INTEGRATED CIRCUITS DATA SHEET TJA1020 LIN transceiver Product specification Supersedes data of 2002 Jul 17 2004 Jan 13 Philips Semiconductors Product specification LIN transceiver TJA1020 FEATURES GENERAL DESCRIPTION General The TJA1020 is the interface between the LIN master/slave protocol controller and the physical bus in a Local Interconnect Network (LIN). It is primarily intended for in-vehicle sub-networks using baud rates from 2.4 up to 20 Kbaud. • Baud rate up to 20 Kbaud • Very low ElectroMagnetic Emission (EME) • High ElectroMagnetic Immunity (EMI) • Low slope mode for an even further reduction of EME The transmit data stream of the protocol controller at the TXD input is converted by the LIN transceiver into a bus signal with controlled slew rate and wave shaping to minimize EME. The LIN bus output pin is pulled HIGH via an internal termination resistor. For a master application an external resistor in series with a diode should be connected between pin INH or pin BAT and pin LIN. The receiver detects the data stream at the LIN bus input pin and transfers it via pin RXD to the microcontroller. • Passive behaviour in unpowered state • Input levels compatible with 3.3 and 5 V devices • Integrated termination resistor for Local Interconnect Network (LIN) slave applications • Wake-up source recognition (local or remote) • Supports K-line like functions. Low power management In normal transceiver operation the TJA1020 can be switched in the normal slope mode or the low slope mode. In the low slope mode the TJA1020 lengthens the rise and fall slopes of the LIN bus signal, thus further reducing the already very low emission in normal slope mode. • Very low current consumption in sleep mode with local and remote wake-up. Protections In sleep mode the power consumption of the TJA1020 is very low, whereas in failure modes the power consumption is reduced to a minimum. • Transmit data (TXD) dominant time-out function • Bus terminal and battery pin protected against transients in the automotive environment (ISO7637) • Bus terminal short-circuit proof to battery and ground • Thermally protected. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VBAT supply voltage on pin BAT 5 12 27 V IBAT supply current on pin BAT in sleep mode 1 3 8 µA supply current on pin BAT in standby mode; bus recessive 100 400 1000 µA supply current on pin BAT in normal slope mode; bus recessive 100 400 1000 µA supply current on pin BAT in normal slope mode; bus dominant 1 3.5 8.0 mA VLIN DC voltage on pin LIN −27 − +40 V Tvj virtual junction temperature −40 − +150 °C Vesd(HBM) electrostatic discharge voltage; human body model; pins NWAKE, LIN and BAT −4 − +4 kV ORDERING INFORMATION TYPE NUMBER PACKAGES NAME TJA1020T SO8 TJA1020U − 2004 Jan 13 DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm bare die; die dimensions 1480 × 1760 × 375 µm 2 VERSION SOT96-1 − Philips Semiconductors Product specification LIN transceiver TJA1020 BLOCK DIAGRAM handbook, full pagewidth BAT NWAKE 7 WAKE-UP TIMER 3 CONTROL 8 NSLP SLEEP/ NORMAL TIMER 2 INH TEMPERATURE PROTECTION 6 TXD LIN TXD TIME-OUT TIMER 4 TJA1020T RXD 1 RXD/ INT BUS TIMER 5 FILTER GND MGU241 Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION RXD 1 receive data output (open-drain); active LOW after a wake-up event NSLP 2 sleep control input (active LOW); controls inhibit output; resets wake-up source flag on TXD and wake-up request on RXD NWAKE 3 RXD 1 4 transmit data input; active LOW output after a local wake-up event GND 5 ground LIN 6 LIN bus line input/output BAT 7 battery supply INH 8 battery related inhibit output for controlling an external voltage regulator; active HIGH after a wake-up event 8 INH 7 BAT NWAKE 3 6 LIN TXD 4 5 GND NSLP 2 local wake-up input (active LOW); negative edge triggered TXD 2004 Jan 13 handbook, halfpage TJA1020T MGU242 Fig.2 Pinning diagram. 