UJA1079 LIN core system basis chip Rev. 02 — 27 May 2010 Product data sheet 1. General description The UJA1079 core System Basis Chip (SBC) replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a Local Interconnect Network (LIN) interface. The UJA1079 supports the networking applications used to control power and sensor peripherals by using the LIN interface as a local sub-bus. The core SBC contains the following integrated devices: • LIN transceiver compliant with LIN 2.1, LIN 2.0 and SAE J2602, and compatible with LIN 1.3 • Advanced independent watchdog (UJA1079/xx/WD versions) • 250 mA voltage regulator for supplying a microcontroller; extendable with external PNP transistor for increased current capability and dissipation distribution • Serial Peripheral Pnterface (SPI) (full duplex) • 2 local wake-up input ports • Limp home output port In addition to the advantages gained from integrating these common ECU functions in a single package, the core SBC offers an intelligent combination of system-specific functions such as: • Advanced low-power concept • Safe and controlled system start-up behavior • Detailed status reporting on system and sub-system levels The UJA1079 is designed to be used in combination with a microcontroller. The SBC ensures that the microcontroller always starts up in a controlled manner. UJA1079 NXP Semiconductors LIN core system basis chip 2. Features and benefits 2.1 General Contains LIN ECU functions: LIN transceiver Scalable 3.3 V or 5 V voltage regulator delivering up to 250 mA for a microcontroller and peripheral circuitry; an external PNP transistor can be connected for better heat distribution over the PCB Watchdog with Window and Timeout modes and on-chip oscillator Serial Peripheral Interface (SPI) for communicating with the microcontroller ECU power management system Designed for automotive applications: Excellent ElectroMagnetic Compatibility (EMC) performance ±8 kV ElectroStatic Discharge (ESD) protection Human Body Model (HBM) on the LIN bus pin and the wake pins ±6 kV ElectroStatic Discharge (ESD) protection IEC 61000-4-2 on the LIN bus pin and the wake pins ±58 V short-circuit proof LIN bus pin Battery and LIN bus pins are protected against transients in accordance with ISO 7637-3 Small 6.1 mm × 11 mm HTSSOP32 package with low thermal resistance Pb-free; RoHS and dark green compliant 2.2 LIN transceiver LIN 2.1 compliant LIN transceiver Compliant with SAE J2602 Downward compatible with LIN 2.0 and LIN 1.3 Low slope mode for optimized EMC performance Integrated LIN termination diode at pin DLIN 2.3 Power management Wake-up via LIN or local wake pins with wake-up source detection 2 wake pins: WAKE1 and WAKE2 inputs can be switched off to reduce current flow Output signal (WBIAS) to bias the wake pins, selectable sampling time of 16 ms or 64 ms Standby mode with very low standby current and full wake-up capability; V1 active to maintain supply to the microcontroller Sleep mode with very low sleep current and full wake-up capability 2.4 Control and Diagnostic features Safe and predictable behavior under all conditions Programmable watchdog with independent clock source UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 2 of 45 UJA1079 NXP Semiconductors LIN core system basis chip Window, Timeout (with optional cyclic wake-up) and Off modes supported (with automatic re-enable in the event of an interrupt) 16-bit Serial Peripheral Interface (SPI) for configuration, control and diagnosis Global enable output for controlling safety-critical hardware Limp home output (LIMP) for activating application-specific ‘limp home’ hardware in the event of a serious system malfunction Overtemperature shutdown Interrupt output pin; interrupts can be individually configured to signal V1 undervoltage, LIN/local wake-up and cyclic and power-on interrupt events Bidirectional reset pin with variable power-on reset length to support a variety of microcontrollers Software-initiated system reset 2.5 Voltage regulator V1 Scalable voltage regulator for the microcontroller, its peripherals and additional external transceivers ±2 % accuracy for LIN master application ±3 % accuracy for LIN slave application 3.3 V and 5 V versions available Delivers up to 250 mA and can be combined with an external PNP transistor for better heat distribution over the PCB Selectable current threshold at which the external PNP transistor starts to deliver current Undervoltage warning at 90 % of nominal output voltage and undervoltage reset at 90 % or 70 % of nominal output voltage Can operate at VBAT voltages down to 4.5 V (e.g. during cranking), in accordance with ISO7637 pulse 4/4b and ISO16750-2 Stable output under all conditions 3. Ordering information Table 1. Ordering information Type number[1] UJA1079TW/5V0/WD UJA1079TW/3V3/WD UJA1079TW/5V0 Package Name Description Version HTSSOP32 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1 UJA1079TW/3V3 [1] UJA1079TW/5V0xx versions contain a 5 V regulator (V1); UJA1079TW/3V3xx versions contain a 3.3 V regulator (V1); WD versions contain a watchdog. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 3 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 4. Block diagram UJA1079 V1 BAT V1 GND V1 UV EXT. PNP CTRL SCK VEXCTRL VEXCC WBIAS SDI SDO SCSN SYSTEM CONTROLLER WAKE1 WAKE2 INTN RSTN WAKE OSC WDOFF TEMP EN DLIN BAT LIMP LIN TXDL LIN BAT RXDL 015aaa123 Fig 1. Block diagram UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 4 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 5. Pinning information 5.1 Pinning i.c. 1 32 BAT i.c. 2 31 VEXCTRL TXDL 3 30 TEST2 V1 4 29 VEXCC RXDL 5 28 WBIAS RSTN 6 27 i.c. INTN 7 26 DLIN EN 8 SDI 9 25 LIN UJA1079 24 i.c. SDO 10 23 GND SCK 11 22 i.c. SCSN 12 21 i.c. i.c. 13 20 i.c. i.c. 14 19 WAKE2 TEST1 15 18 WAKE1 WDOFF 17 LIMP 16 015aaa124 Fig 2. Pin configuration 5.2 Pin description Table 2. UJA1079_2 Product data sheet Pin description Symbol Pin Description i.c. 1 internally connected; should be left floating i.c. 2 internally connected; should be left floating TXDL 3 LIN transmit data input V1 4 voltage regulator output for the microcontroller (5 V or 3.3 V depending on SBC version) RXDL 5 LIN receive data output RSTN 6 reset input/output to and from the microcontroller INTN 7 interrupt output to the microcontroller EN 8 enable output SDI 9 SPI data input SDO 10 SPI data output SCK 11 SPI clock input SCSN 12 SPI chip select input i.c. 13 internally connected; should be left floating i.c. 14 internally connected; should be left floating TEST1 15 test pin; pin should be connected to ground WDOFF 16 WDOFF pin for deactivating the watchdog LIMP 17 limp home output All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 5 of 45 UJA1079 NXP Semiconductors LIN core system basis chip Table 2. Pin description …continued Symbol Pin Description WAKE1 18 local wake-up input 1 WAKE2 19 local wake-up input 2 i.c. 20 internally connected; should be left floating i.c. 21 internally connected; should be left floating i.c. 22 internally connected; should be left floating GND 23 ground i.c. 24 internally connected; should be left floating LIN 25 LIN bus line DLIN 26 LIN termination resistor connection i.c. 27 internally connected; should be left floating WBIAS 28 control pin for external wake biasing transistor VEXCC 29 current measurement for external PNP transistor; this pin is connected to the collector of the external PNP transistor TEST2 30 test pin; pin should be connected to ground VEXCTRL 31 control pin of the external PNP transistor; this pin is connected to the base of the external PNP transistor BAT 32 battery supply for the SBC The exposed die pad at the bottom of the package allows for better heat dissipation from the SBC via the printed circuit board. The exposed die pad is not connected to any active part of the IC and can be left floating, or can be connected to GND. 6. Functional description The UJA1079 combines the functionality of a LIN transceiver, a voltage regulator and a watchdog (UJA1079/xx/WD versions) in a single, dedicated chip. It handles the power-up and power-down functionality of the ECU and ensures advanced system reliability. The SBC offers wake-up by bus activity, by cyclic wake-up and by the activation of external switches. Additionally, it provides a periodic control signal for pulsed testing of wake-up switches, allowing low-current operation even when the wake-up switches are closed in Standby mode. The LIN transceiver is optimized to be highly flexible with regard to bus topologies. V1, the voltage regulator, is designed to power the ECU's microcontroller, its peripherals and additional external transceivers. An external PNP transistor can be added to improve heat distribution. The watchdog is clocked directly by the on-chip oscillator and can be operated in Window, Timeout and Off modes. 