74AUP2G80 Low-power dual D-type flip-flop; positive-edge trigger Rev. 04 — 2 June 2008 Product data sheet 1. General description The 74AUP2G80 provides the dual positive-edge triggered D-type flip-flop. Information on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock pulse. The input pin D must be stable one setup time prior to the LOW-to-HIGH clock transition for predictable operation. Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down. 2. Features n Wide supply voltage range from 0.8 V to 3.6 V n High noise immunity n Complies with JEDEC standards: u JESD8-12 (0.8 V to 1.3 V) u JESD8-11 (0.9 V to 1.65 V) u JESD8-7 (1.2 V to 1.95 V) u JESD8-5 (1.8 V to 2.7 V) u JESD8-B (2.7 V to 3.6 V) n ESD protection: u HBM JESD22-A114E Class 3A exceeds 5000 V u MM JESD22-A115-A exceeds 200 V u CDM JESD22-C101C exceeds 1000 V n Low static power consumption; ICC = 0.9 µA (maximum) n Latch-up performance exceeds 100 mA per JESD78 Class II n Inputs accept voltages up to 3.6 V n Low noise overshoot and undershoot < 10 % of VCC n IOFF circuitry provides partial Power-down mode operation n Multiple package options n Specified from −40 °C to +85 °C and −40 °C to +125 °C 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AUP2G80DC −40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm 74AUP2G80GT −40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; SOT833-1 8 terminals; body 1 × 1.95 × 0.5 mm 74AUP2G80GD −40 °C to +125 °C XSON8U plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; UTLP based; body 3 × 2 × 0.5 mm 74AUP2G80GM −40 °C to +125 °C XQFN8U plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 × 1.6 × 0.5 mm SOT902-1 4. Marking Table 2. Marking codes Type number Marking code 74AUP2G80DC p80 74AUP2G80GT p80 74AUP2G80GD p80 74AUP2G80GM p80 5. Functional diagram 1D D 1Q 1CP CP 2D 2Q D 2CP CP 001aah894 001aah893 Fig 1. Logic symbol Fig 2. IEC logic symbol 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 2 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger CP C C D C C TG TG C C Fig 3. Q C C TG TG C C mna651 Logic diagram (one flip-flop) 6. Pinning information 6.1 Pinning 74AUP2G80 1CP 1 8 VCC 1D 2 7 1Q 2Q 3 6 2D GND 4 5 2CP 74AUP2G80 1CP 1 8 VCC 1D 2 7 1Q 2Q 3 6 2D GND 4 5 2CP 001aaf309 Transparent top view 001aaf308 Fig 4. Pin configuration SOT765-1 (VSSOP8) Fig 5. Pin configuration SOT833-1 (XSON8) 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 3 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger 74AUP2G80 1 VCC 1D 2 7 1Q 2D 2Q 3 6 2D 2CP GND 4 5 2CP 1CP 2 6 1D 3 5 2Q 4 8 7 GND 1 8 1Q 74AUP2G80 1CP VCC terminal 1 index area 001aai216 Transparent top view Transparent top view Fig 6. 001aaf310 Pin configuration SOT996-2 (XSON8U) Fig 7. Pin configuration SOT902-1 (XQFN8U) 6.2 Pin description Table 3. Symbol Pin description Pin Description SOT765-1, SOT833-1 and SOT996-2 SOT902-1 1CP, 2CP 1, 5 7, 3 clock input 1D, 2D 2, 6 6, 2 data input GND 4 4 ground (0 V) 1Q, 2Q 7, 3 1, 5 data output VCC 8 8 supply voltage 7. Functional description Table 4. Function table[1] Input Output nCP nD nQ ↑ L H ↑ H L L X q [1] H = HIGH voltage level; L = LOW voltage level; ↑ = LOW-to-HIGH CP transition; X = don’t care; q = lower case letter indicates the state of referenced input, one setup time prior to the LOW-to-HIGH CP transition. 