74AUP2G125 Low-power dual buffer/line driver; 3-state Rev. 8 — 2 December 2011 Product data sheet 1. General description The 74AUP2G125 provides the dual non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (nOE). A HIGH level at pin nOE causes the output to assume a high-impedance OFF-state. This device has the input-disable feature, which allows floating input signals. The inputs are disabled when the output enable input nOE) is HIGH. Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down. 2. Features and benefits Wide supply voltage range from 0.8 V to 3.6 V High noise immunity Complies with JEDEC standards: JESD8-12 (0.8 V to 1.3 V) JESD8-11 (0.9 V to 1.65 V) JESD8-7 (1.2 V to 1.95 V) JESD8-5 (1.8 V to 2.7 V) JESD8-B (2.7 V to 3.6 V) ESD protection: HBM JESD22-A114F Class 3A exceeds 5000 V MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 1000 V Low static power consumption; ICC = 0.9 A (maximum) Latch-up performance exceeds 100 mA per JESD78B Class II Inputs accept voltages up to 3.6 V Low noise overshoot and undershoot < 10 % of VCC Input-disable feature allows floating input conditions IOFF circuitry provides partial power-down mode operation Multiple package options Specified from 40 C to +85 C and 40 C to +125 C 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AUP2G125DC 40 C to +125 C VSSOP8 plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm 74AUP2G125GT 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads; SOT833-1 8 terminals; body 1 1.95 0.5 mm 74AUP2G125GF 40 C to +125 C XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.35 1 0.5 mm 74AUP2G125GD 40 C to +125 C XSON8U plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; UTLP based; body 3 2 0.5 mm 74AUP2G125GM 40 C to +125 C XQFN8U plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 1.6 0.5 mm SOT902-1 74AUP2G125GN 40 C to +125 C XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.2 1.0 0.35 mm SOT1116 74AUP2G125GS 40 C to +125 C XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.35 1.0 0.35 mm SOT1203 SOT1089 4. Marking Table 2. Marking codes Type number Marking code[1] 74AUP2G125DC p25 74AUP2G125GT p25 74AUP2G125GF aM 74AUP2G125GD p25 74AUP2G125GM p25 74AUP2G125GN aM 74AUP2G125GS aM [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 1A 1Y 1OE 1 EN1 2A 2Y 2 2OE EN2 001aah932 001aah931 Fig 1. Logic symbol 74AUP2G125 Product data sheet Fig 2. IEC logic symbol All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 2 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state nY nA nOE mna227 Fig 3. Logic diagram (one gate) 6. Pinning information 6.1 Pinning 74AUP2G125 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 74AUP2G125 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 001aae974 Transparent top view 001aae973 Fig 4. Pin configuration SOT765-1 Fig 5. Pin configuration SOT833-1, SOT1089, SOT1116 and SOT1203 74AUP2G125 74AUP2G125 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 1 1Y 2A 8 2OE 7 1OE 2 6 1A 3 5 2Y GND 4 1OE VCC terminal 1 index area 001aaj471 Transparent top view Fig 6. Pin configuration SOT996-2 74AUP2G125 Product data sheet 001aae975 Transparent top view Fig 7. Pin configuration SOT902-1 All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 3 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state 6.2 Pin description Table 3. Symbol Pin description Pin Description SOT765-1, SOT833-1, SOT1089, SOT996-2, SOT1116 and SOT1203 SOT902-1 1OE, 2OE 1, 7 7, 1 output enable input (active LOW) 1A, 2A 2, 5 6, 3 data input GND 4 4 ground (0 V) 1Y, 2Y 6, 3 2, 5 data output VCC 8 8 supply