U.T. Vi HYBRID spectrum analyzer Vo B 50 Ω Vo(meas) MID_RFIN2 D RMS voltmeter 50 Ω MDB260 Zi >> 50 Ω symmetrical input. Hybrid loss = 1 dB. Vi = Vi(meas) − loss + 6 + 3 = 80 dBµV. Vo = Vo(meas) + 3.75 dB. Vo Gv = 20 log -----Vi PAL fIF = 36.15 MHz. Fig.18 Gain measurement in the MID-band of the TDA6508A; TDA6509A. unwanted handbook, full pagewidth signal 50 Ω source eu FILTER A C A C AM = 30% 18 dB attenuator MID_RFIN1 IFAMP_OUT1 38.9 MHz Vi HYBRID HYBRID Vo 2x5 turns 2 turns V Vo(meas) 50 Ω IFAMP_OUT2 50 Ω ew D.U.T. modulation analyzer wanted signal source B B D 50 Ω D MID_RFIN2 50 Ω N1/N2 = 5 RMS voltmeter MDB253 Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss). Wanted output signal at picture carrier frequency fRF(w); Vo(w) = 110 dBµV. Unwanted output signal at sound sub-carrier frequency fRF(u); AM = 30%; AF = 2 kHz. Measuring the level of unwanted signal causing 0.3% AM in the wanted signal. fRF(w) = 154.25 MHz (min.); 447.25 MHz (max.). fRF(u) = 159.75 MHz (min.); 452.75 MHz (max.). fosc = 193.15 MHz (min.); 486.15 MHz (max.). Fig.19 Cross-modulation measurement in the MID-band of the TDA6508; TDA6509. 2005 Mar 25 26 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A handbook, full pagewidth unwanted 50 Ω signal source FILTER A AM = 30% eu A C C MID_RFIN1 27 Ω IFAMP_OUT1 Vi HYBRID 38.9 MHz D.U.T. HYBRID Vo 50 Ω B wanted signal source ew 18 dB attenuator B D 50 Ω D modulation analyzer 50 Ω V Vo(meas) MID_RFIN2 RMS voltmeter 50 Ω MDB254 Vo = Vo(meas) + 3.75 dB. Wanted output signal at fpix; Vo(w) = 100 dBµV. Unwanted output signal at fsnd; AM = 30%; AF = 2 kHz. Measuring the level of unwanted signal causing 0.3% AM in the wanted signal. fRF(w) = 154.25 MHz (min.); 447.25 MHz (max.). fRF(u) = 159.75 MHz (min.); 452.75 MHz (max.). fosc = 193.15 MHz (min.); 486.15 MHz (max.). Fig.20 Cross-modulation measurement in the MID-band of the TDA6508A; TDA6509A. 50 Ω signal source A HIGH_RFIN1 C IFAMP_OUT1 e Vi(meas) V 50 Ω HYBRID Vi D.U.T. IFAMP_OUT2 RMS voltmeter B D HIGH_RFIN2 spectrum analyzer Vo Vo(meas) 2x5 turns 2 turns N1/N2 = 5 50 Ω mdb257 Hybrid loss = 1 dB. Vi = Vi(meas) − loss = 70 dBµV. Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss). Vo Gv = 20 log -----Vi PAL fIF = 36.15 MHz. Fig.21 Gain measurement in the HIGH-band of the TDA6508; TDA6509. 2005 Mar 25 27 50 Ω Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners handbook, full pagewidth TDA6508; TDA6508A; TDA6509; TDA6509A signal source 50 Ω A HIGH_RFIN1 C 27 Ω IFAMP_OUT1 Vi(meas) V e 50 Ω HYBRID Vi spectrum analyzer D.U.T. Vo B Vo(meas) 50 Ω HIGH_RFIN2 D RMS voltmeter 50 Ω MDB258 Hybrid loss = 1 dB. Vi = Vi(meas) − loss = 70 dBµV. Vo = Vo(meas) + 3.75 dB. Vo Gv = 20 log -----Vi PAL fIF = 36.15 MHz. Fig.22 Gain measurement in the HIGH-band of the TDA6508A; TDA6509A. NOISE SOURCE A C HIGH_RFIN1 NOISE METER IFAMP_OUT1 HYBRID D.U.T. 2x5 turns 2 turns IFAMP_OUT2 B D N1/N2 = 5 HIGH_RFIN2 mdb255 50 Ω Hybrid loss = 1 dB. NF = NFmeas − hybrid loss. Fig.23 Noise figure measurement in the HIGH-band of the TDA6508; TDA6509. 