3 Philips Semiconductors Product specification LIN transceiver TJA1020 FUNCTIONAL DESCRIPTION The TJA1020 is the interface between the LIN master/slave protocol controller and the physical bus in a Local Interconnect Network (LIN). The LIN transceiver is optimized for the maximum specified LIN transmission speed of 20 Kbaud providing optimum EMC performance due to wave shaping of the LIN output. Operating modes The TJA1020 provides two modes of normal operation, one intermediate mode and one very low power mode. Figure 3 shows the state diagram. handbook, full pagewidth STANDBY INH = HIGH TERM. = 30 kΩ RXD = LOW trx OFF t(NSLP = 1; after 0−>1) > tgotonorm while TXD = 1 NORMAL SLOPE MODE (t(NWAKE = 0; after 1−>0) > tNWAKE INH = HIGH TERM. = 30 kΩ RXD = LINDATA trx ON or t(LIN = 0; after 1−>0) > tBUS) t(NSLP = 1; after 0−>1) > tgotonorm t(NSLP = 0; after 1−>0) > tgotosleep while TXD = 0 while TXD = 1 LOW SLOPE MODE INH = HIGH TERM. = 30 kΩ RXD = LINDATA trx ON t(NSLP = 0; after 1−>0) > tgotosleep while TXD = 1 t(NSLP = 1; after 0−>1) > tgotonorm while TXD = 0 trx: transmitter. TERM.: slave termination resistor, connected between pins LIN and BAT. Fig.3 State diagram. 2004 Jan 13 4 t(NSLP = 1; after 0−>1) > tgotonorm while TXD = 1 SLEEP INH = FLOATING TERM. = HIGH-OHMIC RXD = FLOATING trx OFF switching on BAT MGU243 Philips Semiconductors Product specification LIN transceiver Table 1 TJA1020 Operating modes MODE NSLP TXD (OUTPUT) RXD Sleep 0 weak pull-down Standby(1) 0 weak pull-down if LOW; note 3 remote wake-up; strong pull-down if local wake-up; note 2 Normal slope mode 1 weak pull-down Low slope mode 1 weak pull-down INH floating TRANSMITTER REMARKS floating off no wake-up request detected HIGH off wake-up request detected; in this mode the microcontroller can read the wake-up source: remote or local wake-up HIGH: HIGH recessive state LOW: dominant state normal slope mode notes 2, 3 and 4 HIGH: HIGH recessive state LOW: dominant state low slope mode notes 2, 3 and 5 Notes 1. The standby mode is entered automatically upon any local or remote wake-up event during sleep mode. Pin INH and the 30 kΩ termination resistor at pin LIN are switched on. 2. The internal wake-up source flag (set if a local wake-up did occur and fed to pin TXD) will be reset when entering normal slope or low slope mode (NSLP goes HIGH). 3. The wake-up interrupt (on pin RXD) is released when entering normal slope or low slope mode (NSLP goes HIGH). 4. The normal slope mode is entered during a positive edge on NSLP while pin TXD is already set HIGH. In the event of a short-circuit to ground on pin TXD, the transmitter will be disabled. 5. The low slope mode is entered during the positive edge on NSLP while pin TXD is already pulled LOW. Sleep mode The sleep mode can be activated independently from the actual level on pin LIN or NWAKE. So it is guaranteed that the lowest power consumption is achievable even in case of a continuous dominant level on pin LIN or a continuous LOW on pin NWAKE. This mode is the most power saving mode of the TJA1020 and the default state after power-up (first battery supply). Despite its extreme low current consumption, the TJA1020 can still be waken up remotely via pin LIN, or waken up locally