TJA1080 FlexRay transceiver Rev. 01 — 20 July 2006 Preliminary data sheet 1. General description The TJA1080 is a FlexRay transceiver, which is compatible with the FlexRay electrical physical layer specification V2.1 Rev. A (see Ref. 1). It is primarily intended for communication systems from 1 Mbit/s to 10 Mbit/s, and provides an advanced interface between the protocol controller and the physical bus in a FlexRay network. The TJA1080 can be configured to be used as an active star transceiver or as a node transceiver. The TJA1080 provides differential transmit capability to the network and differential receive capability to the FlexRay controller. It offers excellent EMC performance as well as high ESD protection. The TJA1080 actively monitors the system performance using dedicated error and status information (readable by any microcontroller), as well as internal voltage and temperature monitoring. The TJA1080 supports the mode control as used in Philips TJA1054 (see Ref. 2) and TJA1041 (see Ref. 3) CAN transceivers. 2. Features 2.1 Optimized for time triggered communication systems n n n n n n n n Data transfer up to 10 Mbit/s Usable for 14 V and 42 V powered systems Very low ElectroMagnetic Emission (EME) to support unshielded cable Differential receiver with high common-mode range for ElectroMagnetic Immunity (EMI) Transceiver can be used for small linear passive bus topologies as well as active star topologies Auto I/O level adaptation to host controller supply voltage VIO Bus guardian interface included Automotive product qualification in accordance with AEC-Q100 TJA1080 Philips Semiconductors FlexRay transceiver 2.2 Low power management n Low power management including two inhibit switches n Very low current in Sleep and Standby mode n Wake-up via wake-up symbol on the bus lines (remote), negative edge on pin WAKE (local), and a positive edge on pin STBN if VIO is present n Wake-up source recognition n Automatic power-down (in star Sleep mode) in star configuration 2.3 Diagnosis (detection and signalling) n n n n n n Overtemperature detection Short-circuit on bus lines VBAT power-on flag (first battery connection and cold start) Pin TXEN and pin BGE clamping Undervoltage detection on pins VBAT, VCC and VIO Wake source indication 2.4 Protections n Bus pins protected against 8 kV HBM ESD pulses n Bus pins protected against transients in automotive environment (ISO 7637 class C compliant) n Bus pins short-circuit proof to battery voltage (14 V and 42 V) and ground n Fail-safe mode in case of an undervoltage on pins VBAT, VCC or VIO n Passive behavior of bus lines in the event that transceiver is not powered up 3. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VBAT supply voltage on pin VBAT no time limit −0.3 - +60 V operating range 6.5 - 60 V VCC supply voltage no time limit −0.3 - +5.5 V operating range 4.75 - 5.25 V VBUF supply voltage on pin VBUF no time limit −0.3 - +5.5 V operating range 4.75 - 5.25 V no time limit −0.3 - +5.5 V operating range 2.2 - VIO supply voltage on pin VIO 5.25 V VTRXD0 voltage on pin TRXD0 −0.3 +5.5 V VTRXD1 voltage on pin TRXD1 −0.3 +5.5 V VBP voltage on pin BP −60 - +60 V VBM voltage on pin BM IBAT supply current on pin VBAT −60 - +60 V low power modes in node configuration - 35 50 µA normal power modes - 0.075 1 mA TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 2 of 44 TJA1080 Philips Semiconductors FlexRay transceiver Table 1. Quick reference data …continued Symbol Parameter Conditions Min Typ Max Unit ICC supply current low power modes −1 0 +5 µA Normal mode; VBGE = 0 V; VTXEN = VIO; Receive only mode; star Idle mode - 10 15 mA - 28.5 35 mA - 10 15 mA Normal mode; VBGE = VIO; VTXEN = 0 V; VBUF open [1] Normal mode; VBGE = VIO; VTXEN = 0 V; Rbus = ∞ Ω supply current on pin VIO IIO star Transmit mode - 50 62 mA star Receive mode - 38 42 mA low power modes −1 +1 +5 µA Normal and Receive only mode; VTXD = VIO - 30 1000 µA VOH(dif) differential HIGH-level output voltage on pins BP and BM; 40 Ω < Rbus < 55 Ω; VCC = VBUF = 5 V 600 800 1200 mV VOL(dif) differential LOW-level output voltage on pins BP and BM; 40 Ω < Rbus < 55 Ω; VCC = VBUF = 5 V −1200 −800 −600 mV VIH(dif) differential HIGH-level input voltage on pins BP and BM; normal power modes; −10 V < VBP < +15 V; −10 V < VBM < +15 V 150 225 300 mV VIL(dif) differential LOW-level input voltage on pins BP and BM; normal power modes; −10 V < VBP < +15 V; −10 V < VBM < +15 V −300 −225 −150 mV Tvj virtual junction temperature −40 - +150 °C [2] [1] Current flows from VCC to VBUF. This means that the maximum sum current ICC + IBUF is 35 mA. [2] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature Tvj is: Tvj = Tamb + TD x Rth(j-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). 4. Ordering information Table 2. Ordering information Type number TJA1080TS/N Package Name Description Version SSOP20 plastic shrink small outline package; 20 leads; body with 5.3 mm SOT339-1 TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 3 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 5. Block diagram VIO VCC 4 VBUF 19 VBAT 20 14 1 2 INH2 INH1 TJA1080 TRXD0 11 18 SIGNAL ROUTER TRXD1 TRANSMITTER 17 BP BM 10 VIO TXD TXEN BGE STBN EN RXD ERRN RXEN 5 6 INPUT VOLTAGE ADAPTATION 8 9 3 7 13 12 OUTPUT VOLTAGE ADAPTATION VBAT WAKE BUS FAILURE DETECTION 15 RXDINT STATE MACHINE RXDINT NORMAL RECEIVER OVERTEMPERATURE DETECTION WAKE-UP DETECTION OSCILLATOR LOWPOWER RECEIVER UNDERVOLTAGE DETECTION 16 001aae436 GND Fig 1. Block diagram TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 4 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 6. Pinning information 6.1 Pinning INH2 1 20 VBUF INH1 2 19 VCC EN 3 18 BP VIO 4 17 BM TXD 5 TXEN 6 RXD 7 14 VBAT BGE 8 13 ERRN STBN 9 12 RXEN TJA1080TS TRXD1 10 16 GND 15 WAKE 11 TRXD0 001aae437 Fig 2. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin Type Description INH2 1 O inhibit 2 output for switching external voltage regulator INH1 2 O inhibit 1 output for switching external voltage regulator EN 3 I enable input; when HIGH enabled; internal pull-down VIO 4 P supply voltage for VIO voltage level adaptation TXD 5 I transmit data input; internal pull-down TXEN 6 I transmitter enable input; when HIGH transmitter disabled; internal pull-up RXD 7 O receive data output BGE 8 I bus guardian enable input; when LOW transmitter disabled; internal pull-down STBN 9 I standby input; when LOW low power mode; internal pull-down TRXD1 10 I/O data bus line 1 for inner star connection TRXD0 11 I/O data bus line 0 for inner star connection RXEN 12 O receive data enable output; when LOW bus activity detected ERRN 13 O error diagnoses output; when LOW error detected VBAT 14 P battery supply voltage WAKE 15 I local wake-up input; internal pull-up or pull-down (depends on voltage at pin WAKE) GND 16 P ground BM 17 I/O bus line minus BP 18 I/O bus line plus VCC 19 P supply voltage (+5 V) VBUF 20 P buffer supply voltage TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 5 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 7. Functional description The block diagram of the total transceiver is illustrated in Figure 1. 7.1 Operating configurations 7.1.1 Node configuration In node configuration the transceiver operates as a stand-alone transceiver. The transceiver can be configured as node by connecting pins TRXD0 and TRXD1 to ground during a power-on situation (PWON flag is set). The configuration will be latched when the PWON flag is reset. The following operating modes are selectable: • • • • • Normal: normal power mode Receive: normal power mode Standby: low power mode Go-to-sleep: low power mode Sleep: low power mode 7.1.2 Star configuration In star configuration the transceiver operates as a branch of a FlexRay active star. The transceiver can be configured as star by connecting pin TRXD0 or TRXD1 to VBUF during a PWON situation (PWON flag is set). The configuration will be latched when the PWON flag is reset. It is possible to redirect data from one branch to other branches via the inner bus. It is also possible to send data to all branches via pin TXD, if pins TXEN and BGE have the correct polarity. The following operating modes are available: • • • • • • Star idle: normal power mode Star transmit: normal power mode Star receive: normal power mode Star sleep: low power mode Star standby: low power mode Star locked: normal power mode In the star configuration all modes are autonomously controlled by the transceiver, except in the case of a wake-up. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 6 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 7.1.3 Bus activity and idle detection The following mechanisms for activity and idle detection are valid for node and star configurations in normal power modes: • If the absolute differential voltage on the bus lines is higher than Vi(dif)det(act) for tdet(act)(bus), then activity is detected on the bus lines and pin RXEN is switched to LOW which results in pin RXD being released • If, after bus activity detection, the differential voltage on the bus lines is higher than VIH(dif), pin RXD will go HIGH • If, after bus activity detection, the differential voltage on the bus lines is lower than VIL(dif), pin RXD will go LOW • If the absolute differential voltage on the bus lines is lower than Vi(dif)det(act) for tdet(idle)(bus), then idle is detected on the bus lines and pin RXEN is switched to HIGH. This results in pin RXD being blocked (pin RXD is switched to HIGH or stays HIGH) Additionally, in star configuration, activity and idle can be detected: • If pin TXEN is LOW for longer than tdet(act)(TXEN), activity is detected on pin TXEN • If pin TXEN is HIGH for longer than tdet(idle)(TXEN), idle is detected on pin TXEN • If pin TRXD0 or TRXD1 is LOW for longer than tdet(act)(TRXD), activity is detected on pins TRXD0 and TRXD1 • If pin TRXD0 or TRXD1 is HIGH for longer than tdet(idle)(TRXD), idle is detected on pins TRXD0 and TRXD1 7.2 Operating modes in node configuration The TJA1080 provides two control pins STBN and EN in order to select one of the modes of operation in node configuration. See Table 4 for a detailed description of the pin signalling in node configuration, and Figure 3 for the timing diagram. All modes are directly controlled via pins EN and STBN unless an undervoltage situation is present. If VIO and (VBUF or VBAT) are within their operating range, pin ERRN indicates the error flag. Table 4. Pin Pin signalling in node configuration Mode Normal Receive only Go-to-sleep Standby Sleep STBN HIGH HIGH LOW LOW LOW EN HIGH LOW HIGH LOW X ERRN LOW: error flag set [3] LOW: wake flag set [4] HIGH: error flag set[3] [4] HIGH: wake flag reset [4] LOW: bus activity LOW: wake flag set [4] HIGH: bus idle HIGH: wake flag reset [4] LOW: bus DATA_0 LOW: wake flag set [4] HIGH: bus DATA_1 or idle HIGH: wake flag reset [4] RXEN RXD TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 7 of 44 TJA1080 Philips Semiconductors FlexRay transceiver Table 4. Pin Pin signalling in node configuration …continued Mode Normal Receive only Go-to-sleep Standby Sleep INH1 HIGH HIGH HIGH float [4] INH2 HIGH float [5] float [5] float [4] Transmitter enabled disabled [4] disabled [4] [3] Pin ERRN provides a serial interface for retrieving diagnostic information. [4] Valid if VIO and VBUF or VBAT are present. [5] If wake flag is not set. TXD BGE TXEN BP BM RXEN RXD 001aae439 Fig 3. Timing diagram in normal mode node configuration The state diagram in node configuration is illustrated in Figure 4. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 8 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 1 RECEIVE ONLY NORMAL STBN = 1 EN = 0 STBN = 1 EN = 1 4 3, 30 15, 25, 43, 44 8, 17, 40 5 6, 33 31, 32 10, 20 11, 21 2 14, 24, 41, 42 7, 16, 39 28, 29 12, 22, 36 19 STANDBY(1) GO-TO-SLEEP STBN = 0 EN = 0 STBN = 0 EN = 1 23 9, 18 37, 38 13, 34, 35 26, 45, 46 27, 47, 48 SLEEP STBN = 0 EN = X 001aae438 (1) At the first battery connection the transceiver will enter the Standby mode. Fig 4. State diagram in node configuration The state transitions are represented with numbers, which correspond with the numbers in the last column of Table 5 to Table 8. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 9 of 44 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Philips Semiconductors TJA1080_1 Preliminary data sheet Table 5. State transitions forced by EN and STBN (node configuration) → indicates the action that initiates a transaction; →1 and →2 are the consequences of a transaction. Transition from mode Direction to mode Transition number Pin STBN EN UVVIO UVVBAT UVVCC PWON Wake Normal receive only 1 H →L cleared cleared cleared cleared cleared go-to-sleep 2 →L H cleared cleared cleared cleared cleared standby 3 →L →L cleared cleared cleared cleared cleared 4 H →H cleared cleared cleared X X go-to-sleep 5 →L →H cleared cleared cleared X X standby 6 →L L cleared cleared cleared X X normal 7 →H →H cleared cleared 2 → cleared X 1 → set [2][3] receive only 8 →H L cleared cleared 2 → cleared X 1 → set [2][3] go-to-sleep 9 L →H cleared cleared X X X normal 10 →H H cleared cleared cleared X 1 → set [2][4] receive only 11 →H →L cleared cleared cleared X 1 → set [2][4] standby 12 L →L cleared cleared X X X [4] sleep 13 L H cleared cleared X X cleared [5] normal 14 →H H 2 → cleared 2 → cleared 2 → cleared X 1 → set [2][3] receive only 15 →H L 2 → cleared 2 → cleared 2 → cleared X 1 → set [2][3] Receive only normal Standby Go-to-sleep Rev. 01 — 20 July 2006 Sleep Flag [1] STBN must be set to LOW 60 µs after EN. [2] Positive edge on pin STBN sets the wake flag. [3] Setting the wake flag clears the UVVIO, UVVBAT and UVVCC flag. [4] Hold time of go-to-sleep is less than the minimum hold time. [5] Hold time of go-to-sleep becomes greater than the minimum hold time. Note [1] TJA1080 FlexRay transceiver 10 of 44 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Philips Semiconductors TJA1080_1 Preliminary data sheet Table 6. State transitions forced by a wake-up (node configuration) → indicates the action that initiates a transaction; →1 and →2 are the consequences of a transaction. Transition from mode Direction to mode Transition number Pin STBN EN Wake UVVIO UVVBAT UVVCC PWON Standby normal 16 H H → set cleared cleared 1 → cleared X [1] receive only 17 H L → set cleared cleared 1 → cleared X [1] go-to-sleep 18 L H → set cleared cleared 1 → cleared X [1] standby 19 L L → set cleared cleared 1 → cleared X [1] normal 20 H H → set cleared cleared cleared X receive only 21 H L → set cleared cleared cleared X standby 22 L L → set cleared cleared cleared X go-to-sleep 23 L H → set cleared cleared cleared X normal 24 H H → set 1 → cleared 1 → cleared 1 → cleared X [1] receive only 25 H L → set 1 → cleared 1 → cleared 1 → cleared X [1] standby 26 L L → set 1 → cleared 1 → cleared 1 → cleared X [1] go-to-sleep 27 L H → set 1 → cleared 1 → cleared 1 → cleared X [1] Go-to-sleep Sleep Rev. 01 — 20 July 2006 [1] Flag Note Setting the wake flag clears the UVVIO, UVVBAT and UVVCC flag. TJA1080 FlexRay transceiver 11 of 44 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Philips Semiconductors TJA1080_1 Preliminary data sheet Table 7. State transitions forced by an undervoltage condition (node configuration) → indicates the action that initiates a transaction; →1 and →2 are the consequences of a transaction. Transition from mode Direction to mode Transition number Flag UVVIO UVVBAT UVVCC PWON Wake Normal sleep 28 → set cleared cleared cleared 1 → cleared [1] sleep 29 cleared → set cleared cleared 1 → cleared [1] standby 30 cleared cleared → set cleared 1 → cleared [1] sleep 31 → set cleared cleared X 1 → cleared [1] sleep 32 cleared → set cleared X 1 → cleared [1] standby 33 cleared cleared → set X 1 → cleared [1] sleep 34 → set cleared cleared X 1 → cleared [1] sleep 35 cleared → set cleared X 1 → cleared [1] standby 36 cleared cleared → set X 1 → cleared [1] sleep 37 → set cleared X X 1 → cleared [1][2] sleep 38 cleared → set X X 1 → cleared [1][3] Receive only Go-to-sleep Standby Rev. 01 — 20 July 2006 [1] UVVIO, UVVBAT or UVVCC detected clears the wake flag. [2] UVVIO overrules UVVCC. [3] UVVBAT overrules UVVCC. Note TJA1080 FlexRay transceiver 12 of 44 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Philips Semiconductors TJA1080_1 Preliminary data sheet Table 8. State transitions forced by an undervoltage recovery (node configuration) → indicates the action that initiates a transaction; →1 and →2 are the consequences of a transaction. Transition from mode Direction to mode Transition number Pin STBN EN UVVIO UVVBAT UVVCC PWON Wake Standby normal 39 H H cleared cleared → cleared X X [1] receive only 40 H L cleared cleared → cleared X X [1] normal 41 H H cleared → cleared cleared X 1 → set normal 42 H H → cleared cleared cleared X X Sleep Flag Note receive only 