PHILIPS TJA1054

INTEGRATED CIRCUITS
DATA SHEET
TJA1054
Fault-tolerant CAN transceiver
Preliminary specification
File under Integrated Circuits, IC18
1999 Feb 11
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
FEATURES
GENERAL DESCRIPTION
Optimized for in-car low-speed communication
The TJA1054 is the interface between the protocol
controller and the physical wires of the bus lines in a
Control Area Network (CAN). It is primarily intended for
low-speed applications, up to 125 kBaud, in passenger
cars. The device provides differential transmit capability
but will switch in error conditions to single-wire transmitter
and/or receiver.
• Baud rate up to 125 kBaud
• Up to 32 nodes can be connected
• Supports unshielded bus wires
• Very low Radio Frequency Interference (RFI) due to
built-in slope control function and a very good matching
of the CANL and CANH bus outputs
The TJA1054T is pin and upwards compatible with the
PCA82C252T and the TJA1053T. This means that these
two devices can be replaced by the TJA1054T with
retention of all functions.
• Fully integrated receiver filters
• Permanent dominant monitoring of transmit data input
• Good immunity performance of ElectroMagnetic
Compatibility (EMC) in normal operating mode and in
low power modes.
The most important improvements are:
• Very low RFI due to a very good matching of the CANL
and CANH bus lines outputs
• Good immunity performance of EMC, especially in low
power modes
Bus failure management
• Supports single-wire transmission modes with ground
offset voltages up to 1.5 V
• Fully wake-up capability during failure modes
• Extended bus failure management including
short-circuit of the CANH bus line to VCC
• Automatic switching to single-wire mode in the event of
bus failures, even when the CANH bus wire is
short-circuited to VCC
• Supports easy fault localization
• Automatic reset to differential mode if bus failure is
removed
• Two-edge sensitive wake-up input signal via pin WAKE.
• Fully wake-up capability during failure modes.
Protection
• Short-circuit proof to battery and ground in
12 V powered systems
• Thermally protected
• Bus lines protected against transients in an automotive
environment
• An unpowered node does not disturb the bus lines.
Support for low power modes
• Low current sleep and standby mode with wake-up via
the bus lines
• Power-on reset flag on the output.
ORDERING INFORMATION
TYPE
NUMBER
TJA1054T
1999 Feb 11
PACKAGE
NAME
SO14
DESCRIPTION
plastic small outline package; 14 leads; body width 3.9 mm
2
VERSION
SOT108-1
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VCC
supply voltage on pin VCC
VBAT
battery voltage on pin BAT
CONDITIONS
MIN.
TYP.
MAX.
UNIT
4.75
−
5.25
V
no time limit
−0.3
−
+40
V
operating mode
5.0
−
27
V
load dump
−
−
40
V
30
50
µA
−40
−
+40
V
−40
−
+40
V
CANH bus line transmitter voltage drop ICANH = −40 mA
−
−
1.4
V
∆VCANL
CANH bus line transmitter voltage drop ICANL = 40 mA
−
−
1.4
V
IBAT
battery current on pin BAT
Sleep mode; VCC = 0 V; −
VBAT = 12 V
VCANH
CANH bus line voltage
VCC = 0 to 5.5 V;
VBAT ≥ 0 V;
no time limit
VCANL
CANL bus line voltage
VCC = 0 to 5.5 V;
VBAT ≥ 0 V;
no time limit
∆VCANH
tPD
propagation delay
TXD to RXD
−
1
−
µs
tr
bus line output rise time
10 to 90%; C1 = 10 nF
−
0.6
−
µs
tf
bus line output fall time
90 to 10%; C1 = 1 nF
−
0.3
−
µs
Tamb
operating ambient temperature
−40
−
+125
°C
1999 Feb 11
3
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
BLOCK DIAGRAM
BAT
handbook, full pagewidth
14
INH
WAKE
STB
EN
VCC
10
1
7
TEMPERATURE
PROTECTION
WAKE-UP
STANDBY
CONTROL
5
6
9
11
VCC
12
2
TXD
RTH
FAILURE DETECTOR
PLUS WAKE-UP
PLUS TIME-OUT
4
FILTER
RECEIVER
3
FILTER
13
MGL421
GND
Fig.1 Block diagram.