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 4 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current Conditions VI < 0 V [1] VO > VCC or VO < 0 V [1] Min Max Unit −0.5 +4.6 V −50 - mA −0.5 +4.6 V - ±50 mA −0.5 +4.6 V VO output voltage Active mode and Power-down mode IO output current VO = 0 V to VCC - ±20 mA ICC supply current - +50 mA IGND ground current −50 - mA Tstg storage temperature −65 +150 °C - 250 mW total power dissipation Ptot Tamb = −40 °C to +125 °C [2] [1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For VSSOP8 packages: above 110 °C the value of Ptot derates linearly with 8.0 mW/K. For XSON8, XSON8U and XQFN8U packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K. 9. Recommended operating conditions Table 6. Operating conditions Symbol Parameter VCC supply voltage VI input voltage VO output voltage Tamb ambient temperature ∆t/∆V input transition rise and fall rate Conditions Max Unit 0.8 3.6 V 0 3.6 V Active mode 0 VCC V Power-down mode; VCC = 0 V 0 3.6 V −40 +125 °C - 200 ns/V VCC = 0.8 V to 3.6 V 74AUP2G80_4 Product data sheet Min © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 5 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit Tamb = 25 °C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VCC = 0.8 V 0.70 × VCC - - V VCC = 0.9 V to 1.95 V 0.65 × VCC - - V VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.30 × VCC V VCC = 0.9 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V IO = −20 µA; VCC = 0.8 V to 3.6 V VCC − 0.1 - - V IO = −1.1 mA; VCC = 1.1 V 0.75 × VCC - - V IO = −1.7 mA; VCC = 1.4 V 1.11 - V VI = VIH or VIL - IO = −1.9 mA; VCC = 1.65 V 1.32 - - V IO = −2.3 mA; VCC = 2.3 V 2.05 - - V IO = −3.1 mA; VCC = 2.3 V 1.9 - - V IO = −2.7 mA; VCC = 3.0 V 2.72 - - V IO = −4.0 mA; VCC = 3.0 V 2.6 - - V IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.1 V IO = 1.1 mA; VCC = 1.1 V - - 0.3 × VCC V VI = VIH or VIL IO = 1.7 mA; VCC = 1.4 V - - 0.31 V IO = 1.9 mA; VCC = 1.65 V - - 0.31 V IO = 2.3 mA; VCC = 2.3 V - - 0.31 V IO = 3.1 mA; VCC = 2.3 V - - 0.44 V IO = 2.7 mA; VCC = 3.0 V - - 0.31 V IO = 4.0 mA; VCC = 3.0 V - - 0.44 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - ±0.1 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.2 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.2 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 0.5 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 40 µA CI input capacitance VCC = 0 V to 3.6 V; VI = GND or VCC - 0.6 - pF CO output capacitance VO = GND; VCC = 0 V - 1.3 - pF 74AUP2G80_4 Product data sheet [1] © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 6 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 0.8 V Typ Max Unit 0.70 × VCC - - V VCC = 0.9 V to 1.95 V 0.65 × VCC - - V VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.30 × VCC V VCC = 0.9 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V Tamb = −40 °C to +85 °C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VI = VIH or VIL IO = −20 µA; VCC = 0.8 V to 3.6 V VCC − 0.1 - - V IO = −1.1 mA; VCC = 1.1 V 0.7 × VCC - - V IO = −1.7 mA; VCC = 1.4 V 1.03 - - V IO = −1.9 mA; VCC = 1.65 V 1.30 - - V IO = −2.3 mA; VCC = 2.3 V 1.97 - - V IO = −3.1 mA; VCC = 2.3 V 1.85 - - V IO = −2.7 mA; VCC = 3.0 V 2.67 - - V IO = −4.0 mA; VCC = 3.0 V 2.55 - - V IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.1 V IO = 1.1 mA; VCC = 1.1 V - - 0.3 × VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.37 V VI = VIH or VIL IO = 1.9 mA; VCC = 1.65 V - - 0.35 V IO = 2.3 mA; VCC = 2.3 V - - 0.33 V IO = 3.1 mA; VCC = 2.3 V - - 0.45 V IO = 2.7 mA; VCC = 3.0 V - - 0.33 V - - 0.45 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V IO = 4.0 mA; VCC = 3.0 V - - ±0.5 