INTEGRATED CIRCUITS 74ALVCH162827 20-bit buffer/line driver, non-inverting, with 30 termination resistors (3-State) Product specification IC24 Data Handbook 1998 Sep 29 Philips Semiconductors Product specification 20-bit buffer/line driver, non-inverting, with 30Ω termination resistors (3-State) FEATURES 74ALVCH162827 DESCRIPTION • Complies with JEDEC standard no. 8-1A. • CMOS low power consumption • Direct interface with TTL levels • Current drive ± 12 mA at 3.0 V • MULTIBYTETM flow-through standard pin-out architecture • Low inductance multiple VCC and GND pins for minimum noise The 74ALVCH162827 high-performance CMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ALVCH162827 20-bit buffers provide high performance bus interface buffering for wide data/address paths or buses carrying parity. They have NAND Output Enables (nOE1, nOE2) for maximum control flexibility. The 74ALVCH162827 is designed with 30Ω series resistance in both the pull-up and pull-down output structures. This design reduces line noise in applications such as memory address drivers, clock drivers and bus receivers/transmitters. and ground bounce • Integrated 30 W termination resistors To ensure the high impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. QUICK REFERENCE DATA GND = 0V; Tamb = 25°C; tr = tf = 2.5ns SYMBOL PARAMETER Propagation delay tPHL/tPLH nAn to nYn CI Input capacitance CPD CONDITIONS VCC = 2.5V, CL = 30pF VCC = 3.3V, CL = 50pF Power dissipation dissi ation capacitance ca acitance per er latch VI = GND to VCC Output enabled Output disabled 1 TYPICAL 2.9 2.9 5 14 3 UNIT ns pF pF F NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in mW): PD = CPD × VCC2 × fi + S (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacity in pF; fo = output frequency in MHz; VCC = supply voltage in V; S (CL × VCC2 × fo) = sum of outputs. ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER –40°C to +85°C 74ALVCH162827DGG ACH162827DGG SOT364-1 56-Pin Plastic TSSOP Type II PIN DESCRIPTION PIN NUMBER SYMBOL 55, 54, 52, 51, 49, 48, 47, 45, 44, 43, 42, 41, 40, 38, 37, 36, 34, 33, 31, 30 1A0 - 1A9 2A0 - 2A9 Data inputs 2, 3, 5, 6, 8, 9, 10, 12, 13, 14, 15, 16, 17, 19, 20, 21, 23, 24, 26, 27 1Y0 - 1Y9 2Y0 - 2Y9 Data outputs 1, 56, 28, 29 1OE1 1OE2, 2OE1, 2OE2 4, 11, 18, 25, 32, 39, 46, 53 GND Ground (0V) 7, 22, 35, 50 VCC Positive supply voltage 1998 Sep 29 FUNCTION Output enable inputs (active-LOW) 2 853-2127 20100 Philips Semiconductors Product specification 20-bit buffer/line driver, non-inverting, with 30Ω termination resistors (3-State) PIN CONFIGURATION LOGIC SYMBOL (IEEE/IEC) 1OE1 1 56 1OE2 1Y0 2 55 1A0 1Y1 3 54 1A1 GND 4 53 GND 1Y2 5 52 1A2 1Y3 6 51 1A3 VCC 7 1Y4 50 8 1Y5 74ALVCH162827 49 9 48 1OE2 10 47 1Y0 1Y1 52 5 1Y2 51 6 1Y3 49 8 1Y4 48 9 1Y5 47 10 1Y6 45 12 1Y7 44 13 1A9 43 14 1Y9 2A0 42 15 2Y0 2A1 41 16 2Y1 2A2 40 17 2Y2 1A3 1A5 11 46 55 3 1A2 1A4 EN2 2 1A1 VCC & 29 54 1A0 1A6 1A5 GND EN1 56 2OE1 28 2OE2 1A4 1Y6 & 1 1OE1 GND 1A6 1 1∇ 1Y7 12 45 1A7 1Y8 13 44 1A8 1Y9 14 43 1A9 2Y0 15 42 2A0 2Y1 16 41 2A1 2Y2 17 40 2A2 GND 18 39 GND 2A3 38 19 2Y3 2Y3 19 38 2A3 2A4 37 20 2Y4 2Y4 20 37 2A4 2A5 36 21 2Y5 21 36 2A5 2A6 34 23 2Y6 VCC 22 35 VCC 2A7 33 24 2Y7 2Y6 23 34 2A6 2A8 31 26 2Y8 2Y7 24 33 2A7 2A9 30 27 2Y9 GND 25 32 GND 2Y8 26 31 2A8 2Y9 27 30 2A9 2OE1 28 29 2OE2 1A7 1A8 1 2∇ 1Y8 2Y5 SH00012 SH00010 LOGIC SYMBOL 55 54 FUNCTION TABLE 52 51 49 48 47 1A0 1A1 1A2 1A3 1A4 1A5 1A6 45 44 1A7 1A8 INPUTS 43 nOE1 nOE2 1A9 OUTPUT nAn nYn OPERATING MODE L L L L 1 1OE1 L L H H Transparent 56 1OE2 H