43 H L cleared → cleared cleared X 1 → set receive only 44 H L → cleared cleared cleared X X standby 45 L L cleared → cleared cleared X 1 → set standby 46 L L → cleared cleared cleared X X go-to-sleep 47 L H cleared → cleared cleared X 1 → set go-to-sleep 48 L H → cleared cleared cleared X X Rev. 01 — 20 July 2006 [1] Recovery of UVVCC flag. [2] Recovery of UVVBAT flag. [3] Clearing the UVVBAT flag sets the wake flag. [4] Recovery of UVVIO flag. [2][3] [4] [2][3] [4] [2][3] [4] [2][3] [4] TJA1080 FlexRay transceiver 13 of 44 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. TJA1080 Philips Semiconductors FlexRay transceiver 7.2.1 Normal mode In Normal mode the transceiver is able to transmit and receive data via the bus lines BP and BM. The output of the normal receiver is directly connected to pin RXD. The transmitter behavior in normal mode of operation, with no time-out present on pins TXEN and BGE and the temperature flag not set is given in Table 9. In this mode pins INH1 and INH2 are set HIGH. Table 9. Transmitter function table BGE TXEN TXD Transmitter L X X transmitter is disabled X H X transmitter is disabled H L H transmitter is enabled; the bus lines are actively driven; BP is driven HIGH and BM is driven LOW H L L transmitter is enabled; the bus lines are actively driven; BP is driven LOW and BM is driven HIGH 7.2.2 Receive only mode In receive only mode the transceiver can only receive data. The transmitter is disabled, regardless of the voltages on pins BGE and TXEN. In this mode pins INH1 and INH2 are set HIGH. 7.2.3 Standby mode In Standby mode the transceiver enters a low power mode which means very low current consumption. In the Standby mode the device is not able to transmit or receive data and the low power receiver is activated to monitor bus activity. Standby mode can be entered if the correct polarity is applied to pins EN and STBN (see Figure 4 and Table 5) or an undervoltage is present on pin VCC; see Figure 4. If an undervoltage is present on pin VCC, direct switching to a normal power mode is not possible. By applying a positive edge on pin STBN and thus setting the wake flag, all undervoltage flags are reset and therefore switching to a normal power mode is possible. The transceiver will then enter the mode indicated on pins EN and STBN In this mode the transceiver can be switched to any other mode if no undervoltage is present on pins VIO and VBAT. Pin INH1 is set to HIGH. If the wake flag is set, pin INH2 is set to HIGH and pins RXEN and RXD are set to LOW, otherwise pin INH2 is floating and pins RXEN and RXD are set to HIGH; see Section 7.5. 7.2.4 Go-to-sleep mode In this mode the transceiver behaves as in Standby mode. If this mode is selected for a longer time than the go-to-sleep command hold time (minimum hold time) and the wake flag has been previously cleared, the transceiver will enter Sleep mode, regardless of the voltage on pin EN. If the voltage regulator that supplies the host is switched via pin INH1, pin EN becomes LOW if pin INH1 is switched off. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 14 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 7.2.5 Sleep mode In Sleep mode the transceiver has entered a low power mode. The only difference with Standby mode is that pin INH1 is also set floating. Sleep mode is directly entered if the UVVIO or UVVBAT flag is set. In this mode the transceiver can be switched to any other mode if no undervoltage is present on pins VIO, VCC and VBAT. In case of an undervoltage on pin VCC or VBAT while VIO is present, the wake flag is set by a positive edge on pin STBN. The undervoltage flags will be reset by setting the wake flag, and therefore the transceiver will enter the mode indicated on pins EN and STBN if VIO is present. A detailed description of the wake-up mechanism is given in Section 7.5. 7.3 Operating modes in star configuration In star configuration mode control via pins EN and STBN is not possible. The transceiver autonomously controls the operating modes except in the case of wake-up. The timing diagram of a transceiver configured in star configuration is illustrated in Figure 6. The state diagram in star configuration is illustrated in Figure 5. A detailed description of the pin signalling in star configuration is given in Table 10. If VIO and (VBUF or VBAT) are within their operating range, pin ERRN will indicate the error flag. Table 10. Pin signalling in star configuration Mode TRXD0 / TRXD1 [1] Star Transmit output input [2] ERRN LOW RXEN HIGH LOW error flag error flag bus set [3] reset [3] activity RXD HIGH LOW HIGH bus idle bus DATA_0 bus DATA_1 input Star Locked input Star Standby input Star Sleep input INH2 enabled HIGH HIGH disabled [1] Star Receive output Star Idle Transmitter INH1 error flag Error flag wake flag wake flag wake flag wake flag reset [1][3] set [1] reset [1] set [1] reset [1] set [1][3] [1] Valid if VIO and (VBUF or VBAT) are present. [2] TRXD lines are switched as input if TRXD activity is the initiator for star Transmit mode. [3] Pin ERRN provides a serial interface for retrieving diagnostic information. [4] TRXD lines switched as output if TXEN activity is the initiator for star Transmit mode. float [1] float [1] Pin BGE has to be connected to pin VIO in order to enable the transmitter via pin TXEN. If pin BGE is connected to ground, it is not possible to activate the transmitter via pin TXEN. If pin TXEN is not used (no controller connected to the transceiver), it has to be connected to pin VIO in order to prevent TXEN activity detection. In all modes pin RXD is connected to the output of the normal mode receiver and therefore represents the data on the bus lines. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 15 of 44 TJA1080 Philips Semiconductors FlexRay transceiver STAR LOCKED INH1 = HIGH INH2 = HIGH TXEN activity detected for longer than tto(tx-locked) bus activity detected for longer than tto(rx-locked) idle detected on the bus lines and TXEN for longer than tto(locked-idle) STAR TRANSMIT idle detected on TRXD0, TRXD1, TXEN and the bus lines idle detected on TRXD0, TRXD1, TXEN and the bus lines STAR IDLE INH1 = HIGH INH2 = HIGH STAR RECEIVE INH1 = HIGH INH2 = HIGH INH1 = HIGH INH2 = HIGH TRXD0, TRXD1, TXEN activity detected bus activity detected wake flag 1 time in star locked longer than tto(locked-sleep) wake flag 1 or UVVCC signal 0 no acivity on TRXD0, TRXD1, TXEN and the bus lines for longer than tto(idle-sleep) STAR SLEEP STAR STANDBY INH1 = floating INH2 = floating INH1 = HIGH INH2 = HIGH from star idle, star transmit or star receive if wake flag set and under voltage present on VCC for longer than t > tto(uv)(VCC) power-on VBAT > VBAT(PWON) from any mode if UVVCC flag is set regardless PWON flag 001aae441 Fig 5. State diagram in star configuration TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 16 of 44 TJA1080 Philips Semiconductors FlexRay transceiver star transmit star idle star receive star idle star transmit star idle TRXD0 TRXD1 TXEN TXD TRXDOUT BP BM RXEN RXD 001aae440 TRXDOUT is a virtual signal that indicates the state of the TRXD lines. TRXDOUT HIGH means TRXD lines switched as output. TRXDOUT LOW means TRXD lines switched as input. Fig 6. Timing diagram in star configuration 7.3.1 Star Idle mode This mode is entered if one of the following events occurs: • From star Receive mode and star Transmit mode if idle is detected on the bus lines, on pin TXEN and on pins TRXD0 and TRXD1. • If the transceiver is in star Locked mode and idle is detected on the bus lines and pin TXEN for longer than tto(locked-idle). • If the transceiver is in star Standby mode and the wake flag is set or no undervoltage is present. • If the transceiver is in star Sleep mode and the wake flag is set, the transceiver enters star Idle mode in order to obtain a stable starting point (no glitches on the bus lines etc). • In star Idle mode the transceiver monitors pins TXEN, TRXD0 and TRXD1 and the bus lines for activity. In this mode the transmitter is disabled. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 17 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 7.3.2 Star Transmit mode This mode is entered if one of the following events occur: • If the transceiver is in star Idle mode and activity is detected on pin TXEN. • If the transceiver is in star Idle mode and activity is detected on pins TRXD0 and TRXD1. In star Transmit mode the transmitter is enabled and the transceiver can transmit data on the bus lines. It transmits the data received on pins TXD or TRXD0 and TRXD1 on the bus lines. 