voltage 7. Functional description Table 4. Function table[1] Input Output nOE nA nY L L L L H H H X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current Conditions VI < 0 V [1] VI input voltage IOK output clamping current VO < 0 V VO output voltage Active mode and Power-down mode IO output current VO = 0 V to VCC [1] Min Max Unit 0.5 +4.6 V 50 - mA 0.5 +4.6 V 50 - mA 0.5 +4.6 V - 20 mA ICC supply current - 50 mA IGND ground current 50 - mA Tstg storage temperature 65 +150 C - 250 mW total power dissipation Ptot [1] [2] Tamb = 40 C to +125 C [2] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. For VSSOP8 packages: above 110 C the value of Ptot derates linearly with 8.0 mW/K. For XSON8, XSON8U and XQFN8U packages: above 118 C the value of Ptot derates linearly with 7.8 mW/K. 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 4 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state 9. Recommended operating conditions Table 6. Operating conditions Symbol Parameter VCC Conditions Min Max Unit supply voltage 0.8 3.6 V VI input voltage 0 3.6 V VO output voltage Active mode 0 VCC V Power-down mode; VCC = 0 V 0 3.6 V 40 +125 C 0 200 ns/V Tamb ambient temperature t/V input transition rise and fall rate VCC = 0.8 V to 3.6 V 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 0.8 V Typ Max Unit 0.70 VCC - - V VCC = 0.9 V to 1.95 V 0.65 VCC - - V Tamb = 25 C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage 74AUP2G125 Product data sheet VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.30 VCC V VCC = 0.9 V to 1.95 V - - 0.35 VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V IO = 20 A; VCC = 0.8 V to 3.6 V VCC 0.1 - - V IO = 1.1 mA; VCC = 1.1 V 0.75 VCC - - V IO = 1.7 mA; VCC = 1.4 V 1.11 - - V IO = 1.9 mA; VCC = 1.65 V 1.32 - - V IO = 2.3 mA; VCC = 2.3 V 2.05 - - V VI = VIH or VIL IO = 3.1 mA; VCC = 2.3 V 1.9 - - V IO = 2.7 mA; VCC = 3.0 V 2.72 - - V IO = 4.0 mA; VCC = 3.0 V 2.6 - - V VI = VIH or VIL IO = 20 A; VCC = 0.8 V to 3.6 V - - 0.1 V IO = 1.1 mA; VCC = 1.1 V - - 0.3 VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.31 V IO = 1.9 mA; VCC = 1.65 V - - 0.31 V IO = 2.3 mA; VCC = 2.3 V - - 0.31 V IO = 3.1 mA; VCC = 2.3 V - - 0.44 V IO = 2.7 mA; VCC = 3.0 V - - 0.31 V IO = 4.0 mA; VCC = 3.0 V - - 0.44 V All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 5 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - 0.1 A IOZ OFF-state output current VI = VIH or VIL; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V - - 0.1 A IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - 0.2 A IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - 0.2 A ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 0.5 A ICC additional supply current data input; VI = VCC 0.6 V; IO = 0 A; VCC = 3.3 V [1] - - 40 A nOE input; VI = VCC 0.6 V; IO = 0 A; VCC = 3.3 V [1] - - 110 A all inputs; VI = GND to 3.6 V; nOE = GND; VCC = 0.8 V to 3.6 V [2] - - 1 A CI input capacitance VI = GND or VCC; VCC = 0 V to 3.6 V - 0.8 - pF CO output capacitance output enabled; VO = GND; VCC = 0 V - 1.4 - pF output disabled; VO = GND or VCC; VCC = 0 V to 3.6 V - 1.3 - pF VCC = 0.8 V 0.70 VCC - - V VCC = 0.9 V to 1.95 V 0.65 VCC - - V VCC = 2.3 V to 2.7 V 1.6 - V V Tamb = 40 C to +85 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage 74AUP2G125 Product data sheet - VCC = 3.0 V to 3.6 V 2.0 - - VCC = 0.8 V - - 0.30 VCC V VCC = 0.9 V to 1.95 V - - 0.35 VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V IO = 20 A; VCC = 0.8 V to 3.6 V VCC 0.1 - - V IO = 1.1 mA; VCC = 1.1 V 0.7 VCC - - V IO = 1.7 mA; VCC = 1.4 V 1.03 - - V IO = 1.9 mA; VCC = 1.65 V 1.30 - - V IO = 2.3 mA; VCC = 2.3 V 1.97 - - V IO = 3.1 mA; VCC = 2.3 V 1.85 - - V IO = 2.7 mA; VCC = 3.0 V 2.67 - - V IO = 4.0 mA; VCC = 3.0 V 2.55 - - V VI = VIH or VIL All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 6 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions VOL VI = VIH or VIL LOW-level output voltage Min Typ Max Unit IO = 20 A; VCC = 0.8 V to 3.6 V - - 0.1 V IO = 1.1 mA; VCC = 1.1 V - - 0.3 VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.37 V IO = 1.9 mA; VCC = 1.65 V - - 0.35 V IO = 2.3 mA; VCC = 2.3 V - - 0.33 V IO = 3.1 mA; VCC = 2.3 V - - 0.45 V IO = 2.7 mA; VCC = 3.0 V - - 0.33 V IO = 4.0 mA; VCC = 3.0 V - - 0.45 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - 0.5 A IOZ OFF-state output current VI = VIH or VIL; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V - - 0.5 A IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - 0.5 A IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - 0.6 A ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 0.9 A ICC additional supply current data input; VI = VCC 0.6 V; IO = 0 A; VCC = 3.3 V [1] - - 50 A nOE input; VI = VCC 0.6 V; IO = 0 A; VCC = 3.3 V [1] - - 120 A all inputs; VI = GND to 3.6 V; nOE = GND; VCC = 0.8 V to 3.6 V [2] - - 1 A VCC = 0.8 V 0.75 VCC - - V VCC = 0.9 V to 1.95 V 0.70 VCC - - V Tamb = 40 C to +125 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage 74AUP2G125 Product data sheet VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.25 VCC V VCC = 0.9 V to 1.95 V - - 0.30 VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V VI = VIH or VIL IO = 20 A; VCC = 0.8 V to 3.6 V VCC 0.11 - - V IO = 1.1 mA; VCC = 1.1 V 0.6 VCC - - V IO = 1.7 mA; VCC = 1.4 V 0.93 - - V IO = 1.9 mA; VCC = 1.65 V 1.17 - - V IO = 2.3 mA; VCC = 2.3 V 1.77 - - V IO = 3.1 mA; VCC = 2.3 V 1.67 - - V IO = 2.7 mA; VCC = 3.0 V 2.40 - - V IO = 4.0 mA; VCC = 3.0 V 2.30 - - V All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 7 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions VOL VI = VIH or VIL LOW-level output voltage Min Typ Max Unit IO = 20 A; VCC = 0.8 V to 3.6 V - - 0.11 V IO = 1.1 mA; VCC = 1.1 V - - 0.33 VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.41 V IO = 1.9 mA; VCC = 1.65 V - - 0.39 V IO = 2.3 mA; VCC = 2.3 V - - 0.36 V IO = 3.1 mA; VCC = 2.3 V - - 0.50 V IO = 2.7 mA; VCC = 3.0 V - - 0.36 V IO = 4.0 mA; VCC = 3.0 V - - 0.50 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - 0.75 A IOZ OFF-state output current VI = VIH or VIL; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V - - 0.75 A IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - 0.75 A IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - 0.75 A ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 1.4 A ICC additional supply current data input; VI = VCC 0.6 V; IO = 0 A; VCC = 3.3 V [1] - - 75 A nOE input; VI = VCC 0.6 V; IO = 0 A; VCC = 3.3 V [1] - - 180 A all inputs; VI = GND to 3.6 V; nOE = GND; VCC = 0.8 V to 3.6 V [2] - - 1 A [1] One input at VCC 0.6 V, other input at VCC or GND. [2] To show ICC remains very low when the input-disable feature is enabled. 