2005 Mar 25 28 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A handbook, full pagewidth A NOISE SOURCE C HIGH_RFIN1 27 Ω NOISE FIGURE METER IFAMP_OUT1 HYBRID B D D.U.T. HIGH_RFIN2 MDB256 50 Ω Hybrid loss = 1 dB. NF = NFmeas − hybrid loss. Fig.24 Noise figure measurement in the HIGH-band of the TDA6508A; 6509A. unwanted handbook, full pagewidth signal 50 Ω source eu FILTER A C A C AM = 30% 18 dB attenuator HIGH_RFIN1 IFAMP_OUT1 38.9 MHz Vi HYBRID HYBRID Vo 2x5 turns 2 turns V Vo(meas) 50 Ω IFAMP_OUT2 50 Ω ew D.U.T. modulation analyzer wanted signal source B B D 50 Ω D HIGH_RFIN2 50 Ω N1/N2 = 5 RMS voltmeter MDB251 Vo = Vo(meas) + 15 dB (transformer ratio N1/N2 and transformer loss). Wanted output signal at picture carrier frequency fRF(w); Vo(w) = 110 dBµV. Unwanted output signal at sound sub-carrier frequency fRF(u); AM = 30%; AF = 2 kHz. Measuring the level of unwanted signal causing 0.3% AM in the wanted signal. fRF(w) = 439.25 MHz (min.); 863.25 MHz (max.). fRF(u) = 444.75 MHz (min.); 868.75 MHz (max.). fosc = 478.15 MHz (min.); 902.15 MHz (max.). Fig.25 Cross-modulation measurement in the HIGH-band of the TDA6508; TDA6509. 2005 Mar 25 29 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners handbook, full pagewidth 50 Ω unwanted signal source FILTER A A C C AM = 30% eu TDA6508; TDA6508A; TDA6509; TDA6509A HIGH_RFIN1 27 Ω IFAMP_OUT1 HYBRID Vi HYBRID 38.9 MHz D.U.T. Vo 50 Ω B ew wanted signal source 18 dB attenuator D 50 Ω B D V Vo(meas) 50 Ω HIGH_RFIN2 RMS voltmeter 50 Ω Vo = Vo(meas) + 3.75 dB. Wanted output signal at picture carrier frequency fRF(w); Vo(w) = 100 dBµV. Unwanted output signal at sound sub-carrier frequency fRF(u); AM = 30%; AF = 2 kHz. We measure the level of unwanted signal causing 0.3% AM modulation in the wanted signal fRF(w) = 439.25 MHz (min.); 863.25 MHz (max.). fRF(u) = 444.75 MHz (min.); 868.75 MHz (max.). fosc = 478.15 MHz (min.); 902.15 MHz (max.). Fig.26 Cross-modulation measurement in the HIGH-band of the TDA6508A; TDA6509A. 2005 Mar 25 modulation analyzer 30 MDB252 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... J4 J7 J5 C4 J6 C11 18 pF C6 1 pF C5 1.8 pF C32 R3 100 pF HIGH_RFIN1 C15 4.7 nF C27 4.7 nF HIGH_RFIN2 C13 4.7 nF MID_RFIN1 MID_RFIN2 LOW_RFIN C29 100 pF RF_GND C21 4.7 nF L1 MIX_OUT1 C22 4.7 nF C28 100 pF 31 SDA C9 4.7 nF SCL R18 330 Ω D3 D4 +5 V 4.7 kΩ R9 (5) 28 6 (27) (6) 27 7 (26) 9 (24) (9) 24 10 (23) (10) 23 11 (22) (11) 22 12 (21) (12) 21 13 (20) (13) 20 14 (19) (14) 19 15 (18) (15) 18 16 (17) (16) 17 10 uF (50 V) 1 2 3 4 5 6 OSC_GND C34 MID_OSCIN2 R26 12 Ω MID_OSCIN1 39 pF L4 C35 HIGH_OSCIN2 HIGH_OSCIN1 5.6 kΩ BB179 R7 Vtune 5.6 kΩ C10 4.7 nF VCC VCC C16 4.7 nF PLL_GND C17 AS R6 D7 39 pF 1 4 C26 2 12 pF 3 6 J8 AS VT C7 CP ADC/P4 R19 4.7 nF 27 Ω J9 R11 Vtune 2.2 nF R12 1 