74LVC1G125 Bus buffer/line driver; 3-state Rev. 11 — 2 July 2012 Product data sheet 1. General description The 74LVC1G125 provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (OE). A HIGH-level at pin OE causes the output to assume a high-impedance OFF-state. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features and benefits Wide supply voltage range from 1.65 V to 5.5 V High noise immunity Complies with JEDEC standard: JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8-B/JESD36 (2.7 V to 3.6 V) 24 mA output drive (VCC = 3.0 V) ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V CMOS low power consumption Inputs accept voltages up to 5 V Latch-up performance exceeds 250 mA Direct interface with TTL levels Multiple package options Specified from 40 C to +85 C and 40 C to +125 C 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G125GW 40 C to +125 C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 74LVC1G125GV 40 C to +125 C SC-74A plastic surface-mounted package; 5 leads SOT753 74LVC1G125GM 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1.45 0.5 mm SOT886 74LVC1G125GF 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1 0.5 mm SOT891 74LVC1G125GN 40 C to +125 C XSON6 extremely thin small outline package; no leads; 6 terminals; body 0.9 1.0 0.35 mm SOT1115 74LVC1G125GS 40 C to +125 C XSON6 extremely thin small outline package; no leads; 6 terminals; body 1.0 1.0 0.35 mm SOT1202 74LVC1G125GX 40 C to +125 C X2SON5 X2SON5: plastic thermal enhanced extremely thin SOT1226 small outline package; no leads; 5 terminals; body 0.8 0.8 0.35 mm 4. Marking Table 2. Marking Type number Marking code[1] 74LVC1G125GW VM 74LVC1G125GV V25 74LVC1G125GM VM 74LVC1G125GF VM 74LVC1G125GN VM 74LVC1G125GS VM 74LVC1G125GX VM [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 2 A Y 4 Y A 2 4 1 OE 1 mna118 Fig 1. Logic symbol 74LVC1G125 Product data sheet EN OE mna119 Fig 2. IEC logic symbol All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 mna120 Fig 3. Logic diagram © NXP B.V. 2012. All rights reserved. 2 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 6. Pinning information 6.1 Pinning 74LVC1G125 74LVC1G125 1 OE A 2 GND 3 5 4 OE 1 6 VCC A 2 5 n.c. GND 3 4 Y VCC Y 001aaf199 Transparent top view 001aaf198 Fig 4. Pin configuration SOT353-1 and SOT753 Fig 5. Pin configuration SOT886 74LVC1G125 74LVC1G125 1 OE OE 1 6 VCC A 2 5 n.c. GND 3 4 Y VCC 4 Y 3 GND 2 A 001aaf400 aaa-003032 Transparent top view Transparent top view Fig 6. 5 Pin configuration SOT891, SOT1115 and SOT1202 Fig 7. Pin configuration SOT1226 (X2SON5) 6.2 Pin description Table 3. Pin description Symbol Pin Description TSSOP5 and X2SON5 XSON6 OE 1 1 output enable input A 2 2 data input GND 3 3 ground (0 V) Y 4 4 data output n.c. - 5 not connected VCC 5 6 supply voltage 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 3 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 7. Functional description Table 4. Function table[1] Input Output OE A Y L L L L H H H X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current output voltage VO IO output current ICC supply current IGND ground current Ptot total power dissipation Tstg storage temperature Conditions VI < 0 V [1] Min Max Unit 0.5 +6.5 V 50 - mA 0.5 +6.5 V - 50 mA Active mode [1][2] 0.5 VCC + 0.5 V Power-down mode [1][2] 0.5 +6.5 V - 50 mA - 100 mA 100 - mA - 250 mW 65 +150 C VO > VCC or VO < 0 V VO = 0 V to VCC Tamb = 40 C to +125 C [3] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. [3] For TSSOP5 and SC-74A packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 and X2SON5 package: above 118 C the value of Ptot derates linearly with 7.8 mW/K. 