74AHC1G66; 74AHCT1G66 Single-pole single-throw analog switch Rev. 04 — 18 December 2008 Product data sheet 1. General description 74AHC1G66 and 74AHCT1G66 are high-speed Si-gate CMOS devices. They are single-pole single-throw analog switches. The switch has two input/output pins (Y and Z) and an active HIGH enable input pin (E). When pin E is LOW, the analog switch is turned off. 2. Features n Very low ON resistance: u 26 Ω (typ.) at VCC = 3.0 V u 16 Ω (typ.) at VCC = 4.5 V u 14 Ω (typ.) at VCC = 5.5 V n High noise immunity n Low power dissipation n Balanced propagation delays n Multiple package options n ESD protection: u HMB JESD22-A114E exceeds 2000 V u MM JESD22-A115-A exceeds 200 V u CDM JESD22-C101C exceeds 1000 V n Specified from −40 °C to +85 °C and −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Type number 74AHC1G66GW Package Temperature range Name Description Version −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 74AHCT1G66GW 74AHC1G66GV 74AHCT1G66GV 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch 4. Marking Table 2. Marking codes Type number Marking 74AHC1G66GW AL 74AHCT1G66GW CL 74AHC1G66GV A66 74AHCT1G66GV C66 5. Functional diagram Z E Y E Z Y VCC 001aag487 Fig 1. Logic symbol mna628 Fig 2. Logic diagram 6. Pinning information 6.1 Pinning 74AHC1G66 74AHCT1G66 Y 1 Z 2 GND 3 5 VCC 4 E 001aai834 Fig 3. Pin configuration SOT353-1 and SOT753 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 2 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch 6.2 Pin description Table 3. Pin description Symbol Pin Description Y 1 independent input or output Z 2 independent input or output GND 3 ground (0 V) E 4 enable input (active HIGH) VCC 5 supply voltage 7. Functional description Table 4. Function table[1] Input E Switch L OFF H ON [1] H = HIGH voltage level; L = LOW voltage level. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions input clamping current VI < −0.5 V [1] ISK switch clamping current VI < −0.5 V or VI > VCC + 0.5 V [1] ISW switch current −0.5 V < VO < VCC + 0.5 V ICC IIK Min Max Unit −0.5 +7.0 V −20 - mA - ±20 mA - ±25 mA supply current - 75 mA IGND ground current −75 - mA Tstg storage temperature −65 +150 °C Ptot total power dissipation - 250 mW Tamb = −40 °C to +125 °C [2] [1] The input and output voltage ratings may be exceeded if the input and output voltage ratings are observed. [2] For TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V).[1] Symbol Parameter Conditions 74AHC1G66 74AHCT1G66 Unit Min Typ Max Min Typ Max 2.0 5.0 5.5 4.5 5.0 5.5 V VCC supply voltage VI input voltage 0 - 5.5 0 - 5.5 V VSW switch voltage 0 - VCC 0 - VCC V 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 3 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch Table 6. Recommended operating conditions …continued Voltages are referenced to GND (ground = 0 V).[1] Symbol Parameter Conditions 74AHC1G66 Tamb ambient temperature ∆t/∆V input transition rise and VCC = 3.3 ± 0.3 V fall rate VCC = 5.0 ± 0.5 V 74AHCT1G66 Unit Min Typ Max Min Typ Max −40 +25 +125 −40 +25 +125 [2] °C - - 100 - - - ns/V [2] - - 20 - - 20 ns/V [1] To avoid drawing VCC current out of pin Z, when switch current flows in pin Y, the voltage drop across the bidirectional switch must not exceed 0.4 V. If the switch current flows into pin Z, no VCC current will flow out of terminal Y. In this case there is no limit for the voltage drop across the switch, but the voltage at pins Y and Z may not exceed VCC or GND. [2] Applies to control signal levels. 