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.5 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.6 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 0.9 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 50 µA 74AUP2G80_4 Product data sheet [1] © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 7 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 0.8 V Typ Max Unit 0.75 × VCC - - V VCC = 0.9 V to 1.95 V 0.70 × VCC - - V VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.25 × VCC V VCC = 0.9 V to 1.95 V - - 0.30 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V Tamb = −40 °C to +125 °C HIGH-level input voltage VIH LOW-level input voltage VIL VOH HIGH-level output voltage LOW-level output voltage VOL VI = VIH or VIL IO = −20 µA; VCC = 0.8 V to 3.6 V VCC − 0.11 - - V IO = −1.1 mA; VCC = 1.1 V 0.6 × VCC - - V IO = −1.7 mA; VCC = 1.4 V 0.93 - - V IO = −1.9 mA; VCC = 1.65 V 1.17 - - V IO = −2.3 mA; VCC = 2.3 V 1.77 - - V IO = −3.1 mA; VCC = 2.3 V 1.67 - - V IO = −2.7 mA; VCC = 3.0 V 2.40 - - V IO = −4.0 mA; VCC = 3.0 V 2.30 - - V IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.11 V IO = 1.1 mA; VCC = 1.1 V - - 0.33 × VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.41 VI = VIH or VIL V IO = 1.9 mA; VCC = 1.65 V - - 0.39 V IO = 2.3 mA; VCC = 2.3 V - - 0.36 V IO = 3.1 mA; VCC = 2.3 V - - 0.50 V IO = 2.7 mA; VCC = 3.0 V - - 0.36 V - - 0.50 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V IO = 4.0 mA; VCC = 3.0 V - - ±0.75 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.75 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.75 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 1.4 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 75 µA [1] [1] One input at VCC − 0.6 V, other input at VCC or GND. 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 8 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V; for test circuit see Figure 10. Symbol Parameter Tamb = 25 °C Tamb = −40 °C to +125 °C Min Typ[1] Max Min Max Min Max (85 °C) (85 °C) (125 °C) (125 °C) - 20.9 - VCC = 1.1 V to 1.3 V 2.9 6.0 VCC = 1.4 V to 1.6 V 1.9 4.2 VCC = 1.65 V to 1.95 V 1.7 VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V Conditions Unit CL = 5 pF tpd fmax propagation nCP to nQ; see Figure 8 delay VCC = 0.8 V maximum frequency [2] - - - - ns 12.9 2.6 7.6 2.0 14.3 2.6 15.7 ns 8.9 2.0 9.8 ns 3.4 5.9 1.6 7.0 1.6 7.7 ns 1.4 2.6 4.3 1.2 5.6 1.2 6.2 ns 1.2 2.2 3.6 1.0 4.4 1.0 4.8 ns VCC = 0.8 V - 53 - - - - - MHz VCC = 1.1 V to 1.3 V - 203 - 170 - 170 - MHz VCC = 1.4 V to 1.6 V - 347 - 310 - 300 - MHz VCC = 1.65 V to 1.95 V - 435 - 400 - 390 - MHz VCC = 2.3 V to 2.7 V - 550 - 490 - 480 - MHz VCC = 3.0 V to 3.6 V - 619 - 550 - 510 - MHz - 24.6 - - - - - ns VCC = 1.1 V to 1.3 V 3.3 6.9 14.9 3.0 16.5 3.0 18.2 ns VCC = 1.4 V to 1.6 V 2.6 4.8 8.8 2.3 10.3 2.3 11.3 ns VCC = 1.65 V to 1.95 V 2.3 3.9 6.8 2.0 8.1 2.0 8.9 ns VCC = 2.3 V to 2.7 V 1.9 3.1 5.1 1.7 6.3 1.7 6.9 ns VCC = 3.0 V to 3.6 V 1.8 2.7 4.4 1.4 4.9 1.4 5.4 ns VCC = 0.8 V - 52 - - - - - MHz VCC = 1.1 V to 1.3 V - 192 - 150 - 150 - MHz VCC = 1.4 V to 1.6 V - 324 - 280 - 230 - MHz nCP; see Figure 9 CL = 10 pF tpd fmax propagation nCP to nQ; see Figure 8 delay VCC = 0.8 V maximum frequency [2] nCP; see Figure 9 VCC = 1.65 V to 1.95 V - 421 - 310 - 250 - MHz VCC = 2.3 V to 2.7 V - 486 - 370 - 360 - MHz VCC = 3.0 V to 3.6 V - 550 - 410 - 360 - MHz 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 9 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V; for test circuit see Figure 10. Symbol