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 4 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter VCC Conditions Min Typ Max Unit supply voltage 1.65 - 5.5 V VI input voltage 0 - 5.5 V VO output voltage Active mode 0 - VCC V VCC = 0 V; Power-down mode 0 - 5.5 V 40 - +125 C VCC = 1.65 V to 2.7 V - - 20 ns/V VCC = 2.7 V to 5.5 V - - 10 ns/V Typ[1] Max Unit Tamb ambient temperature t/V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 1.65 V to 1.95 V 0.65 VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7 VCC - - V VCC = 1.65 V to 1.95 V - - 0.35 VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3 VCC V Tamb = 40 C to +85 C VIH VIL VOL VOH HIGH-level input voltage LOW-level input voltage LOW-level output voltage VI = VIH or VIL VCC = 1.65 V to 5.5 V; IO = 100 A - - 0.1 V VCC = 1.65 V; IO = 4 mA - - 0.45 V VCC = 2.3 V; IO = 8 mA - - 0.3 V VCC = 2.7 V; IO = 12 mA - - 0.4 V VCC = 3.0 V; IO = 24 mA - - 0.55 V VCC = 4.5 V; IO = 32 mA - - 0.55 V VCC = 1.65 V to 5.5 V; IO = 100 A VCC 0.1 - - V VCC = 1.65 V; IO = 4 mA 1.2 - - V VCC = 2.3 V; IO = 8 mA 1.9 - - V VCC = 2.7 V; IO = 12 mA 2.2 - - V VCC = 3.0 V; IO = 24 mA 2.3 - - V HIGH-level output voltage VI = VIH or VIL VCC = 4.5 V; IO = 32 mA 3.8 - - V II input leakage current VCC = 0 V to 5.5 V; VI = 5.5 V or GND - 0.1 5 A IOZ OFF-state output current VCC = 3.6 V; VI = VIH or VIL; VO = 5.5 V or GND - 0.1 10 A 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 5 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit IOFF power-off leakage current VCC = 0 V; VI or VO = 5.5 V - 0.1 10 A ICC supply current VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A - 0.1 10 A ICC additional supply current per pin; VCC = 2.3 V to 5.5 V; VI = VCC 0.6 V; IO = 0 A - 5 500 A CI input capacitance - 5 - pF VCC = 1.65 V to 1.95 V 0.65 VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V V Tamb = 40 C to +125 C HIGH-level input voltage VIH LOW-level input voltage VIL LOW-level output voltage VOL VOH VCC = 4.5 V to 5.5 V 0.7 VCC - - VCC = 1.65 V to 1.95 V - - 0.35 VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3 VCC V VCC = 1.65 V to 5.5 V; IO = 100 A - - 0.1 V VCC = 1.65 V; IO = 4 mA - - 0.70 V VI = VIH or VIL VCC = 2.3 V; IO = 8 mA - - 0.45 V VCC = 2.7 V; IO = 12 mA - - 0.60 V VCC = 3.0 V; IO = 24 mA - - 0.80 V VCC = 4.5 V; IO = 32 mA - - 0.80 V VCC = 1.65 V to 5.5 V; IO = 100 A VCC 0.1 - - V VCC = 1.65 V; IO = 4 mA 0.95 - - V VCC = 2.3 V; IO = 8 mA 1.7 - - V VCC = 2.7 V; IO = 12 mA 1.9 - - V VCC = 3.0 V; IO = 24 mA 2.0 - - V VCC = 4.5 V; IO = 32 mA 3.4 - - V HIGH-level output voltage VI = VIH or VIL II input leakage current VCC = 0 V to 5.5 V; VI = 5.5 V or GND - - 100 A IOZ OFF-state output current VCC = 3.6 V; VI = VIH or VIL; VO = 5.5 V or GND - - 200 A IOFF power-off leakage current VCC = 0 V; VI or VO = 5.5 V - - 200 A ICC supply current VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A - - 200 A ICC additional supply current per pin; VCC = 2.3 V to 5.5 V; VI = VCC 0.6 V; IO = 0 A - - 5000 A [1] All typical values are measured at VCC = 3.3 V and Tamb = 25 C. 