kΩ 1 kΩ R1 33 kΩ VCC 30 V C8 6.8 nF +5 V D1 J12 XTAL_REF IFAMP_OUT for test purposes only IFAMP_OUT1 39 kΩ C18 68 nF XTAL_REF C23 18 pF C31 R2 ADC Y1 4 MHz Vtune 5.6 kΩ C2 10 uF (50 V) C3 10 uF (50 V) J2 1 2 3 4 mdb249 The pin numbers in parenthesis refer to the TDA6509 and TDA6509A. Fig.27 Measurement circuit for TDA6508; TDA6509; TDA6508A; TDA6509A: PAL application. Product specification C1 TEST (4) 29 5 (28) J1 4.7 kΩ J11 4 (29) C33 5.6 kΩ BB187 R4 TDA6508; TDA6508A; TDA6509; TDA6509A D2 (3) 30 L3 100 pF R17 330 Ω R8 D5 3 (30) D8 LOW_OSCOUT IFAMP_OUT1 P3 R15 1 kΩ (2) 31 IFAMP_IN2 P0 R14 1 kΩ 2 (31) R27 33 Ω LOW_OSCIN IFAMP_OUT2/IF_GND P1 R13 1 kΩ (1) 32 TDA6508 (7) 26 TDA6508A MIX_OUT2 8 (25) (TDA6509) (8) 25 (TDA6509A) IFAMP_IN1 P2 R16 1 kΩ 1 (32) Vtune 5.6 kΩ 82 pF C12 18 pF 10 Ω BB187 R5 Philips Semiconductors J3 D6 3-band mixer/oscillator and PLL for terrestrial tuners R20 Measurement circuit LOW_RFIN 13.1 2005 Mar 25 L2 MID_RFIN1 HIGH_RFIN1 MID_RFIN2 HIGH_RFIN2 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A 14 INTERNAL PIN CONFIGURATION PIN AVERAGE DC VOLTAGE (V) DESCRIPTION(1) SYMBOL TDA6508 TDA6509 HIGH_RFIN1, HIGH_RFIN2 1, 2 LOW 32, 31 1 2 (32) (31) MID HIGH − − 1.0 − 1.0 − 1.8 − − − − − 2.9 2.9 2.9 MDB228 MID_RFIN1, MID_RFIN2 3, 4 30, 29 3 4 (30) (29) MDB229 LOW_RFIN 5 28 5 (28) MDB230 RF_GND 6 27 6 (27) MDB231 MIX_OUT1, MIX_OUT2 7, 8 26, 25 7 8 (26) (25) MDB232 2005 Mar 25 32 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners PIN TDA6508; TDA6508A; TDA6509; TDA6509A AVERAGE DC VOLTAGE (V) DESCRIPTION(1) SYMBOL TDA6508 TDA6509 IFAMP_IN1, IFAMP_IN2 9, 10 LOW 24, 23 MID HIGH 3.0 3.0 3.0 high-Z or VCC − VDS high-Z or VCC − VDS high-Z or VCC − VDS high-Z high-Z high-Z high-Z high-Z high-Z 1.6 1.6 1.6 9 (24) 10 (23) MDB241 P0, P1, P2, P3 13, 12, 11, 14 20, 21, 22, 19 11 12 (22) 13 14 (21) (20) (19) MDB242 SDA 15 18 15 (18) MDB244 SCL 16 17 16 (17) MDB243 XTAL_REF 17 16 17 (16) MDB245 2005 Mar 25 33 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners PIN TDA6508; TDA6508A; TDA6509; TDA6509A AVERAGE DC VOLTAGE (V) DESCRIPTION(1) SYMBOL TDA6508 TDA6509 ADC/P4 18 15 LOW MID HIGH high-Z or VCC − VDS high-Z or VCC − VDS high-Z or VCC − VDS 1.0 1.0 1.0 VVT VVT VVT 1.25 1.25 1.25 0 0 0 18 (15) MDB246 CP 19 14 19 (14) MDB247 VT 20 13 20 (13) MDB248 AS 21 12 21 (12) MDB236 PLL_GND 22 11 22 (11) MDB237 2005 Mar 25 34 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners PIN TDA6508; TDA6508A; TDA6509; TDA6509A AVERAGE DC VOLTAGE (V) DESCRIPTION(1) SYMBOL TDA6508 TDA6509 IFAMP_OUT1, IFAMP_OUT2 23, 24 LOW 10, 9 23 24 (10) (9) MID HIGH 2.0 2.0 2.0 0 0 0 5 5 5 2.3 2.3 1.3 MDB233 IF_GND 24 9 24 (9) MDB238 VCC 25 8 HIGH_OSCIN1 26, 27 7, 6 supply voltage 26 27 (7) (6) MDB239 2005 Mar 25 35 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners PIN TDA6508; TDA6508A; TDA6509; TDA6509A AVERAGE DC VOLTAGE (V) DESCRIPTION(1) SYMBOL TDA6508 TDA6509 