INTEGRATED CIRCUITS 74ABT827 10-bit buffer/line driver, non-inverting (3-State) Product specification Supersedes data of 1995 Sep 06 IC23 Data Handbook 1998 Jan 16 Philips Semiconductors Product specification 10-bit buffer/line driver, non-inverting (3-State) FEATURES 74ABT827 DESCRIPTION • Ideal where high speed, light loading, or increased fan-in are The 74ABT827 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. required • Flow through pinout architecture for microprocessor oriented The 74ABT827 10-bit buffers provide high performance bus interface buffering for wide data/address paths or buses carrying parity. They have NOR Output Enables (OE0, OE1) for maximum control flexibility. applications • Output capability: +64mA/–32mA • Slim 300 mil-wide plastic 24-pin package • Latch-up protection exceeds 500mA per Jedec Std 17 • ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200 V per Machine Model • Power-up 3-State • Inputs are disabled during 3-State mode QUICK REFERENCE DATA SYMBOL CONDITIONS Tamb = 25°C; GND = 0V PARAMETER TYPICAL UNIT 3.0 ns tPLH tPHL Propagation delay An to Yn CL = 50pF; VCC = 5V CIN Input capacitance VI = 0V or VCC 4 pF COUT Output capacitance Outputs disabled; VO = 0V or VCC 7 pF ICCZ Total supply current Outputs disabled; VCC = 5.5V 500 nA ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 24-Pin Plastic DIP –40°C to +85°C 74ABT827 N 74ABT827 N SOT222-1 24-Pin plastic SO –40°C to +85°C 74ABT827 D 74ABT827 D SOT137-1 24-Pin Plastic SSOP Type II –40°C to +85°C 74ABT827 DB 74ABT827 DB SOT340-1 24-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT827 PW 74ABT827PW DH SOT355-1 1998 Jan 16 2 853-1618 18866 Philips Semiconductors Product specification 10-bit buffer/line driver, non-inverting (3-State) PIN CONFIGURATION 74ABT827 LOGIC SYMBOL 2 OE0 1 24 VCC A0 2 23 Y0 A1 3 22 Y1 A2 4 21 Y2 A3 5 20 Y3 A4 6 19 Y4 A5 7 18 Y5 A6 8 17 Y6 A7 9 3 4 5 6 7 8 9 10 11 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 1 OE0 13 OE1 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 16 Y7 A8 10 15 Y8 A9 11 14 Y9 GND 12 13 OE1 23 22 21 20 19 18 17 16 15 14 SA00234 FUNCTION TABLE INPUTS An Yn L L L Transparent L H H Transparent H X Z High impedance SA00233 H L X Z PIN NUMBER SYMBOL FUNCTION Output enable input (active-Low) 1, 13 OE0, OE1 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 A0-A9 Data inputs 23, 22, 21, 20, 19, 18, 17, 16, 15, 14 Y0-Y9 Data outputs 10 GND Ground (0V) 20 VCC Positive supply voltage LOGIC SYMBOL (IEEE/IEC) 1 13 2 & EN1 1 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 SA00235 1998 Jan 16 3 OPERATING OEn TOP VIEW PIN DESCRIPTION OUTPUTS = = = = High voltage level Low voltage level Don’t care High impedance “off” state MODE Philips Semiconductors Product specification 10-bit buffer/line driver, non-inverting (3-State) 74ABT827 LOGIC DIAGRAM A0 A1 A2 A3 A4 A5 A6 A7 2 3 4 5 6 7 8 9 A8 A9 10 11 1 OE0 13 OE1 22 23 21 Y1 Y0 Y2 20 19 Y3 18 Y4 Y5 17 16 Y6 15 Y7 Y8 14 Y9 SA00236 ABSOLUTE MAXIMUM RATINGS1, 2 PARAMETER SYMBOL VCC CONDITIONS RATING UNIT –0.5 to +7.0 V –18 mA –1.2 to +7.0 V VO < 0 –50 mA DC supply voltage IIK DC input diode current VI DC input voltage3 IOK DC output diode current VI < 0 VOUT DC output voltage3 output in Off or High state –0.5 to +5.5 V IOUT DC output current output in Low state 128 mA Tstg Storage temperature range –65 to 150 °C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS LIMITS SYMBOL VCC PARAMETER UNIT DC supply voltage Min Max 4.5 5.5 V 0 VCC V VI Input voltage VIH High-level input voltage VIL Low-level input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA 0 5 ns/V –40 +85 °C ∆t/∆v Input transition rise or fall rate Tamb Operating free-air temperature range 1998 Jan 16 2.0 4 V Philips Semiconductors Product specification 10-bit buffer/line driver, non-inverting (3-State) 74ABT827 DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER Min VIK VOH VOL Input clamp voltage High-level output voltage Tamb = –40°C to +85°C Tamb = +25°C TEST CONDITIONS