6.1 System Controller 6.1.1 Introduction The system controller manages register configuration and controls the internal functions of the SBC. Detailed device status information is collected and presented to the microcontroller. The system controller also provides the reset and interrupt signals. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 6 of 45 UJA1079 NXP Semiconductors LIN core system basis chip The system controller is a state machine. The SBC operating modes, and how transitions between modes are triggered, are illustrated in Figure 3. These modes are discussed in more detail in the following sections. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 7 of 45 UJA1079 NXP Semiconductors LIN core system basis chip from Standby or Normal V1: OFF limp home = LOW (active) LIN: Off and high resistance watchdog: OFF Off VBAT below power-on threshold Vth(det)pon chip temperature above OTP activatrion threshold Tth(act)otp Overtemp VBAT below power-off threshold Vth(det)poff (from all modes) chip temperature below OTP release threshold Tth(rel)otp V1: OFF LIN: Off and high resistance watchdog: OFF INTN: HIGH VBAT above power-on threshold Vth(det)pon watchdog trigger watchdog overflow or V1 undervoltage Standby V1: ON LIN: Lowpower/Off watchdog: Timeout/Off MC = 00 reset event or MC = 00 MC = 10 or MC = 11 MC = 01 and INTN = HIGH and one wake-up enabled and no wake-up pending wake-up event if enabled Sleep Normal successful watchdog trigger V1: ON LIN: Active/Lowpower watchdog: Window/ Timeout/Off MC = 1x MC = 01 and INTN = HIGH and one wake-up enabled and no wake-up pending V1: OFF LIN: Lowpower/Off watchdog: OFF RSTN: LOW MC = 01 015aaa125 Fig 3. UJA1079 system controller UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 8 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 6.1.2 Off mode The SBC switches to Off mode from all other modes if the battery supply drops below the power-off detection threshold (Vth(det)poff). In Off mode, the voltage regulator is disabled and the bus system is in a high-resistive state. As soon as the battery supply rises above the power-on detection threshold (Vth(det)pon), the SBC goes to Standby mode, and a system reset is executed (reset pulse width of tw(rst), long or short; see Section 6.5.1 and Table 11). 6.1.3 Standby mode The SBC will enter Standby mode: • From Off mode if VBAT rises above the power-on detection threshold (Vth(det)pon) • From Sleep mode on the occurrence of a LIN or local wake-up event • From Overtemp mode if the chip temperature drops below the overtemperature protection release threshold, Tth(rel)otp • From Normal mode if bit MC is set to 00 or a system reset is performed (see Section 6.5) In Standby mode, V1 is switched on. The LIN transceiver will either be in a low-power state (Lowpower mode; STBCL = 1; see Table 6) with bus wake-up detection enabled or completely switched off (Off mode; STBCL = 0) - see Section 6.7.1. The watchdog can be running in Timeout mode or Off mode, depending on the state of the WDOFF pin and the setting of the watchdog mode control bit (WMC) in the WD_and_Status register (Table 4). The SBC will exit Standby mode if: • Normal mode is selected by setting bits MC to 10 or 11 • Sleep mode is selected by setting bits MC to 01 • The chip temperature rises above the OTP activation threshold, Tth(act)otp, causing the SBC to enter Overtemp mode 6.1.4 Normal mode Normal mode is selected from Standby mode by setting bits MC in the Mode_Control register (Table 5) to 10 or 11. In Normal mode, the LIN physical layer (LIN) will be enabled (Active mode; STBCL = 0; see Table 6) or in a low-power state (Lowpower mode; STBCL = 1) with bus wake-up detection active. The SBC will exit Normal mode if: • • • • UJA1079_2 Product data sheet Standby mode is selected by setting bits MC to 00 Sleep mode is selected by setting bits MC to 01 A system reset is generated (see Section 6.1.3; the SBC will enter Standby mode) The chip temperature rises above the OTP activation threshold, Tth(act)otp, causing the SBC to switch to Overtemp mode All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 9 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 6.1.5 Sleep mode Sleep mode is selected from Standby mode or Normal mode by setting bits MC in the Mode_Control register (Table 5) to 01. The SBC will enter Sleep mode providing there are no pending interrupts (INTN = HIGH) or wake-up events and at least one wake-up source is enabled (LIN or WAKE). Any attempt to enter Sleep mode while one of these conditions has not been satisfied will result in a short reset (3.6 ms minimum pulse width; see Section 6.5.1 and Table 11). In Sleep mode, V1 is off and the LIN transceiver will be switched off (Off mode; STBCL = 0; see Table 6) or in a low-power state (Lowpower mode; STBCL = 1) with bus wake-up detection active - see Section 6.7.1). The watchdog is off and the reset pin is LOW. A LIN or local wake-up event will cause the SBC to switch from Sleep mode to Standby mode, generating a (short or long; see Section 6.5.1) system reset. The value of the mode control bits (MC) will be changed to 00 and V1 will be enabled. 6.1.6 Overtemp mode The SBC will enter Overtemp mode from Normal mode or Standby mode when the chip temperature exceeds the overtemperature protection activation threshold, Tth(act)otp. In Overtemp mode, the voltage regulator is switched off and the bus system is in a high-resistive state. When the SBC enters Overtemp mode, the RSTN pin is driven LOW and the limp home control bit, LHC, is set so that the LIMP pin is driven LOW. The chip temperature must drop a hysteresis level below the overtemperature shutdown threshold before the SBC can exit Overtemp mode. After leaving Overtemp mode the SBC enters Standby mode and a system reset is generated (reset pulse width of tw(rst), long or short; see Section 6.5.1 and Table 11). 6.2 SPI 6.2.1 Introduction The Serial Peripheral Interface (SPI) provides the communication link with the microcontroller, supporting multi-slave operations. The SPI is configured for full duplex data transfer, so status information is returned when new control data is shifted in. The interface also offers a read-only access option, allowing registers to be read back by the application without changing the register content. The SPI uses four interface signals for synchronization and data transfer: • • • • SCSN: SPI chip select; active LOW SCK: SPI clock; default level is LOW due to low-power concept SDI: SPI data input SDO: SPI data output; floating when pin SCSN is HIGH Bit sampling is performed on the falling clock edge and data is shifted on the rising clock edge (see Figure 4). UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 10 of 45 UJA1079 NXP Semiconductors LIN core system basis chip SCS SCK 02 01 03 04 15 16 sampled SDI SDO X floating X MSB 14 13 12 01 LSB MSB 14 13 12 01 LSB X floating mce634 Fig 4. SPI timing protocol 6.2.2 Register map The first three bits (A2, A1 and A0) of the message header define the register address. The fourth bit (RO) defines the selected register as read/write or read only. Table 3. UJA1079_2 Product data sheet Register map Address bits 15, 14 and 13 Write access bit 12 = 0 Read/Write access bits 11... 