74AUP1G19 Low-power 1-of-2 decoder/demultiplexer Rev. 01 — 13 August 2008 Product data sheet 1. General description The 74AUP1G19 provides a 1-of-2 decoder/demultiplexer with a common output enable. It buffers the data on input pin A and passes it either to output pin 1Y (true) or 2Y (complement), depending on whether the state of the enable input pin E is LOW or HIGH, respectively. Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features n Wide supply voltage range from 0.8 V to 3.6 V n High noise immunity n Complies with JEDEC standards: u JESD8-12 (0.8 V to 1.3 V) u JESD8-11 (0.9 V to 1.65 V) u JESD8-7 (1.2 V to 1.95 V) u JESD8-5 (1.8 V to 2.7 V) u JESD8-B (2.7 V to 3.6 V) n ESD protection: u HBM JESD22-A114E exceeds 5000 V u MM JESD22-A115-A exceeds 200 V u CDM JESD22-C101-C exceeds 1000 V n Low static power consumption; ICC = 0.9 µA (maximum) n Latch-up performance exceeds 100 mA per JESD 78 Class II n Inputs accept voltages up to 3.6 V n Low noise overshoot and undershoot < 10 % of VCC n IOFF circuitry provides partial Power-down mode operation n Multiple package options n Specified from −40 °C to +85 °C and −40 °C to +125 °C 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AUP1G19GW −40 °C to +125 °C SC-88 plastic surface-mounted package; 6 leads SOT363 74AUP1G19GM −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 × 1.45 × 0.5 mm 74AUP1G19GF −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; SOT891 6 terminals; body 1 × 1 × 0.5 mm 4. Marking Table 2. Marking Type number Marking code 74AUP1G19GW pY 74AUP1G19GM pY 74AUP1G19GF pY 5. Functional diagram 1 A 3 E 1Y 6 2Y 4 mnb126 Fig 1. Logic symbol 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 2 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer 6. Pinning information 6.1 Pinning 74AUP1G19 74AUP1G19 A 1 6 A 1 6 1Y GND 2 5 VCC 1Y GND 2 5 VCC E 3 4 2Y E 3 4 2Y A 1 6 1Y GND 2 5 VCC E 3 4 2Y 001aai073 001aai074 Transparent top view Transparent top view 001aai072 Fig 2. 74AUP1G19 Pin configuration SOT363 (SC-88) Fig 3. Pin configuration SOT886 (XSON6) Fig 4. Pin configuration SOT891 (XSON6) 6.2 Pin description Table 3. Pin description Symbol Pin Description A 1 data input GND 2 ground (0 V) E 3 enable input (active LOW) 2Y 4 data output (complement) VCC 5 supply voltage 1Y 6 data output (true) 7. Functional description Table 4. Function table[1] Input Output E A 1Y 2Y L L L H L H H L H L H H H H H H [1] H = HIGH voltage level; L = LOW voltage level. 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 3 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current Conditions VI < 0 V [1] VO > VCC or VO < 0 V VO output voltage Active mode and Power-down mode VO = 0 V to VCC [1] Min Max Unit −0.5 +4.6 V −50 - mA −0.5 +4.6 V - ±50 mA −0.5 +4.6 V IO output current - ±20 mA ICC supply current - 50 mA IGND ground current −50 - mA Tstg storage temperature −65 +150 °C - 250 mW total power dissipation Ptot Tamb = −40 °C to +125 °C [2] [1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For SC-88 packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K. 9. Recommended operating conditions Table 6. Operating conditions Symbol Parameter VCC supply voltage VI input voltage VO output voltage Tamb ambient temperature ∆t/∆V input transition rise and fall rate Conditions Max Unit 0.8 3.6 V 0 3.6 V Active mode 0 VCC V Power-down mode; VCC = 0 V 0 3.6 V −40 +125 °C 0 200 ns/V VCC = 0.8 V to 3.6 V 74AUP1G19_1 Product data sheet Min © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 4 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit Tamb = 25 °C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VCC = 0.8 V 0.70 × VCC - - V VCC = 0.9 V to 1.95 V 0.65 × VCC - - V VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.30 × VCC V VCC = 0.9 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V IO = −20 µA; VCC = 0.8 V to 3.6 V VCC − 0.1 - - V IO = −1.1 mA; VCC = 1.1 V 0.75 × VCC - - V IO = −1.7 mA; VCC = 1.4 V 1.11 - V VI = VIH or VIL - IO = −1.9 mA; VCC = 1.65 V 1.32 - - V IO = −2.3 mA; VCC = 2.3 V 2.05 - - V IO = −3.1 mA; VCC = 2.3 V 1.9 - - V IO = −2.7 mA; VCC = 3.0 V 2.72 - - V IO = −4.0 mA; VCC = 3.0 V 2.6 - - V IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.1 V IO = 1.1 mA; VCC = 1.1 V - - 0.3 × VCC V VI = VIH or VIL IO = 1.7 mA; VCC = 1.4 V - - 0.31 V IO = 1.9 mA; VCC = 1.65 V - - 0.31 V IO = 2.3 mA; VCC = 2.3 V - - 0.31 V IO = 3.1 mA; VCC = 2.3 V - - 0.44 V IO = 2.7 mA; VCC = 3.0 V - - 0.31 V IO = 4.0 mA; VCC = 3.0 V - - 0.44 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - ±0.1 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.2 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.2 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 0.5 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 40 µA CI input capacitance VCC = 0 V to 3.6 V; VI = GND or VCC - 0.8 - pF CO output capacitance VO = GND; VCC = 0 V - 1.7 - pF 74AUP1G19_1 Product data sheet [1] © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 5 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 0.8 V Typ Max Unit 0.70 × VCC - - V VCC = 0.9 V to 1.95 V 0.65 × VCC - - V VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.30 × VCC V VCC = 0.9 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V Tamb = −40 °C to +85 °C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VI = VIH or VIL IO = −20 µA; VCC = 0.8 V to 3.6 V VCC − 0.1 - - V IO = −1.1 mA; VCC = 1.1 V 0.7 × VCC - - V IO = −1.7 mA; VCC = 1.4 V 1.03 - - V IO = −1.9 mA; VCC = 1.65 V 1.30 - - V IO = −2.3 mA; VCC = 2.3 V 1.97 - - V IO = −3.1 mA; VCC = 2.3 V 1.85 - - V IO = −2.7 mA; VCC = 3.0 V 2.67 - - V IO = −4.0 mA; VCC = 3.0 V 2.55 - - V IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.1 V IO = 1.1 mA; VCC = 1.1 V - - 0.3 × VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.37 V VI = VIH or VIL IO = 1.9 mA; VCC = 1.65 V - - 0.35 V IO = 2.3 mA; VCC = 2.3 V - - 0.33 V IO = 3.1 mA; VCC = 2.3 V - - 0.45 V IO = 2.7 mA; VCC = 3.0 V - - 0.33 V - - 0.45 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V IO = 4.0 mA; VCC = 3.0 V - - ±0.5 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.5 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.6 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 0.9 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 50 µA 74AUP1G19_1 Product data sheet [1] © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 6 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 0.8 V Typ Max Unit 0.75 × VCC - - V VCC = 0.9 V to 1.95 V 0.70 × VCC - - V VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.25 × VCC V VCC = 0.9 V to 1.95 V - - 0.30 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V Tamb = −40 °C to +125 °C HIGH-level input voltage VIH LOW-level input voltage VIL VOH HIGH-level output voltage LOW-level output voltage VOL VI = VIH or VIL IO = −20 µA; VCC = 0.8 V to 3.6 V VCC − 0.11 - - V IO = −1.1 mA; VCC = 1.1 V 0.6 × VCC - - V IO = −1.7 mA; VCC = 1.4 V 0.93 - - V IO = −1.9 mA; VCC = 1.65 V 1.17 - - V IO = −2.3 mA; VCC = 2.3 V 1.77 - - V IO = −3.1 mA; VCC = 2.3 V 1.67 - - V IO = −2.7 mA; VCC = 3.0 V 2.40 - - V IO = −4.0 mA; VCC = 3.0 V 2.30 - - V IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.11 V IO = 1.1 mA; VCC = 1.1 V - - 0.33 × VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.41 VI = VIH or VIL V IO = 1.9 mA; VCC = 1.65 V - - 0.39 V IO = 2.3 mA; VCC = 2.3 V - - 0.36 V IO = 3.1 mA; VCC = 2.3 V - - 0.50 V IO = 2.7 mA; VCC = 3.0 V - - 0.36 V - - 0.50 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V IO = 4.0 mA; VCC = 3.0 V - - ±0.75 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.75 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.75 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 1.4 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 75 µA [1] [1] One input at VCC − 0.6 V, other input at VCC or GND. 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 7 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6. Symbol Parameter Tamb = 25 °C Conditions Tamb =−40 °C to +125 °C Unit Min Typ[1] Max Min Max (85 °C) Max (125 °C) - 15.9 - - - - VCC = 1.1 V to 1.3 V 2.3 5.3 11.5 2.1 11.9 12.0 ns VCC = 1.4 V to 1.6 V 2.1 3.8 6.8 2.0 7.5 7.8 ns VCC = 1.65 V to 1.95 V 1.6 3.1 5.4 1.5 6.1 6.4 ns VCC = 2.3 V to 2.7 V 1.4 2.3 4.0 1.2 4.2 4.5 ns 1.3 2.0 3.4 1.0 3.8 4.1 ns - 17.8 - - - - ns VCC = 1.1 V to 1.3 V 2.4 5.8 11.6 2.1 12.0 12.1 ns VCC = 1.4 V to 1.6 V 2.0 4.2 6.9 1.9 7.5 7.8 ns VCC = 1.65 V to 1.95 V 1.6 3.4 5.6 1.5 6.2 6.5 ns VCC = 2.3 V to 2.7 V 1.4 2.6 4.0 1.3 4.5 4.8 ns VCC = 3.0 V to 3.6 V 1.3 2.2 3.4 1.2 3.7 3.9 ns - 18.9 - - - - ns VCC = 1.1 V to 1.3 V 2.5 6.2 13.8 2.5 13.9 14.1 ns VCC = 1.4 V to 1.6 V 2.3 4.5 8.2 2.1 8.5 8.9 ns VCC = 1.65 V to 1.95 V 2.1 3.7 6.3 2.0 6.8 7.2 ns VCC = 2.3 V to 2.7 V 1.7 2.9 4.7 1.6 5.0 5.3 ns 1.6 2.6 4.0 1.4 4.4 4.7 ns - 21.0 - - - - ns VCC = 1.1 V to 1.3 V 2.6 6.7 13.4 2.5 13.9 14.1 ns VCC = 1.4 V to 1.6 V 2.3 4.8 8.2 2.1 8.8 9.1 ns VCC = 1.65 V to 1.95 V 2.1 4.0 6.4 1.9 7.0 7.3 ns VCC = 2.3 V to 2.7 V 1.8 3.1 4.7 1.6 5.1 5.5 ns VCC = 3.0 V to 3.6 V 1.6 2.8 4.2 1.4 4.4 4.7 ns CL = 5 pF tpd propagation delay A to nY; see Figure 5 [2] VCC = 0.8 V VCC = 3.0 V to 3.6 V E to nY; see Figure 5 ns [2] VCC = 0.8 V CL = 10 pF tpd propagation delay A to nY; see Figure 5 [2] VCC = 0.8 V VCC = 3.0 V to 3.6 V E to nY; see Figure 5 VCC = 0.8 V [2] 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 8 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6. Symbol Parameter Tamb = 25 °C Conditions Tamb =−40 °C to +125 °C Unit Min Typ[1] Max Min Max (85 °C) Max (125 °C) - 21.8 - - - - ns VCC = 1.1 V to 1.3 V 3.0 7.0 15.2 2.7 15.8 16.1 ns VCC = 1.4 V to 1.6 V 2.8 5.0 9.0 2.5 9.8 10.2 ns VCC = 1.65 V to 1.95 V 2.3 4.2 7.0 2.2 7.8 8.2 ns VCC = 2.3 V to 2.7 V 2.1 3.4 5.3 1.9 5.6 6.0 ns 1.9 3.0 4.6 1.7 5.2 5.4 ns - 24.2 - - - - ns VCC = 1.1 V to 1.3 V 3.0 7.5 15.1 2.8 15.7 16.0 ns VCC = 1.4 V to 1.6 V 2.8 5.4 9.1 2.5 10.0 10.4 ns VCC = 1.65 V to 1.95 V 2.3 4.5 7.2 2.2 8.0 8.4 ns VCC = 2.3 V to 2.7 V 2.1 3.6 5.4 2.0 5.8 6.2 ns VCC = 3.0 V to 3.6 V 1.9 3.2 4.7 1.8 5.1 5.4 ns - 30.4 - - - - ns VCC = 1.1 V to 1.3 V 3.6 9.2 20.5 3.6 21.3 21.7 ns VCC = 1.4 V to 1.6 V 3.2 6.6 11.5 3.3 12.8 13.4 ns VCC = 1.65 V to 1.95 V 3.1 5.5 9.5 3.0 10.0 10.6 ns VCC = 2.3 V to 2.7 V 2.9 4.6 6.3 2.6 7.2 7.7 ns 2.7 4.2 5.9 2.5 7.0 7.4 ns CL = 15 pF tpd propagation delay A to nY; see Figure 5 [2] VCC = 0.8 V VCC = 3.0 V to 3.6 V E to nY; see Figure 5 [2] VCC = 0.8 V CL = 30 pF tpd propagation delay A to nY; see Figure 5 [2] VCC = 0.8 V VCC = 3.0 V to 3.6 V E to nY; see Figure 5 VCC = 0.8 V [2] - 33.6 - - - - ns VCC = 1.1 V