1999 Feb 11
CANL
TJA1054
VCC
RXD
CANH
TIMER
VCC
ERR
8
DRIVER
RTL
4
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
PINNING
SYMBOL
PIN
DESCRIPTION
INH
1
inhibit output for switching an external voltage regulator if a wake-up signal occurs
TXD
2
transmit data input for activating the driver to the bus lines
RXD
3
receive data output for reading out the data from the bus lines
ERR
4
error, wake-up and power-on indication output; active LOW in normal operating mode when the
bus has a failure and in low power modes (wake-up signal or in power-on standby)
STB
5
standby digital control signal input (active LOW); defines together with input signal on pin EN the
state of the transceiver (in normal and low power modes); see Table 2 and Fig.3
EN
6
enable digital control signal input; defines together with input signal on pin STB the state of the
transceiver (in normal and low power modes); see Table 2 and Fig.3
WAKE
7
local wake-up signal input; falling and rising edges are both detected
RTH
8
termination resistor connection; in case of a CANH bus wire error the line is terminated with a
selectable impedance
RTL
9
termination resistor connection; in case of a CANL bus wire the line is terminated with a
selectable impedance
VCC
10
supply voltage
CANH
11
HIGH-level voltage bus line
CANL
12
LOW-level voltage bus line
GND
13
ground
BAT
14
battery supply
handbook, halfpage
INH
1
14 BAT
TXD
2
13 GND
RXD
3
12 CANL
ERR
4
TJA1054T 11 CANH
STB
5
10 VCC
EN
6
9
RTL
WAKE
7
8
RTH
MGL422
Fig.2 Pin configuration.
1999 Feb 11
5
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
The differential receiver threshold voltage is set at
−3.2 V typically (VCC = 5 V). This ensures correct
reception with a noise margin as high as possible in the
normal operating mode and in the event of failures 1, 2,
4 and 6a. These failures, or recovery from them, do not
destroy ongoing transmissions.
FUNCTIONAL DESCRIPTION
The TJA1054 is the interface between the CAN protocol
controller and the physical wires of the CAN bus
(see Fig.7). It is primarily intended for low speed
applications, up to 125 kBaud, in passenger cars.
The device provides differential transmit capability to the
CAN bus and differential receive capability to the CAN
controller.
Failures 3 and 6 are detected by comparators connected
to the CANH and CANL bus lines, respectively. If the
comparator threshold is exceeded for a certain period of
time, the reception is switched to the single-wire mode.
This time is needed to avoid false triggering by external RF
fields. Recovery from these failures is detected
automatically after a certain time-out (filtering) and no
transmission is lost. In the event of failure 3 the CANH
driver and pin RTH are switched off. In the event of
failure 6 the CANL driver and pin RTL are switched off.
The pull-up current on pin RTL and the pull-down current
on pin RTH will not be switched off.
To reduce RFI, the rise and fall slope are limited. This
allows the use of an unshielded twisted pair or a parallel
pair of wires for the bus lines. Moreover, it supports
transmission capability on either bus line if one of the wires
is corrupted. The failure detection logic automatically
selects a suitable transmission mode.
In normal operating mode (no wiring failures) the
differential receiver is output on pin RXD (see Fig.1).
The differential receiver inputs are connected to
pins CANH and CANL through integrated filters.
The filtered input signals are also used for the single-wire
receivers. The receivers connected to pins CANH
and CANL have threshold voltages that ensure a
maximum noise margin in single-wire mode.
Failures 3a, 4 and 7 initially result in a permanent
dominant level on pin RXD. After a time-out, the CANL
driver and pin RTL are switched off (failures 4 and 7) or
the CANH driver and pin RTH are switched off (failure 3a).
Only a weak pull-up on pin RTL or a weak pull-down on
pin RTH remains. Reception continues by switching to the
single-wire mode via pins CANH or CANL. When
failures 3a, 4 or 7 are removed, the recessive bus levels
are restored. If the differential voltage remains below the
recessive threshold level for a certain period of time,
reception and transmission switch back to the differential
mode.
