Philips Semiconductors Product specification Rectifier diodes Schottky barrier FEATURES PBYR20100CT, PBYR20100CTB series SYMBOL • Low forward volt drop • Fast switching • Reverse surge capability • High thermal cycling performance • Low thermal resistance QUICK REFERENCE DATA VR = 60 V/ 80 V/ 100 V a2 3 a1 1 IO(AV) = 20 A VF ≤ 0.7 V k 2 GENERAL DESCRIPTION Dual, common cathode schottky rectifier diodes in a conventional leaded plastic package and a surface mounting plastic package. Intended for use as output rectifiers in low voltage, high frequency switched mode power supplies. The PBYR20100CT series is supplied in the SOT78 conventional leaded package. The PBYR20100CTB series is supplied in the SOT404 surface mounting package. PINNING PIN SOT78 (TO220AB) DESCRIPTION 1 anode 1 (a) 2 cathode (k) 1 3 anode 2 (a) tab cathode (k) SOT404 tab tab 2 1 1 23 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT - 60CT 80CT 100CT 60CTB 80CTB 100CTB 60 80 100 V PBYR20 PBYR20 VRRM VRWM VR IO(AV) IFRM IFSM IRRM Tj Tstg Peak repetitive reverse voltage Working peak reverse voltage Continuous reverse voltage Average rectified output current (both diodes conducting) Repetitive peak forward current per diode Non-repetitive peak forward current per diode Peak repetitive reverse surge current per diode Operating junction temperature Storage temperature - 60 80 100 V Tmb ≤ 139 ˚C - 60 80 100 V square wave; δ = 0.5; Tmb ≤ 133 ˚C - 20 A square wave; δ = 0.5; Tmb ≤ 133 ˚C t = 10 ms t = 8.3 ms sinusoidal; Tj = 125 ˚C prior to surge; with reapplied VRRM(max) pulse width and repetition rate limited by Tj max - 20 A - 135 150 A A - 1 A - 150 ˚C - 65 175 ˚C 1. It is not possible to make connection to pin 2 of the SOT404 package. November 1998 1 Rev 1.300 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYR20100CT, PBYR20100CTB series THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-mb per diode both diodes SOT78 package in free air SOT404 package, pcb mounted, minimum footprint, FR4 board Rth j-a Thermal resistance junction to mounting base Thermal resistance junction to ambient MIN. - TYP. MAX. UNIT 60 50 2 1 - K/W K/W K/W K/W ELECTRICAL CHARACTERISTICS All characteristics are per diode at Tj = 25 ˚C unless otherwise specified SYMBOL PARAMETER VF Forward voltage IR Reverse current Cd Junction capacitance November 1998 CONDITIONS MIN. IF = 10 A; Tj = 125˚C IF = 20 A; Tj = 125˚C IF = 20 A VR = VRWM VR = VRWM; Tj = 125˚C VR = 5 V; f = 1 MHz, Tj = 25˚C to 125˚C 2 - TYP. MAX. UNIT 0.61 0.74 0.88 5 5 420 0.7 0.85 0.95 150 15 - V V V µA mA pF Rev 1.300 Philips Semiconductors Product specification Rectifier diodes Schottky barrier 15 PBYR20100CT, PBYR20100CTB series Tmb / C 120 PBYR10100 PF / W Vo = 0.550 V Rs = 0.015 Ohms 100 PBYR10100 10 150 C D = 1.0 130 10 IR / mA 125 C 1 100 C 0.5 0.2 0.1 5 tp I D= 140 tp T 75 C 0.1 Tj = 50 C t T 0 5 0 0.01 150 15 10 0 50 VR/ V IF(AV) / A Fig.1. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x √D. 10 Vo = 0.550 V Rs = 0.015 Ohms a = 1.57 8 2.2 Cd/ pF PBYR20100CT 10000 134 1.9 1000 2.8 6 Fig.4. Typical reverse leakage current per diode; IR = f(VR); parameter Tj Tmb / C 130 PBYR10100 PF / W 100 138 4 142 4 100 146 2 0 0 2 4 6 IF(AV) / A 8 150 10 10 1 Fig.2. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). IF / A 10 VR/ V 100 Fig.5. Typical junction capacitance per diode; Cd = f(VR); f = 1 MHz; Tj = 25˚C to 125 ˚C. PBYR10100 10 50 Transient thermal impedance, Zth j-mb (K/W) Tj = 25 C Tj = 125 C 40 1 Typ Max 30 0.1 20 PD 0.01 tp D= 10 0.001 1us 0 0 0.5 1 VF / V 1.5 2 Fig.3. Typical and maximum forward characteristic IF = f(VF); parameter Tj November 1998 T 10us tp T t 100us 1ms 10ms 100ms 1s 10s pulse width, tp (s) PBYR20100CT Fig.6. Transient thermal impedance per diode; Zth j-mb = f(tp). 3 Rev 1.300 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYR20100CT, PBYR20100CTB series MECHANICAL DATA Dimensions in mm 4,5 max Net Mass: 2 g 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 0,9 max (3x) 2,54 2,54 0,6 2,4 Fig.7. SOT78 (TO220AB); pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for SOT78 (TO220) envelopes. 2. Epoxy meets UL94 V0 at 1/8". November 1998 4 Rev 1.300 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYR20100CT, PBYR20100CTB series MECHANICAL DATA Dimensions in mm 4.5 max 1.4 max 10.3 max Net Mass: 1.4 g 11 max 15.4 2.5 0.85 max (x2) 0.5 2.54 (x2) Fig.8. SOT404 : centre pin connected to mounting base. MOUNTING INSTRUCTIONS Dimensions in mm 11.5 9.0 17.5 2.0 3.8 5.08 Fig.9. SOT404 : soldering pattern for surface mounting. Notes 1. Epoxy meets UL94 V0 at 1/8". November 1998 5 Rev 1.300 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYR20100CT, PBYR20100CTB series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. November 1998 6 Rev 1.300