7.3.3 Star Receive mode This mode is entered if the transceiver is in star Idle mode and activity has been detected on the bus lines. In star Receive mode the transceiver transmit data via the TRXD0 and TRXD1 lines to other transceivers connected to the bus lines. The transmitter is always disabled. 7.3.4 Star Standby mode This mode is entered if one of the following events occur: • From star Idle, star Transmit or star Receive modes if the wake flag is set and an undervoltage on pin VCC is present for longer than tto(uv)(VCC). • If the PWON flag is set. In star Standby mode the transceiver enters a low power mode. In this mode the current consumption is as low as possible to prevent discharging the capacitor at pin VBUF. If pins VIO and VBUF are within their temperature range, pins RXD and RXEN will indicate the wake flag. 7.3.5 Star Sleep mode This mode is entered if one of the following events occur: • From any mode if an undervoltage on pin VCC is present for longer than tdet(uv)(VCC). • If the transceiver is in star Idle mode and no activity is detected on the bus lines and pins TXEN, TRXD0 and TRXD1 for longer than tto(idle-sleep). • If star Locked mode is active for longer than tto(locked-sleep). In star Sleep mode the transceiver will enter a low power mode. In this mode the current consumption is as low as possible to prevent the car battery from discharging. The inhibit switches are switched off. In this mode the wake flag wakes the transceiver. A detailed description of the wake-up mechanism is given in Section 7.5. If pins VIO and VBUF are within their temperature range, pins RXD and RXEN will indicate the wake flag. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 18 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 7.3.6 Star Locked mode This mode is entered if one of the following events occur: • If the transceiver is in star Transmit mode and activity on pin TXEN is detected for longer than tto(tx-locked). • If the transceiver is in star Receive mode and activity is detected on the bus lines for longer than tto(rx-locked). This mode is a fail-silent mode and in this mode the transmitter is disabled. 7.4 Start-up 7.4.1 Node configuration Node configuration can be selected by applying a voltage lower than 0.3VBUF to pins TRXD0 and TRXD1 during power-on. Node configuration is latched by resetting the PWON flag while the voltage on pins TRXD0 and TRXD1 is lower than 0.3VBUF; see Section 7.7.4 for (re)setting the PWON flag. 7.4.2 Star configuration Star configuration can be selected by applying a voltage higher than 0.7VBUF to pins TRXD0 or TRXD1 during power-on. Star configuration is latched by resetting the PWON flag while one of the voltages on pins TRXD0 or TRXD1 is higher than 0.7VBUF. See Section 7.7.4 for (re)setting the PWON flag. In this case the transceiver goes from node Standby mode to star Idle mode. 7.5 Wake-up mechanism 7.5.1 Node configuration If a node configured transceiver is in Sleep mode (pins INH1 and INH2 are switched off), it will enter Standby mode or go-to-sleep mode (depending on the level at pin EN). In both modes pin INH1 is switched on, pin INH2 is switched on or off depending on whether the wake flag is set. If no undervoltage is present on pins VIO and VBAT, the transceiver switches immediately to the mode indicated on pins EN and STBN. In Standby, go-to-sleep and Sleep mode pins RXD and RXEN are driven LOW if the wake flag is set. 7.5.2 Star configuration If a star configured transceiver is in Sleep mode (pins INH1 and INH2 are switched off) it will enter star Idle mode (pins INH1 and INH2 are switched on) if the wake flag is set. In star Idle mode, the transceiver enters the appropriate mode directly, depending on which event has set the wake flag: • If the wake-up source was pin WAKE or a positive edge on pin STBN, the transceiver will remain in star Idle mode. • If the wake-up source was activity detected on pins TRXD0 and TRXD1, the transceiver will change from star Idle mode to star Transmit mode. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 19 of 44 TJA1080 Philips Semiconductors FlexRay transceiver • If the wake-up source was a wake-up symbol, the transceiver will change from star Idle mode to star Receive mode. 7.5.3 Bus wake-up Bus wake-up is detected if two consecutive DATA_0 of at least tdet(wake)DATA_0 separated by an idle or DATA_1 of at least tdet(wake)idle, followed by an idle or DATA_1 of at least tdet(wake)idle are present on the bus lines within tdet(wake)tot. tdet(wake)tot 0V Vdif −425 mV tdet(wake)Data_0 tdet(wake)idle tdet(wake)Data_0 tdet(wake)idle 001aae442 Fig 7. Bus wake-up timing 7.5.4 Local wake-up via pin WAKE If the voltage on pin WAKE is lower than Vth(det)(WAKE) for longer than twake(WAKE) (falling edge on pin WAKE) a local wake-up event on pin WAKE is detected. At the same time, the biasing of this pin is switched to pull-down. If the voltage on pin WAKE is higher than Vth(det)(WAKE) for longer than twake, the biasing of this pin is switched to pull-up, and no local wake-up will be detected. pull-up twake(WAKE) pull-down pull-up twake(WAKE) VBAT WAKE 0V RXD and RXEN VBAT INH1 and INH2 0V 001aae443 Sleep mode: VIO and (VBAT or VCC) still provided. Fig 8. Local wake-up timing via pin WAKE 7.6 Fail silent behavior In order to be fail silent, undervoltage detection is implemented. An undervoltage will be detected on pins VCC, VIO and VBAT. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 20 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 7.6.1 VBAT undervoltage • Node configuration: If the UVVBAT flag is set the transceiver will enter Sleep mode (pins INH1 and INH2 are switched off) regardless of the voltage present on pins EN and STBN. If the undervoltage recovers the wake flag will be set and the transceiver will enter the mode determined by the voltages on pins EN and STBN. • Star configuration: The TJA1080 in star configuration is able to transmit and receive data as long as VCC and VIO are within their operating range, regardless of the undervoltage on VBAT. 7.6.2 VCC undervoltage • Node configuration: If the UVVCC flag is set the transceiver will enter the Standby mode (pin INH2 is switched off) regardless of the voltage present on pins EN and STBN. If the undervoltage recovers or the wake flag is set mode switching via pins EN and STBN is possible. • Star configuration: If the UVVCC flag is set the transceiver will enter the star Sleep mode. 7.6.3 VIO undervoltage • Node configuration: If the voltage on pin VIO is lower than Vuvd(VIO) (even if the UVVIO flag is reset) pins EN, STBN, TXD and BGE are set LOW (internally) and pin TXEN is set HIGH (internally). If the UVVIO flag is set the transceiver will enter Sleep mode (pins INH1 and INH2 are switched off). • Star configuration: If an undervoltage is present on pin VIO (even if the UVVIO flag is reset) pins EN, STBN, TXD and BGE are set LOW (internally) and pin TXEN is set HIGH (internally). If the VIO undervoltage flag is set, pin INH1 is switched off. If an undervoltage is present on pin VIO and VCC is within the operating range, the TJA1080 will forward the received data to all other branches. 7.7 Flags 7.7.1 Local wake-up source flag The local wake-up source flag can only be set in a low power mode. When a wake-up event on pin WAKE is detected (see Section 7.5.4) it sets the local wake-up source flag. The local wake-up source flag is reset by entering a low power mode. 7.7.2 Remote wake-up source flag The remote wake-up source flag can only be set in a low power mode. When a bus wake-up event is detected on the bus lines (see Section 7.5.3) it sets the remote wake-up source flag. The remote wake-up source flag is reset by entering a low power mode. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 21 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 7.7.3 Wake flag The wake flag is set if one of the following events occurs: • • • • The local or remote wake-up source flag is set (edge sensitive) A positive edge is detected on pin STBN if VIO is present Recovery of the UVVBAT flag (only in node configuration) By recognizing activity on pins TRXD0 and TRXD1 (only in star configuration) In node configuration the wake flag is reset by entering Normal mode, a low power mode or setting one of the undervoltage flags. In star configuration the wake flag is reset by entering a low power mode or by recovery of the UVVCC signal (without trec(uv)(VCC)). 