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter 25 C Conditions Min Typ[1] 40 C to +125 C Max Min Max (85 C) Unit Max (125 C) CL = 5 pF tpd propagation delay nA to nY; see Figure 8 VCC = 0.8 V 74AUP2G125 Product data sheet [2] - 20.6 - - - - ns VCC = 1.1 V to 1.3 V 2.8 5.5 10.5 2.5 11.7 12.9 ns VCC = 1.4 V to 1.6 V 2.2 3.9 6.1 2.0 7.3 8.1 ns VCC = 1.65 V to 1.95 V 1.9 3.2 4.8 1.7 6.1 6.7 ns VCC = 2.3 V to 2.7 V 1.6 2.6 3.6 1.4 4.3 4.9 ns VCC = 3.0 V to 3.6 V 1.4 2.4 3.1 1.2 3.9 4.4 ns All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 8 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter 25 C Conditions enable time Min Max (85 C) Max (125 C) - 69.9 - - - - ns VCC = 1.1 V to 1.3 V 3.1 6.1 11.8 2.9 13.9 15.4 ns VCC = 1.4 V to 1.6 V 2.5 4.2 6.6 2.3 7.7 8.3 ns VCC = 1.65 V to 1.95 V 2.1 3.4 5.1 2.0 6.2 6.8 ns VCC = 2.3 V to 2.7 V 1.8 2.6 3.7 1.7 4.5 5.0 ns 1.7 2.4 3.1 1.7 3.5 3.9 ns nOE to nY; see Figure 9 [3] VCC = 0.8 V VCC = 3.0 V to 3.6 V tdis disable time Unit Max Min ten 40 C to +125 C Typ[1] nOE to nY; see Figure 9 [4] - 14.3 - - - - ns VCC = 1.1 V to 1.3 V VCC = 0.8 V 2.7 4.3 6.5 2.7 7.3 8.2 ns VCC = 1.4 V to 1.6 V 2.1 3.2 4.4 2.1 5.1 5.7 ns VCC = 1.65 V to 1.95 V 2.0 3.0 4.3 2.0 5.0 5.7 ns VCC = 2.3 V to 2.7 V 1.4 2.2 2.9 1.4 3.3 4.1 ns VCC = 3.0 V to 3.6 V 1.7 2.5 3.2 1.7 3.4 3.9 ns CL = 10 pF tpd propagation delay nA to nY; see Figure 8 [2] VCC = 0.8 V ten enable time - 24.0 - - - - ns VCC = 1.1 V to 1.3 V 3.2 6.4 12.3 3.0 13.8 15.2 ns VCC = 1.4 V to 1.6 V 2.1 4.5 7.3 1.9 8.5 9.4 ns VCC = 1.65 V to 1.95 V 1.9 3.8 5.5 1.7 6.8 7.6 ns VCC = 2.3 V to 2.7 V 2.1 3.2 4.2 1.6 5.3 5.9 ns VCC = 3.0 V to 3.6 V 1.8 3.0 3.8 1.6 4.6 5.2 ns - 73.7 - - - - ns VCC = 1.1 V to 1.3 V 3.6 6.9 13.5 3.4 15.8 17.5 ns VCC = 1.4 V to 1.6 V 2.3 4.8 7.7 2.2 8.6 9.4 ns VCC = 1.65 V to 1.95 V 2.0 3.9 5.8 1.9 6.8 7.4 ns VCC = 2.3 V to 2.7 V 1.8 3.2 4.3 1.7 5.3 5.9 ns 1.7 3.0 3.9 1.7 4.3 4.8 ns - 32.7 - - - - ns 3.4 5.4 7.9 3.4 8.8 9.9 ns nOE to nY; see Figure 9 [3] VCC = 0.8 V VCC = 3.0 V to 3.6 V tdis disable time nOE to nY; see Figure 9 VCC = 0.8 V VCC = 1.1 V to 1.3 V 74AUP2G125 Product data sheet [4] VCC = 1.4 V to 1.6 V 2.2 4.1 5.5 2.2 6.2 7.1 ns VCC = 1.65 V to 1.95 V 2.2 4.2 5.6 1.9 6.3 7.1 ns VCC = 2.3 V to 2.7 V 1.7 3.0 3.8 1.7 4.5 5.1 ns VCC = 3.0 V to 3.6 V 2.1 3.8 4.8 1.7 5.0 5.6 ns All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 9 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter 25 C Conditions 40 C to +125 C Unit Typ[1] Max Min Max (85 C) Max (125 C) - 27.4 - - - - ns 3.6 7.2 14.1 3.3 15.8 17.5 ns Min CL = 15 pF tpd propagation delay nA to nY; see Figure 8 [2] VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V 3.0 5.1 8.1 2.5 9.8 10.9 ns VCC = 1.65 V to 1.95 V 2.2 4.3 6.3 2.0 7.9 8.8 ns VCC = 2.3 V to 2.7 V 2.0 3.7 4.9 1.8 6.0 6.7 ns 2.0 3.5 4.4 1.8 5.4 6.1 ns - 77.5 - - - - ns VCC = 1.1 V to 1.3 V 4.0 7.7 15.2 3.7 17.6 19.6 ns VCC = 1.4 V to 1.6 V 3.0 5.3 8.4 2.5 9.8 10.7 ns VCC = 1.65 V to 1.95 V 2.3 4.4 6.5 2.1 7.7 8.5 ns VCC = 2.3 V to 2.7 V 2.1 3.6 5.0 2.0 6.1 6.8 ns 2.0 3.5 4.4 1.9 4.9 5.5 ns VCC = 3.0 V to 3.6 V ten enable time nOE to nY; see Figure 9 [3] VCC = 0.8 V VCC = 3.0 V to 3.6 V tdis disable time nOE to nY; see Figure 9 [4] - 60.8 - - - - ns VCC = 1.1 V to 1.3 V VCC = 0.8 V 4.3 6.5 9.2 3.7 10.3 11.6 ns VCC = 1.4 V to 1.6 V 3.0 5.0 6.5 2.5 7.4 8.4 ns VCC = 1.65 V to 1.95 V 3.0 5.3 7.0 2.1 7.4 8.9 ns VCC = 2.3 V to 2.7 V 2.1 3.8 4.9 2.0 5.1 6.4 ns VCC = 3.0 V to 3.6 V 2.9 5.0 6.2 1.9 6.6 7.4 ns CL = 30 pF tpd propagation delay nA to nY; see Figure 8 [2] VCC = 0.8 V ten enable time - 37.4 - - - - ns VCC = 1.1 V to 1.3 V 4.8 9.5 19.0 4.4 21.6 24.0 ns VCC = 1.4 V to 1.6 V 4.0 6.7 10.8 3.0 13.0 14.5 ns VCC = 1.65 V to 1.95 V 2.9 5.6 8.4 2.6 10.3 11.5 ns VCC = 2.3 V to 2.7 V 2.7 4.8 6.3 2.5 7.8 8.7 ns VCC = 3.0 V to 3.6 V 2.7 4.6 5.8 2.5 7.5 8.3 ns - 88.9 - - - - ns VCC = 1.1 V to 1.3 V 5.2 9.9 19.8 4.8 22.8 25.3 ns VCC = 1.4 V to 1.6 V 4.0 6.8 10.8 3.1 12.6 14.1 ns VCC = 1.65 V to 1.95 V 3.0 5.6 8.5 2.8 10.2 11.3 