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 6 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 10. Symbol Parameter 40 C to +85 C Conditions Min Max Min Max VCC = 1.65 V to 1.95 V 1.0 3.3 8.0 1.0 10.5 ns VCC = 2.3 V to 2.7 V 0.5 2.2 5.5 0.5 7 ns VCC = 2.7 V 0.5 2.5 5.5 0.5 7 ns VCC = 3.0 V to 3.6 V 0.5 2.1 4.5 0.5 6 ns VCC = 4.5 V to 5.5 V 0.5 1.7 4.0 0.5 5.5 ns 1.0 4.1 9.4 1.0 12 ns [2] propagation delay A to Y; see Figure 8 tpd enable time ten OE to Y; see Figure 9 [3] VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V 0.5 2.8 6.6 0.5 8.5 ns VCC = 2.7 V 0.5 3.3 6.6 0.5 8.5 ns VCC = 3.0 V to 3.6 V 0.5 2.4 5.3 0.5 7 ns 0.5 2.1 5.0 0.5 6.5 ns VCC = 1.65 V to 1.95 V 1.0 4.3 9.2 1.0 12 ns VCC = 2.3 V to 2.7 V 0.5 2.7 5.0 0.5 6.5 ns VCC = 2.7 V 0.5 3.0 5.0 0.5 6.5 ns VCC = 3.0 V to 3.6 V 0.5 3.1 5.0 0.5 6.5 ns VCC = 4.5 V to 5.5 V 0.5 2.2 4.2 0.5 5.5 ns output enabled - 25 - - - pF output disabled - 6 - - - pF VCC = 4.5 V to 5.5 V disable time tdis power dissipation capacitance CPD 40 C to +125 C Unit Typ[1] OE to Y; see Figure 9 per buffer; VI = GND to VCC [4] [5] [1] Typical values are measured at Tamb = 25 C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively. [2] tpd is the same as tPLH and tPHL [3] ten is the same as tPZH and tPZL [4] tdis is the same as tPLZ and tPHZ [5] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 7 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 12. Waveforms VI VM A input GND t PHL t PLH VOH VM Y output VOL mnb153 Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output load. Fig 8. Input A to output Y propagation delay times VI OE input VM GND tPLZ tPZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL tPHZ tPZH VOH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled mna644 Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output load. Fig 9. Table 9. 3-state enable and disable times Measurement points Supply voltage Input Output VCC VM VM VX VY 1.65 V to 1.95 V 0.5VCC 0.5VCC VOL + 0.15 V VOH 0.15 V 2.3 V to 2.7 V 0.5VCC 0.5VCC VOL + 0.15 V VOH 0.15 V 2.7 V 1.5 V 1.5 V VOL + 0.3 V VOH 0.3 V 3.0 V to 3.6 V 1.5 V 1.5 V VOL + 0.3 V VOH 0.3 V 4.5 V to 5.5 V 0.5VCC 0.5VCC VOL + 0.3 V VOH 0.3 V 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 8 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 10. Test circuit for measuring switching times Table 10. Test data Supply voltage Input VCC VI tr, tf CL RL tPLH, tPHL tPZH, tPHZ tPZL, tPLZ 1.65 V to 1.95 V VCC 2.0 ns 30 pF 1 k open GND 2VCC 2.3 V to 2.7 V VCC 2.0 ns 30 pF 500 open GND 2VCC 2.7 V 2.7 V 2.5 ns 50 pF 500 open GND 6V 3.0 V to 3.6 V 2.7 V 2.5 ns 50 pF 500 open GND 6V 4.5 V to 5.5 V VCC 2.5 ns 50 pF 500 open GND 2VCC 74LVC1G125 Product data sheet Load VEXT All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 9 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.3 0.1 0.1 0.60 0.15 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC JEITA MO-203 SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 11. Package outline SOT353-1 (TSSOP5) 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 10 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC SOT753 JEDEC JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 12. Package outline SOT753 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 11 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state SOT886 XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm b 1 2 3 4x (2) L L1 e 6 5 e1 4 e1 6x A (2) A1 D E terminal 1 index area 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit mm max nom min A(1) 0.5 A1 b D E 0.04 0.25 1.50 1.05 0.20 1.45 1.00 0.17 1.40 0.95 e e1 0.6 0.5 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. Outline version SOT886 sot886_po References IEC JEDEC JEITA European projection Issue date 04-07-22 12-01-05 MO-252 Fig 13. Package outline