Parameter Tamb = 25 °C Tamb = −40 °C to +125 °C Min Typ[1] Max Min Max Min Max (85 °C) (85 °C) (125 °C) (125 °C) - 28.2 - - - - - ns VCC = 1.1 V to 1.3 V 3.0 7.6 16.7 3.4 18.6 3.4 20.5 ns VCC = 1.4 V to 1.6 V 3.0 5.3 9.8 2.6 11.5 2.6 12.7 ns VCC = 1.65 V to 1.95 V 2.6 4.4 7.6 2.3 9.1 2.3 10.0 ns VCC = 2.3 V to 2.7 V 2.2 3.5 5.7 2.0 6.9 2.0 7.6 ns VCC = 3.0 V to 3.6 V 1.9 3.1 5.0 1.8 5.5 1.8 6.1 ns VCC = 0.8 V - 50 - - - - - MHz VCC = 1.1 V to 1.3 V - 181 - 120 - 120 - MHz VCC = 1.4 V to 1.6 V - 301 - 190 - 160 - MHz Conditions Unit CL = 15 pF tpd fmax propagation nCP to nQ; see Figure 8 delay VCC = 0.8 V maximum frequency [2] nCP; see Figure 9 VCC = 1.65 V to 1.95 V - 407 - 240 - 190 - MHz VCC = 2.3 V to 2.7 V - 422 - 300 - 270 - MHz VCC = 3.0 V to 3.6 V - 481 - 320 - 300 - MHz - 38.8 - - - - - ns VCC = 1.1 V to 1.3 V 4.9 9.8 20.7 4.4 24.7 4.4 27.2 ns VCC = 1.4 V to 1.6 V 4.0 6.8 12.7 3.5 15.0 3.5 16.5 ns VCC = 1.65 V to 1.95 V 3.5 5.6 9.9 2.2 11.9 2.2 13.1 ns VCC = 2.3 V to 2.7 V 3.1 4.5 7.5 2.8 9.3 2.8 10.2 ns VCC = 3.0 V to 3.6 V 2.9 4.1 6.4 2.7 7.5 2.7 8.3 ns CL = 30 pF tpd fmax propagation nCP to nQ; see Figure 8 delay VCC = 0.8 V maximum frequency [2] nCP; see Figure 9 VCC = 0.8 V - 28 - - - - - MHz VCC = 1.1 V to 1.3 V - 128 - 70 - 70 - MHz VCC = 1.4 V to 1.6 V - 206 - 120 - 110 - MHz VCC = 1.65 V to 1.95 V - 262 - 150 - 120 - MHz VCC = 2.3 V to 2.7 V - 269 - 190 - 170 - MHz VCC = 3.0 V to 3.6 V - 309 - 200 - 190 - MHz CL = 5 pF, 10 pF, 15 pF and 30 pF tsu(H) set-up time HIGH nD to nCP; see Figure 9 VCC = 0.8 V - 2.5 - - - - - ns VCC = 1.1 V to 1.3 V - 0.5 - 2.3 - 2.3 - ns VCC = 1.4 V to 1.6 V - 0.3 - 1.2 - 1.2 - ns VCC = 1.65 V to 1.95 V - 0.3 - 0.8 - 0.8 - ns VCC = 2.3 V to 2.7 V - 0.2 - 0.6 - 0.6 - ns VCC = 3.0 V to 3.6 V - 0.2 - 0.4 - 0.4 - ns 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 10 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V; for test circuit see Figure 10. Symbol Parameter tsu(L) set-up time LOW hold time th pulse width tW Tamb = 25 °C Tamb = −40 °C to +125 °C Min Typ[1] Max Min Max Min Max (85 °C) (85 °C) (125 °C) (125 °C) VCC = 0.8 V - 1.7 - - - - - ns VCC = 1.1 V to 1.3 V - 0.3 - 1.9 - 1.9 - ns VCC = 1.4 V to 1.6 V - 0.2 - 1.3 - 1.3 - ns Conditions nD to nCP; see Figure 9 VCC = 1.65 V to 1.95 V - 0.2 - 1.1 - 1.1 - ns VCC = 2.3 V to 2.7 V - 0.3 - 0.8 - 0.8 - ns VCC = 3.0 V to 3.6 V - 0.3 - 0.7 - 0.7 - ns nD to nCP; see Figure 9 VCC = 0.8 V - −2.1 - - - - - ns VCC = 1.1 V to 1.3 V - −0.4 - 0.1 - 0.1 - ns VCC = 1.4 V to 1.6 V - −0.3 - 0 - 0 - ns VCC = 1.65 V to 1.95 V - −0.2 - 0 - 0 - ns VCC = 2.3 V to 2.7 V - −0.2 - 0 - 0 - ns VCC = 3.0 V to 3.6 V - −0.3 - 0 - 0 - ns nCP HIGH or LOW; see Figure 9 VCC = 0.8 V - 5.2 - - - - - ns VCC = 1.1 V to 1.3 V - 1.0 - 3.0 - 3.0 - ns VCC = 1.4 V to 1.6 V - 0.8 - 2.0 - 2.0 - ns VCC = 1.65 V to 1.95 V - 0.6 - 2.0 - 2.0 - ns VCC = 2.3 V to 2.7 V - 0.5 - 2.0 - 2.0 - ns VCC = 3.0 V to 3.6 V - 0.5 - 2.0 - 2.0 - ns - 1.8 - - - - - pF power f = 1 MHz; VI = GND to VCC dissipation VCC = 0.8 V capacitance VCC = 1.1 V to 1.3 V CPD [3] - 1.8 - - - - - pF VCC = 1.4 V to 1.6 V - 1.9 - - - - - pF VCC = 1.65 V to 1.95 V - 2.0 - - - - - pF VCC = 2.3 V to 2.7 V - 2.4 - - - - - pF VCC = 3.0 V to 3.6 V - 2.9 - - - - - pF [1] All typical values are measured at nominal VCC. [2] tpd is the same as tPLH and tPHL [3] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. 