via pin NWAKE, or activated directly via pin NSLP. Filters at the inputs of the receiver (LIN), of pin NWAKE and of pin NSLP are preventing unwanted wake-up events due to automotive transients or EMI. All wake-up events have to be maintained for a certain time period (tBUS, tNWAKE and tgotonorm). Standby mode The standby mode is entered automatically whenever a local or remote wake-up occurs while the TJA1020 is in its sleep mode. These wake-up events activate pin INH and enable the slave termination resistor at the pin LIN. As a result of the HIGH condition on pin INH the voltage regulator and the microcontroller can be activated. The sleep mode is initiated by a falling edge on the pin NSLP while TXD is already set HIGH. After a filter time continuously driven sleep command (pin NSLP = LOW), pin INH becomes floating. The standby mode is signalled by a LOW level on pin RXD which can be used as an interrupt for the microcontroller. In sleep mode the internal slave termination between pins LIN and BAT is disabled to minimize the power dissipation in case pin LIN is short-circuited to ground. Only a weak pull-up between pins LIN and BAT is present. 2004 Jan 13 In the standby mode (pin NSLP is still LOW), the condition of pin TXD (weak pull-down or strong pull-down) indicates the wake-up source: weak pull-down for a remote wake-up request and strong pull-down for a local wake-up request. 5 Philips Semiconductors Product specification LIN transceiver TJA1020 In the low slope mode the transmitter output stage drives the LIN bus line with lengthened rise and fall slopes. This will further reduce the already outstanding EME in the normal slope mode. The low slope mode is perfectly suited for applications where transmission speed is not critical. The mode selection is done by the LIN transceiver after a positive edge on pin NSLP, maintained for a certain time period (tgotonorm). If pin TXD is LOW at that time, the low slope mode is entered, otherwise the normal mode is entered. The transition to the low slope mode will be executed during an open pin TXD (fail-safe), a short-circuit from pin TXD to ground (fail-safe) or an intended LOW level of pin TXD programmed by the microcontroller. The transmitter is enabled after a LOW-to-HIGH transition on pin TXD. In the event of a short-circuit to ground on pin TXD, the transmitter will be disabled. Setting pin NSLP HIGH during standby mode results in the following events: • An immediate reset of the wake-up source flag; thus releasing the possible strong pull-down at pin TXD before the actual mode change (after tgotonorm) is performed • A change into normal slope mode if the HIGH level on pin NSLP has been maintained for a certain time period (tgotonorm) while pin TXD is pulled HIGH • A change into low slope mode if the HIGH level on pin NSLP has been maintained for a certain time period (tgotonorm) while pin TXD is pulled LOW either deliberately driven by the microcontroller, or due to a failure. In the event of a short-circuit to ground or an open-wire on pin TXD, the LIN output remains recessive (fail safe) • A reset of the wake-up request signal on pin RXD if the HIGH level on pin NSLP has been maintained for a certain time period (tgotonorm). Wake-up Normal slope mode 1. Remote wake-up via a dominant bus state There are three ways to wake-up a TJA1020 which is in sleep mode: 2. Local wake-up via a negative edge at pin NWAKE In the normal slope mode the transceiver is able to transmit and receive data via the LIN bus line. The receiver detects the data stream