SOT886 (XSON6) 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 12 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm 1 SOT891 b 3 2 4× (1) L L1 e 6 5 e1 4 e1 6× A (1) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 max b D E e e1 L L1 mm 0.5 0.04 0.20 0.12 1.05 0.95 1.05 0.95 0.55 0.35 0.35 0.27 0.40 0.32 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-04-06 07-05-15 SOT891 Fig 14. Package outline SOT891 (XSON6) 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 13 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm 1 SOT1115 b 3 2 (4×)(2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 max 0.35 0.04 0.20 0.95 1.05 nom 0.15 0.90 1.00 0.55 min 0.12 0.85 0.95 0.3 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version sot1115_po References IEC JEDEC JEITA European projection Issue date 10-04-02 10-04-07 SOT1115 Fig 15. Package outline SOT1115 (XSON6) 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 14 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm 1 SOT1202 b 3 2 (4×)(2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 L L1 max 0.35 0.04 0.20 1.05 1.05 0.35 0.40 nom 0.15 1.00 1.00 0.55 0.35 0.30 0.35 min 0.12 0.95 0.95 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version sot1202_po References IEC JEDEC JEITA European projection Issue date 10-04-02 10-04-06 SOT1202 Fig 16. Package outline SOT1202 (XSON6) 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 15 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state X2SON5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0.8 x 0.35 mm B A D SOT1226 X A E A1 A3 detail X terminal 1 index area e C v w b 1 2 terminal 1 index area C A B C y1 C y k D h 3 L 5 4 0 1 mm scale Dimensions Unit mm A(1) A1 A3 D Dh E b e k L max 0.35 0.04 0.128 0.85 0.30 0.85 0.27 0.27 nom 0.80 0.25 0.80 0.22 0.48 0.22 min 0.20 0.17 0.040 0.75 0.20 0.75 0.17 v 0.1 w y y1 0.05 0.05 0.05 Note 1. Dimension A is including plating thickness. 2. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline version References IEC JEDEC EIAJ sot1226_po European projection Issue date 12-04-10 12-04-25 SOT1226 Fig 17. Package outline SOT1226 (X2SON5) 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 16 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC1G125 v.11 20120702 Product data sheet - 74LVC1G125 v.10 Modifications: 74LVC1G125 v.10 Modifications: • • Added type number 74LVC1G125GX (SOT1226) Package outline drawing of SOT886 (Figure 13) modified. 20111207 • Product data sheet - 74LVC1G125 v.9 Legal pages updated. 74LVC1G125 v.9 20101229 Product data sheet - 74LVC1G125 v.8 74LVC1G125 v.8 20100824 Product data sheet - 74LVC1G125 v.7 74LVC1G125 v.7 20070830 Product data sheet - 74LVC1G125 v.6 74LVC1G125 v.6 20060912 Product data sheet - 74LVC1G125 v.5 74LVC1G125 v.5 20040915 Product specification - 74LVC1G125 v.4 74LVC1G125 v.4 20021118 Product specification - 74LVC1G125 v.3 74LVC1G125 v.3 20020528 Product specification - 74LVC1G125 v.2 74LVC1G125 v.2 20010406 Product specification - 74LVC1G125 v.1 74LVC1G125 v.1 20001222 Product specification - - 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 17 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74LVC1G125 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 18 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74LVC1G125 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 2 July 2012 © NXP B.V. 2012. All rights reserved. 19 of 20 74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 2 July 2012 Document identifier: 74LVC1G125