74AUP2G80_4 Product data sheet Unit © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 11 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger 12. Waveforms VI nD input GND VI nCP input VM VM GND tPLH tPHL VM VM VOH nQ output VOL 001aaf311 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 8. The clock input (nCP) to output (nQ) propagation delays VI VM nD input GND th th tsu(L) tsu(H) 1/fmax VI VM nCP input GND tW tPLH tPHL VOH VM nQ output VOL 001aaf312 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 9. Table 9. The clock input (nCP) to output (nQ) propagation delays, clock pulse width, nD to nCP setup and hold times and the nCP maximum frequency Measurement points Supply voltage Output Input VCC VM VM VI tr = tf 0.8 V to 3.6 V 0.5 × VCC 0.5 × VCC VCC ≤ 3.0 ns 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 12 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger VCC VEXT 5 kΩ G VI VO DUT RT CL RL 001aac521 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 10. Load circuit for measuring switching times Table 10. Test data Supply voltage Load VEXT [1] VCC CL RL 0.8 V to 3.6 V 5 pF, 10 pF, 15 pF and 30 pF 5 kΩ or 1 MΩ [1] tPLH, tPHL tPZH, tPHZ tPZL, tPLZ open GND 2 × VCC For measuring enable and disable times RL = 5 kΩ For measuring propagation delays, setup and hold times and pulse width RL = 1 MΩ. 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 13 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger 13. Package outline VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Fig 11. Package outline SOT765-1 (VSSOP8) 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 14 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 12. Package outline SOT833-1 (XSON8) 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 15 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm B D SOT996-2 A A E A1 detail X terminal 1 index area e1 v w b e L1 1 4 8 5 C C A B C M M y y1 C L2 L X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 L2 v w y y1 mm 0.5 0.05 0.00 0.35 0.15 2.1 1.9 3.1 2.9 0.5 1.5 0.5 0.3 0.15 0.05 0.6 0.4 0.1 0.05 0.05 0.1 REFERENCES OUTLINE VERSION IEC SOT996-2 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 13. Package outline SOT996-2 (XSON8U) 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 16 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm B D SOT902-1 A terminal 1 index area E A A1 detail X L1 e e C ∅v M C A B ∅w M C L 4 y1 C y 5 3 metal area not for soldering e1 b 2 6 e1 7 1 terminal 1 index area 8 X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 v w y y1 mm 0.5 0.05 0.00 0.25 0.15 1.65 1.55 1.65 1.55 0.55 0.5 0.35 0.25 0.15 0.05 0.1 0.05 0.05 0.05 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT902-1 --- MO-255 --- EUROPEAN PROJECTION ISSUE DATE 05-11-25 07-11-14 Fig 14. Package outline SOT902-1 (XQFN8U) 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 17 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger 14. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AUP2G80_4 20080602 Product data sheet - 74AUP2G80_3 Modifications: • Added type number 74AUP2G80GD (XSON8U package) 74AUP2G80_3 20080328 Product data sheet - 74AUP2G80_2 74AUP2G80_2 20070801 Product data sheet - 74AUP2G80_1 74AUP2G80_1 20060825 Product data sheet - - 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 18 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AUP2G80_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 2 June 2008 19 of 20 74AUP2G80 NXP Semiconductors Low-power dual D-type flip-flop; positive-edge trigger 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 2 June 2008 Document identifier: 74AUP2G80_4