ns VCC = 2.3 V to 2.7 V 2.7 4.8 6.5 2.6 7.8 8.8 ns VCC = 3.0 V to 3.6 V 2.7 4.6 6.0 2.6 6.9 7.7 ns nOE to nY; see Figure 9 VCC = 0.8 V 74AUP2G125 Product data sheet [3] All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 10 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter 25 C Conditions disable time Unit Max Min Max (85 C) Max (125 C) - 49.9 - - - - ns VCC = 1.1 V to 1.3 V 6.0 9.9 13.3 4.8 14.8 16.5 ns VCC = 1.4 V to 1.6 V 4.4 7.7 9.6 3.1 10.8 12.1 ns VCC = 1.65 V to 1.95 V 5.1 8.7 11.1 2.8 12.4 13.8 ns VCC = 2.3 V to 2.7 V 3.6 6.2 7.6 2.6 8.6 9.6 ns VCC = 3.0 V to 3.6 V 5.2 8.7 10.5 2.6 10.8 13.1 ns VCC = 0.8 V - 2.7 - - - - pF VCC = 1.1 V to 1.3 V - 2.8 - - - - pF Min tdis 40 C to +125 C Typ[1] nOE to nY; see Figure 9 [4] VCC = 0.8 V CL = 5 pF, 10 pF, 15 pF and 30 pF power dissipation capacitance CPD output enabled; fi = 1 MHz; VI = GND to VCC VCC = 1.4 V to 1.6 V - 2.9 - - - - pF VCC = 1.65 V to 1.95 V - 3.0 - - - - pF VCC = 2.3 V to 2.7 V - 3.6 - - - - pF VCC = 3.0 V to 3.6 V - 4.2 - - - - pF [1] All typical values are measured at nominal VCC. [2] tpd is the same as tPLH and tPHL. [3] ten is the same as tPZH and tPZL. [4] tdis is the same as tPHZ and tPLZ. [5] [5] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of the outputs. 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 11 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state 12. Waveforms VI VM nA input GND tPHL tPLH VOH VM nY output VOL mna230 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 8. Table 9. The data input (nA) to output (nY) propagation delays Measurement points Supply voltage Output Input VCC VM VM VI tr = tf 0.8 V to 3.6 V 0.5 VCC 0.5 VCC VCC 3.0 ns VI nOE input VM GND tPLZ tPZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL tPHZ VOH tPZH VY output HIGH-to-OFF OFF-to-HIGH GND VM outputs enabled outputs enabled outputs disabled mna362 Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 9. Table 10. Enable and disable times Measurement points Supply voltage Input Output VCC VM VM VX VY 0.8 V to 1.6 V 0.5 VCC 0.5 VCC VOL + 0.1 V VOH 0.1 V 1.65 V to 2.7 V 0.5 VCC 0.5 VCC VOL + 0.15 V VOH 0.15 V 3.0 V to 3.6 V 0.5 VCC 0.5 VCC VOL + 0.3 V VOH 0.3 V 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 12 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state VCC VEXT 5 kΩ G VI VO DUT CL RT RL 001aac521 Test data is given in Table 11. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 10. Test circuit for measuring switching times Table 11. Test data Supply voltage Load VEXT [1] VCC CL RL 0.8 V to 3.6 V 5 pF, 10 pF, 15 pF and 30 pF 5 k or 1 M [1] tPLH, tPHL tPZH, tPHZ tPZL, tPLZ open GND 2 VCC For measuring enable and disable times RL = 5 k. For measuring propagation delays, set-up and hold times, and pulse width, RL = 1 M. 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 13 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state 13. Package outline VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Fig 11. Package outline SOT765-1 (VSSOP8) 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 14 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 12. Package outline SOT833-1 (XSON8) 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 15 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 x 0.5 mm SOT1089 E terminal 1 index area D A A1 detail X (4×)(2) e L (8×)(2) b 4 5 e1 1 terminal 1 index area 8 L1 X 0 0.5 scale Dimensions Unit mm max nom min 1 mm A(1) 0.5 A1 b D E e e1 L L1 0.35 0.40 0.04 0.20 1.40 1.05 0.15 1.35 1.00 0.55 0.35 0.30 0.35 0.27 0.32 0.12 1.30 