at the LIN bus input pin and transfers it via pin RXD to the microcontroller (see Fig.1): HIGH at a recessive level and LOW at a dominant level on the bus. The receiver has a supply voltage related threshold with hysteresis and an integrated filter to suppress bus line noise. The transmit data stream of the protocol controller at the TXD input is converted by the transmitter into a bus signal with controlled slew rate and wave shaping to minimize EME. The LIN bus output pin is pulled HIGH via an internal slave termination resistor. For a master application an external resistor in series with a diode should be connected between pin INH or BAT on one side and pin LIN on the other side (see Fig.7). 3. Mode change (pin NSLP is HIGH) from sleep mode to normal slope/low slope mode. Remote and local wake-up A falling edge at pin NWAKE followed by a LOW level maintained for a certain time period (tNWAKE) results in a local wake-up. The pin NWAKE provides an internal pull-up towards pin BAT. In order to prevent EMI issues, it is recommended to connect an unused pin NWAKE to pin BAT. If, during power-up, pin NWAKE is LOW for a certain period of time (tNWAKE) this will also result in a local wake-up. A falling edge at pin LIN followed by a LOW level maintained for a certain time period (tBUS) and a rising edge at pin LIN respectively (see Fig.4) results in a remote wake-up. Being in the sleep or standby mode, the TJA1020 enters normal slope mode whenever a HIGH level on pin NSLP is maintained for a time of at least tgotonorm provided its preceding positive edge is executed while pin TXD is already set to HIGH. After a local or remote wake-up pin INH is activated (it goes HIGH) and the internal slave termination resistor is switched on. The wake-up request is indicated by a LOW active wake-up request signal on pin RXD to interrupt the microcontroller. The TJA1020 switches to sleep mode in case of a LOW level on pin NSLP, maintained during a certain time period (tgotosleep) while pin TXD is already set to HIGH. Low slope mode The only difference between the normal slope mode and the low slope mode is the transmitter behaviour. 2004 Jan 13 6 Philips Semiconductors Product specification LIN transceiver TJA1020 Wake-up via mode transition pin TXD exceeds the internal timer value (tdom), the transmitter is disabled, driving the bus line into a recessive state. The timer is reset by a positive edge on pin TXD. It is also possible to set pin INH HIGH with a mode transition towards normal slope/low slope mode via pin NSLP. This is useful for applications with a continuously powered microcontroller. Fail-safe features Pin TXD provides a pull-down to GND in order to force a predefined level on input pin TXD in case the pin TXD is unsupplied. Wake-up source recognition The TJA1020 can distinguish between a local wake-up request on pin NWAKE and a remote wake-up request via a dominant bus state. The wake-up source flag is set in case the wake-up request was a local one. The wake-up source can be read on pin TXD in the standby mode. If an external pull-up resistor on pin TXD to the power supply voltage of the microcontroller has been added a HIGH level indicates a remote wake-up request (weak pull-down at pin TXD) and a LOW level indicates a local wake-up request (strong pull-down at pin TXD; much stronger than the external pull-up resistor). Pin NSLP provides a pull-down to GND in order to force the transceiver into sleep mode in case the pin NSLP is unsupplied. Pin RXD is set floating in case of lost power supply on pin