A timer has been integrated at pin TXD. This timer
prevents the TJA1054 from driving the bus lines to a
permanent dominant state.
Failure detector
The failure detector is fully active in the normal operating
mode. After the detection of a single bus failure the
detector switches to the appropriate mode (see Table 1).
Table 1
If any of the wiring failure occurs, the output signal on
pin ERR will become LOW. On error recovery, the output
signal on pin ERR will become HIGH again.
Bus failures
FAILURE
1
CANH wire interrupted
2
CANL wire interrupted
3
CANH short-circuited to battery
3a
CANH short-circuited to VCC
4
CANL short-circuited to ground
5
CANH short-circuited to ground
6
CANL short-circuited to battery
6a
CANL short-circuited to VCC
7
CANL mutually short-circuited to CANH
1999 Feb 11
During all single-wire transmissions, the EMC
performance (both immunity and emission) is worse than
in the differential mode. The integrated receiver filters
suppress any HF noise induced into the bus wires.
The cut-off frequency of these filters is a compromise
between propagation delay and HF suppression. In the
single-wire mode, LF noise cannot be distinguished from
the required signal.
DESCRIPTION
6
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
If VCC is provided the wake-up request can be read on the
ERR or RXD outputs, so the external microcontroller can
wake-up the transceiver (switch to normal operating
mode) via pins STB and EN.
Low power modes
The transceiver provides 3 low power modes which can be
entered and exited via pins STB and EN (see Table 2 and
Fig.3).
To prevent false wake-up due to transients or RF fields,
the wake-up voltage levels have to be maintained for a
certain period of time. In the low power modes the failure
detection circuit remains partly active to prevent an
increased power consumption in the event of
failures 3, 3a, 4 and 7.
The Sleep mode is the mode with the lowest power
consumption. Pin INH is switched to high-impedance for
deactivation of the external voltage regulator. Pin CANL is
biased to the battery voltage via pin RTL. If the supply
voltage is provided pins RXD and ERR will signal the
wake-up interrupt signal.
Pin INH is set to floating only during the goto-sleep
command and stays floating during the Sleep mode. If
pin INH is set to floating, pin INH will not be set to
HIGH-level again just by a mode change to normal
operating mode. Pin INH will be set to HIGH-level by the
following events only:
The standby mode will react the same as the Sleep mode
but with a HIGH-level on pin INH.
The power-on standby mode is the same as the standby
mode with the battery power-on flag instead of the
wake-up interrupt signal on pin ERR. The output on
pin RXD will show the wake-up interrupt. This mode is only
for reading out the power-on flag.
• power-on (VBAT switching-on at cold start)
• rising or falling edge on pin WAKE
Wake-up requests are recognized by the transceiver when
a dominant signal is detected on either bus line or if
pin WAKE detects an edge (rising or falling) which stays
longer HIGH or LOW respectively during a certain period
of time. On a wake-up request the transceiver will set the
output on pin INH which can be used to activate the
external supply voltage regulator.
Table 2
• a message with 5 consecutive dominant bits during
pin EN or pin STB is at LOW-level.
The signals on pins STB and EN will internally be set to
LOW-level when VCC is below a certain threshold voltage
so providing fail safe functionality.
Normal operating and low power modes
ERR
MODE
STB
RXD
EN
LOW
Goto-sleep
command
0
Sleep
0
0(1)
Standby
0
0
Power-on
standby
1
0
Normal
operating
1
HIGH
LOW
HIGH
1
1
wake-up interrupt
signal;
notes 2 and 3
RTL
SWITCHED
TO
VBAT
wake-up interrupt
signal;
notes 2 and 3
VBAT
VBAT
VBAT power-on flag;
notes 2 and 4
error flag
wake-up interrupt
signal;
notes 2 and 3
no error
flag
dominant
received data
VBAT
recessive
received data
VCC
Notes
1. In case the goto-sleep command was used before. When VCC drops pin EN will become LOW, but this does not effect
the internal functions due to the fail safe functionality.