MID_OSCIN1 28, 29 LOW 5, 4 28 29 (5) (4) MID HIGH 2.3 1.3 2.3 0 0 0 1.7, 2.9 1.4, 3.5 1.4, 3.5 MDB240 OSC_GND 30 3 30 (3) MDB234 LOW_OSCOUT, LOW_OSCIN 31, 32 2, 1 31 (2) 32 (1) MDB235 Note 1. The pin numbers in parenthesis apply to the TDA6508TT. 2005 Mar 25 36 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A 15 PACKAGE OUTLINES TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 (A 3) A A1 pin 1 index θ Lp L 1 detail X 16 w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y Z θ mm 1.1 0.15 0.05 0.95 0.85 0.25 0.30 0.19 0.20 0.09 11.1 10.9 6.2 6.0 0.65 8.3 7.9 1 0.75 0.50 0.2 0.1 0.1 0.78 0.48 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT487-1 2005 Mar 25 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 37 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-1 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 16 y y1 C v M C A B w M C b 9 L 17 8 e e2 Eh 1/2 e 1 terminal 1 index area 24 32 25 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 5.1 4.9 3.25 2.95 5.1 4.9 3.25 2.95 0.5 3.5 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT617-1 --- MO-220 --- 2005 Mar 25 38 EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-18 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A To overcome these problems the double-wave soldering method was specifically developed. 16 SOLDERING 16.1 Introduction to soldering surface mount packages If wave soldering is used the following conditions must be observed for optimal results: This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 16.2 – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. • below 225 °C (SnPb process) or below 245 °C (Pb-free process) A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. – for all BGA, HTSSON..T and SSOP..T packages 16.4 – for packages with a thickness ≥ 2.5 mm Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 16.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. 2005 Mar 25 Manual soldering 39 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners 16.5 TDA6508; TDA6508A; TDA6509; TDA6509A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE REFLOW(2) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(4) suitable PLCC(5), SO, SOJ suitable suitable not recommended(5)(6) suitable SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable CWQCCN..L(8), PMFP(9), WQCCN..L(8) not suitable LQFP, QFP, TQFP not suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar soldering or manual soldering is suitable for PMFP packages. 2005 Mar 25 40 Philips Semiconductors Product specification 3-band mixer/oscillator and PLL for terrestrial tuners TDA6508; TDA6508A; TDA6509; TDA6509A 17 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 18 DEFINITIONS 19 DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2005 Mar 25 41 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R25/03/pp42 Date of release: 2005 Mar 25 Document order number: 9397 750 14909