BAT. The current of the transmitter output stage is limited in order to protect the transmitter against short-circuit to pins BAT or GND. A loss of power (pins BAT and GND) has no impact to the bus line and the microcontroller. There are no reverse currents from the bus. The LIN transceiver can be disconnected from the power supply without influencing the LIN bus. The wake-up request flag (signalled on pin RXD) as well as the wake-up source flag (signalled on pin TXD) are reset immediately, if the microcontroller sets pin NSLP HIGH. The output driver at pin LIN is protected against overtemperature conditions. If the junction temperature exceeds the shutdown junction temperature Tj(sd), the thermal protection circuit disables the output driver. The driver is enabled again if the junction temperature has been decreased below Tj(sd) and a recessive level is present at pin TXD. TXD dominant time-out function A ‘TXD Dominant Time-out’ timer circuit prevents the bus line from being driven to a permanent dominant state (blocking all network communication) if pin TXD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TXD. If the duration of the LOW level on LIN recessive handbook, full pagewidth VBAT 0.6VBAT VLIN 0.4VBAT tBUS LIN dominant ground sleep mode standby mode MBL371 Fig.4 Wake-up behaviour. 2004 Jan 13 7 Philips Semiconductors Product specification LIN transceiver TJA1020 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin GND. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT −0.3 +40 V VTXD, VRXD, VNSLP DC voltage on pins TXD, RXD and NSLP −0.3 +7 V VLIN DC voltage on pin LIN −27 +40 V VNWAKE DC voltage on pin NWAKE −1 +40 V INWAKE current on pin NWAKE (only relevant if VNWAKE < VGND − 0.3 V; current will flow into pin GND) −15 − mA VBAT supply voltage on pin BAT VINH DC voltage on pin INH −0.3 VBAT + 0.3 V IINH output current at pin INH −50 +15 mA Vtrt(LIN) transient voltage on pin LIN (ISO7637) −150 +100 V Tvj virtual junction temperature −40 +150 °C Tstg storage temperature −55 +150 °C Vesd(HBM) electrostatic discharge voltage; human body model on pins NWAKE, LIN and BAT −4 +4 kV on pins RXD, NSLP, TXD and INH −2 +2 kV −200 +200 V Vesd(MM) electrostatic discharge voltage; machine model; all pins note 1 note 2 Notes 1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor. 2. Equivalent to discharging a 200 pF capacitor through a 10 Ω resistor and a 0.75 µH coil. In the event of a discharge from pin INH to pin BAT: −150 V < Vesd(MM) < +150 V. THERMAL CHARACTERISTICS According to IEC60747-1. SYMBOL PARAMETER CONDITION VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in in free air SO8 package 145 K/W Rth(j-s) thermal resistance from junction to substrate bare die 50 K/W QUALITY SPECIFICATION Quality specification in accordance with “AEC - Q100”. 2004 Jan 13 8 in free air Philips Semiconductors Product specification LIN transceiver TJA1020 CHARACTERISTICS VBAT = 5 to 27 V; Tvj = −40 to +150 °C; RL(LIN-BAT) = 500 Ω; all voltages are defined with respect to ground; positive currents flow into the IC; typical values are given at VBAT = 12 V; unless otherwise specified; notes 1 and 2. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply IBAT supply current on pin BAT sleep mode 1 (VLIN = VBAT; VNWAKE = VBAT; VTXD = 0 V; VNSLP = 0 V) 3 8 µA 100 standby mode; bus recessive (VINH = VBAT; VLIN = VBAT; VNWAKE = VBAT; VTXD = 0 V; VNSLP = 0 V) 400 1000 µA standby mode; bus dominant (VBAT = 12 V; VINH = 12 V; VLIN = 0 V; VNWAKE = 12 V; VTXD = 0 V; VNSLP = 0 V); note 3 300 900 2000 µA low slope mode; bus 100 recessive (VINH = VBAT; VLIN = VBAT; VNWAKE = VBAT; VTXD = 5 V; VNSLP = 5 V) 400 1000 µA normal slope mode; bus 100 recessive (VINH = VBAT; VLIN = VBAT; VNWAKE = VBAT; VTXD = 5 V; VNSLP = 5 V) 400 1000 µA low slope mode; bus dominant (VBAT = 12 V; VINH = 12 V; VNWAKE = 12 V; VTXD = 0 V; VNSLP = 5 V); note 3 1 3.5 8 mA normal slope mode; bus dominant (VBAT = 12 V; VINH = 12 V; VNWAKE = 12 V; VTXD = 0 V; VNSLP = 5 V); note 3 1 3.5 8 mA − 7 V Pin TXD VIH HIGH-level input voltage 2 VIL LOW-level input voltage −0.3 − +0.8 V Vhys TXD hysteresis voltage 0.03 − 0.5 V RTXD TXD pull-down resistor 125 350 800 kΩ 2004 Jan 13 VTXD = 5 V 9 Philips Semiconductors Product specification LIN transceiver SYMBOL PARAMETER TJA1020 CONDITIONS MIN. TYP. MAX. UNIT IIL LOW-level input current VTXD = 0 V −5 0 +5 µA IOL LOW-level output current (local wake-up request) standby mode; VNWAKE = 0 V; VLIN = VBAT; VTXD = 0.4 V 1.5 3 − mA Pin NSLP VIH HIGH-level input voltage 2 − 7 V VIL LOW-level input voltage −0.3 − +0.8 V Vhys NSLP hysteresis voltage 0.03 − 0.5 V RNSLP NSLP pull-down resistor VNSLP = 5 V 125 350 800 kΩ IIL LOW-level input current VNSLP = 0 V −5 0 +5 µA 3.5 − mA −5 0 +5 µA Pin RXD (open-drain) IOL LOW-level output current normal slope mode; 1.3 VLIN = 0 V; VRXD = 0.4 V ILH HIGH-level leakage current normal slope mode; VLIN = VBAT; VRXD = 5 V Pin NWAKE VIH HIGH-level input voltage VBAT − 1 − VBAT + 0.3 V VIL LOW-level input voltage −0.3 − VBAT − 3.3 V IIL NWAKE pull-up current VNWAKE = 0 V −30 −10 −3 µA ILH HIGH-level leakage current VNWAKE = 27 V; VBAT = 27 V −5 0 +5 µA Rsw(INH) switch-on resistance between pins BAT and INH standby; low slope or normal slope mode; IINH = −15 mA; VBAT = 12 V − 30 50 Ω ILH HIGH-level leakage current sleep mode; −5 VINH = 27 V; VBAT = 27 V 0 +5 µA Vo(reces) LIN recessive output voltage VTXD = 5 V; ILIN = 0 mA − VBAT V Vo(dom) LIN dominant output voltage VTXD = 0 V; VBAT = 7.3 V − − 1.2 V VTXD = 0 V; VBAT = 7.3; RL = 1 kΩ 0.6 − − V VTXD = 0 V; VBAT = 18 V − − 2.0 V VTXD = 0 V; VBAT = 18 V; 0.8 RL = 1 kΩ − − V Pin INH Pin LIN 0.9VBAT ILH HIGH-level leakage current VLIN = VBAT −1 0 +1 µA IIL LIN pull-up current sleep mode; VLIN = 0 V; VNSLP = 0 V −2 −5 −10 µA 2004 Jan 13 10 Philips Semiconductors Product specification LIN transceiver SYMBOL PARAMETER TJA1020 CONDITIONS MIN. TYP. MAX. UNIT RSLAVE slave termination resistance to pin BAT standby, low slope or normal slope mode; VLIN = 0 V; VBAT = 12 V 20 30 47 kΩ Io(sc) short-circuit output current VLIN = VBAT = 12 V; VTXD = 0 V; t < tdom 27 40 60 mA VLIN = VBAT = 27 V; VTXD = 0 V; t < tdom 60 90 125 mA VBAT = 7.3 to 27 V 0.4VBAT − 0.6VBAT V Vth(rx) receiver threshold voltage Vcntr(rx) receiver centre voltage VBAT = 7.3 to 27 V 0.475VBAT 0.5VBAT 0.525VBAT V Vthr(hys) receiver threshold hysteresis voltage VBAT = 7.3 to 27 V 0.145VBAT 0.16VBAT 0.175VBAT V 160 175 190 °C Thermal shutdown Tj(sd) shutdown junction temperature AC characteristics ∆td(TXD-BUSon/off) TXD propagation delay failure normal slope mode; CL = 10 nF; RL = 500 Ω; (see Fig.5) tPropTxDom − tPropTxRec −2 0 +2 µs ∆td(TXD-BUSon/off) TXD propagation delay failure low slope mode; CL = 10 nF; RL = 500 Ω; (see Fig.5) tPropTxDom − tPropTxRec −5 0 +5 µs ∆td(BUSon/off-RXD) RXD propagation delay failure normal slope mode and low slope mode; CL = 0; RL = ∞; voltage on LIN externally forced; LIN slope time <500 ns; CRXD = 20 pF; RRXD = 2.4 kΩ; (see Fig.5) tPropRxDom − tPropRxRec −2 0 +2 µs tf(slope)(dom) fall time LIN (100% to 0%) normal slope mode; CL = 10 nF; RL = 