2. If the supply voltage VCC is present.
3. Wake-up interrupts are released when entering the normal operating mode.
4. VBAT power-on flag will be reset when entering the normal operating mode.
1999 Feb 11
7
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
Power-on
After power-on (VBAT switched on) the signal on pin INH will become HIGH and an internal power-on flag will be set. This
flag can be read in the power-on standby mode via pin ERR (STB = 1; EN = 0) and will be reset by entering the normal
operating mode.
Protections
A current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery
voltage.
If the junction temperature exceeds a maximum value, the transmitter output stages are disabled. Because the
transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and
hence a lower chip temperature. All other parts of the IC will remain operating.
The pins CANH and CANL are protected against electrical transients which may occur in an automotive environment.
handbook, full pagewidth
POWER-ON
STANDBY
10
GOTO (5)
SLEEP
01
NORMAL (4)
11
(1)
(2)
STANDBY
00
SLEEP
00
MBK949
(3)
(1) Mode change via input ports STB and EN.
(2) Mode change via input ports STB and EN, but in the sleep mode INH is inactive and possibly there is no VCC.
Mode control is only possible if VCC of the transceiver is active.
(3) INH is activated after wake-up via bus or input port WAKE.
(4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are cleared.
(5) Transitions to sleep mode: INH is deactivated.
Fig.3 Mode control.
1999 Feb 11
8
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
supply voltage on pin VCC
−0.3
+6
V
VBAT
battery voltage on pin BAT
−0.3
+40
V
Vn
DC voltage on pins 2 to 6
−0.3
VCC + 0.3
V
VCANH
DC voltage on pin CANH
−40
+40
V
VCANL
DC voltage on pin CANL
−40
+40
V
Vtrt(n)
transient voltage on
pins CANH and CANL
−150
+100
V
VWAKE
DC input voltage on pin WAKE
−
VBAT + 0.3
V
IWAKE
DC input current on pin WAKE
−15
−
mA
VINH
DC output voltage on pin INH
−0.3
VBAT + 0.3
V
VRTH
DC voltage on pin RTH
−0.3
VBAT + 1.2
V
VRTL
DC voltage on pin RTL
−0.3
VBAT + 1.2
V
RRTH
termination resistance on pin RTH
500
16000
Ω
RRTL
termination resistance on pin RTL
500
16000
Ω
Tvj
virtual junction temperature
−40
+150
°C
Tstg
storage temperature
−55
+150
°C
Vesd
electrostatic discharge voltage
human body model; note 3
−2.0
+2.0
kV
machine model; note 4
−200
+200
V
see Fig.6
note 2
Notes
1. All voltages are defined with respect to pin GND. Positive current flows into the IC.
2. Junction temperature in accordance with “IEC 747-1”. An alternative definition is: Tvj = Tamb + P × Rth(vj-a) where
Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of
power dissipation (P) and operating ambient temperature (Tamb).
3. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
4. Equivalent to discharging a 200 pF capacitor through a 10 Ω resistor and a 0.75 µH coil.
THERMAL CHARACTERISTICS
SYMBOL
Rth(vj-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
in free air
QUALITY SPECIFICATION
Quality specification in accordance with “SNW-FQ-611-Part-E”.
