PHILIPS BGOFC0

BGO827; BGO827/FC0;
BGO827/SC0
870 MHz optical receivers
Rev. 5 — 29 September 2010
Product data sheet
1. Product profile
1.1 General description
High dynamic range optical receiver amplifier modules in a standard SOT115 package
where the non-jacketed fiber has either no connector or has an FC/APC or SC/APC
connector.
The amplifier supply voltage pin and the photodiode bias voltage pin both connect to
24 V (DC).
The modules have a mono mode optical input suitable for 1290 nm to 1600 nm
wavelengths, a terminal to monitor the photodiode current and an electrical output having
a characteristic impedance of 75 Ω.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
„
„
„
„
„
„
„
Excellent linearity
Low noise
Excellent flatness
Standard CATV outline
Rugged construction
Gold metallization ensures excellent reliability
High optical input power range
1.3 Applications
„ CATV optical node systems operating in the 40 MHz to 870 MHz frequency range.
BGO827; BGO827/FC0/SC0
NXP Semiconductors
870 MHz optical receivers
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
f
frequency range
s22
output return losses
f = 40 MHz to 870 MHz
optical input return losses
Min
Typ
Max
Unit
40
-
870
MHz
11
-
-
dB
45
-
-
dB
d2
second order distortion
f = 854.5 MHz
-
-
−57
dB
F
equivalent noise input
f = 40 MHz to 870 MHz
-
-
8.5
pA/√Hz
Itot
total current consumption
(DC)
VB = 24 V
175
-
205
mA
2. Pinning information
Table 2.
Pin
Pinning
Description
Simplified outline
Graphic symbol
BGO827 (SOT115T)
1
monitor current
2, 3
common
4
+VB of the photodiode
5
+VB of the amplifier
7, 8
common
9
output
1
5 7 9
4
5
9
1 2, 3, 7, 8
sym098
BGO827/FC0 (SOT115X)
1
monitor current
2, 3
common
4
+VB of the photodiode
5
+VB of the amplifier
7, 8
common
9
output
1
5 7 9
4
5
9
1 2, 3, 7, 8
sym098
BGO827/SC0 (SOT115Y)
1
monitor current
2, 3
common
4
+VB of the photodiode
5
+VB of the amplifier
7, 8
common
9
output
BGO827_FC0_SC0
Product data sheet
1
5 7 9
4
5
9
1 2, 3, 7, 8
sym098
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 September 2010
© NXP B.V. 2010. All rights reserved.
2 of 11
BGO827; BGO827/FC0/SC0
NXP Semiconductors
870 MHz optical receivers
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
BGO827
-
rectangular single-ended package; aluminium flange; 2 vertical mounting
SOT115T
holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8
gold-plated in-line leads
BGO827/FC0
-
rectangular single-ended package; aluminium flange; 2 vertical mounting
holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; optical input
with connector; 8 gold-plated in-line leads
SOT115X
BGO827/SC0
-
rectangular single-ended package; aluminium flange; 2 vertical mounting
holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; optical input
with connector; 8 gold-plated in-line leads
SOT115Y
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Min
Max
Unit
f
frequency range
Conditions
40
870
MHz
Tstg
storage temperature
−40
+85
°C
Tmb
mounting base temperature
−20
+85
°C
Pin
optical input power
continuous
-
5
mW
ESD
ESD sensitivity
human body model;
R = 1.5 kΩ; C = 100 pF
500
-
V
Conditions
Min
Typ
Max
Unit
λ = 1300 nm
800
-
-
V/W
750
-
-
V/W
5. Characteristics
Table 5.
Characteristics
Bandwidth 40 MHz to 870 MHz; VB = 24 V; Tmb = 30 °C; ZL = 75 Ω.
Symbol
Parameter
S
responsivity
BGO827
BGO827/FC0; BGO827/SC0
ΔS
responsivity difference
responsivity at Tmb = 85 °C
− responsivity at
Tmb = 30 °C; f = 870 MHz
-
−50
-
V/W
FL
flatness straight line (peak to
valley)
f = 40 MHz to 870 MHz
-
-
1
dB
SL
slope straight line
f = 40 MHz to 870 MHz
0
-
2
dB
ΔSL
slope difference
slope at Tmb = 85 °C − slope
at Tmb = 30 °C
-
−0.35
-
dB
s22
output return losses
f = 40 MHz to 870 MHz
11
-
-
dB
45
-
-
dB
optical input return losses
BGO827_FC0_SC0
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 September 2010
© NXP B.V. 2010. All rights reserved.
3 of 11
BGO827; BGO827/FC0/SC0
NXP Semiconductors
870 MHz optical receivers
Table 5.