500 Ω; VBAT = 12 V; transition from recessive to dominant; note 4 (see Fig.5) − 16 27 µs tr(slope)(rec) rise time LIN (0% to 100%) normal slope mode; CL = 10 nF; RL = 500 Ω; VBAT = 12 V; transition from dominant to recessive; note 5 (see Fig.5) − 16 27 µs 2004 Jan 13 11 Philips Semiconductors Product specification LIN transceiver SYMBOL PARAMETER ∆tslope(norm) normal slope symmetry tf(slope)(norm)(dom) tr(slope)(norm)(rec) TJA1020 CONDITIONS MIN. MAX. UNIT 0 +5 µs normal slope fall time LIN normal slope mode; − (100% to 0%) CL = 6.8 nF; RL = 660 Ω; VBAT = 12 V; transition from recessive to dominant; note 4 12 22.5 µs normal slope rise time LIN (0% to 100%) normal slope mode; − CL = 6.8 nF; RL = 660 Ω; VBAT = 12 V; transition from dominant to recessive; note 5 12 22.5 µs ∆tslope(norm) normal slope symmetry normal slope mode; −4 CL = 6.8 nF; RL = 660 Ω; VBAT = 12 V; tf(slope)(dom) − tr(slope)(rec) 0 +4 µs tf(slope)(low)(dom) low slope fall time LIN (100% to 0%) low slope mode; CL = 10 nF; RL = 500 Ω; VBAT = 12 V; note 4 − 30 62 µs tr(slope)(low)(rec) low slope rise time LIN (0% to 100%) low slope mode; CL = 10 nF; RL = 500 Ω; VBAT = 12 V; note 5 − 30 62 µs tBUS dominant time for wake-up via bus sleep mode 30 70 150 µs tNWAKE dominant time for wake-up via pin NWAKE sleep mode 7 20 50 µs tgotonorm time period for mode change from sleep or standby mode into normal/low slope mode 2 5 10 µs tgotosleep time period for mode change from normal/low slope mode into sleep mode 2 5 10 µs tdom TXD dominant time out 6 12 20 ms 2004 Jan 13 normal slope mode; CL = 10 nF; RL = 500 Ω; VBAT = 12 V; tf(slope)(dom) − tr(slope)(rec) VTXD = 0 V 12 −5 TYP. Philips Semiconductors Product specification LIN transceiver TJA1020 Notes 1. All parameters are guaranteed over the virtual junction temperature by design, but only 100% tested at 125 °C ambient temperature for dies on wafer level and, in addition to this, 100% tested at 25 °C ambient temperature for cased products, unless otherwise specified. 2. For bare die, all parameters are only guaranteed if the backside of the bare die is connected to ground. 3. If VBAT is higher than 12 V, the battery current increases due to the internal LIN termination resistor. The minimum V BAT – 12 V value of this resistor is 20 kΩ. The maximum current increase is therefore: I BAT ( increase ) = ------------------------------20 kΩ 4. ( t VLIN = 40% ) – ( t VLIN = 95% ) t f(slope)(dom) = ------------------------------------------------------------------------------- ; see Fig.6. 0.55 5. ( t VLIN = 60% ) – ( t VLIN = 5% ) t r(slope)(rec) = ---------------------------------------------------------------------------- ; see Fig.6. 0.55 TIMING DIAGRAMS handbook, full pagewidth TXD 50% 50% t PropTxRec t PropTxDom VLIN 100% 95% 0.5 VBAT 0.5 VBAT 5% 0% t t PropRxRec t PropRxDom RXD 50% 50% MGW323 Fig.5 Timing diagram for AC characteristics, bus loaded. 2004 Jan 13 13 Philips Semiconductors Product specification LIN transceiver TJA1020 handbook, full pagewidth VLIN 100% 95% 60% 40% 5% 0% t tslope(Rec) tslope(Dom) MGU433 Fig.6 Definition of slope timing. APPLICATION INFORMATION ECU handbook, full pagewidth BATTERY LIN BUS LINE +5 V/ +3.3 V only for master node INH VDD RX0 RXD BAT 8 7 1 NWAKE 3 1 kΩ MICROCONTROLLER TX0 Px.x TXD NSLP 4 TJA1020T 2 GND 6 LIN (1) 5 GND More information is available in a separate application note. (1) Cmaster = 1 nF; Cslave = 220 pF. Fig.7 Typical application of the TJA1020. 