0 000 0 = read/write, 1 = read only WD_and_Status register 001 0 = read/write, 1 = read only Mode_Control register 010 0 = read/write, 1 = read only Int_Control register 011 0 = read/write, 1 = read only Int_Status register All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 11 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 6.2.3 WD_and_Status register Table 4. Bit WD_and_Status register Symbol Access Power-on Description default 15:13 A2, A1, A0 R 000 register address 12 R/W 0 access status RO 0: register set to read/write 1: register set to read only 11 WMC R/W 0 watchdog mode control 0: Normal mode: watchdog in Window mode; Standby mode: watchdog in Timeout mode 1: Normal mode: watchdog in Timeout mode; Standby mode: watchdog in Off mode 10:8 NWP[1] R/W 100 nominal watchdog period 000: 8 ms 001: 16 ms 010: 32 ms 011: 64 ms 100: 128 ms 101: 256 ms 110: 1024 ms 111: 4096 ms 7 WOS/SWR R/W - watchdog off status/software reset 0: WDOFF pin LOW; watchdog mode determined by bit WMC 1: watchdog disabled due to HIGH level on pin WDOFF; results in software reset 6 V1S R - V1 status 0: V1 output voltage above 90 % undervoltage recovery threshold (Vuvr; see Table 10) 1: V1 output voltage below 90 % undervoltage detection threshold (Vuvd; see Table 10) 5 reserved R 1 4 WLS1 R - wake-up 1 status 0: WAKE1 input voltage below switching threshold (Vth(sw)) 1: WAKE1 input voltage above switching threshold (Vth(sw)) 3 WLS2 R - wake-up 2 status 0: WAKE2 input voltage below switching threshold (Vth(sw)) 1: WAKE2 input voltage above switching threshold (Vth(sw)) 2:0 [1] reserved R 000 Bit NWP is set to it’s default value (100) after a reset. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 12 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 6.2.4 Mode_Control register Table 5. Mode_Control register Bit Symbol Access Power-on default 15:13 A2, A1, A0 R 001 register address 12 RO 0 access status R/W Description 0: register set to read/write 1: register set to read only 11:10 MC R/W 00 mode control 00: Standby mode 01: Sleep mode 10: Normal mode 11: Normal mode LHWC[1] 9 R/W 1 limp home warning control 0: no limp home warning 1: limp home warning is set; next reset will activate LIMP output LHC[2] 8 R/W 0 limp home control 0: LIMP pin set floating 1: LIMP pin driven LOW 7 ENC R/W 0 enable control 0: EN pin driven LOW 1: EN pin driven HIGH in Normal mode 6 LSC R/W 0 LIN slope control 0: normal slope, 20 kbit/s 1: low slope, 10.4 kbit/s 5 WBC R/W 0 wake bias control 0: WBIAS floating if WSEn = 0; 16 ms sampling if WSEn = 1 1: WBIAS on if WSEn = 0; 64 ms sampling if WSEn = 1 4 PDC R/W 0 power distribution control 0: V1 threshold current for activating the external PNP transistor; load current rising; Ith(act)PNP = 85 mA; V1 threshold current for deactivating the external PNP transistor; load current falling; Ith(deact)PNP = 50 mA; see Figure 7 1: V1 threshold current for activating the external PNP transistor; load current rising; Ith(act)PNP = 50 mA; V1 threshold current for deactivating the external PNP transistor; load current falling; Ith(deact)PNP = 15 mA; see Figure 7 3:0 reserved R 0000 [1] Bit LHWC is set to 1 after a reset. [2] Bit LHC is set to 1 after a reset, if LHWC was set to 1 prior to the reset. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 13 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 6.2.5 Int_Control register Table 6. Int_Control register Bit Symbol Access Power-on default 15:13 A2, A1, A0 R 010 register address 12 RO 0 access status R/W Description 0: register set to read/write 1: register set to read only 11 V1UIE R/W 0 V1 undervoltage interrupt enable 0: V1 undervoltage warning interrupts cannot be requested 1: V1 undervoltage warning interrupts can be requested 10 reserved R 0 9 STBCL R/W 0 LIN standby control 0: When the SBC is in Normal mode (MC = 1x): LIN is in Active mode. The wake-up flag (visible on RXDL) is cleared regardless of the value of VBAT. When the SBC is in Standby/Sleep mode (MC = 0x): LIN is in Off mode. Bus wake-up detection is disabled. LIN wake-up interrupts cannot be requested. 1: LIN is in Lowpower mode with bus wake-up detection enabled, regardless of the SBC mode (MC = xx). LIN wake-up interrupts can be requested. 8 reserved R 0 7:6 WIC1 R/W 00 wake-up interrupt 1 control 00: wake-up interrupt 1 disabled 01: wake-up interrupt 1 on rising edge 10: wake-up interrupt 1 on falling edge 11: wake-up interrupt 1 on both edges 5:4 WIC2 R/W 00 wake-up interrupt 2 control 00: wake-up interrupt 2 disabled 01: wake-up interrupt 2 on rising edge 10: wake-up interrupt 2 on falling edge 11: wake-up interrupt 2 on both edges 3 reserved R 0 2 RTHC R/W 0 reset threshold control 0: The reset threshold is set to the 90 % V1 undervoltage detection voltage (Vuvd; see Table 10) 1: The reset threshold is set to the 70 % V1 undervoltage detection voltage (Vuvd; see Table 10) 1 WSE1 R/W 0 WAKE1 sample enable 0: sampling continuously 1: sampling of WAKE1 is synchronized with WBIAS (sample rate controlled by WBC) UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 14 of 45 UJA1079 NXP Semiconductors LIN core system basis chip Table 6. Int_Control register Bit Symbol Access Power-on default Description 0 WSE2 R/W WAKE2 sample enable 0 0: sampling continuously 1: sampling of WAKE1 is synchronized with WBIAS (sample rate controlled by WBC) 6.2.6 Int_Status register Int_Status register[1] Table 7. Bit Symbol Access Power-on default 15:13 A2, A1, A0 R 011 register address 12 RO 0 access status R/W Description 0: register set to read/write 1: register set to read only 11 V1UI R/W 0 V1 undervoltage interrupts 0: no V1 undervoltage warning interrupt pending 1: V1 undervoltage warning interrupt pending 10 reserved R 0 9 LWI R/W 0 LIN wake-up interrupt 0: no LIN wake-up interrupt pending 1: LIN wake-up interrupt pending 8 reserved R 0 7 CI R/W 0 cyclic interrupt 0: no cyclic interrupt pending 1: cyclic interrupt pending 6 WI1 R/W 0 wake-up interrupt 1 0: no wake-up interrupt 1 pending 1: wake-up interrupt 1 pending 5 POSI R/W 1 power-on status interrupt 0: no power-on interrupt pending 1: power-on interrupt pending 4 WI2 R/W 0 wake-up interrupt 2 0: no wake-up interrupt 2 pending 1: wake-up interrupt 2 pending 3:0 [1] reserved R 0000 An interrupt can be cleared by writing 1 to the relevant bit in the Int_Status register. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 15 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 6.3 On-chip oscillator The on-chip oscillator provides the timing reference for the on-chip watchdog and the internal timers. The on-chip oscillator is supplied by an internal supply that is connected to VBAT and is independent of V1. 6.4 Watchdog (UJA1079/xx/WD versions) Three watchdog modes are supported: Window, Timeout and Off. The watchdog period is programmed via the NWP control bits in the WD_and_Status register (see Table 4). The default watchdog period is 128 ms. A watchdog trigger event is any write access to the WD_and_Status register. When the watchdog is triggered, the watchdog timer is reset. In watchdog Window mode, a watchdog trigger event within a closed watchdog window (i.e. the first half of the window before ttrig(wd)1) will generate an SBC reset. If the watchdog is triggered before the watchdog timer overflows in Timeout or Window mode, or within the open watchdog window (after ttrig(wd)1 but before ttrig(wd)2), the timer restarts immediately. The following watchdog events result in an immediate system reset: • • • • • the watchdog overflows in Window mode the watchdog is triggered in the first half of the watchdog period in Window mode the watchdog overflows in Timeout mode while a cyclic interrupt (CI) is pending the state of the WDOFF pin changes in Normal mode or Standby mode the watchdog mode control bit (WMC) changes state in Normal mode After a watchdog reset (short reset; see Section 6.5.1 and Table 11), the default watchdog period is selected (NWP = 100). The watchdog can be switched off completely by forcing pin WDOFF HIGH. The watchdog can also be switched off by setting bit WMC to 1 in Standby mode. If the watchdog was turned off by setting WMC, any pending interrupt will re-enable it. Note that the state of bit WMC cannot be changed in Standby mode if an interrupt is pending. Any attempt to change WMC when an interrupt is pending will be ignored. 6.4.1 Watchdog Window behavior The watchdog runs continuously in Window mode. If the watchdog overflows, or is triggered in the first half of the watchdog period (less than ttrig(wd)1 after the start of the watchdog period), a system reset will be performed. Watchdog overflow occurs if the watchdog is not triggered within ttrig(wd)2 after the start of watchdog period. If the watchdog is triggered in the second half of the watchdog period (at least ttrig(wd)1, but not more than ttrig(wd)2, after the start of the watchdog period), the watchdog will be reset. The watchdog is in Window mode when pin WDOFF is LOW, the SBC is in Normal mode and the watchdog mode control bit (WMC) is set to 0. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 16 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 6.4.2 Watchdog Timeout behavior The watchdog runs continuously in Timeout mode. It can be reset at any time by a watchdog trigger. If the watchdog overflows, the cyclic interrupt (CI) bit is set. If a CI is already pending, a system reset is performed. The watchdog is in Timeout mode when pin WDOFF is LOW and: • the SBC is in Standby mode and bit WMC = 0 or • the SBC is in Normal mode and bit WMC = 1 6.4.3 Watchdog Off behavior The watchdog is disabled in this state. The watchdog is in Off mode when: • the SBC is in Off, Overtemp or Sleep modes • the SBC is in Standby mode and bit WMC = 1 • the SBC is in any mode and the WDOFF pin is HIGH 6.5 System reset The following events will cause the SBC to perform a system reset: • V1 undervoltage (reset pulse length selected via external pull-up resistor on RSTN pin) • • • • • • • • An external reset (RSTN forced LOW) Watchdog overflow (Window mode) Watchdog overflow in Timeout mode with cyclic interrupt (CI) pending Watchdog triggered too early in Window mode WMC value changed in Normal mode WDOFF pin state changed SBC goes to Sleep mode (MC set to 01; see Table 5) while INTN is driven LOW SBC goes to Sleep mode (MC set to 01; see Table 5) while STBCL = WIC1 = WIC2 = 0 • SBC goes to Sleep mode (MC set to 01; see Table 5) while wake-up pending • Software reset (SWR = 1) • SBC leaves Overtemp mode (reset pulse length selected via external pull-up resistor on RSTN pin) A watchdog overflow in Timeout mode requests a cyclic interrupt (CI), if a CI is not already pending. The UJA1079 provides three signals for dealing with reset events: • RSTN input/output for performing a global ECU system reset or forcing an external reset • EN pin, a fail-safe global enable output • LIMP pin, a fail-safe limp home output UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 17 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 6.5.1 RSTN pin A system reset is triggered if the bidirectional RSTN pin is forced LOW for at least tfltr by the microcontroller (external reset). A reset pulse is output on RSTN by the SBC when a system reset is triggered internally. The reset pulse width (tw(rst)) is selectable (short or long) if the system reset was generated by a V1 undervoltage event (see Section 6.6.2) or by the SBC leaving Off (VBAT > Vth(det)pon) or Overtemp (temperature < Tth(rel)otp) modes. A short reset pulse is selected by connecting a 900 Ω ±10 % resistor between pins RSTN and V1. If a resistor is not connected, the reset pulse will be long (see Table 11). In all other cases (e.g. watchdog-related reset events) the reset pulse length will be short. 6.5.2 EN output The EN pin can be used to control external hardware, such as power components, or as a general-purpose output when the system is running properly. In Normal and Standby modes, the microcontroller can set the EN control bit (bit ENC in the Mode_Control register; see Table 5) via the SPI interface. Pin EN will be HIGH when ENC = 1 and MC = 10 or 11. A reset event will cause pin EN to go LOW. EN pin behavior is illustrated in Figure 5. mode STANDBY NORMAL STANDBY ENC EN RSTN 015aaa074 Fig 5. Behavior of EN pin 6.5.3 LIMP output The LIMP pin can be used to enable the so called ‘limp home’ hardware in the event of an ECU failure. Detectable failure conditions include SBC overtemperature events, loss of watchdog service, RSTN or V1 clamped LOW and user-initiated or external reset events. The LIMP pin is a battery-related, active-LOW, open-drain output. A system reset will cause the limp home warning control bit (bit LHWC in the Mode_Control register; see Table 5) to be set. If LHWC is already set when the system reset is generated, bit LHC will be set which will force the LIMP pin LOW. The application should clear LHWC after each reset event to ensure the LIMP output is not activated during normal operation. In Overtemp mode, bit LHC is always set and, consequently, the LIMP output is always active. If the application manages to recover from the event that activated the LIMP output, LHC can be cleared to deactivate the LIMP output. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 18 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 6.6 Power supplies 6.6.1 Battery pin (BAT) The SBC contains a single supply pin, BAT. An external diode is needed in series to protect the device against negative voltages. The operating range is from 4.5 V to 28 V. The SBC can handle maximum voltages up to 40 V. If the voltage on pin BAT falls below the power-off detection threshold, Vth(det)poff, the SBC immediately enters Off mode, which means that the voltage regulator and the internal logic are shut down. The SBC leaves Off mode for Standby mode as soon as the voltage rises above the power-on detection threshold, Vth(det)pon. The POSI bit in the Int_Status register is set to 1 when the SBC leaves Off mode. 6.6.2 Voltage regulator V1 Voltage regulator V1 is intended to supply the microcontroller, its periphery and additional transceivers. V1 is supplied by pin BAT and delivers up to 250 mA at 3.3 V or 5 V (depending on the UJA1079 version). To prevent the device overheating at high ambient temperatures or high average currents, an external PNP transistor can be connected as illustrated in Figure 6. In this configuration, the power dissipation is distributed between the SBC and the PNP transistor. Bit PDC in the Mode_Control register (Table 5) is used to regulate how the power dissipation is distributed − if PDC = 0, the PNP transistor will be activated when the load current reaches 85 mA (50 mA if PDC = 1) at Tvj = 150 °C. V1 will continue to deliver 85 mA while the transistor delivers the additional load current (see Figure 7 and Figure 8). VEXCTRL battery VEXCC UJA107x BAT V1 015aaa098 Fig 6. UJA1079_2 Product data sheet External PNP transistor control circuit All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 19 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 250 mA 215 mA 85 mA 50 mA load current Ith(act)PNP = 85 mA (PDC = 0) Ith(deact)PNP = 50 mA (PDC = 0) IV1 165 mA PNP current 015aaa111 Fig 7. V1 and PNP currents at a slow ramping load current of 250 mA (PDC = 0) Figure 7 illustrates how V1 and the PNP transistor combine to supply a slow ramping load current of 250 mA with PDC = 0. Any additional load current requirement will be supplied by the PNP transistor, up to its current limit. If the load current continues to rise, IV1 will increase above the selected PDC threshold (to a maximum of 250 mA). For a fast ramping load current, V1 will deliver the required load current (to a maximum of 250 mA) until the PNP transistor has switched on. Once the transistor has been activated, V1 will deliver 85 mA (PDC = 0) with the transistor contributing the balance of the load current (see Figure 8). 250 mA load current 250 mA Ith(act)PNP = 85 mA (PDC = 0) IV1 0 mA −165 mA 165 mA PNP current 015aaa075 Fig 8. UJA1079_2 Product data sheet V1 and PNP currents at a fast ramping load current of 250 mA (PDC = 0) All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 20 of 45 UJA1079 NXP Semiconductors LIN core system basis chip For short-circuit protection, a resistor needs to be connected between pins V1 and VEXCC to allow the current to be monitored. This resistor limits the current delivered by the external transistor. If the voltage difference between pins VEXCC and V1 reaches Vth(act)Ilim, the PNP current limiting activation threshold voltage, the transistor current will not increase further. The thermal performance of the transistor needs to be considered when calculating the value of this resistor. A 3.3 Ω resistor was used with the BCP52-16 (NXP Semiconductors) employed during testing. Note that the selection of the transistor is not critical. In general, any PNP transistor with a current amplification factor (β) of between 60 and 500 can be used. If an external PNP transistor is not used, pin VEXCC must be connected to V1 while pin VEXCTRL can be left open. One advantage of this scalable voltage regulator concept is that there are no PCB layout restrictions when using the external PNP. The distance between the UJA1079 and the external PNP doesn’t affect the stability of the regulator loop because the loop is realized within the UJA1079. Therefore, it is recommended that the distance between the UJA1079 and PNP transistor be maximized for optimal thermal distribution. The output voltage on V1 is monitored continuously and a system reset signal is generated if an undervoltage event occurs. A system reset is generated if the voltage on V1 falls below the undervoltage detection voltage (Vuvd; see Table 10). The reset threshold (90 % or 70 % of the nominal value) is set via the Reset Threshold Control bit (RTHC) in the Int_Control register (Table 6). In addition, an undervoltage warning (a V1UI interrupt) will be generated at 90 % of the nominal output voltage. The status of V1 can be read via bit V1S in the WD_and_Status register (Table 4). 