X X Z High impedance H X Z High impedance 1Y0 1Y1 1Y2 1Y3 1Y4 1Y5 1Y6 1Y7 1Y8 1Y9 2 3 5 6 8 9 10 12 13 14 42 41 40 38 37 36 34 33 31 30 2A0 2A1 2A2 2A3 2A4 2A5 2A6 2A7 2A8 2A9 2Y0 2Y1 2Y2 2Y3 2Y4 2Y5 2Y6 2Y7 2Y8 2Y9 15 24 27 28 2OE1 29 2OE2 16 17 19 20 21 23 26 X X Z H L SH00011 1998 Sep 29 3 = = = = Don’t care High impedance “off” state High voltage level Low voltage level Transparent Philips Semiconductors Product specification 20-bit buffer/line driver, non-inverting, with 30Ω termination resistors (3-State) 74ALVCH162827 LOGIC DIAGRAM nA0 nA1 nA2 nA3 nA4 nA5 nA6 nA7 nA8 nA9 nY0 nY1 nY2 nY3 nY4 nY5 nY6 nY7 nY8 nY9 nOE1 nOE2 SH00013 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER CONDITIONS MIN MAX DC supply voltage 2.5V range (for max. speed performance @ 30 pF output load) 2.3 2.7 DC supply voltage 3.3V range (for max. speed performance @ 50 pF output load) 3.0 3.6 UNIT V VI DC Input voltage range 0 VCC V VO DC output voltage range 0 VCC V –40 +85 °C 0 0 20 10 ns/V Tamb Operating free-air temperature range tr, tf Input rise and fall times VCC = 2.3 to 3.0V VCC = 3.0 to 3.6V ABSOLUTE MAXIMUM RATINGS In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V) SYMBOL VCC PARAMETER CONDITIONS DC supply voltage RATING UNIT –0.5 to +4.6 V IIK DC input diode current VI 0 –50 mA VI DC input voltage Note 1 –0.5 to +4.6 V IOK DC output diode current VO VCC or VO 0 50 mA VO DC output voltage Note 1 –0.5 to VCC +0.5 V IO DC output source or sink current VO = 0 to VCC 50 mA 100 mA –65 to +150 °C IGND, ICC Tstg PTOT DC VCC or GND current Storage temperature range Power dissipation per package –plastic thin-medium-shrink (TSSOP) For temperature range: –40 to +125 °C above +55°C derate linearly with 8 mW/K NOTE: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 Sep 29 4 600 mW Philips Semiconductors Product specification 20-bit buffer/line driver, non-inverting, with 30Ω termination resistors (3-State) 74ALVCH162827 DC ELECTRICAL CHARACTERISTICS Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V). LIMITS SYMBOL PARAMETER VIH HIGH level Input voltage VIL LOW level Input voltage VOH HIGH level output voltage TEST CONDITIONS Temp = -40°C to +85°C MIN TYP1 VCC = 2.3 to 2.7V 1.7 1.2 VCC = 2.7 to 3.6V 2.0 1.5 UNIT MAX V VCC = 2.3 to 2.7V 1.2 0.7 VCC = 2.7 to 3.6V 1.5 0.8 V 3 to 3 6V; VI = VIH or VIL; IO = –100µA 100µA VCC = 2 2.3 3.6V; 02 VCC0.2 VCC = 2.3V; VI = VIH or VIL; IO = –4mA VCC0.4 VCC0.11 VCC = 2.3V; VI = VIH or VIL; IO = –6mA VCC0.6 VCC0.17 VCC = 2.7V; VI = VIH or VIL; IO = –4mA VCC0.5 VCC0.09 VCC = 2.7V; VI = VIH or VIL; IO = –8mA VCC0.7 VCC0.19 VCC = 3.0V; VI = VIH or VIL; IO = –6mA VCC0.6 VCC0.13 VCC = 3.0V; VI = VIH or VIL; IO = –12mA VCC1.0 VCC0.27 VCC V VCC = 2 2.3 3 to 3 3.6V; 6V; VI = VIH or VIL; IO = 100µA GND 0 20 0.20 VCC = 2.3V; VI = VIH or VIL; IO = 4mA 0.07 0.40 VCC = 2.3V; VI = VIH or VIL; IO = 6mA 0.11 0.55 VCC = 2.7V; VI = VIH or VIL; IO = 4mA 0.06 0.40 VCC = 2.7V; VI = VIH or VIL; IO = 8mA 0.13 0.60 VCC = 3.0V; VI = VIH or VIL; IO = 6mA 0.09 0.55 VCC = 3.0V; VI = VIH or VIL; IO = 12mA 0.19 0.80 g current Input leakage 3 to 3 6V; VCC = 2 2.3 3.6V; VI = VCC or GND 0.1 5 µ µA IOZ 3-State output OFF-state current VCC = 2.3 to 3.6V; VI = VIH or VIL; VO = VCC or GND 0.1 10 µA ICC Quiescent supply current VCC = 2.3 to 3.6V; VI = VCC or GND; IO = 0 0.2 40 µA Additional quiescent supply current VCC = 2.3V to 3.6V; VI = VCC – 0.6V; IO = 0 150 750 µA VOL II ∆ICC IBHL LOW level output voltage Bus hold LOW sustaining current 0.7V2 45 VCC = 2.3V; VI = 1.7V2 –45 VCC = 3.0V; VI = 2.0V2 –75 VCC = 2.3V; VI = – V µA µA IBHH Bus hold HIGH sustaining current IBHLO Bus hold LOW overdrive current VCC = 3.6V2 500 µA Bus hold HIGH overdrive current 3.6V2 –500 µA IBHHO VCC = NOTES: 1. All typical values are at Tamb = 25°C. 2. Valid for data inputs of bus hold parts. 