2004 Jan 13 14 MGU244 Philips Semiconductors Product specification LIN transceiver TJA1020 handbook, full pagewidth 100 nF NWAKE BAT INH NSLP RL TJA1020 CL TXD LIN RXD RRXD GND CRXD MGT992 Fig.8 Test circuit for AC characteristics. handbook, full pagewidth 5V 10 kΩ 10 kΩ 10 µF INH BAT NWAKE RXD TJA1020 500 Ω TXD 5V 1 nF LIN NSLP TRANSIENT GENERATOR GND MGT993 The waveforms of the applied transients on pin 6 (LIN) and pin 7 (BAT) are according to ISO7637 part 1, test pulses 1, 2, 3a, 3b, 4, 5, 6 and 7. Fig.9 Test circuit for automotive transients. 2004 Jan 13 15 Philips Semiconductors Product specification LIN transceiver TJA1020 BONDING PAD LOCATIONS handbook, full pagewidth 1 8 2 7 y x 3 6 5A 5B 5C 4 0 MGW322 0 Fig.10 Bonding pad locations. Table 2 Bonding pad locations (dimensions in µm). All x and y co-ordinates are referenced to the bottom left hand corner of the top aluminium layer. CO-ORDINATES SYMBOL PAD x y RXD 1 111 1570 NSLP 2 111 1395 NWAKE 3 165 424 TXD 4 134 134 GND1 5A 1075 90 GND2 5B 1185 90 GND3 5C 1295 90 LIN 6 1318 419 BAT 7 1235 1133 INH 8 1125 1490 2004 Jan 13 16 Philips Semiconductors Product specification LIN transceiver TJA1020 PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 2004 Jan 13 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 17 Philips Semiconductors Product specification LIN transceiver TJA1020 To overcome these problems the double-wave soldering method was specifically developed. SOLDERING Introduction to soldering surface mount packages If wave soldering is used the following conditions must be observed for optimal results: This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. • below 225 °C (SnPb process) or below 245 °C (Pb-free process) A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. – for all BGA, HTSSON-T and SSOP-T packages – for packages with a thickness ≥ 2.5 mm Manual soldering – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. 2004 Jan 13 18 Philips Semiconductors Product specification LIN transceiver TJA1020 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE REFLOW(2) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, USON, VFBGA not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(4) suitable PLCC(5), SO, SOJ suitable suitable not recommended(5)(6) suitable SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable CWQCCN..L(8), PMFP(9), WQCCN..L(8) not suitable LQFP, QFP, TQFP not suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar or manual soldering is suitable for PMFP packages. 2004 Jan 13 19 Philips Semiconductors Product specification LIN transceiver TJA1020 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. REVISION HISTORY REV 5 DATE 2004 01 13 CPCN 200312021 DESCRIPTION Product specification (9397 750 11718) Modifications: • Chapter “Features”; ‘Supports K-line like functions’ added • Figure 1; direction arrow on pin TXD added to indicate an output signal flow as well as an input signal flow. • Figure 3; conditions on mode transitions defined more accurately • Chapter “Thermal characteristics”; Rth(j-s) value in free air = 50 K/W added (was tbf) • Recommendation to connect an unused pin NWAKE to pin BAT incorporated in order to prevent EMI issues • Specification of LIN dominant output voltage changed to align with LIN specification 1.3 • Editorial improvements. 4 20020717 2004 Jan 13 − Product specification (9397 750 10028) 20 Philips Semiconductors Product specification LIN transceiver TJA1020 Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. 2004 Jan 13 21 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R16/05/pp22 Date of release: 2004 Jan 13 Document order number: 9397 750 11718