6.7 LIN transceiver The analog section of the UJA1079 LIN transceiver is identical to that integrated into the TJA1021. The transceiver is the interface between the LIN master/slave protocol controller and the physical bus in a LIN. It is primarily intended for in-vehicle sub-networks using baud rates from 1 kBd up to 20 kBd and is LIN 2.0/LIN 2.1/SAE J2602 compliant. 6.7.1 LIN operating modes 6.7.1.1 Active mode The LIN transceiver will be in Active mode when: • the SBC is in Normal mode (MC = 10 or 11) and • the transceiver is enabled (STBCL = 0; see Table 6) and • the battery voltage (VBAT) is above the LIN undervoltage recovery threshold, Vuvr(LIN). In LIN Active mode, the transceiver can transmit and receive data via the LIN bus pin. The receiver detects data streams on the LIN bus pin (LIN) and transfers them to the microcontroller via pins RXDL (see Figure 1) - LIN recessive is represented by a HIGH level on RXDL, LIN dominant by a LOW level. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 21 of 45 UJA1079 NXP Semiconductors LIN core system basis chip The transmit data streams of the protocol controller at the TXDL input are converted by the transmitter into bus signals with optimized slew rate and wave shaping to minimize EME. 6.7.1.2 Lowpower/Off modes The LIN transceiver will be in Lowpower mode with bus wake-up detection enabled if bit STBCL = 1 (see Table 6). The LIN transceiver can be woken up remotely via pin LIN in Lowpower mode. When the SBC is in Standby mode or Sleep mode (MC = 00 or 01), the LIN transceiver will be in Off mode if bit STBCL = 0. The LIN transceiver is powered down completely in Off mode to minimize quiescent current consumption. Filters at the receiver inputs prevent unwanted wake-up events due to automotive transients or EMI. The wake-up event must remain valid for at least the minimum dominant bus time for wake-up of the LIN transceiver, twake(busdom)min (see Table 11). 6.7.2 Fail-safe features 6.7.2.1 General fail-safe features The following fail-safe features have been implemented: • Pin TXDL has an internal pull-up towards VV1 to guarantee safe, defined states if these pins are left floating • The current of the transmitter output stage is limited in order to protect the transmitter against short circuits to pin BAT • A loss of power (pins BAT and GND) has no impact on the bus lines or on the microcontroller. There will be no reverse currents from the bus. 6.7.2.2 TXDL dominant time-out function A TXDL dominant time-out timer circuit prevents the bus lines being driven to a permanent dominant state (blocking all network communications) if TXDL is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on the TXDL pin. If the pin remains LOW for longer than the TXDL dominant time-out time (tto(dom)TXDL), the transmitter is disabled, driving the bus lines to a recessive state. The timer is reset by a positive edge on the TXDL pin. 6.8 Local wake-up input The SBC provides 2 local wake-up pins (WAKE1 and WAKE2). The edge sensitivity (falling, rising or both) of the wake-up pins can be configured independently via the WIC1 and WIC2 bits in the Int_Control register Table 6). These bits can also be used to disable wake-up via the wake-up pins. When wake-up is enabled, a valid wake-up event on either of these pins will cause a wake-up interrupt to be generated in Standby mode or Normal mode. If the SBC is in Sleep mode when the wake-up event occurs, it will wake up and enter Standby mode. The status of the wake-up pins can be read via the wake-up level status bits (WLS1 and WLS2) in the WD_and_Status register (Table 4). Note that bits WLS1 and WLS2 are only active when at least one of the wake up interrupts is enabled (WIC1 ≠ 00 or WIC2 ≠ 00). UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 22 of 45 UJA1079 NXP Semiconductors LIN core system basis chip enable bias disable bias WBIASI (internal) WBIAS pin WAKEx pin Wake-up int disable bias wake level latched Fig 9. 015aaa078 Wake-up pin sampling synchronized with WBIAS signal The sampling of the wake-up pins can be synchronized with the WBIAS signal by setting bits WSE1 and WSE2 in the Int_Control register to 1 (if WSEx = 0, wake-up pins are sampled continuously). The sampling will be performed on the rising edge of WBIAS (see Figure 9). The sampling time, 16 ms or 64 ms, is selected via the Wake Bias Control bit (WBC) in the Mode_Control register. Figure 10 shows typical circuit for implementing cyclic sampling of the wake-up inputs. UJA1079 BAT 47 kΩ WBIAS PDTA144E 47 kΩ biasing of switches WAKE1 t WAKE2 sample of WAKEx GND sample of WAKEx sample of WAKEx 015aaa126 Fig 10. Typical application for cyclic sampling of wake-up signals UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 23 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 6.9 Interrupt output Pin INTN is an active-LOW, open-drain interrupt output. It is driven LOW when at least one interrupt is pending. An interrupt can be cleared by writing 1 to the corresponding bit in the Int_Status register (Table 7). Clearing bit LWI in Standby mode only clears the interrupt status bit and not the pending wake-up. The pending wake-up is cleared on entering Normal mode and when the corresponding standby control bit (STBCL) is 0. On devices that contain a watchdog, the Cyclic Interrupt (CI) is enabled when the watchdog switches to Timeout mode while the SBC is in Standby mode or Normal mode (provided WDOFF = LOW). A CI is generated if the watchdog overflows in Timeout mode. The CI is provided to alert the microcontroller when the watchdog overflows in Timeout mode. The CI will wake up the microcontroller from a μC standby mode. After polling the Int_Status register, the microcontroller will be aware that the application is in cyclic wake up mode. It can then perform some checks on LIN before returning to the μC standby mode. 6.10 Temperature protection The temperature of the SBC chip is monitored in Normal and Standby modes. If the temperature is too high, the SBC will go to Overtemp mode, where the RSTN pin is driven LOW and limp home is activated. In addition, the voltage regulator and the LIN transmitter are switched off (see also Section 6.1.6 “Overtemp mode”). When the temperature falls below the temperature shutdown threshold, the SBC will go into the Standby mode. The temperature shutdown threshold is between 165 °C and 200 °C. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 24 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 7. Limiting values Table 8. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Vx voltage on pin x DC value Unit pins V1 and INTN −0.3 7 V −0.3 VV1 + 0.3 V pin VEXCC VV1 − 0.3 VV1 + 0.35 V pins WAKE1, WAKE2, WBIAS and LIN; with respect to any other pin −58 +58 V pin LIMP and BAT −0.3 +40 V pin VEXCTRL −0.3 VBAT + 0.3 V pin DLIN; with respect to any other pin reverse current from VV1 ≤ 5 V pin V1 to pin BAT IDLIN current on pin DLIN transient voltage Max pins EN, SDI, SDO, SCK, SCSN, TXDL, RXDL, RSTN and WDOFF IR(V1-BAT) Vtrt Min [1] [2] on pins VBAT − 0.3 +58 V - 250 mA −65 0 mA −150 +100 V −6 +6 kV −8 +8 kV BAT: via reverse polarity diode/capacitor LIN: coupling via 1 nF capacitor DLIN: via 1 kW resistor VESD electrostatic discharge voltage [3] IEC 61000-4-2 pins BAT with capacitor and LIN; via a series resistor on pins DLIN, WAKE1, WAKE2, LIMP and WBIAS; via transistor on pin VEXCTRL [4] [5] HBM pins LIN, DLIN, WAKE1 and WAKE2 [6] pin BAT; referenced to ground −4 +4 kV pin TEST2; referenced to pin BAT −1.25 +2 kV pin TEST2; referenced to other reference pins −2 +2 kV −2 +2 kV −300 +300 V −750 +750 V −500 +500 V −40 +150 °C −55 +150 °C any other pin [7] MM any pin [8] CDM corner pins any other pin Tvj virtual junction temperature Tstg storage temperature UJA1079_2 Product data sheet [9] All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 25 of 45 UJA1079 NXP Semiconductors LIN core system basis chip Table 8. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Tamb ambient temperature Conditions Min Max Unit −40 +125 °C [1] A reverse diode connected between V1 (anode) and BAT (cathode) limits the voltage drop voltage from V1(+) to BAT (−). [2] Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b. [3] IEC 61000-4-2 (150 pF, 330 Ω). [4] ESD performance according to IEC 61000-4-2 (150 pF, 330 Ω) has been verified by an external test house for pins BAT, LIN, WAKE1 and WAKE2. The result is equal to or better than ±6 kV. [5] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ). [6] V1 and BAT connected to GND, emulating application circuit. [7] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 μH, 10 Ω). [8] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF). [9] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P × Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 26 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 8. Thermal characteristics optional heatsink top layer optional heatsink top layer PCB copper area: (bottom layer) 2 cm2 optional heatsink top layer PCB copper area: (bottom layer) 8 cm2 015aaa137 Layout conditions for Rth(j-a) measurements: board finish thickness 1.6 mm ±10 %, board double layer, board dimensions 129 mm × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm. Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see Figure 12). Fig 11. HTSSOP PCB UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 27 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 015aaa138 90 Rth(j-a) (K/W) 70 without heatsink top layer 50 with heatsink top layer 30 0 2 4 6 8 PCB Cu heatsink area (cm2) 10 Fig 12. HTSSOP32 thermal resistance junction to ambient as a function of PCB copper area Table 9. Thermal characteristics Symbol Parameter Rth(j-a) UJA1079_2 Product data sheet Conditions thermal resistance from junction to ambient Typ Unit single-layer board [1] 78 K/W four-layer board [2] 39 K/W [1] According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board. [2] According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers (thickness: 35 μm) and thermal via array under the exposed pad connected to the first inner copper layer. All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 28 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 9. Static characteristics Table 10. Static characteristics Tvj = −40 °C to +150 °C; VBAT = 4.5 V to 28 V; VBAT > VV1; RLIN = 500 Ω; all voltages are defined with respect to ground; positive currents flow in the IC; typical values are given at VBAT = 14 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 4.5 - 28 V Supply; pin BAT VBAT battery supply voltage IBAT battery supply current MC = 00 (Standby; V1 on) STBCL = 1 (LIN wake-up enabled) WIC1 = WIC2 = 11 (WAKE interrupts enabled); 7.5 V < VBAT < 28 V IV1 = 0 mA; VRSTN = VSCSN = VV1 VTXDL = VV1; VSDI = VSCK = 0 V Tvj = −40 °C - 75 89 μA Tvj = 25 °C - 68 80 μA Tvj = 150 °C - 62 73 μA Tvj = −40 °C - 53 62 μA Tvj = 25 °C - 49 57 μA Tvj = 150 °C - 45 51 μA contributed by LIN wake-up receiver STBCL = 1 VLIN = VBAT; 5.5 V < VBAT < 28 V - 1.1 2 μA contributed by WAKE pin edge detectors; WIC1 = WIC2 = 11 VWAKE1 = VWAKE2 = VBAT 0 5 10 μA 5.1 V < VBAT < 7.5 V - - 50 μA 4.5 V < VBAT < 5.1 V V1 on (5 V version) - - 3 mA LIN Active mode (recessive) STBCL = 0; MC = 1x VTXDL= VV1; IDLIN = ILIN = 0 mA 5.5 V < VBAT < 28 V - - 1300 μA LIN Active mode (dominant) STBCL = 0; MC = 1x VTXDL = 0 V; IDLIN = ILIN = 0 mA VBAT = 14 V - - 5 mA LIN Active mode (dominant) STBCL = 0; MC = 1x VTXDL= 0 V; IDLIN = ILIN = 0 mA VBAT = 28 V - - 10 mA MC = 01 (Sleep; V1 off) STBCL = 1 (LIN wake-up enabled) WIC1 = WIC2 = 11 (WAKE interrupts enabled); 7.5 V < VBAT < 28 V VV1 = 0 V IBAT(add) additional battery supply current Vth(det)pon power-on detection threshold voltage 4.5 - 5.5 V Vth(det)poff power-off detection threshold voltage 4.25 - 4.5 V UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 29 of 45 UJA1079 NXP Semiconductors LIN core system basis chip Table 10. Static characteristics …continued Tvj = −40 °C to +150 °C; VBAT = 4.5 V to 28 V; VBAT > VV1; RLIN = 500 Ω; all voltages are defined with respect to ground; positive currents flow in the IC; typical values are given at VBAT = 14 V; unless otherwise specified. Symbol Parameter Vhys(det)pon Conditions Min Typ Max Unit power-on detection hysteresis voltage 200 - - mV Vuvd(LIN) LIN undervoltage detection voltage 5 - 5.3 V Vuvr(LIN) LIN undervoltage recovery voltage 5 - 5.5 V Vhys(uvd)LIN LIN undervoltage detection hysteresis voltage 25 - 300 mV Vuvd(ctrl)Iext external current control undervoltage detection voltage 5.9 - 7.5 V VO(V1)nom = 5 V; VBAT = 5.5 V to 28 V IV1 = −200 mA to −5 mA; CLIN ≥ 560 pF 4.9 5 5.1 V VO(V1)nom = 5 V; VBAT = 5.5 V to 28 V 4.85 5 5.15 V 4.75 5 5.1 V 4.5 5 5.1 V 4.85 5 5.1 V 3.234 3.3 3.366 V 3.201 3.3 3.399 V 2.97 3.3 3.366 V - - 3 Ω Voltage source; pin V1 VO output voltage IV1 = −200 mA to −5 mA; CLIN ≥ 220 pF VO(V1)nom = 5 V; VBAT = 5.5 V to 28 V IV1 = −250 mA to −200 mA VO(V1)nom = 5 V; VBAT = 5.5 V to 5.75 V IV1 = −250 mA to −5 mA 150 °C < Tvj < 200 °C VO(V1)nom = 5 V; VBAT = 5.75 V to 28 V IV1 = −250 mA to −5 mA 150 °C < Tvj < 200 °C VO(V1)nom = 3.3 V; VBAT = 4.5 V to 28 V IV1 = −250 mA to −5 mA; CLIN ≥ 560 pF VO(V1)nom = 3.3 V; VBAT = 4.5 V to 28 V IV1 = −250 mA to −5 mA; CLIN ≥ 220 pF VO(V1)nom = 3.3 V; VBAT = 4.5 V to 28 V IV1 = −250 mA to −5 mA 150 °C < Tvj < 200 °C R(BAT-V1) Vuvd Vuvr IO(sc) resistance between pin BAT and pin V1 VO(V1)nom = 5 V; VBAT = 4.5 V to 5.5 V undervoltage detection voltage 90 %; VO(V1)nom = 5 V; RTHC = 0 4.5 - 4.75 V 90 %; VO(V1)nom = 3.3 V; RTHC = 0 2.97 - 3.135 V 70 %; VO(V1)nom = 5 V; RTHC = 1 3.5 - 3.75 V IV1 = −250 mA to −5 mA regulator in saturation undervoltage recovery voltage 90 %; VO(V1)nom = 5 V 4.56 - 4.9 V 90 %; VO(V1)nom = 3.3 V 3.025 - 3.234 V short-circuit output current IVEXCC = 0 mA −600 - −250 mA UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 30 of 45 UJA1079 NXP Semiconductors LIN core system basis chip Table 10. Static characteristics …continued Tvj = −40 °C to +150 °C; VBAT = 4.5 V to 28 V; VBAT > VV1; RLIN = 500 Ω; all voltages are defined with respect to ground; positive currents flow in the IC; typical values are given at VBAT = 14 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit voltage variation on pin V1 as a function of load current variation VBAT = 5.75 V to 28 V IV1 = −250 mA to −5 mA - - 25 mV voltage variation on pin V1 as a function of supply voltage variation VBAT = 5.5 V to 28 V; IV1 = −30 mA - - 25 mV 3.5 5.8 8 mA PDC 0 74 130 191 mA PDC 0; Tvj = 150 °C 74 85 99 mA PDC 1 44 76 114 mA PDC 1; Tvj = 150 °C 44 50 59 mA PDC 0 40 76 120 mA PDC 0; Tvj = 150 °C 44 50 59 mA PDC 1 11 22 36 mA PDC 1; Tvj = 150 °C 12 15 18 mA 240 - 330 mV Load regulation ΔVV1 Line regulation ΔVV1 PNP base; pin VEXCTRL IO(sc) short-circuit output current VVEXCTRL ≥ 4.5 V; VBAT = 6 V to 28 V Ith(act)PNP PNP activation threshold current load current increasing; external PNP transistor connected - see Section 6.6.2 Ith(deact)PNP PNP deactivation threshold current load current falling; external PNP transistor connected - see Section 6.6.2 PNP collector; pin VEXCC Vth(act)Ilim current limiting activation threshold voltage measured across resistor connected between pins VEXCC and V1 (see Section 6.6.2) 2.97 V ≤ VV1 ≤ 5.5 V; 6 V < VBAT < 28 V Serial peripheral interface inputs; pins SDI. SCK and SCSN Vth(sw) switching threshold voltage VV1 = 2.97 V to 5.5 V 0.3VV1 - 0.7VV1 V Vhys(i) input hysteresis voltage VV1 = 2.97 V to 5.5 V 100 - 900 mV Rpd(SCK) pull-down resistance on pin SCK 50 130 400 kΩ Rpu(SCSN) pull-up resistance on pin SCSN 50 130 400 kΩ ILI(SDI) input leakage current on pin SDI −5 - +5 μA Serial peripheral interface data output; pin SDO IOH HIGH-level output current VSCSN = 0 V; VO = VV1 − 0.4 V VV1 = 2.97 V to 5.5 V −30 - −1.6 mA IOL LOW-level output current VSCSN = 0 V; VO = 0.4 V VV1 = 2.97 V to 5.5 V 1.6 - 30 mA ILO