7.7.4 Power-on flag The PWON flag is set if the internal supply voltage for the digital part becomes higher than the lowest value it needs to operate. In node configuration, entering Normal mode resets the PWON flag. In star configuration the PWON flag is reset when the UVVCC signal goes LOW (no undervoltage detected). 7.7.5 Node or star configuration flag Configuration flag set means node configuration. 7.7.6 Temperature medium flag The temperature medium flag is set if the junction temperature exceeds Tj(warn)(medium) in a normal power mode. The temperature medium flag is reset when the junction temperature becomes lower than Tj(warn)(medium) in a normal power mode. No action will be taken if this flag is set. 7.7.7 Temperature high flag The temperature high flag is set if the junction temperature exceeds Tj(dis)(high) in a normal power mode. In node configuration the temperature high flag is reset if a negative edge is applied to pin TXEN while the junction temperature is lower than Tj(dis)(high) in a normal power mode. In star configuration mode the temperature high flag is reset by any activity detection (edge) while the junction temperature is lower than Tj(dis)(high) in a normal power mode. If the temperature high flag is set the transmitter is disabled and pins TRXD0 and TRXD1 are switched off. 7.7.8 TXEN_BGE clamped flag The TXEN_BGE clamped flag is set if pin TXEN is LOW and pin BGE is HIGH for longer than tdetCL(TXEN_BGE). The TXEN_BGE clamped flag is reset if pin TXEN is HIGH or pin BGE is LOW. If the TXEN_BGE flag is set, the transmitter is disabled. 7.7.9 Bus error flag The bus error flag is set if pin TXEN is LOW and pin BGE is HIGH and the data received from the bus lines (pins BP and BM) is different to that received on pin TXD. The TJA1080 also expects that a data frame begins with a bit value other than the last bit of the previous data frame. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 22 of 44 TJA1080 Philips Semiconductors FlexRay transceiver This is the case for a valid data frame which begins with the DATA_0 period of the Transmission Start Sequence (TSS) and ends with the DATA_1 bit of the Frame End Sequence (FES). Any violation of this frame format will be detected by the TJA1080. Consequently, when transmitting a wake-up pattern, a bus error will be signalled. This error indication should be ignored and the status register should be cleared by reading the vector. No action will be taken if the bus error flag is set. 7.7.10 UVVBAT flag The UVVBAT flag is set if the voltage on pin VBAT is lower than Vuvd(VBAT). The UVVBAT flag is reset if the voltage is higher than Vuvd(VBAT) or by setting the wake flag; see Section 7.6.1. 7.7.11 UVVCC flag The UVVCC flag is set if the voltage on pin VCC is lower than Vuvd(VCC) for longer than tdet(uv)(VCC). The flag is reset if the voltage on pin VCC is higher than Vuvd(VCC) for longer than trec(uv)(VCC) or the wake flag is set; see Section 7.6.2. 7.7.12 UVVIO flag The UVVIO flag is set if the voltage on pin VIO is lower than Vuvd(VIO) for longer than tdet(uv)(VIO). The flag is reset if the voltage on pin VIO is higher than Vuvd(VIO) or the wake flag is set; see Section 7.6.3. 7.7.13 Error flag The error flag is set if one of the status bits S4 to S12 is set. The error flag is reset if none of the S4 to S12 status bits are set; see Table 11. 7.8 TRXD collision A TRXD collision is detected when two or more TJA1080s in star configuration enter star Receive mode. 7.9 Status register The status register can be read out on pin ERRN by using pin EN as clock; the status bits are given in Table 11. The timing diagram is illustrated in Figure 9. The status register is accessible if the UVVIO flag is not set in node or star configuration. A negative edge on pin EN starts the read out. Within the period td(EN-ERRN) after the first edge on pin EN, pin ERRN will go HIGH if it was previously LOW. On the second negative edge on pin EN the first status bit (S0) will be shifted out. The status bits are valid after td(EN-ERRN). If no edge is detected on pin EN for longer than tdet(EN), the transceiver will enter the state selected on pins EN and STBN (node configuration) and status bit S4 to S12 will be reset if the corresponding flag has been reset. Pin ERRN is LOW if the corresponding status bit is set. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 23 of 44 TJA1080 Philips Semiconductors FlexRay transceiver Table 11. Status bits Bit number Status bit Description S0 LOCAL WAKEUP local wake-up source flag is redirected to this bit S1 REMOTE WAKEUP remote wake-up source flag is redirected to this bit S2 NODE CONFIG node configuration flag is redirected to this bit S3 PWON status bit set means PWON flag has been set previously S4 BUS ERROR status bit set means bus error flag has been set previously S5 TEMP HIGH status bit set means temperature high flag has been set previously S6 TEMP MEDIUM status bit set means temperature medium flag has been set previously S7 TXEN_BGE CLAMPED status bit set means TXEN_BGE clamped flag has been set previously S8 UVVBAT status bit set means UVVBAT flag has been set previously S9 UVVCC status bit set means UVVCC flag has been set previously S10 UVVIO status bit set means UVVIO flag has been set previously S11 STAR LOCKED status bit is set if star Locked mode has been entered previously S12 TRXD COLLISION status bit is set if a TRXD collision has been detected previously receive only normal standby receive only normal 0.7VIO STBN 0.3VIO tdet(EN) tdet(EN) td(stb) td(stb) 0.7VIO EN 0.3VIO TEN ERRN td(EN-ERRN) 0.7VIO 0.3VIO S0 S1 S2 001aae444 Fig 9. Timing diagram for status bits TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 24 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 8. Limiting values Table 12. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter Conditions Min Max Unit VBAT supply voltage on pin VBAT no time limit −0.3 +60 V operating range 6.5 60 V VCC supply voltage no time limit −0.3 +5.5 V operating range 4.75 5.25 V no time limit −0.3 +5.5 V VBUF supply voltage on pin VBUF VIO supply voltage on pin VIO operating range 4.75 5.25 V no time limit −0.3 +5.5 V operating range 2.2 5.25 V VINH1 voltage on pin INH1 −0.3 VBAT + 0.3 V VINH2 voltage on pin INH2 −0.3 VBAT + 0.3 V VWAKE voltage on pin WAKE −0.3 VBAT + 0.3 V Io(WAKE) output current on pin WAKE pin GND not connected −15 - mA VBGE voltage on pin BGE no time limit −0.3 VIO + 0.3 V VTXEN voltage on pin TXEN no time limit −0.3 VIO + 0.3 V VTXD voltage on pin TXD no time limit −0.3 VIO + 0.3 V VERRN voltage on pin ERRN no time limit −0.3 VIO + 0.3 V VRXD voltage on pin RXD no time limit −0.3 VIO + 0.3 V VRXEN voltage on pin RXEN no time limit −0.3 VIO + 0.3 V VEN voltage on pin EN no time limit −0.3 +5.5 V VSTBN voltage on pin STBN no time limit −0.3 +5.5 V VTRXD0 voltage on pin TRXD0 no time limit −0.3 +5.5 V VTRXD1 voltage on pin TRXD1 no time limit −0.3 +5.5 V VBP voltage on pin BP −60 +60 V VBM voltage on pin BM transient voltage Vtrt −60 +60 V on pins BP and BM [1] −200 +200 V on pin VBAT [2] −200 +200 V on pin VBAT [3] 6.5 60 V on pin VBAT [4] - 60 V −55 +150 °C [5] −40 +150 °C HBM on pins BP and BM to ground [6] −8.0 +8.0 kV HBM at any other pin [7] −4.0 +4.0 kV MM on all pins [8] −200 +200 V CDM on all pins [9] −1000 +1000 V storage temperature Tstg Tvj virtual junction temperature VESD electrostatic discharge voltage [1] According to ISO 7637, part 3 test pulses a and b; Class C; see Figure 13; RL = 45 Ω; CL = 100 pF. [2] According to ISO 7637, part 2 test pulses 1, 2, 3a and 3b; Class C; see Figure 13; RL = 45 Ω; CL = 100 pF. [3] According to ISO 7637, part 2 test pulse 4; Class C; see Figure 13; RL = 45 Ω; CL = 100 pF. [4] According to ISO 7637, part 2 test pulse 5b; Class C; see Figure 13; RL = 45 Ω; CL = 100 pF. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 25 of 44 TJA1080 Philips Semiconductors FlexRay transceiver [5] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature Tvj is: Tvj = Tamb + TD x Rth(j-a), where Rth(j-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). [6] HBM: C = 100 pF; R = 1.5 kΩ. [7] HBM: C = 100 pF; R = 1.5 kΩ. [8] MM: C = 200 pF; L = 0.75 µH; R = 10 Ω. [9] CDM: C = 330 pF; R = 150 Ω. 9. Thermal characteristics Table 13. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air 126 K/W Rth(j-s) thermal resistance from junction to substrate in free air - K/W TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 26 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 10. Static characteristics Table 14. Static characteristics All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = −40 °C to + 150 °C; Rbus = 45 Ω; RTRXD = 200 Ω unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol Parameter Conditions Min Typ Max Unit - 35 50 µA star Sleep mode - 40 50 µA star Standby mode - 75 150 µA normal power modes - 0.075 1 mA 2.75 3.8 4,5 V low power modes −1 0 +5 µA Normal mode; VBGE = 0 V; VTXEN = VIO; Receive only mode; star Idle mode - 10 15 mA - 28.5 35 mA Normal mode; VBGE = VIO; VTXEN = 0 V; Rbus = ∞ Ω - 10 15 mA star Transmit mode - 50 62 mA star Receive mode - 38 42 mA 2.75 3.8 4.5 V low power modes −1 +1 +5 µA Normal and Receive only mode; VTXD = VIO - 30 1000 µA Pin VBAT IBAT Vuvd(VBAT) supply current on pin VBAT low power modes in node configuration undervoltage detection voltage on pin VBAT Pin VCC ICC supply current Normal mode; VBGE = VIO; VTXEN = 0 V; VBUF open Vuvd(VCC) undervoltage detection voltage on pin VCC [3] Pin VIO IIO supply current on pin VIO Vuvd(VIO) undervoltage detection voltage on pin VIO 1 1.5 2 V Vuvr(VIO) undervoltage recovery voltage on pin VIO 1 1.6 2.2 V Vuvhys(VIO) undervoltage hysteresis voltage on pin VIO 25 <tbd> <tbd> mV TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 27 of 44 TJA1080 Philips Semiconductors FlexRay transceiver Table 14. Static characteristics …continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = −40 °C to + 150 °C; Rbus = 45 Ω; RTRXD = 200 Ω unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol Parameter Conditions Min Typ Max Unit supply current on pin VBUF low power modes in node configuration −1 0 +5 µA −40 −20 +1 µA −1 0 +5 µA - 26.5 35 mA star Transmit mode - 47 62 mA star Receive mode - 35 42 mA Normal mode; VBGE = 0 V; VTXEN = VIO; Receive only mode; star Idle mode - 10 15 mA Pin VBUF IBUF low power modes in star configuration VBUF = 0 V; VCC = 0 V VBUF = 5.25 V Normal mode; VBGE = VIO; VTXEN = 0 V; VBUF = VCC [3] VBUF(on) on-state voltage on pin VBUF VCC switch is switched on; Normal mode; VBGE = VIO; VTXEN = 0 V; VCC > maximum value of Vuvd(VCC) VCC − 0.25 VCC − 0.05 VCC V VBUF(off) off-state voltage on pin VBUF VCC switch is switched off; low power modes in star configuration; VCC < minimum value of Vuvd(VCC) 4.5 4.9 5.25 V Pin EN VIH(EN) HIGH-level input voltage on pin EN 0.7VIO 0.5VIO 5.5 V VIL(EN) LOW-level input voltage on pin EN −0.3 0.5VIO 0.3VIO V IIH(EN) HIGH-level input current on pin EN VEN = 0.7VIO 3 8 11 µA IIL(EN) LOW-level input current on pin EN VEN = 0 V −1 0 +1 µA Pin STBN VIH(STBN) HIGH-level input voltage on pin STBN 0.7VIO 0.5VIO 5.5 V VIL(STBN) LOW-level input voltage on pin STBN −0.3 0.5VIO 0.3VIO V IIH(STBN) HIGH-level input current on pin STBN VSTBN = 0.7VIO 3 8 11 µA IIL(STBN) LOW-level input current on pin STBN VSTBN = 0 V −1 0 +1 µA TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 28 of 44 TJA1080 Philips Semiconductors FlexRay transceiver Table 14. Static characteristics …continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = −40 °C to + 150 °C; Rbus = 45 Ω; RTRXD = 200 Ω unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol Parameter Conditions Min Typ Max Unit Pin TXEN VIH(TXEN) HIGH-level input voltage on pin TXEN 0.7VIO 0.5VIO VIO + 0.3 V VIL(TXEN) LOW-level input voltage on pin TXEN −0.3 0.5VIO 0.3VIO V IIH(TXEN) HIGH-level input current on pin TXEN VTXEN = VIO −1 0 +1 µA IIL(TXEN) LOW-level input current on pin TXEN VTXEN = 0.3VIO −12 −9 −3 µA IL(TXEN) leakage current on pin TXEN VTXEN = 5.25 V; VIO = 0 V −1 0 +1 µA Pin BGE VIH(BGE) HIGH-level input voltage on pin BGE 0.7VIO 0.5VIO VIO + 0.3 V VIL(BGE) LOW-level input voltage on pin BGE −0.3 0.5VIO 0.3VIO V IIH(BGE) HIGH-level input current on pin BGE VBGE = 0.7VIO 3 8 11 µA IIL(BGE) LOW-level input current on pin BGE VBGE = 0 V −1 0 +1 µA VIH(TXD) HIGH-level input voltage on pin TXD normal power modes 0.7VIO 0.5VIO VIO + 0.3 V VIL(TXD) LOW-level input voltage on pin TXD normal power modes −0.3 0.5VIO 0.3VIO V IIH(TXD) HIGH-level input current on pin TXD VTXD = VIO 70 300 650 µA IIL(TXD) LOW-level input current on pin TXD normal power modes; VTXD = 0 V −5 0 +5 µA low power modes −1 0 +1 µA VTXD = 5.25 V; VIO = 0 V −1 0 +1 µA Pin TXD ILI(TXD) input leakage current on pin TXD Pin RXD IOH(RXD) HIGH-level output current VRXD = VIO − 0.4 V; VIO = VCC on pin RXD −2 −4 −15 mA IOL(RXD) LOW-level output current on pin RXD 2 7 20 mA −1500 −550 −100 µA −1 0 +1 µA VRXD = 0.4 V Pin ERRN IOH(ERRN) HIGH-level output current node configuration; on pin ERRN VERRN = VIO − 0.4 V; VIO = VCC star configuration; VERRN = VIO − 0.4 V; VIO = VCC TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 29 of 44 TJA1080 Philips Semiconductors FlexRay transceiver Table 14. Static characteristics …continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = −40 °C to + 150 °C; Rbus = 45 Ω; RTRXD = 200 Ω unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol Parameter Conditions Min Typ Max Unit IOL(ERRN) LOW-level output current on pin ERRN VERRN = 0.4 V 300 700 1500 µA Pin RXEN IOH(RXEN) HIGH-level output current VRXEN = VIO − 0.4 V; on pin RXEN VIO = VCC −4 −1.5 −0.5 mA IOL(RXEN) LOW-level output current on pin RXEN VRXEN = 0.4 V 1 3 8 mA Pins TRXD0 and TRXD1 VIH(TRXD0) HIGH-level input voltage on pin TRXD0 star Idle and star Transmit mode 0.7VBUF 0.5VBUF VBUF + 0.3 V VIL(TRXD0) LOW-level input voltage on pin TRXD0 star Idle and star Transmit mode −0.3 0.5VBUF 0.3VBUF V VOL(TRXD0) LOW-level output voltage on pin TRXD0 Rpu = 200 Ω −0.3 +0.3 +0.8 V VIH(TRXD1) HIGH-level input voltage on pin TRXD1 star Idle and star Transmit mode 0.7VBUF 0.5VBUF VBUF + 0.3 V VIL(TRXD1) LOW-level input voltage on pin TRXD1 star Idle and star Transmit mode −0.3 0.5VBUF 0.3VBUF V VOL(TRXD1) LOW-level output voltage on pin TRXD1 Rpu = 200 Ω −0.3 +0.3 +0.8 V Normal, Receive only, star Idle, star Transmit and star Receive mode; VTXEN = VIO 0.4VBUF 0.5VBUF 0.6VBUF V Standby, go-to-sleep, Sleep, star Standby and star Sleep mode −0.1 0 +0.1 V Normal, receive only, star Idle, star Transmit and star Receive mode; VTXEN = VIO 0.4VBUF 0.5VBUF 0.6VBUF V Standby, go to sleep, Sleep, star Standby and star Sleep mode −0.1 0 +0.1 V Pins BP and BM Vo(idle)(BP) Vo(idle)(BM) idle output voltage on pin BP idle output voltage on pin BM Io(idle)BP idle output current on pin BP −60 V < |VBP| < +60 V 1 3 7.5 mA Io(idle)BM idle output current on pin BM −60 V < |VBM| < +60 V 1 3 7.5 mA Vo(idle)(dif) differential idle output voltage −25 0 +25 mV VOH(dif) differential HIGH-level output voltage 40 Ω < Rbus < 55 Ω; VCC = VBUF = 5 V 600 800 1200 mV VOL(dif) differential LOW-level output voltage 40 Ω < Rbus < 55 Ω; VCC = VBUF = 5 V −1200 −800 −600 mV TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 30 of 44 TJA1080 Philips Semiconductors FlexRay transceiver Table 14. Static characteristics …continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = −40 °C to + 150 °C; Rbus = 45 Ω; RTRXD = 200 Ω unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol Parameter Conditions Min Typ Max Unit VIH(dif) differential HIGH-level input voltage normal power modes; −10 V < VBP < +15 V; −10 V < VBM < +15 V 150 225 300 mV VIL(dif) differential LOW-level input voltage normal power modes; −10 V < VBP < +15 V; −10 V < VBM < +15 V −300 −225 −150 mV low power modes; −10 V < VBP < +15 V; −10 V < VBM < +15 V −400 −225 −125 mV |Vi(dif)det(act)| activity detection differential input voltage (absolute value) normal power modes 150 225 300 mV |Io(sc)(BP)| short-circuit output current on pin BP (absolute value) VBP = 0 V, 60 V 10 20 30 mA |Io(sc)(BM)| short-circuit output current on pin BM (absolute value) VBM = 0 V, 60 V 10 20 30 mA Ri(BP) input resistance on pin BP Idle level; Rbus = ∞ Ω 10 20 40 kΩ Ri(BM) input resistance on pin BM Idle level; Rbus = ∞ Ω 10 20 40 kΩ Ri(dif)(BP-BM) differential input resistance between pin BP and pin BM Idle level; Rbus = ∞ Ω 20 40 80 kΩ ILI(BP) input leakage current on pin BP VBP = 5 V; VBAT = VCC = VIO = 0 V −10 0 +10 µA ILI(BM) input leakage current on pin BM VBM = 5 V; VBAT = VCC = VIO = 0 V −10 0 +10 µA Vcm(bus)(DATA_0) DATA_0 bus common mode voltage Rbus = 45 Ω 0.4VBUF 0.5VBUF 0.6VBUF V Vcm(bus)(DATA_1) DATA_1 bus common mode voltage Rbus = 45 Ω 0.4VBUF 0.5VBUF 0.6VBUF V ∆Vcm(bus) Rbus = 45 Ω −25 0 +25 mV bus common mode voltage difference Pin INH1 VOH(INH1) HIGH-level output voltage IINH1 = −0.2 mA on pin INH1 VBAT − 0.8 VBAT − 0.3 VBAT V IL(INH1) leakage current on pin INH1 Sleep mode −5 0 +5 µA IOL(INH1) LOW-level output current on pin INH1 VINH1 = 0 V −15 −8 - mA TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 31 of 44 TJA1080 Philips Semiconductors FlexRay transceiver Table 14. Static characteristics …continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = −40 °C to + 150 °C; Rbus = 45 Ω; RTRXD = 200 Ω unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC.[1][2] Symbol Parameter Conditions Min Typ Max Unit Pin INH2 VOH(INH2) HIGH-level output voltage IINH2 = −0.2 mA on pin INH2 VBAT − 0.8 VBAT − 0.3 VBAT V IL(INH2) leakage current on pin INH2 Sleep mode −5 0 +5 µA IOL(INH2) LOW-level output current on pin INH2 VINH2 = 0 V −15 −8 - mA Vth(det)(WAKE) detection threshold voltage on pin WAKE low power mode 2.5 3.7 4.5 V IIL(WAKE) LOW-level input current on pin WAKE VWAKE = 2.4 V for t > twake(WAKE) 3 6.5 11 µA IIH(WAKE) HIGH-level input current on pin WAKE VWAKE = 4.6 V for t > twake(WAKE) −11 −6.5 −3 µA Pin WAKE Temperature protection Tj(warn)(medium) medium warning junction temperature 155 165 175 °C Tj(dis)(high) high disable junction temperature 180 190 200 °C [1] All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % are tested at 125 °C for dies on wafer level (pre-testing) and above this for cased products 100 % are tested at Tamb = −40 °C and +25 °C (final testing) unless otherwise specified. Both pre-testing and final testing use correlated test conditions to cover the specified temperature and power supply voltage range. For bare dies all parameters are only guaranteed with the backside of the bare die connected to ground. [2] At power-up VBAT should be supplied first. When VBAT reaches 6.5 V, VCC and VIO may be switched on with a delay of at least 60 µs with respect to VBAT. [3] Current flows from VCC to VBUF. This means that the maximum sum current ICC + IBUF is 35 mA. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 32 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 11. Dynamic characteristics Table 15. Dynamic characteristics All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = −40 °C to + 150 °C; Rbus = 45 Ω; RTRXD = 200 Ω unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC[1]. Symbol Parameter Conditions Min Typ Max Unit delay time from TXD to bus Normal or star Transmit mode DATA_0 - 31 50 ns DATA_1 - 32 50 ns - 1 4 ns - 27 50 ns - 28 50 ns - 1 5 ns DATA_0 - 28 50 ns DATA_1 - 30 50 ns - 2 5 ns - 28 50 ns - 28 50 ns - 0 5 ns Pins BP and BM td(TXD-bus) [2] ∆td(TXD-bus) delay time difference from TXD to bus Normal or star Transmit mode; between DATA_0 and DATA_1 [2] td(TRXD-bus) delay time from TRXD to bus star Transmit mode [3] DATA_0 DATA_1 ∆td(TRXD-bus) delay time difference from TRXD star Transmit mode; to bus between DATA_0 and DATA_1 td(bus-RXD) delay time from bus to RXD [3][4] normal or star Transmit mode; CRXD = 15 pF; see Figure 11 ∆td(bus-RXD) delay time difference from bus to normal or star Transmit RXD mode; CRXD = 15 pF; between DATA_0 and DATA_1; see Figure 11 td(bus-TRXD) delay time from bus to TRXD star Receive mode; see Figure 11 DATA_0 DATA_1 ∆td(bus-TRXD) delay time difference from bus to star Receive mode; TRXD between DATA_0 and DATA_1; see Figure 11 td(TXEN-busidle) delay time from TXEN to bus idle Normal mode - 28 50 ns td(TXEN-busact) delay time from TXEN to bus active Normal mode - 22 50 ns td(BGE-busidle) delay time from BGE to bus idle Normal mode - 30 50 ns td(BGE-busact) delay time from BGE to bus active Normal mode - 22 50 ns tr(dif)(bus) bus differential rise time 10 % to 90 %; RL = 45 Ω; CL = 100 pF 8 12 23 ns tf(dif)(bus) bus differential fall time 90 % to 10 %; RL = 45 Ω; CL = 100 pF 8 12 23 ns TJA1080_1 Preliminary data sheet [4] © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 33 of 44 TJA1080 Philips Semiconductors FlexRay transceiver Table 15. Dynamic characteristics …continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = −40 °C to + 150 °C; Rbus = 45 Ω; RTRXD = 200 Ω unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC[1]. Symbol Parameter Conditions Min Typ Max Unit DATA_0 wake-up detection time Standby, Sleep, star Standby or star Sleep idle wake-up detection time mode; total wake-up detection time −10 V < VBP < +15 V; −10 V < VBM < +15 V 1 2.2 4 µs 1 2.5 4 µs 50 - 115 µs tdet(uv)(VCC) undervoltage detection time on pin VCC 100 - 670 ms trec(uv)(VCC) undervoltage recovery time on pin VCC 1 - 5.2 ms tdet(uv)(VIO) undervoltage detection time on pin VIO 100 - 670 ms tto(uv)(VCC) undervoltage time-out time on pin VCC for entering Standby mode star configuration; wake flag is set 432 - 900 µs WAKE symbol detection tdet(wake)DATA_0 tdet(wake)idle tdet(wake)tot Undervoltage Activity detection tdet(act)(TXEN) activity detection time on pin TXEN star configuration 100 140 200 ns tdet(act)(TRXD) activity detection time on pin TRXD star configuration 100 140 200 ns tdet(act)(bus) activity detection time on bus pins Vdif: 0 → 400 mV 100 150 250 ns tdet(idle)(TXEN) idle detection time on pin TXEN star configuration 100 140 200 ns tdet(idle)(TRXD) idle detection time on pin TRXD star configuration tdet(idle)(bus) idle detection time on bus pins Vdif: 400 mV → 0 50 75 100 ns 100 150 250 ns 640 - 2660 ms Star modes tto(idle-sleep) idle to sleep time-out time tto(tx-locked) transmit to locked time-out time 2600 - 10400 µs tto(rx-locked) receive to locked time-out time 2600 - 10400 µs tto(locked-sleep) locked to sleep time-out time 64 - 333 ms tto(locked-idle) locked to idle time-out time 1.4 - 5.1 µs - 1 2 µs Node modes td(STBN-RXD) STBN to RXD delay time wake flag set td(STBN-INH2) STBN to INH2 delay time - 3 10 µs th(gotosleep) go-to-sleep hold time 20 35 50 µs Status register tdet(EN) detection time on pin EN for mode control 20 - 80 µs TEN time period on pin EN for reading status bits 4 - 20 µs td(EN-ERRN) delay time from EN to ERRN for reading status bits - 0.8 2 µs TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 34 of 44 TJA1080 Philips Semiconductors FlexRay transceiver Table 15. Dynamic characteristics …continued All parameters are guaranteed for VBAT = 6.5 V to 60 V; VCC = 4.75 V to 5.25 V; VBUF = 4.75 V to 5.25 V; VIO = 2.2 V to 5.25 V; Tvj = −40 °C to + 150 °C; Rbus = 45 Ω; RTRXD = 200 Ω unless otherwise specified. All voltages are defined with respect to ground; positive currents flow into the IC[1]. Symbol Parameter Conditions Min Typ Max Unit wake-up time on pin WAKE low power mode; falling edge on pin WAKE; 6.5 V < VBAT < 27 V 5 25 100 µs low power mode; falling edge on pin WAKE; 27 V < VBAT < 60 V 25 75 175 µs 2600 - 10400 µs WAKE twake(WAKE) Miscellaneous tdetCL(TXEN_BGE) TXEN_BGE clamp detection time [1] At power-up VBAT should be supplied first. When VBAT reaches 6.5 V, VCC and VIO may be switched on with a delay of at least 60 µs with respect to VBAT. [2] Rise and fall time (10 % to 90 %) of tr(TXD) and tf(TXD) = 5 ns. [3] Rise and fall time (10 % to 90 %) of tr(TRXD) and tf(TRXD) = 5 ns. [4] The worst case asymmetry from one branch to another is the sum of the delay difference from TRXD0 and TRXD1 to DATA_0 and DATA_1 plus the delay difference from DATA_0 and DATA_1 to TRXD0 and TRXD1. The TJA1080 should not be used in topologies with cascaded stars. TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 35 of 44 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx td(TXEN-busact) Philips Semiconductors TJA1080_1 Preliminary data sheet td(TXD-bus) td(TXD-bus) td(BGE-busact) td(TXEN-busidle) td(BGE-busidle) 0.7VIO TXD 0.3VIO 0.7VIO TXEN 0.3VIO 0.7VIO BGE 0.3VIO Rev. 01 — 20 July 2006 BP and BM 90 % +300 mV 0V −300 mV −150 mV −300 mV −150 mV −300 mV 10 % 0.7VIO RXEN 0.3VIO 0.7VIO RXD 0.3VIO td(bus-RXD) td(bus-RXD) tdet(idle)(bus) tdet(act)(bus) tdet(idle)(bus) tdet(act)(bus) tr(dif)(bus) tf(dif)(bus) 001aae445 TJA1080 FlexRay transceiver 36 of 44 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Fig 10. Detailed timing diagram in node configuration TJA1080 Philips Semiconductors FlexRay transceiver Vdif (mV) 22.5 ns 22.5 ns 600 300 57.5 ns −300 −600 80 ns ∆td(bus-RXD) RXD Vdif (mV) ∆td(bus-RXD) 22.5 ns 22.5 ns 600 300 57.5 ns −300 −600 80 ns ∆td(bus-RXD) RXD ∆td(bus-RXD) 001aae446 Vdif is the receiver test signal. Fig 11. Receiver test signal TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 37 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 12. Test information +12 V +5 V 100 nF 10 µF 4 19 VIO VCC 22 µF 14 20 VBAT VBUF BP 18 RL TJA1080 BM RXD CL 17 7 15 pF 001aae447 Fig 12. Test circuit for dynamic characteristics ISO 7637 PULSE GENERATOR 12 V or 42 V +5 V 100 nF 10 µF 4 VIO 19 VCC 10 µF 14 20 VBAT VBUF BP 1 nF 18 RL TJA1080 BM CL 17 1 nF ISO 7637 PULSE GENERATOR 001aae448 The waveforms of the applied transients are in accordance with ISO 7637, test pulses 1, 2, 3a, 3b, 4 and 5. Test conditions: Normal mode: bus idle Normal mode: bus active; TXD at 5 MHz and TXEN at 1 kHz Fig 13. Test circuit for automotive transients TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 38 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 13. Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 w M bp e detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.9 0.5 8 o 0 o Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Fig 14. Package outline SOT339-1 (SSOP20) TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 39 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 14. Soldering 14.1 Introduction to soldering surface mount packages There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 14.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow temperatures range from 215 °C to 260 °C depending on solder paste material. The peak top-surface temperature of the packages should be kept below: Table 16. SnPb eutectic process - package peak reflow temperatures (from J-STD-020C July 2004) Package thickness Volume mm3 < 350 Volume mm3 ≥ 350 < 2.5 mm 240 °C + 0/−5 °C 225 °C + 0/−5 °C ≥ 2.5 mm 225 °C + 0/−5 °C 225 °C + 0/−5 °C Table 17. Pb-free process - package peak reflow temperatures (from J-STD-020C July 2004) Package thickness Volume mm3 < 350 Volume mm3 350 to 2000 Volume mm3 > 2000 < 1.6 mm 260 °C + 0 °C 260 °C + 0 °C 260 °C + 0 °C 1.6 mm to 2.5 mm 260 °C + 0 °C 250 °C + 0 °C 245 °C + 0 °C ≥ 2.5 mm 250 °C + 0 °C 245 °C + 0 °C 245 °C + 0 °C Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 40 of 44 TJA1080 Philips Semiconductors FlexRay transceiver – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 14.5 Package related soldering information Table 18. Suitability of surface mount IC packages for wave and reflow soldering methods Package[1] Soldering method Wave Reflow[2] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable[4] suitable PLCC[5], SO, SOJ suitable suitable not recommended[5][6] suitable SSOP, TSSOP, VSO, VSSOP not recommended[7] suitable CWQCCN..L[8], not suitable LQFP, QFP, TQFP PMFP[9], WQCCN..L[8] [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. TJA1080_1 Preliminary data sheet not suitable © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 41 of 44 TJA1080 Philips Semiconductors FlexRay transceiver [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. 15. Abbreviations Table 19. Abbreviations Abbreviation Description CAN Communications Area Network CDM Charge Device Model EMC ElectroMagnetic Compatibility EME ElectroMagnetic Emission EMI ElectroMagnetic Interference ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model PWON Power-on 16. References [1] EPL — FlexRay Communications System Electrical Physical Layer Specification Version 2.1 Rev. A, FlexRay Consortium, Dec 2005 [2] PS41 — Product Specification: TJA1041; High speed CAN transceiver, www.semiconductors.philips.com [3] PS54 — Product Specification: TJA1054; Fault-tolerant CAN transceiver, www.semiconductors.philips.com 17. Revision history Table 20. Revision history Document ID Release date Data sheet status Change notice Supersedes TJA1080_1 20060720 Objective data sheet - - TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 42 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 18.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] TJA1080_1 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 20 July 2006 43 of 44 TJA1080 Philips Semiconductors FlexRay transceiver 20. Contents 1 2 2.1 2.2 2.3 2.4 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.1.2 7.1.3 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.3 7.3.1 7.3.2 7.3.3 7.3.4 7.3.5 7.3.6 7.4 7.4.1 7.4.2 7.5 7.5.1 7.5.2 7.5.3 7.5.4 7.6 7.6.1 7.6.2 7.6.3 7.7 7.7.1 7.7.2 7.7.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Optimized for time triggered communication systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Low power management . . . . . . . . . . . . . . . . . 2 Diagnosis (detection and signalling) . . . . . . . . . 2 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Operating configurations. . . . . . . . . . . . . . . . . . 6 Node configuration . . . . . . . . . . . . . . . . . . . . . . 6 Star configuration . . . . . . . . . . . . . . . . . . . . . . . 6 Bus activity and idle detection . . . . . . . . . . . . . 7 Operating modes in node configuration . . . . . . 7 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . 14 Receive only mode . . . . . . . . . . . . . . . . . . . . . 14 Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . 14 Go-to-sleep mode . . . . . . . . . . . . . . . . . . . . . . 14 Sleep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Operating modes in star configuration . . . . . . 15 Star Idle mode . . . . . . . . . . . . . . . . . . . . . . . . 17 Star Transmit mode. . . . . . . . . . . . . . . . . . . . . 18 Star Receive mode . . . . . . . . . . . . . . . . . . . . . 18 Star Standby mode . . . . . . . . . . . . . . . . . . . . . 18 Star Sleep mode . . . . . . . . . . . . . . . . . . . . . . . 18 Star Locked mode. . . . . . . . . . . . . . . . . . . . . . 19 Start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Node configuration . . . . . . . . . . . . . . . . . . . . . 19 Star configuration . . . . . . . . . . . . . . . . . . . . . . 19 Wake-up mechanism . . . . . . . . . . . . . . . . . . . 19 Node configuration . . . . . . . . . . . . . . . . . . . . . 19 Star configuration . . . . . . . . . . . . . . . . . . . . . . 19 Bus wake-up . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Local wake-up via pin WAKE . . . . . . . . . . . . . 20 Fail silent behavior . . . . . . . . . . . . . . . . . . . . . 20 VBAT undervoltage. . . . . . . . . . . . . . . . . . . . . . 21 VCC undervoltage . . . . . . . . . . . . . . . . . . . . . . 21 VIO undervoltage. . . . . . . . . . . . . . . . . . . . . . . 21 Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Local wake-up source flag . . . . . . . . . . . . . . . 21 Remote wake-up source flag . . . . . . . . . . . . . 21 Wake flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7.7.4 7.7.5 7.7.6 7.7.7 7.7.8 7.7.9 7.7.10 7.7.11 7.7.12 7.7.13 7.8 7.9 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 18.1 18.2 18.3 18.4 19 20 Power-on flag . . . . . . . . . . . . . . . . . . . . . . . . . Node or star configuration flag . . . . . . . . . . . . Temperature medium flag . . . . . . . . . . . . . . . Temperature high flag . . . . . . . . . . . . . . . . . . TXEN_BGE clamped flag. . . . . . . . . . . . . . . . Bus error flag . . . . . . . . . . . . . . . . . . . . . . . . . UVVBAT flag. . . . . . . . . . . . . . . . . . . . . . . . . . . UVVCC flag . . . . . . . . . . . . . . . . . . . . . . . . . . . UVVIO flag. . . . . . . . . . . . . . . . . . . . . . . . . . . . Error flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . TRXD collision . . . . . . . . . . . . . . . . . . . . . . . . Status register . . . . . . . . . . . . . . . . . . . . . . . . Limiting values . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . Static characteristics . . . . . . . . . . . . . . . . . . . Dynamic characteristics . . . . . . . . . . . . . . . . . Test information. . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . Manual soldering . . . . . . . . . . . . . . . . . . . . . . Package related soldering information . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . References . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 22 22 22 22 22 23 23 23 23 23 23 25 26 27 33 38 39 40 40 40 40 41 41 42 42 42 43 43 43 43 43 43 44 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Koninklijke Philips Electronics N.V. 2006. All rights reserved. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: [email protected]. Date of release: 20 July 2006 Document identifier: TJA1080_1