Characteristics …continued
Bandwidth 40 MHz to 870 MHz; VB = 24 V; Tmb = 30 °C; ZL = 75 Ω.
Symbol
d2
Parameter
Conditions
second order distortion
Min
Typ
Max
Unit
fm = 446.5 MHz
[1][2]
-
-
−68
dB
fm = 746.5 MHz
[1][3]
-
-
−63
dB
fm = 854.5 MHz
[1][4]
second order distortion difference d2 at Tmb = 85 °C − d2
at Tmb = 30 °C
Δd2
d2 at Tmb = −20 °C − d2
at Tmb = 30 °C
[5][6]
-
-
−57
dB
-
2.5
-
dB
-
−1.5
-
dB
-
-
−73
dB
d3
third order distortion
fm = 853.25 MHz
Δd3
third order distortion difference
d3 at Tmb = 85 °C − d3
at Tmb = 30 °C
-
1
-
dB
d3 at Tmb = −20 °C − d3
at Tmb = 30 °C
-
−1
-
dB
f = 40 MHz to 450 MHz
-
-
7
pA/√Hz
f = 450 MHz to 750 MHz
-
-
8
pA/√Hz
F
equivalent noise input
f = 750 MHz to 870 MHz
-
-
8.5
pA/√Hz
λ = 1310 ±20 nm
0.85
-
-
A/W
λ = 1550 ±20 nm
0.9
-
-
A/W
1290
-
1600
nm
BGO827
1
-
-
m
BGO827/FC0; BGO827/SC0
746
-
861
mm
Itot
total current consumption (DC)
175
-
205
mA
Ibias
diode bias current at pin 4 (DC)
-
-
25
mA
spectral sensitivity
sλ
λ
optical wavelength
L
length of optical fiber
SM type; 9/125 μm
[1]
Two laser test; each laser with a modulation index of 40 %; Popt = 1 mW (total)
[2]
fm = 446.5 MHz; fp = 97.25 MHz; fq = 349.25 MHz
[3]
fm = 746.5 MHz; fp = 133.25 MHz; fq = 613.25 MHz
[4]
fm = 854.5 MHz; fp = 133.25 MHz; fq = 721.25 MHz
[5]
Three laser test; each laser with a modulation index of 60 %; Popt = 1 mW (total)
[6]
fm = 853.25 MHz; fp = 133.25 MHz; fq = 265.25 MHz; fr = 721.25 MHz
Pin 1
10 kΩ
photo
current
1 kΩ
mlb151
Fig 1.
BGO827_FC0_SC0
Product data sheet
Monitor current pin
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 September 2010
© NXP B.V. 2010. All rights reserved.
4 of 11
BGO827; BGO827/FC0/SC0
NXP Semiconductors
870 MHz optical receivers
6. Package outline
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads
D
N1
N2
E
S2
SOT115T
N
Z
p
M
M1
M2
A2
1
2
3
4
5
7
8
9
A
S1
L
F
S
W
c
e
b
w M
e1
d
U2
B
q2
Q
y M B
q1
x M B
y M B
p
U1
q
0
5
S1
10 mm
U1
U2
16.7 4.95 44.75
16.1 4.55 44.25
scale
optical input
S2
8.2
7.8
x
y
Z
max.
6-32
0.25
UNC
0.7
0.1
12
q1
q2
S
W
w
DIMENSIONS (mm are the original dimensions)
UNIT
A2
A
max. max.
mm 20.8
9.5
OUTLINE
VERSION
b
c
D
d
E
max. max. max.
e
e1
F
0.51
0.25 27.2 2.54 13.75 2.54 5.08 12.7
0.38
L
min.
M
M1
M2
N
min.
N1
N2
p
Q
max.
8.8
2.5
1.6
0.9 1000
10.7
0.0
5
0
4.15
3.85
2.4
REFERENCES
IEC
JEDEC
JEITA
38.1 25.4 10.2
4.2
ISSUE DATE
04-02-04
10-06-18
SOT115T
Fig 2.
EUROPEAN
PROJECTION
q
Package outline SOT115T
BGO827_FC0_SC0
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 September 2010
© NXP B.V. 2010. All rights reserved.