output leakage current VSCSN = VV1; VO = 0 V to VV1 VV1 = 2.97 V to 5.5 V −5 - 5 μA UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 31 of 45 UJA1079 NXP Semiconductors LIN core system basis chip Table 10. Static characteristics …continued Tvj = −40 °C to +150 °C; VBAT = 4.5 V to 28 V; VBAT > VV1; RLIN = 500 Ω; all voltages are defined with respect to ground; positive currents flow in the IC; typical values are given at VBAT = 14 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Reset output with clamping detection; pin RSTN IOH HIGH-level output current VRSTN = 0.8VV1 VV1 = 2.97 V to 5.5 V −1500 - −100 μA IOL LOW-level output current strong; VRSTN = 0.2VV1 VV1 = 2.97 V to 5.5 V −40 °C < Tvj < 200 °C 4.9 - 40 mA weak; VRSTN = 0.8VV1 VV1 = 2.97 V to 5.5 V −40 °C < Tvj < 200 °C 200 - 540 μA VV1 = 1 V to 5.5 V pull-up resistor to VV1 ≥ 900 Ω −40 °C < Tvj < 200 °C; VBAT < 28 V 0 - 0.2VV1 V VV1 = 2.975 V to 5.5 V pull-up resistor to V1 ≥ 900 Ω −40 °C < Tvj < 200 °C 0 - 0.5 V 0.8VV1 - VV1 + 0.3 V VOL LOW-level output voltage VOH HIGH-level output voltage -40 °C < Tvj < 200 °C Vth(sw) switching threshold voltage VV1 = 2.97 V to 5.5 V 0.3VV1 - 0.7VV1 V Vhys(i) input hysteresis voltage VV1 = 2.97 V to 5.5 V 100 - 900 mV VOL = 0.4 V 1.6 - 15 mA Interrupt output; pin INTN IOL LOW-level output current Enable output; pin EN IOH HIGH-level output current VOH = VV1 − 0. 4 V VV1 = 2.97 V to 5.5 V −20 - −1.6 mA IOL LOW-level output current VOL = 0.4 V; VV1 = 2.97 V to 5.5 V 1.6 - 20 mA VOL LOW-level output voltage IOL = 20 μA; VV1 = 1.5 V - - 0.4 V Watchdog off input; pin WDOFF Vth(sw) switching threshold voltage VV1 = 2.97 V to 5.5 V 0.3VV1 - 0.7VV1 V Vhys(i) input hysteresis voltage VV1 = 2.97 V to 5.5 V 100 - 900 mV Rpupd pull-up/pull-down resistance VV1 = 2.97 V to 5.5 V 5 10 20 kΩ Wake input; pin WAKE1, WAKE2 Vth(sw) switching threshold voltage 2 - 3.75 V Vhys(i) input hysteresis voltage 100 - 1000 mV Ipu pull-up current VWAKE = 0 V for t < twake −2 - 0 μA Ipd pull-down current VWAKE = VBAT for t < twake 0 - 2 μA VLIMP = 0.4 V; LHC = 1 Tvj = −40 °C to 200 °C 0.8 - 8 mA VWBIAS = 1.4 V 1 - 7 mA Limp home output; pin LIMP IO output current Wake bias output; pin WBIAS IO output current LIN transmit data input; pin TXDL Vth(sw) switching threshold voltage VV1 = 2.97 V to 5.5 V 0.3VV1 - 0.7VV1 V Vhys(i) input hysteresis voltage VV1 = 2.97 V to 5.5 V 100 900 mV UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 - © NXP B.V. 2010. All rights reserved. 32 of 45 UJA1079 NXP Semiconductors LIN core system basis chip Table 10. Static characteristics …continued Tvj = −40 °C to +150 °C; VBAT = 4.5 V to 28 V; VBAT > VV1; RLIN = 500 Ω; all voltages are defined with respect to ground; positive currents flow in the IC; typical values are given at VBAT = 14 V; unless otherwise specified. Symbol Parameter Rpu pull-up resistance Conditions Min Typ Max Unit 4 12 25 kΩ LIN receive data output; pin RXDL IOH HIGH-level output current LIN Active mode; VRXDL = VV1 − 0.4 V −20 - −1.5 mA IOL LOW-level output current VRXDL= 0.4 V 1.6 - 20 mA Rpu pull-up resistance MC = 00; Standby mode 4 12 25 kΩ LIN bus line; pin LIN IBUS_LIM current limitation for driver dominant state LIN Active mode; VBAT = VLIN = 18 V VTXDL = 0 V 40 - 100 mA IBUS_PAS_rec receiver recessive input leakage current VLIN = 28 V; VBAT = 5.5 V; VTXDL = VV1 - - 2 μA IBUS_PAS_dom receiver dominant input leakage current including pull-up resistor VTXDL = VV1; VLIN = 0 V; VBAT = 14 V −10 - +10 μA IL(log) loss of ground leakage current VBAT = VGND = 28 V; VLIN = 0 V −100 - 10 μA IL(lob) loss of battery leakage current VBAT = 0 V; VLIN = 28 V - - 2 μA Vrec(RX) receiver recessive voltage VBAT = 5.5 V to 18 V 0.6 × VBAT - - V Vdom(RX) receiver dominant voltage VBAT = 5.5 V to 18 V - - 0.4VBAT V Vth(cntr)RX receiver center threshold voltage Vth(cntr)RX = (Vth(rec)RX + Vth(dom)RX)/2 VBAT = 5.5 V to 18 V; LIN Active mode 0.475 0.5 × × VBAT VBAT 0.525 × VBAT V Vth(hys)RX receiver hysteresis threshold voltage Vth(hys)RX = Vth(rec)RX − Vth(dom)RX VBAT = 5.5 V to 18 V; LIN Active mode 0.05 × VBAT 0.15 × VBAT 0.175 × VBAT V Cext external capacitance on pin LIN - - 30 pF VO(dom) dominant output voltage LIN Active mode; VTXDL = 0 V VBAT = 7 V - - 1.4 V LIN Active mode; VTXDL = 0 V VBAT = 18 V - - 2.0 V 5 mA < IDLIN < 20 mA 0.4 0.65 1 V LIN bus termination; pin DLIN ΔV(DLIN-BAT) voltage difference between pin DLIN and pin BAT Temperature protection Tth(act)otp overtemperature protection activation threshold temperature 165 180 200 °C Tth(rel)otp overtemperature protection release threshold temperature 126 138 150 °C UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 33 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 10. Dynamic characteristics Table 11. Dynamic characteristics Tvj = −40 °C to +150 °C; VBAT = 4.5 V to 28 V; VBAT > VV1; RLIN = 500 Ω; all voltages are defined with respect to ground; positive currents flow in the IC; typical values are given at VBAT = 14 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VV1 falling; dVV1/dt = 0.1 V/μs 7 - 23 μs 95 - 140 ms Voltage source; pin V1 td(uvd) undervoltage detection delay time tdet(CL)L LOW-level clamping detection VV1 < 0.9VO(V1)nom; V1 active time Serial peripheral interface timing; pins SCSN, SCK, SDI and SDO tcy(clk) clock cycle time VV1 = 2.97 V to 5.5 V 320 - - ns tSPILEAD SPI enable lead time VV1 = 2.97 V to 5.5 V; clock is LOW when SPI select falls 110 - - ns tSPILAG SPI enable lag time VV1 = 2.97 V to 5.5 V; clock is LOW when SPI select rises 140 - - ns tclk(H) clock HIGH time VV1 = 2.97 V to 5.5 V 160 - - ns tclk(L) clock LOW time VV1 = 2.97 V to 5.5 V 160 - - ns tsu(D) data input set-up time VV1 = 2.97 V to 5.5 V 0 - - ns th(D) data input hold time VV1 = 2.97 V to 5.5 V 80 - - ns tv(Q) data output valid time pin SDO; VV1 = 2.97 V to 5.5 V CL = 100 pF - - 110 ns tWH(S) chip select pulse width HIGH VV1 = 2.97 V to 5.5 V 20 - - ns long; Ipu(RSTN) < 100 μA; no pull-up 20 - 25 ms short; Rpu(RSTN) = 900 Ω to 1100 Ω Reset output; pin RSTN tw(rst) reset pulse width 3.6 - 5 ms tdet(CL)L LOW-level clamping detection RSTN driven HIGH internally but time RSTN remains LOW 95 - 140 ms tfltr filter time 7 - 18 μs 0.9 - 2.3 ms Watchdog off input; pin WDOFF tfltr filter time Wake input; pin WAKE1, WAKE2 twake wake-up time 10 - 40 μs td(po) power-on delay time 113 - 278 μs 0.396 - - 0.396 - - LIN transceiver; pins LIN, TXDL, RXDL δ1 UJA1079_2 Product data sheet duty cycle 1 Vth(rec)RX(max) = 0.744VBAT Vth(dom)RX(max) = 0.581VBAT; tbit = 50 μs VBAT = 7 V to 18 V; LSC = 0 [1] Vth(rec)RX(max) = 0.76VBAT Vth(dom)RX(max) = 0.593VBAT; tbit = 50 μs VBAT = 5.5 V to 7 V; LSC = 0 [1] All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 [2] [2] © NXP B.V. 2010. All rights reserved. 34 of 45 UJA1079 NXP Semiconductors LIN core system basis chip Table 11. Dynamic characteristics …continued Tvj = −40 °C to +150 °C; VBAT = 4.5 V to 28 V; VBAT > VV1; RLIN = 500 Ω; all voltages are defined with respect to ground; positive currents flow in the IC; typical values are given at VBAT = 14 V; unless otherwise specified. Symbol δ2 Parameter Conditions duty cycle 2 δ3 duty cycle 3 δ4 duty cycle 4 Vth(rec)RX(min) = 0.422VBAT Vth(dom)RX(min) = 0.284VBAT; tbit = 50 μs VBAT = 7.6 V to 18 V; LSC = 0 [2] Vth(rec)RX(min) = 0.41VBAT Vth(dom)RX(min) = 0.275VBAT; tbit = 50 μs VBAT = 6.1 V to 7.6 V; LSC = 0 [2] Vth(rec)RX(max) = 0.778VBAT Vth(dom)RX(max) = 0.616VBAT tbit = 96 μs; VBAT = 7 V to 18 V LSC = 1 [1] Vth(rec)RX(max) = 0.797VBAT Vth(dom)RX(max) = 0.630VBAT tbit = 96 μs; VBAT = 5.5 V to 7 V LSC = 1 [1] Vth(rec)RX(min) = 0.389VBAT Vth(dom)RX(min) = 0.251VBAT; tbit = 96 μs VBAT = 7.6 V to 18 V; LSC = 1 [2] Vth(rec)RX(min) = 0.378VBAT Vth(dom)RX(min) = 0.242VBAT; tbit = 96 μs VBAT = 6.1 V to 7.6 V; LSC = 1 [2] Min Typ Max - - 0.581 - - 0.581 0.417 - - 0.417 - - - - 0.590 - - 0.590 Unit [3] [3] [2] [2] [3] [3] tPD(RX)r rising receiver propagation delay VBAT = 5.5 V to 18 V; RRXDL = 2.4 kΩ CRXDL = 20 pF - - 6 μs tPD(RX)f falling receiver propagation delay VBAT = 5.5 V to 18 V; RRXDL = 2.4 kΩ CRXDL = 20 pF - - 6 μs tPD(RX)sym receiver propagation delay symmetry VBAT = 5.5 V to 18 V; RRXDL = 2.4 kΩ CRXDL = 20 pF −2 - +2 μs twake(busdom)min minimum bus dominant wake-up time 28 - 104 μs tto(dom)TXDL TXDL dominant time-out time LIN online mode; VTXDL = 0 V 20 - 80 ms 227 - 278 μs WBC = 1 58.1 - 71.2 ms WBC = 0 14.5 - 17.8 ms [4] Wake bias output; pin WBIAS tWBIASL WBIAS LOW time tcy cycle time Watchdog ttrig(wd)1 watchdog trigger time 1 Normal mode watchdog Window mode only [5] 0.45 × NWP[6] 0.555 × NWP[6] ms ttrig(wd)2 watchdog trigger time 2 Normal, Standby and Sleep modes watchdog Window mode only [7] 0.9 × NWP[6] 1.11 × NWP[6] ms 460.8 563.2 kHz Oscillator oscillator frequency fosc [1] t bus ( rec ) ( min ) δ1, δ3 = ------------------------------- . 