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version SOT1089 sot1089_po References IEC JEDEC JEITA European projection Issue date 10-04-09 10-04-12 MO-252 Fig 13. Package outline SOT1089 (XSON8) 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 16 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 v w b e L1 1 4 8 5 C C A B C M M y y1 C L2 L X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 L2 v w y y1 mm 0.5 0.05 0.00 0.35 0.15 2.1 1.9 3.1 2.9 0.5 1.5 0.5 0.3 0.15 0.05 0.6 0.4 0.1 0.05 0.05 0.1 REFERENCES OUTLINE VERSION IEC SOT996-2 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 14. Package outline SOT996-2 (XSON8U) 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 17 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm B D SOT902-1 A terminal 1 index area E A A1 detail X L1 e e C ∅v M C A B ∅w M C L 4 y1 C y 5 3 metal area not for soldering e1 b 6 2 e1 7 1 terminal 1 index area 8 X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 v w y y1 mm 0.5 0.05 0.00 0.25 0.15 1.65 1.55 1.65 1.55 0.55 0.5 0.35 0.25 0.15 0.05 0.1 0.05 0.05 0.05 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT902-1 --- MO-255 --- EUROPEAN PROJECTION ISSUE DATE 05-11-25 07-11-14 Fig 15. Package outline SOT902-1 (XQFN8U) 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 18 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1.0 x 0.35 mm 1 2 SOT1116 b 4 3 (4×)(2) L L1 e 8 7 e1 6 e1 5 e1 (8×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 max 0.35 0.04 0.20 1.25 1.05 nom 0.15 1.20 1.00 0.55 min 0.12 1.15 0.95 0.3 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version sot1116_po References IEC JEDEC JEITA European projection Issue date 10-04-02 10-04-07 SOT1116 Fig 16. Package outline SOT1116 (XSON8) 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 19 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.0 x 0.35 mm SOT1203 b 2 1 3 (4×)(2) 4 L L1 e 8 7 6 e1 e1 5 e1 (8×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 L L1 max 0.35 0.04 0.20 1.40 1.05 0.35 0.40 nom 0.15 1.35 1.00 0.55 0.35 0.30 0.35 min 0.12 1.30 0.95 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version sot1203_po References IEC JEDEC JEITA European projection Issue date 10-04-02 10-04-06 SOT1203 Fig 17. Package outline SOT1203 (XSON8) 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 20 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state 14. Abbreviations Table 12. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 15. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AUP2G125 v.8 20111202 Product data sheet - 74AUP2G125 v.7 Modifications: • Legal pages updated. 74AUP2G125 v.7 20100921 Product data sheet - 74AUP2G125 v.6 74AUP2G125 v.6 20091127 Product data sheet - 74AUP2G125 v.5 74AUP2G125 v.5 20090202 Product data sheet - 74AUP2G125 v.4 74AUP2G125 v.4 20090122 Product data sheet - 74AUP2G125 v.3 74AUP2G125 v.3 20080409 Product data sheet - 74AUP2G125 v.2 74AUP2G125 v.2 20070419 Product data sheet - 74AUP2G125 v.1 74AUP2G125 v.1 20061017 Product data sheet - - 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 21 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 22 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AUP2G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 2 December 2011 © NXP B.V. 2011. All rights reserved. 23 of 24 74AUP2G125 NXP Semiconductors Low-power dual buffer/line driver; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Contact information. . . . . . . . . . . . . . . . . . . . . 23 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 2 December 2011 Document identifier: 74AUP2G125