to 1.3 V 3.6 9.8 20.0 3.5 20.9 21.3 ns VCC = 1.4 V to 1.6 V 3.2 7.0 11.6 3.3 12.8 13.5 ns VCC = 1.65 V to 1.95 V 3.1 5.8 9.3 3.0 10.3 10.9 ns VCC = 2.3 V to 2.7 V 2.9 4.7 6.8 2.7 7.4 7.9 ns VCC = 3.0 V to 3.6 V 2.7 4.3 6.0 2.5 7.0 7.4 ns 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 9 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6. Symbol Parameter Tamb = 25 °C Conditions Tamb =−40 °C to +125 °C Unit Min Typ[1] Max Min Max (85 °C) Max (125 °C) VCC = 0.8 V - 5.8 - - - - pF VCC = 1.1 V to 1.3 V - 5.9 - - - - pF VCC = 1.4 V to 1.6 V - 5.9 - - - - pF VCC = 1.65 V to 1.95 V - 6.0 - - - - pF VCC = 2.3 V to 2.7 V - 6.8 - - - - pF VCC = 3.0 V to 3.6 V - 7.7 - - - - pF CL = 5 pF, 10 pF, 15 pF and 30 pF power dissipation capacitance CPD fi = 1 MHz; VI = GND to VCC [3] [1] All typical values are measured at nominal VCC. [2] tpd is the same as tPLH and tPHL. [3] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. 12. Waveforms VI VM A, E input VM GND t PHL t PLH VOH nY output VM VM mnb127 VOL Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage drop that occur with the output load. Fig 5. Table 9. The data input (A or E) to output (nY) propagation delays Measurement points Supply voltage Output Input VCC VM VM VI tr = tf 0.8 V to 3.6 V 0.5 × VCC 0.5 × VCC VCC ≤ 3.0 ns 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 10 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer VCC VEXT 5 kΩ G VI VO DUT RT CL RL 001aac521 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 6. Table 10. Load circuit for measuring switching times Test data Supply voltage Load VEXT VCC CL RL tPLH, tPHL 0.8 V to 3.6 V 5 pF, 10 pF, 15 pF and 30 pF 1 MΩ open 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 11 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer 13. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT363 Fig 7. JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Package outline SOT363 (SC-88) 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 12 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× (2) L L1 e 6 5 4 e1 e1 6× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 1.5 1.4 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 Fig 8. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 MO-252 Package outline SOT886 (XSON6) 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 13 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm 1 SOT891 b 3 2 4× (1) L L1 e 6 5 4 e1 e1 6× A (1) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 max b D E e e1 L L1 mm 0.5 0.04 0.20 0.12 1.05 0.95 1.05 0.95 0.55 0.35 0.35 0.27 0.40 0.32 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 05-04-06 07-05-15 SOT891 Fig 9. EUROPEAN PROJECTION Package outline SOT891 (XSON6) 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 14 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor TTL Transistor Transistor Logic HBM Human Body Model ESD ElectroStatic Discharge MM Machine Model CDM Charged Device Model 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AUP1G19_1 20080813 Product data sheet - - 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 15 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. 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A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AUP1G19_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 13 August 2008 16 of 17 74AUP1G19 NXP Semiconductors Low-power 1-of-2 decoder/demultiplexer 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 13 August 2008 Document identifier: 74AUP1G19_1