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max 1.5 - - 1.5 - 1.5 - V VCC = 3.0 V 2.1 - - 2.1 - 2.1 - V VCC = 5.5 V 3.85 - - 3.85 - 3.85 - V VCC = 2.0 V - - 0.5 - 0.5 - 0.5 V VCC = 3.0 V - - 0.9 - 0.9 - 0.9 V 74AHC1G66 VIH VIL HIGH-level input voltage LOW-level input voltage VCC = 2.0 V VCC = 5.5 V - - 1.65 - 1.65 - 1.65 V II input leakage current VI = 5.5 V or GND; VCC = 5.5 V - - 0.1 - 1.0 - 2.0 µA IS(OFF) OFF-state leakage current Y or Z; VCC = 5.5 V; see Figure 4 - - 0.1 - 1.0 - 4.0 µA IS(ON) ON-state leakage current Y or Z; VCC = 5.5 V; see Figure 5 - - 0.1 - 1.0 - 4.0 µA ICC supply current E, Y or Z = VCC or GND; VCC = 5.5 V - - 1.0 - 10 - 40 µA CI input capacitance E input - 2.0 10 - 10 - 10 pF CS(ON) ON-state capacitance Y or Z input or output - 4.0 10 - 10 - 10 pF 74AHCT1G66 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V II input leakage current VI = 5.5 V or GND; VCC = 5.5 V - - 0.1 - 1.0 - 2.0 µA 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 4 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max IS(OFF) OFF-state leakage current Y or Z; VCC = 5.5 V; see Figure 4 - - 0.1 - 1.0 - 4.0 µA IS(ON) ON-state leakage current Y or Z; VCC = 5.5 V; see Figure 5 - - 0.1 - 1.0 - 4.0 µA ICC supply current E, Y or Z = VCC or GND; VCC = 5.5 V - - 1.0 - 10 - 40 µA ∆ICC additional per input pin; VI = 3.4 V; supply current other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance E input - 2.0 10 - 10 - 10 pF CS(ON) ON-state capacitance Y or Z input or output - 4.0 10 - 10 - 10 pF 10.1 Test circuits VCC VCC E VIL IS VI Y Z IS IS GND VI VO 001aai835 VI = VCC or GND and VO = GND or VCC. Fig 4. Test circuit for measuring OFF-state leakage current Y Z GND VO 001aai836 VI = VCC or GND and VO = open circuit. Fig 5. Test circuit for measuring ON-state leakage current 74AHC_AHCT1G66_4 Product data sheet E VIH © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 5 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch 10.2 ON resistance Table 8. ON resistance At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graph see Figure 7 [1]. Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Typ max Max Max 148[1] - - - Ω ISW = 10 mA; VCC = 3.0 V to 3.6 V 28 50 70 110 Ω ISW = 10 mA; VCC = 4.5 V to 5.5 V 15 30 40 60 Ω ISW = 1.0 mA; VCC = 2.0 V 30 - - - Ω ISW = 10 mA; VCC = 3.0 V to 3.6 V 20 50 65 90 Ω ISW = 10 mA; VCC = 4.5 V to 5.5 V 15 22 26 40 Ω ISW = 1.0 mA; VCC = 2.0 V 28 - - - Ω ISW = 10 mA; VCC = 3.0 V to 3.6 V 18 50 65 90 Ω ISW = 10 mA; VCC = 4.5 V to 5.5 V 13 22 26 40 Ω 74AHC1G66 and 74AHCT1G66 RON(peak) ON resistance (peak) RON(rail) ON resistance (rail) VI = VCC to GND; see Figure 6 ISW = 1.0 mA; VCC = 2.0 V VI = GND; see Figure 6 VI = VCC; see Figure 6 [1] At supply voltages approaching 2 V, the analog switch ON resistance becomes extremely non-linear. Therefore it is recommended that these devices be used to transmit digital signals only, when using this supply voltage. 10.3 ON resistance test circuit and graphs mna630 40 RON (Ω) 30 VCC = 3.0 V VSW 20 VCC 4.5 V E VIH 5.5 V Y VI 10 Z GND ISW 0 0 001aag490 Test circuit for measuring ON resistance Fig 7. VI (V) 6 Typical ON resistance as a function of input voltage 74AHC_AHCT1G66_4 Product data sheet 4 Tamb = 25 °C. RON = VSW / ISW. Fig 6. 2 © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 6 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch 11. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); CL = 50 pF; unless otherwise specified; For test circuit see Figure 10. Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Typ[1] max Max Max VCC = 2.0 V 2.2 5.0 6.0 7.0 ns VCC = 3.0 V to 3.6 V 1.0 2.0 3.0 4.0 ns 0.6 1.0 2.0 3.0 ns VCC = 2.0 V; CL = 15 pF 7.0 25.0 33.0 40.0 ns VCC = 2.0 V 11.0 35.0 46.0 57.0 ns VCC = 3.0 V to 3.6 V; CL = 15 pF 4.0 11.0 14.0 18.0 ns VCC = 3.0 V to 3.6 V 5.8 15.0 20.0 25.0 ns VCC = 4.5 V to 5.5 V; CL = 15 pF 3.0 8.0 10.0 13.0 ns 4.0 11.0 13.0 17.0 ns VCC = 2.0 V; CL = 15 pF 9.0 25.0 33.0 40.0 ns VCC = 2.0 V 13.0 35.0 46.0 57.0 ns VCC = 3.0 V to 3.6 V; CL = 15 pF 6.0 11.0 14.0 18.0 ns VCC = 3.0 V to 3.6 V 8.4 15.0 20.0 25.0 ns VCC = 4.5 V to 5.5 V; CL = 15 pF 5.0 8.0 10.0 13.0 ns 6.1 11.0 13.0 17.0 ns 13 - - - pF 0.7 1.0 2.0 3.0 ns 3.0 7.0 10.0 13.0 ns 4.7 10.0 13.0 17.0 ns VCC = 4.5 V to 5.5 V; CL = 15 pF 5.0 8.0 10.0 13.0 ns VCC = 4.5 V to 5.5 V 6.5 11.0 13.0 17.0 ns 74AHC1G66 tpd propagation delay Y to Z or Z to Y; see Figure 8 [2] VCC = 4.5 V to 5.5 V ten enable time E to Y or Z; see Figure 9 [2] VCC = 4.5 V to 5.5 V tdis disable time E to Y or Z; see Figure 9 [2] VCC = 4.5 V to 5.5 V CPD power dissipation capacitance VI = GND to VCC [3] [2] 74AHCT1G66 tpd propagation delay Y to Z or Z to Y; see Figure 8 ten enable time E to Y or Z; see Figure 9 VCC = 4.5 V to 5.5 V [2] VCC = 4.5 V to 5.5 V; CL = 15 pF VCC = 4.5 V to 5.5 V tdis disable time E to Y or Z; see Figure 9 [2] 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 7 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch Table 9. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); CL = 50 pF; unless otherwise specified; For test circuit see Figure 10. Symbol Parameter CPD power dissipation capacitance 25 °C Conditions max Max Max 15 - - - [3] VI = GND to VCC −40 °C to +85 °C −40 °C to +125 °C Unit Typ[1] [1] All typical values are measured at VCC = 2.0 V, VCC = 3.3 V, VCC = 5.0 V and Tamb = 25 °C. [2] tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. [3] CPD is used to determine the dynamic power dissipation PD (µW). PD = CPD × VCC2 × fi + Σ ((CL × CSW) × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; CSW = maximum switch capacitance in pF (see Table 7); VCC = supply voltage in Volt; Σ ((CL × CSW) × VCC2 × fo) = sum of outputs. pF 11.1 Waveforms and test circuit VI VM Y or Z input GND t PLH t PHL VOH VM Z or Y output VOL mna667 Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 8. Input (Y or Z) to output (Z or Y) propagation delays 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 8 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch VI E VM GND t PZL t PLZ VCC Y or Z output LOW-to-OFF OFF-to-LOW VM VX VOL t PZH t PHZ Y or Z output HIGH-to-OFF OFF-to-HIGH VOH VY VM GND switch enabled switch disabled switch enabled mna668 Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 9. Table 10. Enable and disable times Measurement points Type Input Output VM VM VX VY 74AHC1G66 0.5VCC 0.5VCC VOL + 0.3 V VOH − 0.3 V 74AHCT1G66 1.5 V 1.5 V VOL + 0.3 V VOH − 0.3 V 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 9 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC G VI VO RL S1 open DUT RT CL 001aad983 Test data is given in Table 11. Definitions for test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 10. Test circuit for measuring switching times Table 11. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74AHC1G66 GND to VCC 3 ns 15 pF, 50 pF 1 kΩ open GND VCC 74AHCT1G66 GND to 3 V 3 ns 15 pF, 50 pF 1 kΩ open GND VCC 11.2 Additional dynamic characteristics Table 12. Additional dynamic characteristics for 74AHC1G66 and 74AHCT1G66 GND = 0 V; tr = tf = 3.0 ns; CL = 50 pF; unless otherwise specified. All typical values are measured at Tamb = 25 °C. Symbol Parameter Conditions Min Typ Max Unit THD total harmonic distortion fi = 1 kHz; RL = 10 kΩ; see Figure 11 VCC = 3.0 V to 3.6 V - 0.025 - % VCC = 4.5 V to 5.5 V - 0.015 - % VCC = 3.0 V to 3.6 V; VI = 2.5 V - 0.025 - % VCC = 4.5 V to 5.5 V; VI = 4.0 V - 0.015 - % fi = 10 kHz; RL = 10 kΩ; see Figure 11 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 10 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch Table 12. Additional dynamic characteristics for 74AHC1G66 and 74AHCT1G66 …continued GND = 0 V; tr = tf = 3.0 ns; CL = 50 pF; unless otherwise specified. All typical values are measured at Tamb = 25 °C. Symbol Parameter Conditions f(−3dB) −3 dB frequency response RL = 50 Ω; CL = 10 pF; see Figure 12 and 13 αiso [1] isolation (OFF-state) Min Typ Max Unit VCC = 3.0 V to 3.6 V - 230 - MHz VCC = 4.5 V to 5.5 V - 280 - MHz VCC = 3.0 V to 3.6 V; VI = 2.5 V - −50 - dB VCC = 4.5 V to 5.5 V; VI = 4.0 V - −50 - dB RL = 600 Ω; fi = 1 MHz; see Figure 14 [1] Adjust input voltage VI to 0 dBm level (0 dBm =1 mW into 50 Ω). 