1999 Feb 11
9
VALUE
UNIT
120
K/W
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
DC CHARACTERISTICS
VCC = 4.75 to 5.25 V; VBAT = 5 to 27 V; VSTB = VCC; Tamb = −40 to +125 °C; unless otherwise specified. All voltages are
defined with respect to ground. Positive currents flow into the IC. All parameters are guaranteed over the temperature
range by design, but only 100% tested at 25 °C.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
ICC
IBAT
supply current
normal operating mode;
VTXD = VCC (recessive)
4
7
11
mA
normal operating mode;
VTXD = 0 V (dominant); no load
11
17
27
mA
low power modes; VTXD = VCC
0
0
10
µA
VBAT = VWAKE = VINH = 12 V
10
30
50
µA
VBAT = VWAKE = VINH = 5 to 27 V
5
30
125
µA
battery current on pin BAT all modes; in low power modes at
VRTL = VBAT or
VRTL < 2.5 V (>1.5 ms)
VBAT =VWAKE = VINH = 3.5 V
5
20
30
µA
VBAT = VWAKE = VINH = 1 V
0
0
10
µA
−
35
60
µA
for setting power-on flag
−
−
1
V
for not setting power-on flag
3.5
−
−
V
ICC + IBAT supply current plus battery low power modes; VCC = 5 V;
current
VBAT = VWAKE = VINH = 12 V
VBAT
battery voltage on pin BAT low power modes
Pins STB, EN and TXD
VIH
HIGH-level input voltage
0.7VCC
−
VCC + 0.3 V
VIL
LOW-level input voltage
−0.3
−
0.3VCC
V
IIH
HIGH-level input current
pins STB and EN
−
9
20
µA
pin TXD
−25
−80
−200
µA
pins STB and EN
4
8
−
µA
pin TXD
−100
−320
−800
µA
2.75
−
4.5
V
IIL
VCC
LOW-level input current
supply voltage
VI = 4 V
VI = 1 V
for forced power-on standby mode
(fail safe)
Pins RXD and ERR
VOH
VOL
HIGH-level output voltage
on pin ERR
lO = −100 µA
VCC − 0.9 −
VCC
V
on pin RXD
IO = −1 mA
VCC − 0.9 −
VCC
V
IO = 1.6 mA
0
−
0.4
V
IO = 7.5 mA
0
−
1.5
V
LOW-level output voltage
on pins ERR and RXD
1999 Feb 11
10
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
SYMBOL
PARAMETER
TJA1054
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Pin WAKE
IIL
LOW-level input current
Vth(WAKE)
wake-up threshold voltage VSTB = 0 V
VWAKE = 0 V; VBAT = 27 V
−1
−4
−10
µA
2.5
3.2
3.9
V
Pin INH
∆VH
HIGH-level voltage drop
IINH = −0.18 mA
−
−
0.8
V
IL
leakage current
Sleep mode; VINH = 0 V
−
−
5
µA
VCC = 5 V
−3.5
−3.2
−2.9
V
VCC = 4.75 to 5.25 V
−0.70VCC −0.64VCC −0.58VCC V
Pins CANH and CANL
Vdiff
VO(reces)
VO(dom)
differential receiver
threshold voltage
recessive output voltage
no failures and
bus failures 1, 2, 5, 6a; see Fig.4
VTXD = VCC
on pin CANH
RRTH < 4 kΩ
−
on pin CANL
RRTL < 4 kΩ
dominant output voltage
−
0.2
V
VCC − 0.2 −
−
V
VTXD = 0 V; VEN = VCC
on pin CANH
ICANH = −40 mA
VCC − 1.4 −
−
V
on pin CANL
ICANL = 40 mA
−
−
1.4
V
normal operating mode;
VCANH = 0 V; VTXD = 0 V
−45
−80
−110
mA
low power modes;
VCANH = 0 V; VCC = 5 V
−
−0.25
−
µA
normal operating mode;
VCANL = 14 V; VTXD = 0 V
45
70
100
mA
low power modes;
VCANL = 12 V; VBAT = 12 V
−
0
−
µA
Vdet(CANH) detection threshold
voltage for short-circuit to
battery voltage on
pin CANH
normal operating mode
1.5
1.7
1.85
V
low power modes
1.1
1.8
2.5
V
Vdet(CANL) detection threshold
voltage for short-circuit to
battery voltage on
pin CANL
normal operating mode
6.5
7.3
8
V
on pin CANL
low power modes
2.5
3.2
3.9
V
on pin CANH
low power modes
1.1
1.8
2.5
V
low power modes
0.8
1.4
−
V
IO(CANH)
IO(CANL)
Vth(wake)
output current on
pin CANH
output current on
pin CANL
wake-up threshold voltage
∆Vth(wake) difference of wake-up
threshold voltages
Vse(CANH)
single-ended receiver
threshold voltage on
pin CANH
1999 Feb 11
normal operating mode and
failures 4, 6 and 7
VCC = 5 V
1.5
1.7
1.85
V
VCC = 4.75 to 5.25 V
0.30VCC
0.34VCC
0.37VCC
V
11
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
SYMBOL
Vse(CANL)
PARAMETER
single-ended receiver
threshold voltage on
pin CANL
TJA1054
CONDITIONS
MIN.