VCC = 4.5V; IIK = –18mA Typ Max –0.9 –1.2 Min UNIT Max –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA Power-off leakage current VCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±100 ±100 µA Power-up/down 3-State output current3 VCC = 2.0V; VO = 0.5V; VI = GND or VCC; V OE = VCC ±5.0 ±50 ±50 µA IOZH 3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 µA IOZL 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 µA ICEX Output HIgh leakage current VCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 µA –80 –180 –180 mA VCC = 5.5V; Outputs High, VI = GND or VCC 0.5 250 250 µA VCC = 5.5V; Outputs Low, VI = GND or VCC 25 38 38 mA VCC = 5.5V; Outputs 3–State; VI = GND or VCC 0.5 250 250 µA Outputs enabled, one input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA Outputs 3-State, one data input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.01 50 50 mA Outputs 3–State, one enable input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA II IOFF IPU/IPD IO Output current1 ICCH ICCL Quiescent supply current ICCZ ∆ICC Additional supply current per input pin2 VCC = 5.5V; VO = 2.5V –50 –50 NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. 3. This parameter is valid for any VCC between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V 10%, a transition time of up to 100µsec is permitted. 1998 Jan 16 5 Philips Semiconductors Product specification 10-bit buffer/line driver, non-inverting (3-State) 74ABT827 AC CHARACTERISTICS GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER Tamb = -40 to +85oC VCC = +5.0V ±0.5V Tamb = +25oC VCC = +5.0V WAVEFORM UNIT Min Typ Max Min Max 1 1.1 1.1 3.0 2.9 4.4 4.1 1.1 1.1 4.8 4.7 ns Output enable time to High and Low level 2 1.6 2.6 3.7 4.6 5.1 5.9 1.6 2.6 5.9 6.9 ns Output disable time from High and Low level 2 2.0 2.5 4.8 5.1 6.3 6.6 2.0 2.5 6.8 6.9 ns tPLH tPHL Propagation delay An to Yn tPZH tPZL tPHZ tPLZ AC WAVEFORMS VM = 1.5V, VIN = GND to 3.0V 3V 1.5V OEn INPUT 1.5V INPUT tPHL Yn OUTPUT OUTPUT VOL TEST CIRCUIT AND WAVEFORM 7V S1 Open GND 500 Ω Load Circuit TEST S1 tpd open tPLZ/tPZL 7V tPHZ/tPZH open DEFINITIONS Load capacitance includes jig and probe capacitance; CL = see AC CHARACTERISTICS for value. SA00012 1998 Jan 16 VOL + 0.3V VOL VOH VOH – 0.3V SA00206 Waveform 2. Waveforms Showing the 3-State Output Enable and Disable Times Waveform 1. Waveforms Showing the Input (An) to Output (Yn) Propagation Delays CL = 50 pF VM 3.5V 0V SA00028 500 Ω tPHZ tPZH 1.5V From Output Under Test VM Yn OUTPUT VOH 1.5V tPLZ tPZL 0V tPLH VM VM 6 Philips Semiconductors Product specification 10-bit buffer/line driver, non-inverting (3-State) DIP24: plastic dual in-line package; 24 leads (300 mil) 1998 Jan 16 7 74ABT827 SOT222-1 Philips Semiconductors Product specification 10-bit buffer/line driver, non-inverting (3-State) SO24: plastic small outline package; 24 leads; body width 7.5 mm 1998 Jan 16 8 74ABT827 SOT137-1 Philips Semiconductors Product specification 10-bit buffer/line driver, non-inverting (3-State) SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm 1998 Jan 16 9 74ABT827 SOT340-1 Philips Semiconductors Product specification 10-bit buffer/line driver, non-inverting (3-State) TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm 1998 Jan 16 10 74ABT827 SOT355-1 Philips Semiconductors Product specification 10-bit buffer/line driver, non-inverting (3-State) 74ABT827 DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Formative or in Design This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. Preliminary Specification Preproduction Product This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product Specification Full Production This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Philips Semiconductors and Philips Electronics North America Corporation register eligible circuits under the Semiconductor Chip Protection Act. Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. (print code) Document order number: Date of release: July 1994 9397-750-03474