1998 Sep 29 5 –175 Philips Semiconductors Product specification 20-bit buffer/line driver, non-inverting, with 30Ω termination resistors (3-State) 74ALVCH162827 AC CHARACTERISTICS FOR VCC = 2.5V ± 0.2V GND = 0V; tr = tf ≤ 2.0ns; CL = 30pF LIMITS SYMBOL PARAMETER VCC = 2.5 ± 0.2V WAVEFORM UNIT MIN TYP1 MAX tPHL/tPLH Propagation delay nAn to nYn 1, 3 1.0 2.9 4.6 ns tPZH/tPZL 3-State output enable time nOEn to nYn 2, 3 1.4 3.9 6.4 ns tPHZ/tPLZ 3-State output disable time nOEn to nYn 2,3 1.7 2.2 5.9 ns NOTE: 1. All typical values are at VCC = 2.5V and Tamb = 25°C. AC CHARACTERISTICS FOR VCC = 3.0V ± 0.3V GND = 0V; tr = tf ≤ 2.5ns; CL = 50pF LIMITS SYMBOL PARAMETER LIMITS VCC = 3.3 ± 0.3V WAVEFORM VCC = 2.7V MIN TYP1, 2 MAX TYP1 MAX UNIT tPHL/tPLH Propagation delay nAn to nYn 1, 3 1.5 2.9 4.2 3.1 4.7 ns tPZH/tPZL 3-State output enable time nOEn to nYn 2, 3 1.6 3.7 5.4 4.4 6.5 ns tPHZ/tPLZ 3-State output disable time nOEn to nYn 2, 3 1.8 3.0 4.7 3.2 5.2 ns NOTES: 1. All typical values are at VCC Tamb = 25°C. 2. Typical value is measured at VCC = 3.3V. 1998 Sep 29 6 Philips Semiconductors Product specification 20-bit buffer/line driver, non-inverting, with 30Ω termination resistors (3-State) AC WAVEFORMS FOR VCC = 2.3V TO 2.7V 74ALVCH162827 TEST CIRCUIT AND WAVEFORM VM = 0.5 VCC VX = VOL + 0.15V VY = VOH –0.15V VOL and VOH are the typical output voltage drop that occur with the output load. V =V CC I S1 VCC VI AC WAVEFORMS FOR VCC = 3.0V TO 3.6V AND VCC = 2.7V RANGE D.U.T. RT VM = 1.5 V VX = VOL + 0.3V VY = VOH –0.3V VOL and VOH are the typical output voltage drop that occur with the output load. V = 2.7V I RL = 500 Ω VO PULSE GENERATOR 2 * VCC Open GND RL = 500 Ω CL Test Circuit for switching times DEFINITIONS RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators. VI An INPUT SWITCH POSITION VM TEST GND tPLH/tPHL tPHL tPLH VM 2 VCC tPHZ/tPZH GND VI < 2.7V VCC 2.7–3.6V 2.7V Waveform 3. Load circuitry for switching times SH00132 Waveform 1. Input (nAx) to Output (nYx) Propagation Delays VI VM GND tPLZ tPZL VCC OUTPUT LOW-to-OFF OFF-to-LOW VM VX VOL tPHZ tPZH VOH OUTPUT HIGH-to-OFF OFF-to-HIGH VY VM GND outputs enabled outputs disabled outputs enabled SH00137 Waveform 2. 3-State Output Enable and Disable Times 1998 Sep 29 VCC SV00906 VOL nOE INPUT Open tPLZ/tPZL VOH Yn OUTPUT S1 7 Philips Semiconductors Product specification 20-bit buffer/line driver, non-inverting, with 30 termination resistors (3-State) TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1mm 1998 Sep 29 8 74ALVCH162827 SOT364-1 Philips Semiconductors Product specification 20-bit buffer/line driver, non-inverting, with 30 termination resistors (3-State) NOTES 1998 Sep 29 9 74ALVCH162827 Philips Semiconductors Product specification 20-bit buffer/line driver, non-inverting, with 30 termination resistors (3-State) 74ALVCH162827 DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Formative or in Design This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. Preliminary Specification Preproduction Product This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product Specification Full Production This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Date of release: 06-98 Document order number: 1998 Sep 29 10 9397-750-04603