TYP.
MAX.
UNIT
normal operating mode and
failures 3 and 3a
VCC = 5 V
3.15
3.3
3.45
V
VCC = 4.75 to 5.25 V
0.63VCC
0.66VCC
0.69VCC
V
Pins RTH and RTL
Rsw(RTL)
switch-on resistance
normal operating mode;
between pin RTL and VCC IO < 10 mA
−
50
100
Ω
Rsw(RTH)
switch-on resistance
between pin RTH and
ground
−
50
100
Ω
VO(RTH)
output voltage on pin RTH low power modes; IO = 1 mA
−
0.7
1.0
V
normal operating mode;
IO < 10 mA
IO(RTL)
output current on pin RTL
−1.25
−0.65
−0.3
mA
Ipu(RTL)
pull-up current on pin RTL normal operating mode and
failures 4, 6 and 7
−
75
−
µA
Ipd(RTH)
pull-down current on
pin RTH
normal operating mode and
failures 3 and 3a
−
75
−
µA
for shutdown
155
165
180
°C
low power modes; VRTL = 0 V
Thermal shutdown
Tj
junction temperature
1999 Feb 11
12
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
TIMING CHARACTERISTICS
VCC = 4.75 to 5.25 V; VBAT = 5 to 27 V; VSTB = VCC; Tamb = −40 to +125 °C; unless otherwise specified. All voltages are
defined with respect to ground. Positive currents flow into the IC. All parameters are guaranteed over the temperature
range by design, but only 100% tested at 25 °C.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
tt(r-d)
CANL and CANH output
transition time for
recessive-to-dominant
10 to 90%;
C1 = 10 nF; C2 = 0; R1 = 100 Ω;
see Fig.5
0.35
0.60
−
µs
tt(d-r)
CANL and CANH output
transition time for
dominant-to-recessive
10 to 90%;
C1 = 1 nF; C2 = 0; R1 = 100 Ω;
see Fig.5
0.2
0.3
−
µs
tPD(L)
propagation delay TXD to
RXD (LOW)
no failures and failures 1, 2, 5, 6a;
see Figs 4 and 5
C1 = 1 nF; C2 = 0; R1 = 100 Ω
−
0.75
1.35
µs
C1 = C2 = 3.3 nF; R1 = 100 Ω
−
1
1.75
µs
C1 = 1 nF; C2 = 0; R1 = 100 Ω
−
0.85
1.4
µs
C1 = C2 = 3.3 nF; R1 = 100 Ω
−
1.1
1.7
µs
C1 = 1 nF; C2 = 0; R1 = 100 Ω
−
1.2
1.9
µs
C1 = C2 = 3.3 nF; R1 = 100 Ω
−
2.5
3.3
µs
C1 = 1 nF; C2 = 0; R1 = 100 Ω
−
1.1
1.7
µs
C1 = C2 = 3.3 nF; R1 = 100 Ω
−
1.5
2.2
µs
failures 3, 3a, 4, 6 and 7;
see Figs 4 and 5
tPD(H)
propagation delay TXD to
RXD (HIGH)
no failures and failures 1, 2, 5, 6a;
see Figs 4 and 5
failures 3, 3a, 4, 6 and 7;
see Figs 4 and 5
tCANH(min)
minimum dominant time for
wake-up on pin CANH
low power modes; VBAT = 12 V
7
−
38
µs
tCANL(min)
minimum dominant time for
wake-up on pin CANL
low power modes; VBAT = 12 V
7
−
38
µs
tWAKE(min)
minimum time on pin WAKE
low power modes; VBAT = 12 V;
for wake-up after receiving a falling
or rising edge
7
−
38
µs
tdet
failure detection time
normal mode
failure 3 and 3a
1.6
−
8.0
ms
failure 4, 6 and 7
0.3
−
1.6
ms
failure 3 and 3a
1.6
−
8.0
ms
failure 4 and 7
0.1
−
1.6
ms
low power modes; VBAT = 12 V
1999 Feb 11
13
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
SYMBOL
trec
TJA1054
PARAMETER
failure recovery time
CONDITIONS
MIN.