2 × t bit [2] Bus load conditions are: CL = 1 nF and RL = 1 kΩ; CL = 6.8 nF and RL = 660 Ω; CL = 10 nF and RL = 500 Ω. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 512 © NXP B.V. 2010. All rights reserved. 35 of 45 UJA1079 NXP Semiconductors LIN core system basis chip [3] t bus ( rec ) ( max ) δ2, δ4 = -------------------------------- . 2 × t bit [4] tPD(RX)sym = tPD(RX)r − tPD(RX)f. [5] A system reset will be performed if the watchdog is in Window mode and is triggered less than ttrig(wd)1 after the start of the watchdog period (or in the first half of the watchdog period). [6] The nominal watchdog period is programmed via the NWP control bits in the WD_and_Status register (see Table 4); valid in watchdog Window mode only. [7] The watchdog will be reset if it is in window mode and is triggered at least ttrig(wd)1, but not more than ttrig(wd)2, after the start of the watchdog period (or in the second half of the watchdog period). A system reset will be performed if the watchdog is triggered more than ttrig(wd)2 after the start of the watchdog period (watchdog overflows). BAT RXDL DLIN RLIN SBC CRXDL LIN TXDL CLIN GND 015aaa128 Fig 13. Timing test circuit for LIN transceiver tbit tbit tbit VTXDL tbus(rec)(min) tbus(dom)(max) VBAT Vth(rec)RX(max) Vth(dom)RX(max) LIN bus signal Vth(rec)RX(min) Vth(dom)RX(min) tbus(dom)(min) output of receiving node A VRXDL output of receiving node B VRXDL thresholds of receiving node A thresholds of receiving node B tbus(rec)(max) tPD(RX)f tPD(RX)r tPD(RX)r tPD(RX)f 015aaa133 Fig 14. LIN transceiver timing diagram UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 36 of 45 UJA1079 NXP Semiconductors LIN core system basis chip SCS tSPILEAD tSPILAG Tcy(clk) tclk(H) tclk(L) tsu(D) th(D) tWH(S) SCK SDI MSB X LSB X tv(Q) floating SDO floating X MSB LSB 015aaa045 Fig 15. SPI timing diagram 11. Test information 11.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 - Failure mechanism based stress test qualification for integrated circuits, and is suitable for use in automotive applications. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 37 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 12. Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2 Eh (A3) A A1 pin 1 index θ Lp L detail X 16 1 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D(1) Dh E(2) Eh e HE L Lp v w y Z θ mm 1.1 0.15 0.05 0.95 0.85 0.25 0.30 0.19 0.20 0.09 11.1 10.9 5.1 4.9 6.2 6.0 3.6 3.4 0.65 8.3 7.9 1 0.75 0.50 0.2 0.1 0.1 0.78 0.48 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT549-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 03-04-07 05-11-02 MO-153 Fig 16. Package outline SOT549-1 (HTSSOP32) UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 38 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 13.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 39 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 17) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 12 and 13 Table 12. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 13. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 17. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 40 of 45 UJA1079 NXP Semiconductors LIN core system basis chip temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 17. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 41 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 14. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes UJA1079_2 20100527 Product data sheet - UJA1079_1 Modifications: UJA1079_1 UJA1079_2 Product data sheet • • • • • • Template upgraded to Rev. 2.11 including revised legal information • • Table 11: revised parameter values/conditions - tdet(CL)L for RSTN pin Figure 14: revised Table 4: bit 7: WOS revised Table 8: revised values/conditions - VESD, IR(V1-BAT) Table 9: added Table 10: revised parameter values/conditions - Vth(cntr)RX, Vth(hys)RX and VOL for RSTN pin, IO for LIMP pin; R(BAT-V1); Vuvr for pin V1 Section 6.7.1.2, Table 11: parameter renamed to twake(busdom)min 20091201 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 - © NXP B.V. 2010. All rights reserved. 42 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be UJA1079_2 Product data sheet suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 43 of 45 UJA1079 NXP Semiconductors LIN core system basis chip Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] UJA1079_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 27 May 2010 © NXP B.V. 2010. All rights reserved. 44 of 45 UJA1079 NXP Semiconductors LIN core system basis chip 17. Contents 1 2 2.1 2.2 2.3 2.4 2.5 3 4 5 5.1 5.2 6 6.1 6.1.1 6.1.2 6.1.3 6.1.4 6.1.5 6.1.6 6.2 6.2.1 6.2.2 6.2.3 6.2.4 6.2.5 6.2.6 6.3 6.4 6.4.1 6.4.2 6.4.3 6.5 6.5.1 6.5.2 6.5.3 6.6 6.6.1 6.6.2 6.7 6.7.1 6.7.1.1 6.7.1.2 6.7.2 6.7.2.1 6.7.2.2 6.8 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 LIN transceiver . . . . . . . . . . . . . . . . . . . . . . . . . 2 Power management . . . . . . . . . . . . . . . . . . . . . 2 Control and Diagnostic features . . . . . . . . . . . . 2 Voltage regulator V1 . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 System Controller . . . . . . . . . . . . . . . . . . . . . . . 6 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Overtemp mode . . . . . . . . . . . . . . . . . . . . . . . 10 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Register map . . . . . . . . . . . . . . . . . . . . . . . . . 11 WD_and_Status register. . . . . . . . . . . . . . . . . 12 Mode_Control register . . . . . . . . . . . . . . . . . . 13 Int_Control register . . . . . . . . . . . . . . . . . . . . . 14 Int_Status register. . . . . . . . . . . . . . . . . . . . . . 15 On-chip oscillator . . . . . . . . . . . . . . . . . . . . . . 16 Watchdog (UJA1079/xx/WD versions) . . . . . . 16 Watchdog Window behavior . . . . . . . . . . . . . . 16 Watchdog Timeout behavior . . . . . . . . . . . . . . 17 Watchdog Off behavior . . . . . . . . . . . . . . . . . . 17 System reset. . . . . . . . . . . . . . . . . . . . . . . . . . 17 RSTN pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 EN output . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 LIMP output . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Power supplies . . . . . . . . . . . . . . . . . . . . . . . . 19 Battery pin (BAT) . . . . . . . . . . . . . . . . . . . . . . 19 Voltage regulator V1 . . . . . . . . . . . . . . . . . . . . 19 LIN transceiver . . . . . . . . . . . . . . . . . . . . . . . . 21 LIN operating modes . . . . . . . . . . . . . . . . . . . 21 Active mode . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Lowpower/Off modes . . . . . . . . . . . . . . . . . . . 22 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . 22 General fail-safe features . . . . . . . . . . . . . . . . 22 TXDL dominant time-out function . . . . . . . . . . 22 Local wake-up input . . . . . . . . . . . . . . . . . . . . 22 6.9 6.10 7 8 9 10 11 11.1 12 13 13.1 13.2 13.3 13.4 14 15 15.1 15.2 15.3 15.4 16 17 Interrupt output. . . . . . . . . . . . . . . . . . . . . . . . Temperature protection . . . . . . . . . . . . . . . . . Limiting values . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . Static characteristics . . . . . . . . . . . . . . . . . . . Dynamic characteristics. . . . . . . . . . . . . . . . . Test information . . . . . . . . . . . . . . . . . . . . . . . Quality information . . . . . . . . . . . . . . . . . . . . . Package outline. . . . . . . . . . . . . . . . . . . . . . . . Soldering of SMD packages . . . . . . . . . . . . . . Introduction to soldering. . . . . . . . . . . . . . . . . Wave and reflow soldering. . . . . . . . . . . . . . . Wave soldering . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 24 25 27 29 34 37 37 38 39 39 39 39 40 42 43 43 43 43 44 44 45 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 May 2010 Document identifier: UJA1079_2