11.3 Test circuits and graphs VCC VCC E VIH 2RL 10 µF Y/Z Z/Y fi VO 2RL CL D 001aai678 Test conditions: VCC = 3.0 V to 3.6 V; VI = 2.5 V (p-p). VCC = 4.5 V to 5.5 V; VI = 4.0 V (p-p). Fig 11. Test circuit for measuring total harmonic distortion VCC VCC E VIH 2RL 0.1 µF fi Y/Z Z/Y VO 2RL CL dB 001aai680 With fi = 1 MHz adjust the switch input voltage for a 0 dBm level at the switch output, (0 dBm = 1 mW into 50 Ω). Then increase the input fi frequency until the dB meter reads −3 dB. Fig 12. Test circuit for measuring the −3 dB frequency response 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 11 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch 001aai837 4 (dB) 2 0 −2 −4 104 105 106 107 108 109 fi (Hz) Test conditions: VCC = 4.5 V; GND = 0 V; RL = 50 Ω; RSOURCE = 1 kΩ. Fig 13. Typical −3 dB frequency response VCC VCC E VIL 2RL 0.1 µF Y/Z fi Z/Y VO CL 2RL dB 001aai679 Adjust the switch input voltage for a 0 dBm level (0 dBm = 1 mW into 600 Ω). Fig 14. Test circuit for measuring isolation (OFF-state) 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 12 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch 12. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.3 0.1 0.1 0.60 0.15 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC JEITA MO-203 SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 15. Package outline SOT353-1 (TSSOP5) 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 13 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT753 JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 16. Package outline SOT753 (SC-74A) 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 14 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch 13. Abbreviations Table 13. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 14. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHC_AHCT1G66_4 20081218 Product data sheet - 74AHC_AHCT1G66_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • Legal texts have been adapted to the new company name where appropriate. Package SOT353 changed to SOT353-1 in Table 1 and Figure 15. Quick Reference Data and Soldering sections removed. Section 2 “Features” updated. 74AHC_AHCT1G66_3 20020606 Product specification - 74AHC_AHCT1G66_2 74AHC_AHCT1G66_2 20020215 Product specification - 74AHC_AHCT1G66_1 74AHC_AHCT1G66_1 20010129 Product specification - - 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 15 of 17 74AHC1G66; 74AHCT1G66 NXP Semiconductors Single-pole single-throw analog switch 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AHC_AHCT1G66_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 18 December 2008 16 of 17 NXP Semiconductors 74AHC1G66; 74AHCT1G66 Single-pole single-throw analog switch 17. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 10.1 10.2 10.3 11 11.1 11.2 11.3 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 6 ON resistance test circuit and graphs. . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms and test circuit . . . . . . . . . . . . . . . . 8 Additional dynamic characteristics . . . . . . . . . 10 Test circuits and graphs . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 18 December 2008 Document identifier: 74AHC_AHCT1G66_4