TYP.
MAX.
UNIT
normal mode
failure 3 and 3a
0.3
−
1.6
ms
failure 4 and 7
7
−
38
µs
failure 6
125
−
750
µs
0.3
−
1.6
ms
5
−
50
µs
0.75
−
4
ms
failure detection
(pin ERR becomes LOW)
−
4
−
failure recovery
−
4
−
low power modes; VBAT = 12 V
failures 3, 3a, 4 and 7
th(min)
minimum hold time of goto-sleep
command
tdis(TXD)
disable time of TXD permanent
dominant timer
normal mode; VTXD = 0 V
∆pc
pulse-count difference between
CANH and CANL
normal mode and
failures 1, 2, 5 and 6a
handbook, full pagewidth
VCC
VTXD
0V
VCANL
5V
3.6 V
1.4 V
VCANH
0V
2.2 V
−3.2 V
−5 V
Vdiff
VRXD
0.7VCC
0.3VCC
tPD(H)
tPD(L)
Vdiff = VCANH − VCANL.
Fig.4 Timing diagram for dynamic characteristics.
1999 Feb 11
14
MGL424
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
TEST AND APPLICATION INFORMATION
+5 V
handbook, full pagewidth
INH
WAKE
TXD
STB
EN
RXD
VCC
BAT
1
14
10
7
8
2
12
RTH
R1
CANL
TJA1054
5
C2
11
6
9
3
13
20 pF
C1
CANH
RTL
R1
4
GND
C1
ERR
MGL423
For testing, the 100 Ω termination resistors are not connected to RTH or RTL because minimum 500 Ω per transceiver is allowed.
Fig.5 Test circuit for dynamic characteristics.
+12 V
handbook, full pagewidth
+5 V
10 µF
INH
WAKE
TXD
STB
EN
RXD
1
10
7
8
125 Ω
RTH
1 nF
511 Ω
2
12
5
CANL
1 nF
TJA1054
11
6
CANH
511 Ω
9
3
13
20 pF
VCC
BAT
14
GND
4
1 nF
RTL
125 Ω
1 nF
ERR
MGL426
The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a and 3b.
Fig.6 Test circuit for automotive transients.
1999 Feb 11
15
GENERATOR
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
VBAT
handbook, full pagewidth
BATTERY
VDD
P8xC592/P8xCE598
+5 V
CAN CONTROLLER
+5 V
CTX0
CRXO
TXD
WAKE
2
7
Px.x
RXD
Px.x
STB
3
Px.x
ERR
5
4
EN
INH
6
1
14
TJA1054
10
CAN TRANSCEIVER
13
8
11
RTH
12
CANH
CANL
BAT
VCC
GND
100 nF
9
RTL
CAN BUS LINE
MGL425
Fig.7 Application diagram.
1999 Feb 11
16
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
PACKAGE OUTLINE
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.010 0.057
0.004 0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.050
0.028
0.024
0.01
0.01
0.004
0.028
0.012
inches 0.069
0.244
0.039
0.041
0.228
0.016
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06S
MS-012AB
1999 Feb 11
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-23
97-05-22
17
o
8
0o
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
SOLDERING
Introduction to soldering surface mount packages
• For packages with leads on two sides and a pitch (e):
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Feb 11
18
Philips Semiconductors
Preliminary specification
Fault-tolerant CAN transceiver
TJA1054
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, SQFP
not suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not
PLCC(3),
SO, SOJ
suitable
suitable(2)
suitable
suitable
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Feb 11
19
Philips Semiconductors – a worldwide company
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For all other countries apply to: Philips Semiconductors,
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Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1999
SCA62
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
285002/00/01/pp20
Date of release: 1999 Feb 11
Document order number:
9397 750 03636