5 of 11
BGO827; BGO827/FC0/SC0
NXP Semiconductors
870 MHz optical receivers
Rectangular single-ended package; aluminium flange;
2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes;
optical input with connector; 8 gold-plated in-line leads
E
SOT115X
N1
N2
M
M1
D
S2
Z
p
M2
A2
1
2
3
4
5
7
8
9
A
S1
L
F
S
c
W
e
b
d
U2
B
w M
e1
Q
q2
y M B
q1
y M B
x M B
p
N
R
U1
q
0
25 mm
Scale
0
5
10 mm
S
scale
4.2
connector
S1
S2
U1
U2
16.7 4.95 44.75
16.1 4.55 44.25
8.2
7.8
DIMENSIONS (mm are the original dimensions)
UNIT
A2
A
max. max.
mm 20.8
9.5
OUTLINE
VERSION
b
c
D
d
E
max. max. max.
e
e1
F
0.51
0.25 27.2 2.54 13.75 2.54 5.08 12.7
0.38
L
min.
M
M1
M2
8.8
2.5
1.6
0.9
N
861 10.7
746 0.0
REFERENCES
IEC
JEDEC
JEITA
y
Z
max.
6-32 0.25
UNC
0.7
0.1
12
q1
q2
R
min.
N2
p
Q
max.
5
0
4.15
3.85
2.4
EUROPEAN
PROJECTION
w
q
38.1 25.4 10.2
35
ISSUE DATE
04-02-04
10-06-18
SOT115X
Fig 3.
N1
x
W
Package outline SOT115X
BGO827_FC0_SC0
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 September 2010
© NXP B.V. 2010. All rights reserved.
6 of 11
BGO827; BGO827/FC0/SC0
NXP Semiconductors
870 MHz optical receivers
Rectangular single-ended package; aluminium flange;
2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes;
optical input with connector; 8 gold-plated in-line leads
E
SOT115Y
N1
N2
M
M1
D
S2
Z
p
M2
A2
1
2
3
4
5
7
8
9
A
S1
L
F
S
c
W
e
b
d
U2
B
w M
e1
Q
q2
y M B
q1
y M B
x M B
p
N
R
U1
q
0
25 mm
Scale
0
5
10 mm
S
scale
connector
S1
S2
U1
x
y
Z
max.
8.2 6-32 0.25
7.8 UNC
0.7
0.1
12
q1
q2
R
min.
U2
4.2 16.7 4.95 44.75
16.1 4.55 44.25
W
w
DIMENSIONS (mm are the original dimensions)
UNIT
A2
A
max. max.
mm 20.8
9.5
OUTLINE
VERSION
b
c
D
d
E
max. max. max.
e
e1
F
0.51
0.25 27.2 2.54 13.75 2.54 5.08 12.7
0.38
L
min.
M
M1
M2
8.8
2.5
1.6
0.9
N
861 10.7
746 0.0
REFERENCES
IEC
JEDEC
JEITA
N2
p
Q
max.
5
0
4.15
3.85
2.4
EUROPEAN
PROJECTION
q
38.1 25.4 10.2
35
ISSUE DATE
04-02-05
10-06-18
SOT115Y
Fig 4.
N1
Package outline SOT115Y
BGO827_FC0_SC0
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 September 2010
© NXP B.V. 2010. All rights reserved.
7 of 11
BGO827; BGO827/FC0/SC0
NXP Semiconductors
870 MHz optical receivers
7. Handling information
Fiberglass optical coupling: maximum tensile strength = 5 N; minimum bending
radius = 35 mm.
8. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGO827_FC0_SC0 v.5
20100929
Product data sheet
-
BGO827_FC0_SC0 v.4
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Package outline and simplified outline drawings have been updated to the latest version.
BGO827_FC0_SC0 v.4
(9397 750 14436)
20050329
Product data sheet
-
BGO827_FC0_SC0 v.3
BGO827_FC0_SC0 v.3
(9397 750 13061)
20040407
Product specification
-
BGO827_FC0_SC0 v.2
BGO827_FC0_SC0 v.2
(9397 750 10522)
20021210
Product specification
-
BGO827_FC0_SC0 v.1
BGO827_FC0_SC0 v.1
(9397 750 09934)
20020627
Product specification
-
-
BGO827_FC0_SC0
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 September 2010
© NXP B.V. 2010. All rights reserved.
8 of 11
BGO827; BGO827/FC0/SC0
NXP Semiconductors
870 MHz optical receivers
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
BGO827_FC0_SC0
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 September 2010
© NXP B.V. 2010. All rights reserved.
9 of 11
BGO827; BGO827/FC0/SC0
NXP Semiconductors
870 MHz optical receivers
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGO827_FC0_SC0
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 September 2010
© NXP B.V. 2010. All rights reserved.
10 of 11
NXP Semiconductors
BGO827; BGO827/FC0/SC0
870 MHz optical receivers
11. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
10
11
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Handling information. . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 September 2010
Document identifier: BGO827_FC0_SC0